CN113453392A - 加热装置 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/0288—Applications for non specified applications
- H05B1/0291—Tubular elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/54—Heating elements having the shape of rods or tubes flexible
- H05B3/56—Heating cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/54—Heating elements having the shape of rods or tubes flexible
- H05B3/56—Heating cables
- H05B3/565—Heating cables flat cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
- H01B7/22—Metal wires or tapes, e.g. made of steel
- H01B7/226—Helicoidally wound metal wires or tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/019—Heaters using heating elements having a negative temperature coefficient
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Abstract
本技术方案涉及基于自调节式加热带的加热装置,并且可以在各种行业中使用。加热装置包括自调节式加热带和外部金属挠性铠装部,所述铠装部的带材具有纵向凹槽,并且带材的边缘具有弯曲部。加热带包括两个导体,这两个导体彼此绝缘,并放置在导电聚合物基体中,该导电聚合物基体被封装在聚合物绝缘护套中。开发了具有高机械强度、高挠性、高密封性、对外部侵蚀性介质具有高抗性以及防火安全性的加热装置。
Description
技术领域
所要求保护的技术方案涉及基于自调节式加热带的加热装置,并且可以在各种行业中使用。
背景技术
包含自调节式带的加热装置在本领域中是众所周知的。
自调节式带是指导电碳(聚合物)基体(基部),该基体(基部)的内部布置有导电芯,导电部分以分散的方式分布在导电芯之间。
基体的特征在于电导率对温度有很大的依赖性,并且导电塑料的负温度电阻系数比铜或钢的负温度电阻系数高一个数量级。这确保了自调节式的加热电缆的热功率。自调节式加热带可以仅在过热区域局部地改变功率。
在加热期间中,聚合物基部膨胀,合并入基部中的导电颗粒之间的距离变大,导致导电颗粒之间的基体中导的导电连接(路径)的数量减少,这增加了基体电阻,降低了其电导率,此外降低了过热的带部分的局部加热。在带部分冷却后,聚合物基部的尺寸接近原始尺寸,并继续加热。
低温自调节式带可以确保设备从+10℃加热到+50℃,此外由于其热特性,允许加热带自地动将+50℃温度时的功耗降低至50%以下。
现有技术中已知自调节式加热带,它由两个彼此绝缘的导电芯组成,所述两个导电芯布置在合并入聚合物绝缘护套中的导电聚合物基体中(参见CN 109379793A,22.02.2019)。
已知解决方案的缺点是加热带的结构强度低、对外部侵蚀性介质的保护不足以及防火安全性的考虑。
发明内容
所要求保护的技术方案的挑战在于开发基于具有高工作性能的自调节式加热带的加热装置。
该技术成果是开发具有高机械强度、高挠性、高密封性、对外部侵蚀性介质(包括紫外线)的高抗性和防火安全性的加热装置。
所要求的技术结果是通过使用以下基本特征的总和而获得的:所述加热装置包括自调节式加热带,所述自调节式加热带合并有彼此绝缘的两个导电芯,所述导电芯布置导在电聚合物基体中,该导电聚合物基体被封装在聚合物绝缘护套中;根据所要求保护的技术方案,该装置包括外部挠性金属铠装部。
或者,铠装部可由金属条缠绕而成,重叠节距最大为0.5。
或者,铠装部带材可以具有纵向凹槽,并且带带材边缘可以被弯曲以在缠绕期间安装到所述的凹槽中。
或者,该带可以附加地包含铜、锡或铜锡编织物。
或者,该带可以附加地包含聚烯烃或氟塑料护套。
或者,在外部金属铠装部下直接施加固体阻水层,或在外部金属铠装部下直接设置该装置的附加阻水绝缘绕组。
或者,疏水物可以用作阻水层或绕组。
或者,在聚合物绝缘护套上施加阻水层,或在聚合物绝缘护套上直接设置该装置的附加阻水绝缘绕组。
或者,疏水物用作阻水层或绕组。
附图说明
图1表示根据要求保护的技术方案的加热装置的整体视图;图2表示本实施方式中具有外部导电编织物的加热装置。图上的名称是相同的。
具体实施方式
图1表示基于平行电阻式自调节式带的加热装置。该带由导电聚合物基体1组成,该聚合物基体1通过挤压被压在两个平行的导电芯2、3周围。该基体用作加热元件。此外,通过挤压将聚烯烃或氟塑料制成的聚合物绝缘护套4压在基体1上。通常,为获得附加的机械保护和/或用作接地线,添加了导电编织物5(例如,锡或铜-锡或铜编织物)。此类编织物通常由外部编织物6覆盖,以提供附加的机械和腐蚀保护。
与非自调节式加热带相比,平行电阻式自调节式带具有许多优点,并继而更受欢迎。例如,自调节式加热带由于它的温度特性而不会过热。随着该带的任何点的温度升高,该点的发热元件电阻变得更高,同时降低了该点的输出功率,并且加热器有效地关闭。
加热装置包含外部金属挠性铠装部7,该铠装部7由金属带材通过缠绕制成。绕组由不超过0.5的重叠节距而制成。当节距大于0.5时,该装置的挠性将显著降低,这将使装置的使用和安装更加困难。根据该装置必要的强度或挠性,重叠节距可以在0.1到0.5之间变化。随着挠性的增加,绕组节距将接近0.1,而且随着强度的增加,绕组节距将接近0.5。外部铠装部的可用性提高了加热装置的机械强度,同时保持了相对较高的挠性。
该金属带材具有纵向凹槽,并且在装置上缠绕下一卷带时,将该金属带材边缘弯曲以安装到所述的凹槽中。根据绕组节距,选择纵向凹槽位置。在绕组节距为0.5的情况下,纵向凹槽位于带中心,当节距降低至0.1时,纵向凹槽移向带边缘。
在带中该凹槽的可用性、缠绕期间捆绑带与该凹槽的紧密接触、凹槽中弯曲部的可靠固定允许装置获得不可渗透的外部铠装部以及显著增加加热装置的密封性。
加热装置的密封性和外部金属护套的可用性允许增加装置对外部腐蚀性介质(包括紫外线辐射)的抵抗力,并提高防火安全性。
可以在外部金属铠装部7下直接施加固体阻水层,或可以在外部金属铠装部7下直接设置装置的附加阻水绝缘绕组(图纸中未显示),以进一步改善加热带密封性能和防水性。疏水物可用作阻水层或绕组。此外,还可以在聚合物绝缘护套上直接施加和设置阻水层或附加阻水绕组。
另外,给定加热装置的优点是,可以根据必要的长度在现场将装置切割成所需的长度,而无需任何附加的结构复杂性。
加热装置的示例性实施方式
半导体自调节式基体被压在两个剖面为1.25mm2的平行镀锡铜芯周围。将覆盖有镀锡铜线网状编织物的热塑性弹性体(聚烯烃)绝缘护套压在基体上。锡编织物的顶部覆盖有热塑性编织物。
将获得的加热带放置在钢护套中,该钢护套由钢带缠绕在加热带上而应用。绕组节距为0.5。加热装置的电源为220V至240V。装置的最高温度为65℃。
根据GOSTRIEC 60079-0-2011、GOSTRIEC 60079-7-2012和GOSTRIEC 60079-30-1-2011,所要求保护的加热装置已批准用于安全和爆炸危险领域。GOST 14254-96规定的装置防护等级为IP67。
Claims (9)
1.一种加热装置,所述加热装置包括自调节式加热带,所述自调节式加热带包括两个彼此绝缘的导电芯,所述导电芯布置在导电聚合物基体中,所述导电聚合物基体被封装在聚合物绝缘护套中;其中,所述装置包含外部挠性金属铠装部。
2.根据权利要求1所述的加热装置,其中,所述铠装部能够由金属带材缠绕制成,所述金属带材的重叠节距最大为0.5。
3.根据权利要求2所述的加热装置,其中,所述铠装部的带材能够具有纵向凹槽,并且所述带材边缘能够被弯曲以在缠绕期间安装到所述凹槽中。
4.根据权利要求1所述的加热装置,其中,所述带附加地包含铜或锡或锡铜编织物。
5.根据权利要求1所述的加热装置,其中,所述带附加地包括聚烯烃或氟塑料护套。
6.根据权利要求1所述的加热装置,其中,在所述外部金属铠装部下直接施加固体阻水层,或在所述外部金属铠装部下直接设置所述装置的附加阻水绝缘绕组。
7.根据权利要求6所述的加热装置,其中,疏水物用作阻水层或绕组。
8.根据权利要求1所述的加热装置,其中,在所述聚合物绝缘护套上直接施加阻水层,或者在所述聚合物绝缘护套上直接设置附加的阻水绝缘绕组。
9.根据权利要求8所述的加热装置,其中,疏水物用作阻水层或绕组。
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CN203150164U (zh) * | 2013-01-15 | 2013-08-21 | 安徽瑞之星电缆集团有限公司 | 一种防爆发热型椭圆电缆 |
CN203327270U (zh) * | 2013-06-24 | 2013-12-04 | 扬州市金阳光电缆有限公司 | 输油气管线用智能型自控温伴热电缆 |
WO2016130576A1 (en) * | 2015-02-09 | 2016-08-18 | Pentair Thermal Management Llc | Heater cable having a tapered profile |
CN109379793A (zh) * | 2018-11-16 | 2019-02-22 | 安邦电气股份有限公司 | 一种高温锅炉用自限温电伴热带 |
EP3664575A1 (en) * | 2018-12-07 | 2020-06-10 | nVent Services GmbH | Improving flammability of heating cable |
US20210131719A1 (en) * | 2019-11-06 | 2021-05-06 | Haier Us Appliance Solutions, Inc. | Refrigerator appliance and heating assembly having a hydrophobic layer |
-
2020
- 2020-03-26 RU RU2020112432A patent/RU2735946C1/ru active
-
2021
- 2021-03-15 US US17/201,664 patent/US20210307114A1/en not_active Abandoned
- 2021-03-22 GB GB2103954.0A patent/GB2594791A/en active Pending
- 2021-03-25 CN CN202110320070.5A patent/CN113453392A/zh active Pending
- 2021-03-25 DE DE102021107610.2A patent/DE102021107610A1/de not_active Withdrawn
- 2021-03-25 KR KR1020210039196A patent/KR20210122139A/ko unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11769622B2 (en) * | 2015-04-06 | 2023-09-26 | Samsung Electro-Mechanics Co., Ltd. | Inductor device and method of manufacturing the same |
CN114360790A (zh) * | 2021-12-23 | 2022-04-15 | 扬州利家科技有限公司 | 一种防爆耐腐蚀型串联电伴热带 |
Also Published As
Publication number | Publication date |
---|---|
DE102021107610A1 (de) | 2021-09-30 |
GB2594791A (en) | 2021-11-10 |
GB202103954D0 (en) | 2021-05-05 |
RU2735946C1 (ru) | 2020-11-11 |
US20210307114A1 (en) | 2021-09-30 |
KR20210122139A (ko) | 2021-10-08 |
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