CN113411993A - Electronic transmission control device - Google Patents

Electronic transmission control device Download PDF

Info

Publication number
CN113411993A
CN113411993A CN202110485576.1A CN202110485576A CN113411993A CN 113411993 A CN113411993 A CN 113411993A CN 202110485576 A CN202110485576 A CN 202110485576A CN 113411993 A CN113411993 A CN 113411993A
Authority
CN
China
Prior art keywords
circuit board
housing
board arrangement
transmission control
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110485576.1A
Other languages
Chinese (zh)
Other versions
CN113411993B (en
Inventor
托马斯·普罗伊施尔
约瑟夫·洛伊布尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Publication of CN113411993A publication Critical patent/CN113411993A/en
Application granted granted Critical
Publication of CN113411993B publication Critical patent/CN113411993B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Abstract

The invention relates to an electronic transmission control device having a housing, a circuit board arrangement and an electrical or electronic component mounted on the circuit board arrangement, wherein the circuit board arrangement extends partially within the housing in a region sealed with respect to the oil and partially outside the housing in a region not sealed with respect to the oil, and wherein the circuit-board arrangement has a plurality of electrically conductive conductor trace layers, which are electrically insulated from one another by dielectric layers, and wherein, in a section of the circuit board arrangement extending outside the housing in a region that is not sealed against oil, a final closed outermost layer made of an oil-resistant, electrically insulating material is applied to the outer, electrically conductive conductor trace layer, except for the interface for electrically contacting the electrical or electronic component to the circuit board arrangement.

Description

Electronic transmission control device
The present application is a divisional application of the chinese invention patent application having PCT application numbers PCT/EP2015/063786, No. 201580038675.8, and an invention name of "electronic transmission control device and manufacturing method thereof", which was applied on 19/6/2015 in 2015, entered the chinese country on 16/1/2017.
Technical Field
The present invention relates to an electronic transmission control device.
Background
An electronic transmission control device known from practice has a housing, a circuit board arrangement and an electrical or electronic component mounted on the circuit board arrangement. The circuit board arrangement of the electronic transmission control device is located partly within the housing in a region sealed from oil and partly outside the housing in a region unsealed from oil. The circuit board arrangement has a plurality of electrically conductive conductor trace layers, which are electrically insulated from one another by dielectric layers. In the case of the circuit board arrangements of electronic transmission control devices known from practice, a further dielectric layer is laminated on the outer electrically conductive conductor trace layer, onto which further dielectric layer an electrically conductive contact layer is applied, which is subsequently removed over a large area by etching and is only retained in the region of an electrical interface which is used to bring the electrical or electronic component into contact with the conductor trace layer of the circuit board arrangement. The regions of the contact layer applied to the outer dielectric layer which have been etched but not removed in the region of the electrical interface are provided with a nickel-and gold-containing coating in order to protect these regions from corrosion caused by oil. This results in a relatively complex design of the circuit board arrangement of the electronic transmission control device known from practice.
Disclosure of Invention
Starting from this, the invention is based on the object of providing a novel electronic transmission control device and a method for the production thereof.
This object is achieved by an electronic transmission control device according to the invention.
According to the invention, at least in a section of the circuit board arrangement extending outside the housing in the region that is not sealed against oil, a final closed outermost layer made of an oil-resistant, electrically insulating material is applied to the outer, electrically conductive conductor trace layer, with the exception of an interface for electrically contacting the electrical or electronic component to the circuit board arrangement.
The circuit board arrangement of the electronic transmission control device according to the invention has a simpler and more compact structure. The final closed layer, which is made of an electrically insulating material, is applied to the outer, electrically conductive conductor trace layer. However, no conductive contact layer is applied to these final layers. Thereby, the number of conductive layers is reduced by two compared to the prior art. The lamination and etching processes required for the already saved electrically conductive contact layers according to the prior art are thus also eliminated. This makes it possible to manufacture the electronic transmission control device more simply and at lower cost.
Preferably, the circuit board arrangement has four electrically conductive conductor trace layers, which are electrically insulated from one another by three dielectric layers, wherein, at least in a section of the circuit board arrangement extending outside the housing, apart from the interface, a final closed outermost layer made of an oil-resistant, electrically insulating material is applied to the outer electrically conductive conductor trace layer. Such an electronic transmission control device has a circuit board arrangement with a particularly compact and simple structure.
According to an advantageous first refinement of the invention, the outermost layer of each final closure made of an oil-resistant, electrically insulating material is configured as a laminate made of a polyimide film or of a prepreg. This refinement of the invention is particularly suitable when the housing of the electronic transmission control unit is produced as a multishell die-cast aluminum housing.
According to an alternative, advantageous second development of the invention, the respective final closed outermost layer made of oil-resistant, electrically insulating material is designed as an injection-molded layer made of plastic. This refinement of the invention is particularly suitable when the housing of the electronic transmission control unit is embodied as a plastic injection-molded housing.
Drawings
Preferred modifications will appear from the following description. Embodiments of the invention are explained in detail with the aid of the figures, without being restricted thereto. In the drawings:
fig. 1 shows a schematic cross-sectional view through an electronic transmission control device according to the invention.
Detailed Description
The present invention relates to an electronic transmission control device, which is used, for example, in an automated manual transmission of a motor vehicle.
Fig. 1 shows a very schematic representation of an electronic transmission control device 10 according to the invention. The electronic transmission control device 10 has a housing 11, a circuit board arrangement 12 and electrical or electronic components 13, 14 which are mounted on the circuit board arrangement 12 and are in electrical contact therewith. The circuit board arrangement 12 has a section 15, which section 15 is positioned within the housing 11 in a region sealed from the transmission oil. A further section 16 of the circuit board arrangement 12 is arranged outside the housing 11 in a region that is not sealed with respect to the transmission oil.
The circuit board arrangement 12 has a plurality of electrically conductive conductor trace layers 17a, 17b, 17c and 17 d. These electrically conductive conductor trace layers 17a, 17b, 17c and 17d are electrically insulated from one another by dielectric layers 18a, 18b and 18 c. In the embodiment shown there are four conductor trace layers 17a, 17b, 17c and 17d and three such dielectric layers 18a, 18b and 18 c.
At least in a section 16 of the circuit board arrangement 12, which extends outside the housing 11 in the region that is not sealed with respect to transmission oil, a final closed outermost layer 20, 21 of an oil-resistant, electrically insulating dielectric material is applied to the outer electrically conductive conductor trace layers 17a and 17d, in addition to an electrical interface 19 for contacting the electrical or electronic component 14 with the conductor trace layers 17a and 17 d.
No further electrically conductive layer is then applied to these closed final layers 20, 21, i.e. no contact layers are applied to them, which are subsequently removed over a large area by etching, to be precise, the layer 20 or 21 applied to the outer conductor trace layer 17a, 17d, which is made of an oil-resistant, electrically insulating material, is a closed or final layer of the circuit board arrangement 12 in the section 16 of the circuit board arrangement protruding from the housing 11.
According to a first variant of the invention, the respective closed final layer 20 or 21 made of an oil-resistant, electrically insulating material is constructed as a laminate made of a polyimide film. When the closed final layer 20 or 21 made of polyimide film is then formed, these layers are only applied locally to the outer conductor trace layers 17a, 17d, i.e. where the conductors of these conductor trace layers 17a, 17d actually run.
According to a second variant, the respective closed final layers 20, 21 are constructed as a stack of prepregs. Such laminates made of prepregs are less expensive than those made of polyimide films, so that these laminates made of prepregs are then applied over their full surface in the region of the outer conductor trace layers 17a, 17d to be covered, leaving the electrical interface 19 free.
When the housing 11 of the electronic transmission control device 10 is formed by a multi-shell die-cast aluminum housing and the shells of these die-cast aluminum housings are pressed together, the closed final layers 20, 21 made of polyimide film or made of prepreg are then used.
When the housing 11 of the electronic transmission control device 10 is made of plastic and is designed as a plastic injection-molded housing, the closed final layers 20, 21 are then preferably likewise made of plastic. The final layers 20, 21 made of plastic are typically applied locally to the outer conductor trace layers 17a, 17b, i.e. where the conductors of these conductor trace layers 17a, 17d are actually distributed.
In order to produce the electronic transmission control device 10 according to the invention, provision is made first of all for a core layer 18a of insulating dielectric material to be produced, which is laminated on both sides with inner, electrically conductive conductor trace layers 17b and 17 c. These inner conductor trace layers 17b, 17c are subjected to etching in order to build up the desired conductor trace structure on them.
Onto the etched conductor trace layers 17b, 17c of the core layer 18a, in each case, a further layer 18b or 18c of an electrically insulating dielectric material is applied, wherein onto these further electrically insulating dielectric layers 18b, 18c further electrically conductive conductor trace layers 17a or 17d are applied, which are subsequently subjected to etching in order to build up the desired conductor trace structure in the region of these outer conductor trace layers 17a and 17 d.
Although this step can be repeated a number of times, it is preferably carried out only once, that is to say that on both sides of the core layer 18a, only one further dielectric layer 18b and 18c is applied onto the conductor trace layers 17b, 17c accommodated by the core layer 18a, together with the conductor trace layers 17a, 17d treated by etching.
Following the etching of the outer conductor trace layers 17a, 17d, a respective closed final layer 20 or 21 of an oil-resistant, electrically insulating material is applied to the outer conductor trace layers, i.e. in the section 16 of the circuit board arrangement 12 extending outside the housing 11 in the region not sealed with respect to oil.
As already mentioned, these final layers 20, 21 can be formed as a laminate made of polyimide films or prepregs or alternatively as a plastic injection molding layer.
Fig. 1 shows: within the housing 11, in the region sealed from oil, a layer 22 made of solder resist can be applied in the respective section 15 of the circuit board arrangement 12. Such solder resists are not resistant to transmission oil and are therefore not suitable for use in sections 16 of the circuit board 12 that are subject to transmission oil attack.
The interfaces 19 which are left free by the respective finally closed outermost layers 20, 21 in the section 16 of the circuit board arrangement 12 are preferably provided with a nickel-and gold-containing coating in order to protect the interfaces against corrosion caused by oil.
The circuit board arrangement 12 of the electronic transmission control device 10 according to the invention has a simple and compact structure and can be produced at a lower cost than the circuit board arrangement of known transmission control devices. Two conductive layers are saved, so that there is less overlap of the two conductive layers and there is no need to partially strip the two conductive layers by etching. The circuit board arrangement 12 of the transmission control device 10 according to the invention can thus be reduced in its thickness and complexity.
List of reference numerals
10 Transmission control device
11 casing
12 circuit board facility
13 structural component
14 structural component
15 section
16 sectors
17a conductor trace layer
17b conductor trace layer
17c conductor trace layer
17d conductor trace layer
18a dielectric layer
18b dielectric layer
18c dielectric layer
19 interface
20 layers of
21 layers of
22 layers of

Claims (7)

1. Electronic transmission control device (10) having a housing (11), a circuit board arrangement (12), and electrical or electronic components (13, 14) mounted on the circuit board arrangement (12), wherein the circuit board arrangement (12) extends partially within the housing (11) in a region sealed from oil and partially outside the housing (11) in a region unsealed from oil, and wherein the circuit board arrangement (12) has a plurality of electrically conductive conductor trace layers (17a, 17b, 17c, 17d) which are electrically insulated from one another by dielectric layers (18a, 18b, 18c), characterized in that the circuit board arrangement (12) is partially in a section (15) of the circuit board arrangement (12) extending within the housing (11) in a region sealed from oil and partially in a section (15) of the circuit board arrangement (12) of the circuit board arrangement (11) which is outside the housing (11) and is not sealed from oil In a section (16) extending in the sealed region, final closed outermost layers (20, 21) made of an oil-resistant, electrically insulating material are applied to the outer electrically conductive conductor trace layers (17a, 17d) except for an interface (19) for electrically contacting the electrical or electronic component (13, 14) to the circuit board arrangement (12), wherein each final closed outermost layer (20, 21) is designed as a laminate made of prepreg.
2. The electronic transmission control device according to claim 1, characterized in that the circuit board arrangement (12) has four electrically conductive conductor trace layers (17a, 17b, 17c, 17d) which are electrically insulated from one another by three dielectric layers (18a, 18b, 18c), and that, at least in a section (16) of the circuit board arrangement (12) extending outside the housing (11), a final closed outermost layer (20, 21) of an oil-resistant, electrically insulating material is applied to the outer electrically conductive conductor trace layer (17a, 17d) outside the interface (19).
3. The electronic transmission control device according to claim 1 or 2, characterized in that each final closed outermost layer (20, 21) is configured as a laminate made of a polyimide film.
4. An electronic transmission control device according to claim 3, characterised in that the housing (11) is constructed as a multi-shell die-cast aluminium housing, the shells of which are pressed together.
5. The electronic transmission control device according to claim 1, characterized in that the housing (11) is configured as a multi-shell die-cast aluminum housing, the shells of which are pressed together.
6. The electronic transmission control device according to claim 1 or 2, characterized in that each final closed outermost layer (20, 21) is configured as an injection molded layer made of plastic.
7. The electronic transmission control device according to claim 6, characterized in that the housing (11) is configured as a plastic injection molded housing.
CN202110485576.1A 2014-07-18 2015-06-19 Electronic transmission control device Active CN113411993B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102014214057.9 2014-07-18
DE102014214057.9A DE102014214057A1 (en) 2014-07-18 2014-07-18 Electronic transmission control device and method of manufacturing the same
PCT/EP2015/063786 WO2016008672A1 (en) 2014-07-18 2015-06-19 Electronic transmission controller, and method for producing same
CN201580038675.8A CN106538077A (en) 2014-07-18 2015-06-19 Electronic transmission controller, and method for producing same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580038675.8A Division CN106538077A (en) 2014-07-18 2015-06-19 Electronic transmission controller, and method for producing same

Publications (2)

Publication Number Publication Date
CN113411993A true CN113411993A (en) 2021-09-17
CN113411993B CN113411993B (en) 2022-10-21

Family

ID=53488310

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110485576.1A Active CN113411993B (en) 2014-07-18 2015-06-19 Electronic transmission control device
CN201580038675.8A Pending CN106538077A (en) 2014-07-18 2015-06-19 Electronic transmission controller, and method for producing same

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580038675.8A Pending CN106538077A (en) 2014-07-18 2015-06-19 Electronic transmission controller, and method for producing same

Country Status (5)

Country Link
US (1) US10440845B2 (en)
JP (1) JP6618986B2 (en)
CN (2) CN113411993B (en)
DE (1) DE102014214057A1 (en)
WO (1) WO2016008672A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601826A1 (en) * 1986-07-17 1988-01-22 Alsthom Cgee Flexible electrical-connection strip
CN1531740A (en) * 2000-11-09 2004-09-22 应用材料有限公司 Power distribution printed circuit board for semiconductor processing system
CN101552255A (en) * 2008-04-05 2009-10-07 赛米控电子股份有限公司 Power semiconductor module with hermetically sealed switching assembly and corresponding production method
CN101690437A (en) * 2007-06-28 2010-03-31 罗伯特.博世有限公司 Electric control device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249466A (en) * 1975-10-20 1977-04-20 Fujitsu Ltd Method of forming solder mask
JPH10213366A (en) * 1997-01-29 1998-08-11 Matsushita Electric Ind Co Ltd Inverter device of mobile air conditioner
JP2002158046A (en) * 2000-11-17 2002-05-31 Yazaki Corp Attachment module
JP4191378B2 (en) * 2000-11-30 2008-12-03 イビデン株式会社 Method for manufacturing printed wiring board
US6608757B1 (en) * 2002-03-18 2003-08-19 International Business Machines Corporation Method for making a printed wiring board
DE10340974A1 (en) * 2003-09-05 2005-03-24 Robert Bosch Gmbh Control unit for motor vehicles braking systems comprises a frame having a recess filled with a sealing gel which is viscous enough the flow around electrical strip conductors in the recess
JP4478007B2 (en) * 2004-12-16 2010-06-09 日立オートモティブシステムズ株式会社 Electronic circuit device and manufacturing method thereof
JP4291279B2 (en) * 2005-01-26 2009-07-08 パナソニック株式会社 Flexible multilayer circuit board
JP5001542B2 (en) * 2005-03-17 2012-08-15 日立電線株式会社 Electronic device substrate, method for manufacturing the same, and method for manufacturing the electronic device
JP2010219093A (en) * 2009-03-13 2010-09-30 Aisin Aw Co Ltd Electronic circuit device
JP5406062B2 (en) * 2010-01-26 2014-02-05 パナソニック株式会社 Automotive printed wiring boards
JP5589735B2 (en) * 2010-10-06 2014-09-17 日本電気株式会社 Electronic component built-in substrate and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601826A1 (en) * 1986-07-17 1988-01-22 Alsthom Cgee Flexible electrical-connection strip
CN1531740A (en) * 2000-11-09 2004-09-22 应用材料有限公司 Power distribution printed circuit board for semiconductor processing system
CN101690437A (en) * 2007-06-28 2010-03-31 罗伯特.博世有限公司 Electric control device
CN101552255A (en) * 2008-04-05 2009-10-07 赛米控电子股份有限公司 Power semiconductor module with hermetically sealed switching assembly and corresponding production method

Also Published As

Publication number Publication date
DE102014214057A1 (en) 2016-01-21
CN106538077A (en) 2017-03-22
CN113411993B (en) 2022-10-21
US20170171996A1 (en) 2017-06-15
WO2016008672A1 (en) 2016-01-21
JP2017528906A (en) 2017-09-28
US10440845B2 (en) 2019-10-08
JP6618986B2 (en) 2019-12-11

Similar Documents

Publication Publication Date Title
US9674969B2 (en) Flexible printed circuit board and manufacturing method thereof
CN103687344B (en) Circuit board manufacturing method
CN105097247A (en) Inductor, coil substrate, and manufacturing method of coil substrate
KR20170084156A (en) Electronic component and method of manufacturing same
US20070000687A1 (en) Apparatus and method for an embedded air dielectric for a package and a printed circuit board
JP5924461B1 (en) Composite electronic components
CN104349575A (en) Flexible circuit board and manufacturing method thereof
WO2014162478A1 (en) Component-embedded substrate and manufacturing method for same
US20160081191A1 (en) Printed circuit board and manufacturing method thereof
US11570904B2 (en) Method for contacting and rewiring an electronic component embedded into a printed circuit board
KR20150008771A (en) Printed Circuit Board Having Embedded Electronic Device And Manufacturing Method Thereof
JP2019091841A (en) Electronic circuit board
US8723050B2 (en) Multilayer printed circuit board and method for making same
CN104768318A (en) Flexible-rigid combination circuit board and manufacturing method thereof
CN113411993B (en) Electronic transmission control device
FI126777B (en) A method for manufacturing a flexible circuit board and a flexible circuit board
CN105592639A (en) Circuit board and manufacturing method thereof
US20130220683A1 (en) Printed circuit board and method for manufacturing printed circuit board
US10278282B2 (en) Substrate structure and manufacturing method thereof
TWI419624B (en) Combined multilayered circuit board having embedded electronic components and manufacturing method of the same
TWI615075B (en) Flexible circuit board and manufacturing method for same
US20170084509A1 (en) Substrate, chip package with same and method for manufacturing same
JP6863244B2 (en) Electronic components and manufacturing methods for electronic components
RU2575641C2 (en) Method of making radioelectronic components
US20170261037A1 (en) Rolling bearing comprising an electric circuit, and method for producing an electric circuit for a rolling bearing

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant