CN113453432A - Manufacturing process of high-thermal-conductivity PCB - Google Patents
Manufacturing process of high-thermal-conductivity PCB Download PDFInfo
- Publication number
- CN113453432A CN113453432A CN202010230520.7A CN202010230520A CN113453432A CN 113453432 A CN113453432 A CN 113453432A CN 202010230520 A CN202010230520 A CN 202010230520A CN 113453432 A CN113453432 A CN 113453432A
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- Prior art keywords
- transferring
- carrying
- automatic
- aoi
- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Abstract
The invention discloses a manufacturing process of a high-thermal-conductivity PCB, which comprises the following steps: (1) cutting; (2) an inner layer; (3) AOI; (4) pressing; (5) drilling; (6) electroplating; (7) a line; (8) AOI; (9) resistance welding; (10) characters; (11) surface treatment-gold precipitation; (12) molding: single machine operation flow; (13) electrical measurement: the automatic electric measuring machine and the semi-automatic electric measuring machine are linked with an automatic manipulator; (14) visual inspection: an AVI automatic appearance/color checker; (15) packaging: and (5) single machine operation flow. Through the mode, the problems of hole collapse and orifice flash in the process of drilling the PCB made of the high-thermal-conductivity PTFE material in the prior art can be solved.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a manufacturing process of a high-thermal-conductivity PCB.
Background
The high-thermal-conductivity PTFE material has the advantages of low expansion coefficient, good thermal conductivity (the thermal conductivity of the high-thermal-conductivity PTFE material is more than 1w/mk), high hardness, good flatness, good electromagnetic compatibility and the like, so the high-thermal-conductivity PTFE material is widely applied to the field of aerospace.
In the prior art, a high-thermal-conductivity PTFE material is obtained by improving the thermal conductivity of a common high-frequency material, and the method specifically comprises two methods: synthesizing a polymer having good thermal conductivity and filling the polymer with a high thermal conductivity material.
For the high heat conduction PCB which is obtained by filling polymer with high heat conduction material (ceramic) to improve the heat conduction coefficient, namely the PCB which is made of high heat conduction PTFE material containing a large amount of ceramic powder in the material, because the material is soft and the machining performance is poor, the traditional machining method is easy to cause the situations of orifice flashing and hole collapse, when the surface of a mechanical grinding plate is roughened in the later process, the flashing can be pressed into the hole, so that the hole wall is flanged, the hole diameter is influenced, or the bonding force between copper on the surface of the orifice and a base material is influenced, the reliability risk of the use of a client is increased, especially for a large hole with the hole diameter more than or equal to 2.5mm, the problem is easier to occur in the machining process.
Disclosure of Invention
The invention mainly solves the technical problem of providing a manufacturing process of a high-thermal-conductivity PCB, which can solve the problems of hole collapse and orifice flash during drilling of the PCB made of high-thermal-conductivity PTFE material in the prior art.
In order to solve the technical problems, the invention adopts a technical scheme that: the manufacturing process of the high-thermal-conductivity PCB comprises the following steps:
(1) charging
Arranging a lifter in a material area to be cut, placing the cut materials on a frame to be transferred in batches, and then transferring the materials to an inner course by using a transfer trolley to be transferred;
(2) inner layer
Linking the pretreatment with photosensitive ink coating and drying oven equipment, starting an exposure machine to realize automatic exposure operation, then carrying out the operation links of developing, etching and film removing, and simultaneously removing the film, drying and transferring to AOI;
(3)AOI
carrying out quality inspection and judgment, transferring to a punching machine for operation, and then transferring to the pretreatment of a pressing course;
(4) pressing together
Performing hot melting, riveting, pre-stacking and pre-arranging work of a pressing process, performing X-Ray target drilling operation after the PCB is cooled, and transferring to a drilling course;
(5) drilling holes
Carrying out PIN, encapsulation and drilling operation, and transferring to electroplating;
(6) electroplating of
Carrying out pretreatment, plate grinding, frame inserting, glue residue removal, chemical copper deposition and whole-plate electroplating; then finishing the operation processes of plate grinding, glue residue removal, chemical copper deposition, drying and material collection and transferring to a circuit manufacturing process;
(7) line
Feeding, microetching, washing, grinding a plate, grinding a volcanic ash plate, washing and drying; then, the AOI inspection process is carried out;
(8)AOI
carrying out quality inspection and judgment, and then transferring to a solder mask course;
(9) solder resist
Carrying out solder mask pretreatment, plate grinding and sand blasting surface cleaning, then completing silk screen printing, prebaking, exposure and development, and then turning to a text course;
(10) character(s)
The whole character operation process of automatic feeding, silk-screen printing, baking and material receiving;
(11) surface treatment-immersion gold
Producing and manufacturing a surface treatment gold immersion process according to the planned scheduling requirement, then carrying out surface treatment gold immersion operation, and drying a post-treatment plate washing line after gold immersion;
(12) molding: single machine operation flow;
(13) electrical measurement: the automatic electric measuring machine and the semi-automatic electric measuring machine are linked with an automatic manipulator;
(14) visual inspection: an AVI automatic appearance inspection machine;
(15) packaging: and (5) single machine operation flow.
The invention adopts a further technical scheme for solving the technical problem that:
further, in step (1), the cut material 120 is placed on a "to-be-rotated stand" in a block/batch manner.
Further, in the step (11), the flow of the surface treatment immersion gold operation is as follows: feeding, deoiling, microetching, pickling, presoaking, activating, post-soaking, nickel depositing, gold depositing and blanking.
The invention has the beneficial effects that: the invention can maximally automate the manufacturing process, maximally reduce the number of operating personnel, maximally reduce the labor intensity of workers, improve the quality, improve the efficiency and reduce the manufacturing cost.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to more readily understand the advantages and features of the present invention, and to clearly and unequivocally define the scope of the present invention.
Example (b): the invention discloses a manufacturing process of a high-thermal-conductivity PCB (printed circuit board), which comprises the following steps of:
(1) charging
Arranging a lifter in a material area to be cut, placing the cut materials on a frame to be transferred in batches, and then transferring the materials to an inner course by using a transfer trolley to be transferred;
(2) inner layer
Linking the pretreatment with photosensitive ink coating and drying oven equipment, starting an exposure machine to realize automatic exposure operation, then carrying out the operation links of developing, etching and film removing, and simultaneously removing the film, drying and transferring to AOI;
(3)AOI
carrying out quality inspection and judgment, transferring to a punching machine for operation, and then transferring to the pretreatment of a pressing course;
(4) pressing together
Performing hot melting, riveting, pre-stacking and pre-arranging work of a pressing process, performing X-Ray target drilling operation after the PCB is cooled, and transferring to a drilling course;
(5) drilling holes
Carrying out PIN, encapsulation and drilling operation, and transferring to electroplating;
(6) electroplating of
Carrying out pretreatment, plate grinding, frame inserting, glue residue removal, chemical copper deposition and whole-plate electroplating; then finishing the operation processes of plate grinding, glue residue removal, chemical copper deposition, drying and material collection and transferring to a circuit manufacturing process;
(7) line
Feeding, microetching, washing, grinding a plate, grinding a volcanic ash plate, washing and drying; then, the AOI inspection process is carried out;
(8)AOI
carrying out quality inspection and judgment, and then transferring to a solder mask course;
(9) solder resist
Carrying out solder mask pretreatment, plate grinding and sand blasting surface cleaning, then completing silk screen printing, prebaking, exposure and development, and then turning to a text course;
(10) character(s)
The whole character operation process of automatic feeding, silk-screen printing, baking and material receiving;
(11) surface treatment-immersion gold
Producing and manufacturing a surface treatment gold immersion process according to the planned scheduling requirement, then carrying out surface treatment gold immersion operation, and drying a post-treatment plate washing line after gold immersion;
(12) molding: single machine operation flow;
(13) electrical measurement: the automatic electric measuring machine and the semi-automatic electric measuring machine are linked with an automatic manipulator;
(14) visual inspection: an AVI automatic appearance inspection machine;
(15) packaging: and (5) single machine operation flow.
In the step (1), 120 pieces/batch of cut materials are placed on a stand to be rotated.
In the step (11), the surface treatment gold immersion operation flow comprises the following steps: feeding, deoiling, microetching, pickling, presoaking, activating, post-soaking, nickel depositing, gold depositing and blanking.
The working principle of the invention is as follows: the invention can maximally automate the manufacturing process, maximally reduce the number of operating personnel, maximally reduce the labor intensity of workers, improve the quality, improve the efficiency and reduce the manufacturing cost.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications made by the present invention in the equivalent structure or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (3)
1. The manufacturing process of the high-thermal-conductivity PCB is characterized by comprising the following steps of: the method comprises the following steps:
(1) charging
Arranging a lifter in a material area to be cut, placing the cut materials on a frame to be transferred in batches, and then transferring the materials to an inner course by using a transfer trolley to be transferred;
(2) inner layer
Linking the pretreatment with photosensitive ink coating and drying oven equipment, starting an exposure machine to realize automatic exposure operation, then carrying out the operation links of developing, etching and film removing, and simultaneously removing the film, drying and transferring to AOI;
(3)AOI
carrying out quality inspection and judgment, transferring to a punching machine for operation, and then transferring to the pretreatment of a pressing course;
(4) pressing together
Performing hot melting, riveting, pre-stacking and pre-arranging work of a pressing process, performing X-Ray target drilling operation after the PCB is cooled, and transferring to a drilling course;
(5) drilling holes
Carrying out PIN, encapsulation and drilling operation, and transferring to electroplating;
(6) electroplating of
Carrying out pretreatment, plate grinding, frame inserting, glue residue removal, chemical copper deposition and whole-plate electroplating; then finishing the operation processes of plate grinding, glue residue removal, chemical copper deposition, drying and material collection and transferring to a circuit manufacturing process;
(7) line
Feeding, microetching, washing, grinding a plate, grinding a volcanic ash plate, washing and drying; then, the AOI inspection process is carried out;
(8)AOI
carrying out quality inspection and judgment, and then transferring to a solder mask course;
(9) solder resist
Carrying out solder mask pretreatment, plate grinding and sand blasting surface cleaning, then completing silk screen printing, prebaking, exposure and development, and then turning to a text course;
(10) character(s)
The whole character operation process of automatic feeding, silk-screen printing, baking and material receiving;
(11) surface treatment-immersion gold
Producing and manufacturing a surface treatment gold immersion process according to the planned scheduling requirement, then carrying out surface treatment gold immersion operation, and drying a post-treatment plate washing line after gold immersion;
(12) molding: single machine operation flow;
(13) electrical measurement: the automatic electric measuring machine and the semi-automatic electric measuring machine are linked with an automatic manipulator;
(14) visual inspection: an AVI automatic appearance inspection machine;
(15) packaging: and (5) single machine operation flow.
2. The manufacturing process of the high thermal conductivity PCB board of claim 1, wherein: in the step (1), 120 pieces/batch of cut materials are placed on a stand to be rotated.
3. The manufacturing process of the high thermal conductivity PCB board of claim 1, wherein: in the step (11), the surface treatment gold immersion operation flow comprises the following steps: feeding, deoiling, microetching, pickling, presoaking, activating, post-soaking, nickel depositing, gold depositing and blanking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010230520.7A CN113453432A (en) | 2020-03-27 | 2020-03-27 | Manufacturing process of high-thermal-conductivity PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010230520.7A CN113453432A (en) | 2020-03-27 | 2020-03-27 | Manufacturing process of high-thermal-conductivity PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113453432A true CN113453432A (en) | 2021-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010230520.7A Pending CN113453432A (en) | 2020-03-27 | 2020-03-27 | Manufacturing process of high-thermal-conductivity PCB |
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| CN (1) | CN113453432A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340156A (en) * | 2021-11-04 | 2022-04-12 | 新余市木林森线路板有限公司 | Manufacturing method of PET material die cutting process flexible single panel |
-
2020
- 2020-03-27 CN CN202010230520.7A patent/CN113453432A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340156A (en) * | 2021-11-04 | 2022-04-12 | 新余市木林森线路板有限公司 | Manufacturing method of PET material die cutting process flexible single panel |
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Application publication date: 20210928 |