CN113395876B

CN113395876B - Heat dissipation plate of BSG motor inverter and processing method

Info

Publication number: CN113395876B
Application number: CN202110614703.3A
Authority: CN
Inventors: 郭慧; 倪鹏; 韩振
Original assignee: Jiangsu Yunyi Electric Co Ltd
Current assignee: Prestolite Electric Weifang Ltd
Priority date: 2021-06-02
Filing date: 2021-06-02
Publication date: 2022-04-19
Anticipated expiration: 2041-06-02
Also published as: CN113395876A

Abstract

The invention discloses a heat dissipation plate of a BSG motor inverter, which comprises a heat dissipation plate body, wherein the upper end surface of the heat dissipation plate body is a bearing surface, the lower end surface of the heat dissipation plate body is an assembly surface, a capacitor module mounting groove is formed in the middle of the bearing surface, a U-shaped runner groove is formed in the periphery of the capacitor module mounting groove, a cover plate is arranged on the U-shaped runner groove in a sealing mode, runner ports are formed in the assembly surfaces of two ends of the U-shaped runner groove, the groove wall and the groove bottom of the capacitor module mounting groove are sealed without holes, and a capacitor module positioning boss is arranged at the groove bottom of the capacitor module mounting groove. Also discloses a method for processing the heat dissipation plate of the BSG motor inverter. Through the setting of the sealed sclausura of cell wall and the tank bottom of electric capacity module mounting groove and electric capacity module location boss, heating panel glue leakage when effectively preventing electric capacity module encapsulating to solve the not good problem of encapsulating technology effect.

Description

Heat dissipation plate of BSG motor inverter and processing method

Technical Field

The invention belongs to the technical field of BSG motor inverters, and particularly relates to a heat dissipation plate of a BSG motor inverter and a processing method.

Background

Energy conservation and emission reduction are common responsibilities of all human beings and strong desires of most social members. Under the environment that fossil fuels are increasingly exhausted and the automobile technology is rapidly developed, the national requirements on automobile oil consumption and emission are more and more strict. Although the BSG technology is not as good as the fuel cell and pure electric technology no matter the energy saving and emission reduction effect or the advanced degree, the technology is gradually seen by experts in the industry, and may occupy the position of the energy saving and emission reduction mainstream technology of the traditional power automobile for a long time in the future. The BSG technology has the greatest advantages of small change to the whole vehicle and limited increased cost. Taking the case of the Chery A5 equipped with the BSG, the manufacturer prices are 7.48 ten thousand yuan, and compared with the ordinary A5 with the price of 6.98 ten thousand, the price is increased by about 7 percent, thereby creating conditions for the ordinary consumers to purchase BSG vehicle models. Moreover, with the expansion of market scale, the application cost of the BSG technology is expected to be further reduced, and when the price difference between the BSG vehicle type and the price of the traditional power vehicle of the same type is reduced to a certain degree, the cost factor of the BSG technology can be almost ignored. In addition, the problems of high battery attenuation, short endurance mileage, low charging speed and the like of the existing new energy automobile exist, so that the convenience degree of the popularization and the use of the pure electric automobile is greatly influenced, and particularly in the field of commercial vehicles, the pure electric commercial vehicle is limited in current development due to the large driving mileage and large output power. The 48V BSG (Belt-drive Starter Generator) belongs to the weak mixing technology in hybrid power, is a motor system integrating an inverter controller and a motor, and can realize the quick start and stop of the motor when an automobile is idling and recover energy when the automobile is braked. The power is provided during climbing, the comprehensive oil-saving efficiency can reach 8-12%, and the environment pollution and the energy consumption are reduced, and the products and parts are recycled or reused according to the green design principle known as '3R', namely Reduce, Reuse and Recycle. The BSG system mainly comprises a motor and a control inverter, wherein the control inverter is the key for realizing the functions of the BSG system and comprises a capacitor module, a power module, a PCB module and other parts, and high-temperature heat generated in the operation of the system can directly influence the functions of electronic components in the control inverter, so that the BSG system is usually required to be effectively cooled by using cooling liquid.

In the prior art, when a capacitor module mounting groove is designed, positioning holes matched with other structures are often needed to be formed in the bottom of the groove, such as PIN PIN positioning holes, and the arrangement of the positioning holes leads to the connection of the capacitor module and a heat dissipation plate, so that the glue filling effect is seriously affected and even glue leakage is generated to further affect a PCB module when the glue filling process is carried out. Therefore, the heat dissipation plate of the BSG motor inverter and the processing method are designed.

Disclosure of Invention

The invention aims to provide a heat dissipation plate of a BSG motor inverter and a processing method thereof, and aims to solve the problem of poor glue pouring process effect in the background technology.

In order to achieve the purpose, the specific technical scheme of the heat dissipation plate of the BSG motor inverter and the processing method is as follows:

the utility model provides a BSG motor inverter's heating panel, includes the heating panel body, heating panel body up end is the loading end, and the terminal surface is the assembly face down, the loading end middle part is equipped with electric capacity module mounting groove, and the periphery of electric capacity module mounting groove is equipped with U type runner groove, and U type runner groove is sealed to be equipped with the apron, and U type runner groove both ends are equipped with the runner mouth at the assembly face, and the cell wall and the sealed sclausura of tank bottom of electric capacity module mounting groove are equipped with electric capacity module location boss, and the tank bottom of electric capacity module mounting groove is equipped with electric capacity module location boss, and the setting of sclausura and electric capacity module location boss is sealed to cell wall and tank bottom through electric capacity module mounting groove, and heating panel glue leakage when effectively preventing electric capacity module encapsulating to solve the problem that encapsulating technological effect is not good.

Furthermore, the height of the capacitor module positioning boss is 3.4-5 mm, so that the glue filling effect is ensured, and the thickness of the heat dissipation plate body and even the space utilization rate of the inverter are not affected.

Furthermore, be equipped with on the electric capacity module location boss and keep away a breach for better and electric capacity module adapted.

Further, electric capacity module location boss up end is equipped with electric capacity module reference column, and electric capacity module reference column up end is equipped with the internal thread hole, the electric capacity module of the fixed different models of adaptation of being convenient for.

Furthermore, the U-shaped runner groove is internally provided with a turbulence component, so that the fluid disturbance effect of the cooling medium can be enhanced, the heat dissipation effect is enhanced, and the normal work of the power module is ensured.

Furthermore, the turbulence component is fixedly arranged at the bottom and/or the side wall of the U-shaped runner groove, so that the production and the manufacture are convenient.

Furthermore, the turbulence component is corrugated heat dissipation ribs and/or convex heat dissipation ribs, and can be flexibly selected and matched according to use requirements.

Furthermore, the assembly surface is provided with a PCB installation limiting wall along the closed loop of the end surface outline, so that the installation and the positioning of the PCB module can be effectively realized, and the PCB module is conveniently protected by glue pouring.

Furthermore, be equipped with power module welding area on the apron, power module welding area plane degree is not more than 0.4mm to reach better welding effect.

A processing method of a heat dissipation plate of a BSG motor inverter comprises the following steps:

firstly, processing a heat dissipation plate body and a cover plate, preparing to weld the heat dissipation plate body and the cover plate, and processing a step surface for welding at the welding position of the heat dissipation plate body and the cover plate;

secondly, completing welding, and performing finish machining treatment after welding;

and thirdly, electroplating the surface of the heat dissipation plate body.

Compared with the prior art, the invention has the following beneficial effects:

1. according to the capacitor module positioning structure, through the arrangement of the groove wall and the groove bottom seal imperforate of the capacitor module mounting groove and the capacitor module positioning boss, glue leakage of the heat dissipation plate during glue pouring of the capacitor module is effectively prevented, and therefore the problem of poor glue pouring process effect is solved.

2. The invention has compact structure, small volume and high consistency between the outline and the motor outline, and meets the small and light development requirements of the integrated BSG system.

3. The invention is provided with the U-shaped runner groove, so that the heat dissipation effect can be greatly improved through the circulation of the cooling medium, the weight of the heat dissipation plate can be reduced, and the heat dissipation requirement of the commercial vehicle BSG system inverter can be met.

4. The U-shaped runner groove is internally provided with the turbulence parts, the number and the shapes of the turbulence parts can be confirmed according to the heat dissipation demand, the universality is wide, the cooling medium fluid disturbance effect can be enhanced, the heat dissipation effect is enhanced, and the normal work of the power module is ensured.

5. The surface of the invention is electroplated, thus improving the weldability and the integral corrosion resistance of the heat dissipation plate body and the power module.

6. The invention can be divided into two components of the heat dissipation plate body and the cover plate during processing, and then welding is carried out, so that the tightness and the strength of the U-shaped runner groove are ensured.

Drawings

FIG. 1 is an exploded view of a load-bearing surface according to the present invention;

fig. 2 is a schematic view of the assembly plane of the present invention.

The reference numbers in the figures illustrate: 1. the capacitor module comprises a bearing surface, 11 capacitor module mounting grooves, 12U-shaped runner grooves, 121 turbulence components, 13 cover plates, 131 power module welding areas, 2 assembly surfaces, 21 runner ports, 22 PCB mounting limiting walls, 3 capacitor module positioning bosses, 31 avoidance notches, 32 capacitor module positioning columns and 33 internal thread holes.

The specific implementation mode is as follows:

for a better understanding of the objects, structure and function of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.

As shown in fig. 1 to 2, a heat dissipation plate of a BSG motor inverter is designed, which comprises a heat dissipation plate body, wherein the upper end surface of the heat dissipation plate body is a bearing surface 1, the lower end surface is an assembly surface 2, a capacitor module mounting groove 11 is arranged in the middle of the bearing surface 1, a U-shaped runner groove 12 is arranged on the periphery of the capacitor module mounting groove 11, a cover plate 13 is arranged on the U-shaped runner groove 12 in a sealing manner, flow channel ports 21 are arranged at two ends of the U-shaped runner groove 12 on the assembly surface 2, the groove wall and the groove bottom of the capacitor module mounting groove 11 are sealed without holes, a capacitor module positioning boss 3 is arranged at the groove bottom of the capacitor module mounting groove 11, the leakage of the heat dissipation plate during the glue filling of the capacitor module is effectively prevented, and the problem of poor glue filling process effect is solved.

A method for processing a heat dissipation plate of a BSG motor inverter comprises the following steps:

firstly, processing a heat dissipation plate body and a cover plate 13, preparing to weld the heat dissipation plate body with the cover plate 13, and processing a step surface for welding at the welding position of the heat dissipation plate body and the cover plate 13;

and thirdly, electroplating the surface of the heat dissipation plate body.

The cover plate is provided with a power module welding area 131, and the flatness of the power module welding area 131 is not more than 0.4mm, so that a better welding effect is achieved; the heat dissipation plate body further comprises a component positioning hole, the component positioning hole comprises an output screw positioning hole, a stator wire positioning hole, a PCB (printed circuit board) mounting positioning hole, a support PIN positioning hole, a plug mounting hole and a current sensor positioning hole, and the upper end face of the component positioning hole is not lower than the upper end face of the capacitor module mounting groove 11, so that the heat dissipation plate is effectively prevented from glue leakage when the capacitor module is filled with glue, and the PCB module is affected.

The inside hollow structure that is of heating panel body after making contains U type runner groove 12, and it is equipped with vortex part 121 corresponding power module welding area 131 department, vortex part 121 is fixed to be set up in U type runner groove 12 tank bottom and/or lateral wall, is convenient for produce manufacturing. Install capacitor module into capacitor module mounting groove 11 after, carry out the injecting glue in the capacitor module mounting groove, the injecting glue degree of depth is not more than the height of capacitor module location boss 3, when BSG motor during operation, liquid cooling medium flows in by the runner port, flow through U type runner groove 12, when the power module welding area 131 department of corresponding of flowing through, vortex part 121 forms effectual vortex to the inflow cooling medium, make it possess the torrent district characteristic, the radiating effect is improved, the cooling medium flows out through another runner port 21 after passing through U type runner groove 12.

In the above embodiment, 3 examples are listed to realize the above technical solution:

example 1

This embodiment is the height of capacitor module location boss 3 is 3.4mm, has both guaranteed the encapsulating effect, can not exert an influence to heating panel body thickness and even the space utilization of dc-to-ac converter again. Be equipped with on the capacitor module location boss 3 and keep away a breach 31 for better and capacitor module adapted. The upper end surface of the capacitor module positioning boss 3 is provided with an internal threaded hole 33 for being matched and fixed with a capacitor module. The flatness of the welding area 131 of the power module is 0.4mm, so as to achieve better welding effect.

The processing method comprises the following steps: the heat dissipation plate comprises a heat dissipation plate body and a cover plate 13 during machining, the cover plate 13 adopts a stamping process, the heat dissipation plate body adopts a die-casting process, and the turbulence members 121 are simultaneously die-cast during die-casting of the heat dissipation plate body, the turbulence members 121 are columnar protrusions, a step surface of 1mm is reserved at the welding contact position of the heat dissipation plate body and the cover plate 13, a friction stir welding head forms welding around the edge contour of the cover plate 13 during welding to realize sealing of the U-shaped runner groove 12, machining is performed on the surface of a welding area 131 of a power module of the cover plate 13 after welding to remove redundant materials, and the flatness of the welding surface is ensured to be not more than 0.4 mm; the surface of the heat dissipation plate is plated after machining.

Example 2

The embodiment is that the height of capacitor module location boss 3 is 5mm, has both guaranteed the encapsulating effect, can not exert an influence to heating panel body thickness and even the space utilization of dc-to-ac converter again. The U-shaped runner groove 12 is internally provided with a turbulence member 121, the turbulence member 121 is fixed at the bottom of the U-shaped runner groove 12 through welding, so that the turbulence effect of a cooling medium fluid can be enhanced, the heat dissipation effect is enhanced, and the normal work of the power module is ensured, the turbulence member 121 is a plate-shaped bulge, and the turbulence member 121 is arranged along the direction of the U-shaped runner groove 12; the 3 up end of electric capacity module location boss is equipped with electric capacity module reference column 32, and electric capacity module reference column 32 up end is equipped with internal thread hole 33, the electric capacity module of the fixed different models of adaptation of being convenient for. The flatness of the welding area 131 of the power module is 0.3mm, so as to achieve better welding effect.

The processing method comprises the following steps: the difference between this embodiment and embodiment 1 is that the heat sink body and the cover plate 13 are machined, the plate-shaped spoiler 121 is cut out, the spoiler 121 is fixed to the bottom of the U-shaped runner groove 12, and then the heat sink body and the cover plate 13 are welded by a cold welding process.

Example 3

The embodiment is that the height of capacitor module location boss 3 is 3.7mm, has both guaranteed the encapsulating effect, can not exert an influence to heating panel body thickness and even the space utilization of dc-to-ac converter again. The assembly surface 2 is provided with a PCB installation limiting wall 22 along the end surface outline in a closed loop mode, so that the installation and the positioning of a PCB module can be effectively realized, and the PCB module is conveniently protected by glue pouring. The surface electroplating treatment is nickel plating treatment and is used for improving the weldability of the heat dissipation plate body and the power module and the overall corrosion resistance of the heat dissipation plate body. The flatness of the welding area 131 of the power module is 0.25mm to achieve better welding effect.

The processing method comprises the following steps: the difference between this embodiment and the above-mentioned embodiment lies in that the punching press is made corrugated heat dissipation rib, with corrugated heat dissipation rib welded fastening in U type runner groove 12 tank bottom, simultaneously, corrugated heat dissipation rib both sides embedding U type runner groove 12's lateral wall, accomplish PCB installation limiting wall 22 when machining the heating panel body, use laser welding technology to accomplish the welding.

It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a heating panel of BSG motor inverter, includes the heating panel body, and heating panel body up end is loading face (1), and the lower terminal surface is assembling face (2), its characterized in that: bearing surface (1) middle part is equipped with capacitor module mounting groove (11), and the periphery of capacitor module mounting groove (11) is equipped with U type runner groove (12), and U type runner groove (12) are sealed to be equipped with apron (13), and U type runner groove (12) both ends are equipped with runner hole (21) at assembly surface (2), and the cell wall and the sealed sclausura in tank bottom of capacitor module mounting groove (11), and the tank bottom of capacitor module mounting groove (11) is equipped with capacitor module location boss (3).

2. The heat dissipation plate of the BSG motor inverter as claimed in claim 1, wherein the height of the capacitor module positioning boss (3) is 3.4-5 mm.

3. The heat dissipation plate of the BSG motor inverter as claimed in claim 1, wherein the positioning boss (3) of the capacitor module is provided with a clearance gap (31).

4. The heatsink of claim 1, wherein the capacitor module positioning bosses (3) have capacitor module positioning posts (32) on upper end surfaces thereof, and the capacitor module positioning posts (32) have internal threaded holes (33) on upper end surfaces thereof.

5. The heat sink for an inverter of a BSG motor as claimed in claim 1, wherein a flow disturbing member (121) is provided in said U-shaped flow channel groove (12).

6. The heatsink of claim 5, wherein the spoiler (121) is fixedly installed at a bottom and/or a side wall of the U-shaped channel groove (12).

7. The heatsink of claim 5, wherein the spoiler (121) is a corrugated heatsink rib and/or a convex heatsink rib.

8. Heat sink for a BSG motor inverter, according to claim 1, characterised in that the mounting surface (2) is provided with a PCB mounting limiting wall (22) in a closed loop along the end surface contour.

9. The heatsink of claim 1, wherein the cover plate (13) has a power module soldering region (131), and the flatness of the power module soldering region (131) is not greater than 0.4 mm.

10. A method for processing a heat dissipation plate of a BSG motor inverter, the method being used for processing the heat dissipation plate of the BSG motor inverter as claimed in any one of claims 1 to 9, and comprising the following steps:

firstly, processing a heat dissipation plate body and a cover plate (13), preparing the heat dissipation plate body to be welded with the cover plate (13), and processing a step surface for welding at the welding position of the heat dissipation plate body and the cover plate (13);

and thirdly, electroplating the surface of the heat dissipation plate body.