CN113435156B - Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement - Google Patents
Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement Download PDFInfo
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- CN113435156B CN113435156B CN202110772132.6A CN202110772132A CN113435156B CN 113435156 B CN113435156 B CN 113435156B CN 202110772132 A CN202110772132 A CN 202110772132A CN 113435156 B CN113435156 B CN 113435156B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
- G06F30/3947—Routing global
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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Abstract
The invention discloses a method for adjusting the data spacing of a copper surface of a printed circuit board and intelligently judging a copper bridge to be supplemented, which comprises the following steps of: step 1: reading the manufacturing data in the computer-aided manufacturing CAM of the printed circuit board through computer software for preprocessing; step 2: judging the isolated bonding pad and the large-area copper surface by software; and step 3: optimizing the isolated copper space, namely manually setting space parameters between an isolated pad and a large-area copper surface, and then completing the adjustment of the data space of the copper surface through software; and 4, step 4: the optimization of the copper bridge, the width of the copper bridge is set manually, and then the copper bridge is judged and supplemented automatically through software; and 5: the results of the copper bridge repair are automatically checked by the software. By the mode, the copper surface data space can be automatically adjusted, the part needing to be supplemented with the copper bridge can be intelligently judged, the function of automatically supplementing the copper bridge is completed, the automation degree is high, and the labor and time cost is saved.
Description
Technical Field
The invention relates to the field of Computer Aided Manufacturing (CAM), in particular to a method for adjusting copper surface data spacing and intelligently judging a copper bridge to be supplemented in the computer aided manufacturing of a printed circuit board.
Background
As the circuit density of printed circuit boards increases, it is common to use computer aided manufacturing CAM software to complete the design manufacturing. In the routine work of CAM engineers in the PCB manufacturer, one of the items is to modify the copper data of the PCB to match the process capability of the manufacturer, so that the final product can meet the original design to the maximum extent and the overall production yield can be increased.
The correction of the copper surface data mainly comprises the adjustment of the distance between the isolated copper foil and the large-area copper foil and the copper bridge supplement. The copper bridge is a line which needs to be connected between two adjacent copper surface hollowed areas in a large-area copper foil, the copper bridge is easy to break in the design process of the copper bridge, and how to optimize the copper bridge is a key concern of CAM engineers. In the prior art, most CAM software needs to manually select a copper bridge to be repaired, so that more manpower and working hours are wasted, and improvement is needed.
Disclosure of Invention
The invention mainly solves the technical problem of providing a method for adjusting the copper surface data interval of the printed circuit board and intelligently judging and supplementing a copper bridge, automatically adjusting the copper surface data interval, judging and supplementing the copper bridge, improving the intelligent level and reducing the labor cost.
In order to solve the technical problems, the invention adopts a technical scheme that: the method for adjusting the data spacing of the copper surface of the printed circuit board and intelligently judging the copper bridge supplement comprises the following steps of:
step 1: reading manufacturing data in the printed circuit board computer aided manufacturing CAM through computer software for preprocessing;
step 2: judging the isolated bonding pad and the large-area copper surface by software;
and 3, step 3: optimizing the spacing of the isolated copper, namely manually setting spacing parameters between an isolated pad and a large-area copper surface, and completing the adjustment of the data spacing of the copper surface through software;
and 4, step 4: the optimization of the copper bridge, the width of the copper bridge is set manually, and then the copper bridge is judged and supplemented automatically through software;
and 5: the result of the copper bridge is automatically checked by software.
In a preferred embodiment of the present invention, in the step 2, the initial design pitch and the initial copper bridge width in the CAM for computer aided manufacturing of the printed circuit board are obtained by determining the isolated pads and determining the large-area copper surface.
In a preferred embodiment of the present invention, in the step 3, firstly, the attribute window of the copper surface is called out by software, the required pitch parameter is adjusted and set according to the manufacturing process capability, and then the software is handed over to compare the initial design pitch with the pitch parameter, so as to automatically complete the pitch optimization adjustment.
In a preferred embodiment of the present invention, in the step 4, the copper bridge width parameter is set according to the process capability, and then the software is handed over to compare the initial copper bridge width with the copper bridge width parameter, so as to determine the place where the copper bridge needs to be compensated, and complete the action of compensating the copper bridge.
In a preferred embodiment of the present invention, the place where the initial copper bridge width is smaller than the copper bridge width parameter is determined as the place where the copper bridge needs to be compensated.
In a preferred embodiment of the present invention, in said step 5, after the result of copper bridge repair is automatically checked by software, if there is still a place where copper bridge repair is needed, step 3 and step 4 are repeated, or separate copper bridge repair is manually performed.
The beneficial effects of the invention are: the method for adjusting the copper surface data interval of the printed circuit board and intelligently judging the copper bridge supplement can automatically adjust the copper surface data interval by computer aided manufacturing software, intelligently judges the position needing the copper bridge supplement, and completes the function of automatically supplementing the copper bridge.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic diagram of an initial design pitch in a computer-aided manufacturing CAM for a printed circuit board;
FIG. 2 is a schematic diagram of the structure of FIG. 1 after adjusting the data spacing between copper surfaces;
FIG. 3 is a schematic diagram of the initial copper bridge width in a printed circuit board computer aided manufacturing CAM;
fig. 4 is a schematic structural diagram of fig. 3 after copper bridge supplement is completed.
The parts in the drawings are numbered as follows: 1. large copper surface, 2 copper surface hollowed area, 3 isolated copper surface, 4 copper bridge.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the editing of the printed circuit board, the copper surface object is usually reduced and shielded, but the network is easily broken due to too much reduction of the copper surface, and at this time, the traditional method is to be gradually repaired by a CAM engineer to make the network smoothly connected, which is commonly called as copper bridge repairing. The method can automatically balance between the reduction of the copper surface object and the repair of the broken copper bridge aiming at the related problems, thereby greatly reducing the repair labor and time.
Referring to fig. 1 to 4, an embodiment of the present invention includes:
a method for adjusting the data spacing of a copper surface of a printed circuit board and intelligently judging a copper bridge supplement comprises the following steps:
step 1: reading manufacturing data in the printed circuit board computer aided manufacturing CAM through computer software for preprocessing;
step 2: judging isolated pads and large-area copper surfaces by software, wherein as shown in fig. 1, hollowed copper surface regions 2 are distributed on a large-area copper surface 1 to obtain isolated copper surfaces 3 (isolated pads), and through the judgment of the isolated pads and the judgment of the large-area copper surfaces, an initial design interval and an initial copper bridge width in the CAM for computer-aided manufacturing of the printed circuit board are obtained, wherein in the embodiment, as shown in fig. 1, the hollowed copper surface regions 2 are of an annular structure, the width of the hollowed copper surfaces is 8 mils, namely, the initial design interval is 8 mils, and as shown in fig. 3, the initial copper bridge width is no or less than 5 mils;
and step 3: optimizing the isolated copper space, namely manually setting space parameters between an isolated pad and a large-area copper surface 1, and then completing the adjustment of the data space of the copper surface through software, in the embodiment, firstly calling out an attribute window of the copper surface through the software, adjusting and setting required space parameters according to the manufacturing process capability, as shown in fig. 2, adjusting the width of a copper surface hollowed area 2 to be 10 mils (space parameter), further hollowing the large-area copper surface 1, and then submitting the copper surface to the software to compare the initial design space with the space parameters, and automatically completing the optimization adjustment of the space;
and 4, step 4: the optimization of the copper bridge, set up the width of the copper bridge through the manpower first, and then judge and mend the copper bridge automatically through the software, the place that the width of initial copper bridge is smaller than the width parameter of the copper bridge, judge as needing to mend the place of the copper bridge, in this embodiment, set up the width parameter of the copper bridge according to the process ability, for example, set up the width of the copper bridge as 5 mils, then give to the software and carry on the contrast of the width parameter of initial copper bridge and copper bridge, judge the place needing to mend the copper bridge, and finish the movements to mend the copper bridge, as shown in fig. 4, mend the copper bridge automatically, in addition, the width of the copper face hollowed out area 2 in step 3 expands, may make the width of the place copper bridge that originally does not need to mend the copper bridge less than 5 mils, is judged as needing to mend the place of the copper bridge, carry on the movements to mend the copper bridge;
and 5: the result of the copper bridge is automatically checked through software, after the result is obtained, if the place where the copper bridge needs to be supplemented is still available, when the place where the copper bridge needs to be supplemented is more, the step 3 and the step 4 can be repeated, the copper bridge is subjected to interval adjustment and intelligent judgment, and when the place where the copper bridge is supplemented is less, the copper bridge can be manually and independently supplemented.
In summary, the method for adjusting the copper surface data spacing and intelligently judging the copper bridge supplement of the printed circuit board provided by the invention can adjust the copper surface data spacing of the printed circuit board, intelligently judge the copper bridge supplement place and automatically supplement the copper bridge, can ensure the correctness of the circuit, and is beneficial to improving the working efficiency and the yield of a factory production line.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are also included in the scope of the present invention.
Claims (5)
1. A method for adjusting the data spacing of copper surfaces of a printed circuit board and intelligently judging a copper bridge supplement is characterized by comprising the following steps:
step 1: reading the manufacturing data in the computer-aided manufacturing CAM of the printed circuit board through computer software for preprocessing;
step 2: judging the isolated bonding pad and the large-area copper surface by software;
and 3, step 3: optimizing the isolated copper space, namely manually setting space parameters between an isolated pad and a large-area copper surface, and then completing the adjustment of the data space of the copper surface through software;
and 4, step 4: the optimization of the copper bridge, the width of the copper bridge is set manually, and then the copper bridge is judged and supplemented automatically through software;
and 5: and (4) automatically checking the result of the copper bridge supplement through software, if the copper bridge needs to be supplemented at a place, repeating the step (3) and the step (4) when the copper bridge needs to be supplemented at a plurality of places, adjusting the distance and intelligently judging the copper bridge to supplement the copper bridge, and selecting manual work to supplement the copper bridge when the copper bridge needs to be supplemented at a small place.
2. The method for adjusting the data pitch of the copper surfaces of the printed circuit board and intelligently judging the copper bridge supplement according to claim 1, wherein in the step 2, the initial design pitch and the initial copper bridge width in the CAM for computer aided manufacturing of the printed circuit board are obtained through the judgment of the isolated bonding pads and the judgment of the large-area copper surfaces.
3. The method for adjusting the copper surface data spacing and intelligently judging the copper bridge filling of the printed circuit board according to claim 2, wherein in the step 3, firstly, the attribute window of the copper surface is called out through software, the required spacing parameter is adjusted and set according to the manufacturing process capability, and then the software is handed over to compare the initial design spacing with the spacing parameter, so as to automatically complete the spacing optimization adjustment.
4. The method according to claim 2, wherein in step 4, the copper bridge width parameter is set according to the process capability, and then software is used to compare the initial copper bridge width with the copper bridge width parameter, determine the location where the copper bridge needs to be compensated, and complete the copper bridge compensation.
5. The method for adjusting the data pitch of the copper surface of the printed circuit board and intelligently judging the copper bridge filling according to claim 4, wherein the place where the initial copper bridge width is smaller than the copper bridge width parameter is judged as the place where the copper bridge needs to be filled.
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| CN202110772132.6A CN113435156B (en) | 2021-07-08 | 2021-07-08 | Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement |
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| CN202110772132.6A CN113435156B (en) | 2021-07-08 | 2021-07-08 | Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement |
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| CN113435156B true CN113435156B (en) | 2022-07-22 |
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Citations (1)
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| CN109815556A (en) * | 2018-12-30 | 2019-05-28 | 广州兴森快捷电路科技有限公司 | A kind of recognition methods, device, equipment and the storage medium of line layer isolated area |
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| CN1741716A (en) * | 2004-08-25 | 2006-03-01 | 上海展华电子有限公司 | Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam |
| US9437516B2 (en) * | 2014-01-07 | 2016-09-06 | Infineon Technologies Austria Ag | Chip-embedded packages with backside die connection |
| CN103942395B (en) * | 2014-04-30 | 2017-04-12 | 天津普林电路股份有限公司 | Quick detection and correction method for narrowest copper-face connection portion of high-precision interconnection circuit board |
| CN105095606A (en) * | 2015-09-15 | 2015-11-25 | 中国兵器工业集团第二一四研究所苏州研发中心 | Design method for increasing PCB yield |
| CN107509302A (en) * | 2017-07-28 | 2017-12-22 | 胜宏科技（惠州）股份有限公司 | A kind of multi-functional wiring board detection module and detection method |
| CN108536915B (en) * | 2018-03-13 | 2022-10-25 | 京信网络系统股份有限公司 | Method and device for designing bonding pad in PCB design drawing of printed circuit board |
| CN110402031A (en) * | 2019-08-09 | 2019-11-01 | 景旺电子科技(龙川)有限公司 | It is a kind of for adding the method and system of circuit board copper bridging wiring |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109815556A (en) * | 2018-12-30 | 2019-05-28 | 广州兴森快捷电路科技有限公司 | A kind of recognition methods, device, equipment and the storage medium of line layer isolated area |
Non-Patent Citations (1)
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| 基于"印刷电路板制作"的电子工艺训练课程新增训练项目的教学与实践;李欣等;《黑龙江科学》;20161031(第19期);第88-89、143页 * |
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