CN113437623A - Passive cooling module and method for all-in-one air-cooled solid laser - Google Patents
Passive cooling module and method for all-in-one air-cooled solid laser Download PDFInfo
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- CN113437623A CN113437623A CN202110687500.7A CN202110687500A CN113437623A CN 113437623 A CN113437623 A CN 113437623A CN 202110687500 A CN202110687500 A CN 202110687500A CN 113437623 A CN113437623 A CN 113437623A
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- 238000001816 cooling Methods 0.000 title claims abstract description 70
- 239000007787 solid Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000013078 crystal Substances 0.000 description 24
- 238000005057 refrigeration Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention relates to a passive cooling module and a passive cooling method for an all-in-one air-cooled solid laser, which comprises a module seat, wherein a cooling bottom plate for mounting a laser is arranged at the top of the module seat, an aluminum fin radiator extending into the module seat is arranged at the bottom of the cooling bottom plate, a fan set is arranged in the middle of the side wall of one side of the module seat, an air outlet corresponding to the fan set is arranged on the side wall of the other side of the module seat, and a power supply interface for controlling the fan set to work is arranged on the module seat; the invention utilizes the aluminum fin radiator and the large-air-volume fan to radiate the heat of the cooling bottom plate, obtains relatively stable temperature difference with the environment through high-speed air flow, and leads the small-power solid laser to reach a dynamic stable state.
Description
Technical Field
The invention belongs to the technical field of laser beam processing, such as welding, cutting and punching, and particularly relates to a compact passive cooling module of an all-in-one machine suitable for a low-power air-cooled solid laser.
Background
The cooling method for the laser crystal in the all-solid-state laser can be roughly divided into three methods: liquid cooling, semiconductor refrigeration and air cooling conduction heat dissipation.
The liquid cooling can achieve a good cooling effect by controlling the temperature and the flow of the liquid, and the liquid cooling takes constant-temperature water as a cooling mode and needs an independent laser water cooler for cooling; the added laser water cooling machine has no advantages in cost, and can not meet the requirements under the environment with higher humidity requirements.
The semiconductor (TEC) refrigeration needs a cooling mode of adding a cooling fin fan on the basis of a semiconductor refrigeration piece, the cooling temperature precision is better controlled by the mode, but a temperature control circuit and other related equipment are added, the integral volume of the laser is increased, the semiconductor refrigeration piece used for the semiconductor refrigeration has short service time, and the semiconductor refrigeration piece is easy to damage after being used for a long time and is not suitable for the practical application of industrial products.
The cooling temperature of a water cooling and semiconductor cooling mode is generally lower than the room temperature, the local temperature of the surface of the crystal is usually lower than the room temperature in actual use, the crystal is easy to fog when meeting cold air in the air, the surface of the crystal is easy to damage when a laser runs, and the service life of the laser is shortened; in addition, in the end-face pump laser, due to the limitation of various refrigeration modes, only side refrigeration can be relied on, the temperature difference from the middle to the edge of the laser crystal on a section vertical to the laser operation is higher, and the output light mode of the laser beam is deteriorated by the thermal lens effect caused by the temperature difference.
The full air-cooled heat dissipation industrial laser has the advantages of simple structure, stable operation, long service life, particular suitability for long-time operation in a poor environment and high stability; and the full air-cooled heat dissipation mode can reduce the temperature difference from the middle to the edge of the section of the laser rod along the direction vertical to the light path, reduce the adverse effect of the thermal lens effect on laser output beams, and further improve the output quality of the laser beams.
The Chinese invention has the patent application number of ZL200910253670 and the patent name of: the patent discloses a full air-cooled radiating double-pump double-crystal laser, which comprises an air-cooled radiating device, a first laser crystal, a second laser crystal, a first laser crystal clamp, a second laser crystal clamp and a shell with a radiating outlet, wherein the air-cooled radiating device mainly comprises a fan and a radiating fin, the first laser crystal clamp and the second laser crystal clamp are provided with arrangement groove holes for clamping the laser crystals, the first laser crystal clamp and the second laser crystal clamp are fixed on the radiating fin, the longitudinal section of the arrangement groove holes is in a diamond shape, the diagonal of the diamond shape is consistent with the C axis of the laser crystals placed on the arrangement groove holes, the appearance of the first laser crystal and the appearance of the second laser crystal are matched with the arrangement groove holes, the transverse section of the outlet of the arrangement groove holes is in a horn shape, when the laser crystal cooling device works, heat energy generated by the laser crystal is conducted to the crystal clamp through four contact surfaces of the laser crystal in a heat conduction mode, the crystal clamp conducts the heat to the bottom plate of the laser shell, the conducted heat is directly blown to the cooling fins below the bottom plate through the fan at the lower part of the laser shell, the heat is finally taken out of the laser and is transmitted to the surrounding air, and the laser crystal is effectively cooled.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a passive cooling module and a method for an all-in-one air-cooled solid-state laser, in which an aluminum fin radiator and a large-volume fan are used to radiate heat from a cooling base plate, and a temperature difference relatively stable to the environment is obtained by high-speed air flow, so that a low-power solid-state laser reaches a dynamic stable state.
In order to achieve the purpose, the passive cooling module and the passive cooling method for the all-in-one air-cooled solid laser comprise a module seat, wherein a cooling bottom plate for mounting the laser is arranged at the top of the module seat, an aluminum fin radiator extending into the module seat is arranged at the bottom of the cooling bottom plate, a fan set is arranged in the middle of the side wall of one side of the module seat, an air outlet corresponding to the fan set is arranged on the side wall of the other side of the module seat, and a power supply interface for controlling the fan set to work is arranged on the module seat.
Furthermore, the side wall of the module seat is provided with a fixed support leg for fixing the module seat on the laser machine frame.
Further, be provided with temperature sensor in the module seat, be provided with the communication interface that is used for being connected with temperature sensor on the module seat.
Further, the module seat includes the long curb plate and the short curb plate of front end and rear end of both sides, long curb plate and short curb plate all pass through the bolt fastening in cooling bottom plate edge all around.
Furthermore, the fan group is provided with 4-6 fans, the fans are fixed on the inner side wall of the long side plate through mounting bolts, and the long side plate is provided with air inlet holes which are in one-to-one correspondence with the fans.
Further, the aluminum fin radiators are arranged into aluminum fin radiating fins which are uniformly distributed on the cooling bottom plate, a radiating channel is arranged between every two adjacent aluminum fin radiating fins, and the radiating channels are uniformly distributed between the fan set and the air outlet.
The invention also discloses a passive cooling module for the all-in-one air-cooled solid laser and a heat dissipation control method, which comprises the following steps:
1) the temperature in the passive cooling module is monitored in real time through the temperature sensor, and the temperature in the passive cooling module is controlled to be 29-32 ℃.
2) After the temperature exceeds 29 ℃, the rotating speed of the fan is increased through the power supply interface, so that the temperature is increased to be within the range of 29-32 ℃;
3) and after the temperature exceeds 32 ℃, reducing the rotating speed of the fan through the power supply interface to reduce the temperature to be within the range of 29-32 ℃.
Further, the fan model: AFB0624 SH; current: 0.18A; air volume: 38 CFM; the specific heat capacity of the aluminum fin radiator is 900 KJ/kg.K.
The invention has the beneficial effects that:
the passive cooling module and the passive cooling method for the all-in-one air-cooled solid laser utilize an aluminum fin radiator and a large-air-volume fan to radiate heat of a cooling bottom plate, and obtain relatively stable temperature difference with the environment through high-speed air flow, so that the low-power solid laser reaches a dynamic stable state.
Drawings
FIG. 1 is a schematic diagram of the left side of the passive cooling module and method for an all-in-one air-cooled solid-state laser according to the present invention;
fig. 2 is a right side schematic view of the passive cooling module and method for an all-in-one air-cooled solid-state laser according to the present invention.
FIG. 3 is a schematic bottom-view structural diagram of a passive cooling module and method for an all-in-one air-cooled solid-state laser according to the present invention;
FIG. 4 is a temperature control diagram of the passive cooling module and method for the all-in-one air-cooled solid-state laser according to the present invention.
Reference numerals: 1-a module seat, 2-a cooling bottom plate, 3-an aluminum fin radiator, 4-a fixed supporting leg, 5-a communication interface, 6-a power supply interface, 7-an air outlet and 8-a fan; 9-mounting bolts.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments. It should be understood that the scope of the above subject matter of the present invention is not limited to the following examples, and any technique realized based on the summary of the present invention is within the scope of the present invention.
Fig. 1-4 are schematic structural diagrams of a passive cooling module and a method for an all-in-one air-cooled solid-state laser device according to the present invention, the passive cooling module and the method for an all-in-one air-cooled solid-state laser device according to the present invention include a module base 1, a cooling bottom plate 2 for mounting a laser device is disposed at the top of the module base 1, an aluminum fin radiator 3 extending into the module base is disposed at the bottom of the cooling bottom plate 2, a fan set is disposed in the middle of a side wall of one side of the module base 1, an air outlet 7 corresponding to the fan set is disposed on a side wall of the other side of the module base 1, and a power supply interface 6 for controlling the fan set to operate is disposed on the module base 1.
In the embodiment, the aluminum fin radiator 3 and the large-air-volume fan are used for radiating heat of the cooling bottom plate 2, and the temperature difference relatively stable with the environment is obtained through high-speed air flow, so that the low-power solid laser reaches a dynamic stable state.
In a preferred embodiment, the side wall of the module seat 1 is provided with a fixing support leg 4 for fixing the module seat on a laser machine frame, and the structure of the embodiment is beneficial to the installation and fixation of the module seat 1, and is convenient for the passive cooling module to be integrated on the laser machine frame.
The preferred embodiment, be provided with temperature sensor in the module seat 1, be provided with on the module seat and be used for the communication interface 5 be connected with temperature sensor, the temperature condition in the module seat is monitored through temperature sensor to this embodiment, is favorable to controlling fan group simultaneous working quantity and rotational speed, arrives and obtains the difference in temperature with the environment relatively stable, makes the low-power solid laser reach dynamic steady state.
The preferred embodiment, module seat 1 includes the long curb plate and the front end of both sides and the short curb plate of rear end, long curb plate and short curb plate all pass through the bolt fastening at 2 edges all around of cooling bottom plate, and module seat 1 simple structure in this embodiment, processing is convenient.
In a preferred embodiment, the fan group is provided with 4 to 6 fans 9, the fans are fixed on the inner side walls of the long side plates through mounting bolts 9, air inlet holes are formed in the long side plates and correspond to the fans 9 one to one, in this embodiment, the fans 9 are arranged on the inner side walls of the module base 1 and correspond to the air outlet 7, air is supplied from one end of the aluminum fin radiator 3 through the air inlet holes, air is discharged from the other end of the aluminum fin radiator 3, and high-speed air flow is formed in the aluminum fin radiator 3, so that a heat dissipation effect is improved.
In a preferred embodiment, the aluminum fin radiators 3 are disposed as aluminum fin radiating fins uniformly distributed on the cooling base plate 2, a radiating channel is disposed between adjacent aluminum fin radiating fins, and the radiating channel is uniformly distributed between the fan set and the air outlet.
The invention also discloses a passive cooling module for the all-in-one air-cooled solid laser and a heat dissipation control method, which comprises the following steps:
1) the temperature in the passive cooling module is monitored in real time through the temperature sensor, and the temperature in the passive cooling module is controlled to be 29-32 ℃.
2) After the temperature exceeds 29 ℃, the rotating speed of the fan is increased through the power supply interface, so that the temperature is increased to be within the range of 29-32 ℃;
3) and after the temperature exceeds 32 ℃, reducing the rotating speed of the fan through the power supply interface to reduce the temperature to be within the range of 29-32 ℃.
In this embodiment, a fan speed control device is adopted, and this function can realize that the fan automatically adjusts the fan set speed according to the temperature of the temperature sensor, reduces the fan speed at low temperature, increases the fan speed at high temperature, and increases the heat dissipation effect.
In a preferred embodiment, the fan model: AFB0624 SH; current: 0.18A; air volume: 38 CFM; the specific heat capacity of the aluminum fin radiator is 900 KJ/kg.K, the specific heat capacity of the aluminum fin radiator in the embodiment is 900 KJ/kg.K, the specific heat capacity of the copper fin radiator is 386 KJ/kg.K, and the specific heat capacity of the aluminum fin radiator is three times that of the copper fin radiator; the medium with high specific heat capacity absorbs or emits more heat when the temperature rises or falls by 1 ℃; an aluminum fin radiator: the radiator has small thermal resistance, proper wind fin spacing and surface area, and large air volume, and the fans are aligned to radiate heat, and the central temperature of the fixed laser is controlled to be 30 +/-2 ℃ after the embodiment is adopted.
Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (8)
1. The utility model provides a passive cooling module for all-in-one forced air cooling solid laser which characterized in that: the laser module comprises a module seat, wherein a cooling bottom plate used for installing a laser is arranged at the top of the module seat, an aluminum fin radiator extending into the module seat is arranged at the bottom of the cooling bottom plate, a fan set is arranged in the middle of the side wall of one side of the module seat, an air outlet corresponding to the fan set is arranged on the side wall of the other side of the module seat, and a power supply interface used for controlling the fan set to work is arranged on the module seat.
2. The passive cooling module for the all-in-one air-cooled solid-state laser device according to claim 1, wherein: and the side wall of the module seat is provided with a fixed supporting leg for fixing the module seat on the laser machine frame.
3. The passive cooling module for the all-in-one air-cooled solid-state laser device according to claim 2, wherein: the module seat is internally provided with a temperature sensor, and the module seat is provided with a communication interface used for being connected with the temperature sensor.
4. The passive cooling module and the method for the all-in-one air-cooled solid-state laser according to any one of claims 1 to 3, wherein: the module seat includes the long curb plate and the short curb plate of front end and rear end of both sides, long curb plate and short curb plate all pass through the bolt fastening in cooling bottom plate edge all around.
5. The passive cooling module for the all-in-one air-cooled solid-state laser device according to claim 4, wherein: the fan group is provided with 4-6 fans, the fans are fixed on the inner side wall of the long side plate through mounting bolts, and the long side plate is provided with air inlet holes which are in one-to-one correspondence with the fans.
6. The passive cooling module for the all-in-one air-cooled solid-state laser device according to claim 5, wherein: the aluminum fin radiator is provided with aluminum fin radiating fins which are uniformly distributed on the cooling bottom plate, a radiating channel is arranged between every two adjacent aluminum fin radiating fins, and the radiating channels are uniformly distributed between the fan set and the air outlet.
7. A heat dissipation control method for the passive cooling module of the all-in-one air-cooled solid-state laser device, which is characterized by comprising the following steps of: the method comprises the following steps of,
1) the temperature in the passive cooling module is monitored in real time through the temperature sensor, and the temperature in the passive cooling module is controlled to be 29-32 ℃.
2) After the temperature exceeds 29 ℃, the rotating speed of the fan is increased through the power supply interface, so that the temperature is increased to be within the range of 29-32 ℃;
3) and after the temperature exceeds 32 ℃, reducing the rotating speed of the fan through the power supply interface to reduce the temperature to be within the range of 29-32 ℃.
8. The heat dissipation control method for the passive cooling module of the all-in-one air-cooled solid-state laser device according to claim 7, wherein: the fan model is as follows: AFB0624 SH; current: 0.18A; air volume: 38 CFM; the specific heat capacity of the aluminum fin radiator is 900 KJ/kg.K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687500.7A CN113437623A (en) | 2021-06-22 | 2021-06-22 | Passive cooling module and method for all-in-one air-cooled solid laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687500.7A CN113437623A (en) | 2021-06-22 | 2021-06-22 | Passive cooling module and method for all-in-one air-cooled solid laser |
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| CN113437623A true CN113437623A (en) | 2021-09-24 |
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| CN202110687500.7A Pending CN113437623A (en) | 2021-06-22 | 2021-06-22 | Passive cooling module and method for all-in-one air-cooled solid laser |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201270374Y (en) * | 2008-08-08 | 2009-07-08 | 镭射沃激光科技(深圳)有限公司 | Infrared solid laser for semi-conductor optical fiber coupling pump |
| CN101694920A (en) * | 2009-10-30 | 2010-04-14 | 吴肇宸 | Diode laser dual-end-surface-pumped dual-output all-solid-state laser |
| CN101707324A (en) * | 2009-12-01 | 2010-05-12 | 温州市嘉泰激光科技有限公司 | Whole wind-cooling heat dissipation dual-pumping dual-crystal laser |
| CN201608422U (en) * | 2009-10-30 | 2010-10-13 | 吴肇宸 | Diode laser double end-pumped dual-way output all-solid-state laser |
| CN203205702U (en) * | 2013-03-26 | 2013-09-18 | 南京诺威尔光电系统有限公司 | Air-cooled heat dissipation apparatus for semiconductor laser device |
| CN209544816U (en) * | 2019-04-12 | 2019-10-25 | 北京蓝溪华兴光电科技有限公司 | A kind of air-cooled hundred-watt level semiconductor Optical Maser System |
| CN209658589U (en) * | 2018-04-08 | 2019-11-19 | 东莞理工学院 | A kind of PWM temperature control air cooled type constant temperature laser |
-
2021
- 2021-06-22 CN CN202110687500.7A patent/CN113437623A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201270374Y (en) * | 2008-08-08 | 2009-07-08 | 镭射沃激光科技(深圳)有限公司 | Infrared solid laser for semi-conductor optical fiber coupling pump |
| CN101694920A (en) * | 2009-10-30 | 2010-04-14 | 吴肇宸 | Diode laser dual-end-surface-pumped dual-output all-solid-state laser |
| CN201608422U (en) * | 2009-10-30 | 2010-10-13 | 吴肇宸 | Diode laser double end-pumped dual-way output all-solid-state laser |
| CN101707324A (en) * | 2009-12-01 | 2010-05-12 | 温州市嘉泰激光科技有限公司 | Whole wind-cooling heat dissipation dual-pumping dual-crystal laser |
| CN203205702U (en) * | 2013-03-26 | 2013-09-18 | 南京诺威尔光电系统有限公司 | Air-cooled heat dissipation apparatus for semiconductor laser device |
| CN209658589U (en) * | 2018-04-08 | 2019-11-19 | 东莞理工学院 | A kind of PWM temperature control air cooled type constant temperature laser |
| CN209544816U (en) * | 2019-04-12 | 2019-10-25 | 北京蓝溪华兴光电科技有限公司 | A kind of air-cooled hundred-watt level semiconductor Optical Maser System |
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Application publication date: 20210924 |
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