CN113394152B - Positioning device of support plate - Google Patents
Positioning device of support plate Download PDFInfo
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- CN113394152B CN113394152B CN202110660491.2A CN202110660491A CN113394152B CN 113394152 B CN113394152 B CN 113394152B CN 202110660491 A CN202110660491 A CN 202110660491A CN 113394152 B CN113394152 B CN 113394152B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a positioning device of a carrier plate, which comprises a conveying device and blocking devices, wherein the conveying device conveys the carrier plate along a first plane, the blocking devices can be arranged in a preset area and used for moving towards a set direction to abut against at least two opposite edges of the carrier plate, and then the blocking devices push the carrier plate oppositely along the first plane to ensure that adjacent sub-carrier plates in the carrier plate abut against preset positions. In the embodiment of the invention, the blocking device moves towards the set direction to abut against the opposite edges of the support plates, the blocking device can push the sub-support plates at the edges along the first plane in opposite directions, and the sub-support plates push the adjacent sub-support plates to move together until all the sub-support plates abut against the adjacent sub-support plates, so that the whole support plates are positioned, the positions of the sub-support plates are accurately determined, and the difficulty in taking and placing silicon wafers is reduced.
Description
Technical Field
The invention belongs to the technical field of solar cell production, and particularly relates to a positioning device of a carrier plate.
Background
In the production process of the solar cell, a carrier plate is usually adopted to carry the silicon wafer, so that the silicon wafer is used as a carrier to be transmitted among various parts of a production system, partial processing technologies such as detection, surface etching, silk-screen printing and the like of the silicon wafer are realized, and the solar cell with a preset circuit printed on the surface of the silicon wafer is finally obtained.
The related carrier plates are formed by arranging a plurality of sub-carrier plates, a non-complete fixing mode is adopted between the sub-carrier plates, the moving space between the adjacent sub-carrier plates is large, and the difficulty in taking and placing the silicon wafer is high.
Disclosure of Invention
In view of this, the present invention provides a positioning device for a carrier, so as to solve the technical problem of how to improve the stability between sub-carriers to reduce the difficulty of picking and placing silicon wafers.
The technical scheme of the invention is realized as follows:
the embodiment of the invention provides a positioning device of a carrier plate, wherein the carrier plate is formed by arranging a plurality of sub-carrier plates, and the positioning device comprises:
the conveying device is used for conveying the carrier plate along a first plane;
the at least two blocking devices are arranged in a preset area of the conveying device and used for moving towards a set direction to abut against at least two opposite edges of the carrier plate; and the blocking device pushes the carrier plate along the first plane in opposite directions in a state of abutting against the opposite edges of the carrier plate, so that the adjacent sub-carrier plates abut against preset positions.
Further, the set direction is perpendicular to the first plane.
Further, the blocking device comprises a first blocking component and a second blocking component which are arranged in the first direction at intervals of a preset distance, and the preset distance is greater than or equal to the length of the carrier plate along the first direction; the first blocking assembly and the second blocking assembly are used for pushing the carrier plate in the first direction in opposite directions; the first direction is a conveying direction of the carrier plate and is located in the first plane.
Further, the first blocking assembly is arranged at one end of the conveying device in the first direction, the second blocking assembly is arranged in the middle of the conveying device in the first direction, and the distance from the middle to the two ends of the conveying device in the first direction is larger than or equal to the length of the carrier plate in the first direction.
Further, the blocking device further comprises a third blocking component and a fourth blocking component which are arranged at intervals of a preset distance in the second direction, and the preset distance is larger than or equal to the length of the carrier plate along the second direction; the third blocking assembly and the fourth blocking assembly are used for pushing the carrier plate in the second direction in opposite directions; the second direction is perpendicular to the first direction and lies within the first plane.
Further, the first barrier assembly, the second barrier assembly, the third barrier assembly, and the fourth barrier assembly each include one of:
the overturning positioning structure comprises a first push plate, and the first push plate rotates between an extending direction parallel to the first plane and an extending direction vertical to the first plane in a crossed mode;
and the translational positioning structure comprises a second push plate, and the second push plate moves along the direction vertical to the first plane so as to intersect or be spaced with the first plane.
Further, the turning positioning structure further comprises:
a first support spaced from the first plane;
the rotating shaft is arranged at intervals with the first supporting piece and is rotatably connected with one side of the first push plate, and the length extending direction of the rotating shaft is parallel to the first direction or the second direction;
the first driving piece is fixed on the first supporting piece, and the first driving piece is connected with the other side of the first push plate and used for driving the first push plate to rotate around the rotating shaft.
Further, the translational positioning structure includes:
a second support member spaced from the first plane;
the mounting plate is movably connected with the second supporting piece and the second push plate;
the translation piece is arranged on the mounting plate and used for driving the second push plate to translate along the set direction relative to the mounting plate;
and the pushing piece is arranged on the second supporting piece and used for driving the second push plate to push the carrier plate.
Furthermore, the sub-carrier plate is arranged on a connecting line in a penetrating mode and is arranged in an area surrounded by the frame, and the connecting line is fixed with the frame; the first push plate and one side of second push plate all are provided with a plurality of archs at interval under the circumstances that first push plate and/or second push plate support the edge of support plate, the connecting wire is located a plurality ofly between the arch, so that the arch promotes sub-support plate.
Further, the preset area is an area where the conveying device is used for uploading or transferring the silicon wafers to or from the carrier plate.
The embodiment of the invention provides a positioning device of a carrier plate, which comprises a conveying device and blocking devices, wherein the conveying device conveys the carrier plate along a first plane, the blocking devices can be arranged in a preset area and used for moving towards a set direction to abut against at least two opposite edges of the carrier plate, and then the blocking devices push the carrier plate oppositely along the first plane to enable adjacent sub-carrier plates in the carrier plate to abut against preset positions. In the embodiment of the invention, the blocking device moves towards the set direction to abut against the opposite edges of the support plates, the blocking device can push a plurality of sub-support plates at the edges in opposite directions along the first plane, and the sub-support plates push the adjacent sub-support plates to move together until all the sub-support plates abut against the adjacent sub-support plates, so that the whole support plates are positioned, the positions of the sub-support plates are accurately determined, and the difficulty in taking and placing silicon wafers is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a carrier according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a positioning device according to an embodiment of the present invention;
FIG. 3 is a top view of a positioning device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a positioning device according to another embodiment of the present invention;
FIG. 5 is a schematic view of the movement of a first push plate according to one embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an inverted positioning structure according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating positions of a protrusion and a carrier in an embodiment of the invention;
fig. 8 is a schematic structural diagram of a translational positioning structure according to an embodiment of the present invention.
Description of reference numerals:
1. a carrier plate; 11. a frame; 12. a carrier plate; 13. a through hole; 14. a connecting wire; 2. a conveying device; 3. a blocking device; 31. a first blocking component; 32. a second barrier assembly; 33. a third barrier assembly; 34. a fourth barrier assembly; 41. a first push plate; 42. a first support member; 43. a rotating shaft; 44. a first driving member; 45. a first protrusion; 51. a second push plate; 52. a second support member; 53. mounting a plate; 54. a translation member; 55. a pusher member; 56. a second protrusion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The individual features described in the embodiments can be combined in any suitable manner without departing from the scope, for example different embodiments and aspects can be formed by combining different features. In order to avoid unnecessary repetition, various possible combinations of the specific features of the invention will not be described further.
In the following description, the term "first/second/so" is used merely to distinguish different objects and does not mean that there is a common or relationship between the objects. It should be understood that the description of the "upper", "lower", "outer" and "inner" directions as related to the orientation in the normal use state, and the "left" and "right" directions indicate the left and right directions indicated in the corresponding schematic drawings, and may or may not be the left and right directions in the normal use state.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. "plurality" means greater than or equal to two.
The invention provides a carrier plate positioning device which is used for determining the position of a carrier plate, so that a silicon wafer can be conveniently placed on and taken out of the carrier plate, and the carrier plate positioning device can be applied to loading and unloading of the silicon wafer in partial processing technologies such as detection, surface etching, silk-screen printing and the like of the silicon wafer. It should be noted that the type of the application scenario of the present invention does not limit the carrier board positioning apparatus of the present invention.
As shown in fig. 1, the carrier board 1 is formed by arranging a plurality of sub-carrier boards 12, specifically, the carrier board 1 can be placed in an area surrounded by a frame 11, the frame 11 is a frame structure with a hollow center, the sub-carrier boards 12 are also frame structures with hollow center, each sub-carrier board 12 is provided with two through holes 13 penetrating through two opposite ends of the sub-carrier board 12, connecting wires 14 such as steel wires are sequentially inserted through the through holes 13 of the plurality of sub-carrier boards 12, so that the plurality of sub-carrier boards 12 are arranged in a row, and a plurality of rows of sub-carrier boards 12 are arranged in the frame 11, thereby forming the carrier board 1 with rows and columns. The same connecting line 14 carries a plurality of sub-carriers 12, and both ends of the connecting line 14 are connected to the frame 11, so that the deformation amount of the middle portion of the connecting line 14 is larger than that of both ends of the connecting line 14, and there may be a deviation in the positions of the sub-carriers 12 on the same connecting line 14.
As shown in fig. 2, a carrier positioning apparatus according to an embodiment of the present invention includes a conveying device 2 and a blocking device 3. In a part of technological processes of transmission and processing of silicon wafers, a carrier plate 1 is required to carry the silicon wafers, a conveying device 2 conveys the carrier plate 1 along a first plane (a plane formed by xy directions in fig. 2), when the carrier plate reaches a preset area of the conveying device 2, loading of the carrier plate is carried out in the preset area, namely, a related grabbing device grabs the silicon wafers onto each sub carrier plate 12 until the carrier plate 1 is fully arranged in rows and columns, and then the carrier plate 1 carries the silicon wafers to enter the processing of the next technological process; in other embodiments, the preset area may also be a blanking area of the carrier, and the related gripping device takes out the silicon wafers on each sub-carrier 12.
As shown in fig. 2, the blocking means 3 are adapted to move in a set direction to abut against at least two opposite edges of the carrier plate 1. In particular, abutting is understood to mean that the blocking means 3 are in contact with the edge of the carrier plate, which are in forceful communication with each other due to the contact; the carrier plate 1 is composed of a plurality of sub-carrier plates 12, and the edge of the carrier plate 1 against which the blocking device 3 abuts is the edge of the plurality of sub-carrier plates 12 close to one side of the blocking device 3. The process of the blocking means 3 abutting against the carrier plate 1 can be regarded as a process of moving from a first position to a second position, wherein the first position can be regarded as an initial position of the blocking means 3, the second position can be regarded as a position where the blocking means 3 just touches the edge of the carrier plate 1, the first position is not in a first plane, and the second position is in the first plane, that is, the blocking means 3 does not interfere with the movement of the carrier plate 1 on the conveyor 2 in the first position, and the movement of the carrier plate 1 on the conveyor 2 is blocked when the second position is reached; the embodiment of the present invention does not limit the way in which the blocking device 3 moves from the first position to the second position, and specifically, the blocking device 3 can move linearly from the first position to the second position, and the blocking device 3 can also move arcuately from the first position to the second position, as long as the blocking device 3 can move from a position that does not interfere with the transfer of the carrier plate 1 to a position that contacts the edge of the carrier plate 1.
As shown in fig. 2, two oppositely arranged blocking means 3 are arranged on both sides of the carrier plate 1, and the blocking means 3 abut against both sides of the carrier plate 1 and move towards each other to determine the position of each sub-carrier plate 12, i.e. the blocking means 3, in a state abutting against opposite edges of the carrier plate 1, push the carrier plate 1 towards each other along a first plane (a plane enclosed by the x and y directions shown in fig. 2) to abut against a predetermined position of an adjacent sub-carrier plate. Specifically, in a state where the carrier 1 is entirely in a predetermined shape (for example, approximately square) and there is no significant gap between adjacent sub-carriers, the position of each sub-carrier, that is, the predetermined position corresponding to each sub-carrier, is in this state. For example, the carrier board 1 includes 10 × 10 sub-carrier boards, and the predetermined position of each sub-carrier board is a position where they abut against an adjacent sub-carrier board in the case where the shape and size of the sub-carrier board are determined. The process of the blocking means 3 pushing the daughter carrier plates 12 to their predetermined positions is as follows: when the blocking device 3 abuts against the edge of the carrier plate 1, the blocking device 3 is located between the frame and the sub-carrier plates 12 and acts on a force towards one side of the sub-carrier plates 12, so that the plurality of sub-carrier plates 12 located at the edge of the carrier plate 1 are flush with the edge of the blocking device 3, then, the two opposite blocking devices push the plurality of sub-carrier plates at the corresponding edges in opposite directions, and the sub-carrier plates push the adjacent sub-carrier plates to move together until all the sub-carrier plates abut against the adjacent sub-carrier plates, so that a predetermined position where the sub-carrier plates abut against each other is reached, and the positioning of the whole carrier plate 1 is realized.
In the embodiment of the present invention, the blocking devices 3 may be disposed on two opposite sides of the conveying device 2 along the conveying direction (x direction shown in fig. 2), or may be disposed on two opposite sides perpendicular to the conveying direction (y direction shown in fig. 2).
In the embodiment of the invention, the blocking device moves towards the set direction to abut against the opposite edges of the support plates, the blocking device can push a plurality of sub-support plates at the edges in opposite directions along the first plane, and the sub-support plates push the adjacent sub-support plates to move together until all the sub-support plates abut against the adjacent sub-support plates, so that the whole support plates are positioned, the positions of the sub-support plates are accurately determined, and the difficulty in taking and placing silicon wafers is reduced.
In some embodiments, as shown in fig. 2, the set direction may be a direction (z direction) perpendicular to the first plane. In particular, the first position of the blocking means 3 may be arranged above or below near the edge of the carrier plate 1, the blocking means 3 causing the blocking means 3 to at least partially intersect the first plane in a second position by moving in the z-direction. The setting direction in the embodiment of the invention is vertical to the first plane, so that the blocking device can not interfere the movement of the carrier plate on the conveying device in the process that the blocking device does not need to block and position.
In some embodiments, as shown in fig. 3, two blocking devices 3 are spaced apart in the first direction (the x-direction shown in fig. 3). Wherein the first direction is located in a first plane (a plane defined by the xy direction in fig. 3) and is a conveying direction of the carrier board 1 (the x direction shown in fig. 3). The blocking device 3 includes a first blocking assembly 31 and a second blocking assembly 32 disposed at an interval in the first direction, and the first blocking assembly 31 and the second blocking assembly 32 are disposed at a predetermined distance L in the first direction. The predetermined distance L is greater than or equal to the length H of the carrier 1 in the first direction, and the length H of the carrier 1 in the first direction in the embodiment of the present invention may be the size of the outer edge surrounded by the plurality of sub-carriers 12, and may also be regarded as the size of the outer edge surrounded by the frame 11. During positioning of the carrier, the carrier 1 in the conveyor 2 moves along a first direction (x direction shown in fig. 3) to a predetermined area, which may be an area for loading or unloading the carrier, specifically, the first blocking member 31 and the second blocking member 32 are disposed at two opposite sides of the predetermined area, then the first blocking member 31 and the second blocking member 32 move (e.g. move up and down) towards a predetermined direction to abut against two opposite edges (two left and right edges of the carrier shown in fig. 3) of the carrier 1, and then, in the case that the first blocking member 31 and the second blocking member 32 abut against the edges of the carrier 1, the first blocking member 31 and the second blocking member 32 push the carrier towards each other in the first direction, for example, the first blocking member 31 in the embodiment shown in fig. 3 pushes the carrier 1 towards the right direction along the x direction, and the second blocking member 32 pushes the carrier 1 towards the left direction along the x direction, finally, all the sub-carrier plates are abutted against each other to form a carrier plate 1 whole body which is orderly arranged in rows and columns. According to the embodiment of the invention, the blocking devices are arranged in the first direction of transmission of the transmission device at intervals, so that the position stability of the carrier plate in the transmission direction can be improved, and the accuracy of taking and placing the silicon wafer from the carrier plate in the first direction is improved.
In some embodiments, as shown in fig. 3, in the case that the first blocking assembly 31 and the second blocking assembly 32 are disposed at intervals in the first direction, the first blocking assembly 31 is disposed at one end of the conveying device 2 in the first direction, specifically, one end of the conveying device 2 may be a loading end of the carrier plate 1, and may also be a blanking end of the carrier plate 1, and the first blocking assembly 31 is disposed at the loading end or the blanking end of the conveying device 2, which is beneficial to improving stability of the carrier plate 1 between the sub-carrier plates during loading and blanking. The second barrier assembly 32 is disposed in the middle of the conveyor 2 in the first direction (x direction in fig. 3), the middle of the conveyor 2 refers to a position between the opposite ends (left and right ends in fig. 3), and the second barrier assembly 32 may be disposed at the middle of the opposite ends of the conveyor 2 or in an area near the middle. The distance from the middle of the conveying device 2 to the two ends of the conveying device 2 in the first direction is greater than or equal to the length H of the carrier plate 1 in the first direction, so that the area formed by the first blocking mechanism 31 and the second blocking mechanism 32 is greater than or equal to the size of the carrier plate 1, and the carrier plates on the two sides of the carrier plate can be conveniently contacted to realize the positioning of the carrier plate.
In some embodiments, as shown in fig. 4, four blocking devices may be provided, in addition to the first blocking assembly 31 and the second blocking assembly 32 spaced in the first direction (x direction shown in fig. 4) as described in the above embodiments, further including a third blocking assembly 33 and a fourth blocking assembly 34 spaced in a second direction (y direction shown in fig. 4), the second direction being disposed in the first plane (plane formed by x and y shown in fig. 4) and being perpendicular to the first direction (x direction shown in fig. 4), the third blocking assembly 33 and the fourth blocking assembly 34 being spaced by a set distance M, the predetermined distance M being greater than or equal to the length N of the carrier plate in the second direction; the third blocking assembly 33 and the fourth blocking assembly 34 are used for pushing the carrier plate 1 towards each other along the second direction (y direction shown in fig. 4); during the positioning process, the carrier plate 1 in the conveying device 2 moves to the predetermined area along the first direction (x direction shown in fig. 4), the third blocking assembly 33 and the fourth blocking assembly 34 push the carrier plate 1 in opposite directions, specifically, the third blocking assembly 33 in the embodiment shown in fig. 4 pushes the carrier plate 1 downwards, the fourth blocking assembly 34 pushes the carrier plate 1 upwards, and the pushing directions of the third blocking assembly 33 and the fourth blocking assembly 34 are parallel to the second direction (y direction shown in fig. 4) and are located in the first plane (plane defined by xy direction shown in fig. 4). According to the embodiment of the invention, the first blocking assembly and the second blocking assembly are arranged at intervals in the first direction, the third blocking assembly and the fourth blocking assembly are arranged at intervals in the second direction, and the displacement of the carrier plate in four directions can be limited simultaneously in the process of loading and unloading the carrier plate, so that the stability of the carrier plate and the accuracy of loading and unloading the silicon wafer are improved.
In some embodiments, as shown in fig. 4, one of the two oppositely disposed blocking devices may be a component without power on the first plane, for example, there may be an urging force in the first direction in the first blocking assembly 31 and the second blocking assembly 32 spaced apart in the first direction, which is exemplified by the first blocking assembly 31 having no power on the first direction, during the operation of the carrier plate positioning device, the first blocking assembly 31 and the second blocking assembly 32 move from the initial position to the position abutting against the edge of the carrier plate 1, the second blocking assembly 32 urges the edge of the carrier plate leftwards in fig. 4, the first blocking assembly 31 does not change its position in the x direction, therefore, the second blocking assembly 32 applies a leftward force to the carrier plate 1, the carrier plate 1 transmits a force to the first blocking assembly 31, the first blocking assembly 31 generates a rightward opposite force, so that the carrier plate 1 is fixed under two opposing forces. In the embodiment of the present invention, one of the third blocking assembly 33 and the fourth blocking assembly 34 may be disposed on a non-powered component on the first plane, as long as the two oppositely disposed blocking devices can generate opposite acting forces on the carrier plate.
In some embodiments, as shown in fig. 5, the blocking device may be provided as a flip-over detent structure, which is rotated to effect movement in a set direction. Optionally, the flip positioning structure comprises a first push plate 41, the first push plate 41 rotates between an extending direction parallel to the first plane (x direction shown in fig. 5, i.e. the first push plate 41 is in the position shown by the dotted line) and an extending direction perpendicular to the first plane (z direction shown in fig. 5, i.e. the first push plate 41 is in the position shown by the solid line), i.e. rotates 90 degrees counterclockwise from top to bottom; in other embodiments, the movement of the first push plate 41 in the set direction can be performed by rotating the first push plate from top to bottom by 90 degrees clockwise, or from bottom to top by rotating the first push plate clockwise or counterclockwise. As shown in fig. 5, the first pushing plate rotates 90 degrees counterclockwise from top to bottom to roughly describe the principle of the flip positioning structure for positioning the carrier plate.
As shown in fig. 5, in the case that the first push plate 41 is in the first position (the position shown by the dotted line), the first push plate 41 in the first position is parallel to the first plane, and the movement of the carrier plate 1 in the first plane is not interfered by the first push plate 41; when the carrier 1 moves to the preset area, the carrier 1 needs to be loaded and unloaded, and at this time, the first push plate 41 rotates counterclockwise in fig. 5 from the first position to the second position (the position shown by the solid line) until the first push plate 41 contacts with the edge of the carrier 1 (the left side of the carrier shown in fig. 5); in the process that the first push plate 41 continues to rotate counterclockwise, the first push plate 41 continuously pushes the left side of the carrier plate 1 to move rightward along the conveyor 2 until the sub-carrier plates at the edges are all flush with the first push plate 41, so that the adjacent sub-carrier plates abut against a predetermined position. It should be noted that the flipping positioning structure provided in the embodiment of the present invention may be disposed on the left and right sides of the carrier in the first direction or on the front and back sides in the second direction, as long as the first pushing plate can move from the first position to the second position and push the carrier to move in the first plane.
In some embodiments, as shown in fig. 6, the flip-positioning structure further comprises a first support member 42, a rotating shaft 43, and a first driving member 44. The first support 42 is spaced from the first plane, and as shown in fig. 1, the first support 42 is spaced above the conveyor 2 from the first plane (the plane defined by xy in fig. 1) by a distance greater than the thickness of the carrier plate 1, so that the first support 42 is located at a position that does not affect the movement of the carrier plate 1 in the first direction (the x direction in fig. 2). As shown in fig. 6, the rotating shaft 43 is rotatably connected to one side of the first push plate 41, and the rotating shaft 43 is spaced apart from the first support 42. Referring to fig. 1, in the case that the flip positioning structure is disposed at either side of the carrier plate in the first direction, the rotation axis 43 is disposed in parallel with the second direction (y direction shown in fig. 2); in case the flip-flop positioning structure is arranged on either side of the carrier plate in the second direction, the rotation axis is arranged parallel to the first direction (x-direction shown in fig. 2). The first driving member 44 is fixed to the first supporting member 42, the first driving member 44 is connected to the other side of the first push plate 41, and the first driving member 44 is configured to drive the first push plate 41 to rotate around the rotating shaft 43. It should be noted that, the first driving member 44 in the embodiment of the present invention may be configured as a driving device such as an air cylinder, a linear motor, etc., as long as the first driving member 44 can drive the first pushing plate 41 to rotate around the rotating shaft 43. The rotational axis 43 in the present embodiment is spaced from the first plane by a distance greater than the thickness of the carrier plate. With the first push plate 41 in the first position, the carrier plate 1 can move along a first plane; in case the first push plate 41 is rotated to the second position about the rotation axis 43, the first push plate intersects the first plane such that the first push plate abuts against the edge of the carrier plate. Referring to fig. 1, the first support 42 according to the embodiment of the present invention may be disposed on the upper side or the lower side of the conveyor 2 in the z direction.
In some embodiments, as shown in fig. 6, the first push plate 41 is provided with a plurality of first protrusions 45 at intervals on one side, and in combination with fig. 7, in the case that the first push plate abuts against the edge of the carrier plate, the connecting lines 14 are located between the plurality of first protrusions 45, so that the first protrusions 45 push the sub-carrier 12. The sub-carrier 12 is disposed in the area surrounded by the frame 11 through the connecting line 14, and the connecting line 14 is fixed to the frame 11. According to the embodiment of the invention, the first bulge in the first push plate is inserted between the sub-carrier plate and the frame, so that the first push plate is directly contacted with the sub-carrier plate, and the positioning of the sub-carrier plate is realized.
In some embodiments, as shown in FIG. 8, a blocking arrangement may be provided as a translational positioning structure, the blocking arrangement including a second push plate 51, the second push plate 51 being movable in a direction perpendicular to the first plane (the z-direction shown in FIG. 8), the second push plate 51 being movable to intersect or be spaced from the first plane. Referring to fig. 2, the second push plate 51 is disposed perpendicular to the first plane (the plane defined by xy in fig. 2), and in the initial state, the second push plate 51 is disposed at a distance from the first plane, and the second push plate 51 does not interfere with the movement of the carrier plate 1 in the first plane; at the moment of positioning, the second push plate moves in the Z direction in fig. 2 until the second push plate 51 intersects the first plane, so that the second push plate 51 blocks on the plane in which the carrier plate 1 moves. It should be noted that the translational positioning structure provided by the embodiment of the present invention may be disposed on the left and right sides of the carrier plate 1 in the first direction or on the front and back sides in the second direction. In the embodiment of the present invention, the second push plate 51 is set to move linearly, so that the lateral space required for the movement is small, which is beneficial to reducing the assembly size of the positioning device.
In some embodiments, as shown in connection with fig. 1 and 8, the translational positioning structure includes a second support 52, a mounting plate 53, a translator 54, and a pusher member 55. The second support member 52 is spaced from the first plane (the plane enclosed by xy in fig. 1); the second support 52 is spaced from the first plane by a distance larger than the thickness of the carrier plate 1, so that the second support 52 is arranged at a position that does not influence the movement of the carrier plate 1 in the first direction. The mounting plate 53 is movably connected to both the second support member 52 and the second push plate 51, and the translation member 54 is disposed on the mounting plate 53 and configured to drive the second push plate 51 to translate along a set direction relative to the mounting plate 53, where the translation member 54 in the embodiment of the present invention includes, but is not limited to, a cylinder, a linear motor, and other driving components, as long as the translation member 54 can drive the second push plate 51 to move relative to the mounting plate 53, and specifically, the translation member 54 drives the second push plate 51 to move along a z direction shown in fig. 8, so that the translation member 54 moves from a position spaced from the first plane to a position intersecting the first plane. The pushing member 55 is disposed on the second supporting member 52, the pushing member 55 drives the mounting plate 53, the translation member 54 and the second push plate 51 to move relative to the second supporting member 52, the relative positions of the mounting plate 53, the translation member 54 and the second push plate 51 may not change during the above movement, and the pushing member 55 may drive the second push plate 51 to make a linear motion in the first plane, so as to push the edge of the contacted carrier plate 1.
In some embodiments, as shown in fig. 8, one side of the second push plate 51 is provided with a plurality of spaced second protrusions 56, and in the case that the second push plate 51 abuts against the edge of the carrier plate, the connecting lines are located between the plurality of protrusions, so that the protrusions push the sub-carrier plate. The action principle is similar to that shown in fig. 7, and the description of this embodiment is omitted.
As shown in fig. 4, the first blocking assembly 31, the second blocking assembly 32, the third blocking assembly 33 and the fourth blocking assembly 34 in the embodiment of the present invention may be configured as any one of an inverted positioning structure and a translational positioning structure. In the embodiment shown in fig. 1, the first stop assembly 31 is provided in an inverted orientation configuration and the second stop assembly 32 is provided in a translated orientation configuration. In the initial state, the first barrier assembly 31 is disposed above the conveyor 2 in the z direction, and the second barrier assembly 32 is disposed below the conveyor 1 in the z direction. It should be noted that, the embodiment of the present invention does not limit the blocking device to be disposed on any side of the conveying device, as long as the blocking device does not interfere with the movement of the carrier plate on the conveying device at the initial time.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (10)
1. The positioning device for the carrier plate is characterized in that the carrier plate is formed by arranging a plurality of sub-carrier plates, the carrier plate is placed in an area surrounded by a frame, the frame is of a frame structure with a hollow middle part, the sub-carrier plates are of a frame structure with a hollow middle part, each sub-carrier plate is provided with two through holes penetrating through two opposite ends of the sub-carrier plate, connecting wires sequentially penetrate through the through holes of the sub-carrier plates, the sub-carrier plates are arranged in rows, and a plurality of rows of sub-carrier plates are arranged in the frame to form the carrier plate with rows and columns; the same connecting line bears a plurality of sub-carrier plates, and two ends of the connecting line are connected with the frame;
the positioning device includes:
the conveying device is used for conveying the carrier plate along a first plane;
the at least two blocking devices are arranged in a preset area of the conveying device and used for moving towards a set direction to abut against at least two opposite edges of the carrier plate; the blocking device pushes the carrier plate along the first plane in opposite directions in a state of abutting against the opposite edges of the carrier plate, so that the adjacent sub-carrier plates abut against preset positions;
wherein, when the blocking device abuts against the edge, the blocking device abuts against the edges of the sub-carriers close to the side corresponding to the blocking device; the blocking device moves from a first position against the carrier plate to a second position, the first position being an initial position of the blocking device, the second position being a position where the blocking device just touches the edge of the carrier plate, the first position not being in the first plane, the second position being in the first plane, so that the blocking device does not interfere with the movement of the carrier plate on the conveyor device in the first position, and the blocking device blocks the movement of the carrier plate on the conveyor device in the second position.
2. The positioning device of claim 1, wherein the set direction is perpendicular to the first plane.
3. The positioning device of claim 2, wherein the blocking device comprises a first blocking member and a second blocking member disposed at a predetermined distance apart in the first direction, the predetermined distance being greater than or equal to a length of the carrier plate in the first direction; the first blocking assembly and the second blocking assembly are used for pushing the carrier plate in the first direction in opposite directions; the first direction is a conveying direction of the carrier plate and is located in the first plane.
4. The positioning device according to claim 3, wherein the first blocking assembly is disposed at one end of the conveyor in the first direction, and the second blocking assembly is disposed at a middle portion of the conveyor in the first direction, and a distance from the middle portion to both ends of the conveyor in the first direction is greater than or equal to a length of the carrier plate in the first direction.
5. The positioning device as set forth in claim 4, wherein the blocking device further comprises a third blocking member and a fourth blocking member disposed at a predetermined distance from each other in the second direction, the predetermined distance being greater than or equal to a length of the carrier plate in the second direction; the third blocking assembly and the fourth blocking assembly are used for pushing the carrier plate in the second direction in opposite directions; the second direction is perpendicular to the first direction and lies within the first plane.
6. The positioning device of any of claims 3-5, wherein the first, second, third, and fourth stop assemblies each comprise one of:
the overturning positioning structure comprises a first push plate, and the first push plate rotates between an extending direction parallel to the first plane and an extending direction vertical to the first plane in a crossed mode;
and the translation positioning structure comprises a second push plate, and the second push plate moves along the direction vertical to the first plane so as to intersect or be separated from the first plane.
7. The positioning device of claim 6, wherein the flip positioning structure further comprises:
a first support member spaced from the first plane;
the rotating shaft is arranged at intervals with the first supporting piece and is rotatably connected with one side of the first push plate, and the length extending direction of the rotating shaft is parallel to the first direction or the second direction;
the first driving piece is fixed on the first supporting piece, and the first driving piece is connected with the other side of the first push plate and used for driving the first push plate to rotate around the rotating shaft.
8. The positioning device of claim 6, wherein the translational positioning structure comprises:
a second support member spaced from the first plane;
the mounting plate is movably connected with the second supporting piece and the second push plate;
the translation piece is arranged on the mounting plate and used for driving the second push plate to translate along the set direction relative to the mounting plate;
and the pushing piece is arranged on the second supporting piece and used for driving the second push plate to push the carrier plate.
9. The positioning device according to claim 6, wherein the first and second push plates are each provided with a plurality of spaced protrusions at one side, and the connecting line is located between the plurality of protrusions in a state where the first and/or second push plates abut against an edge of the carrier plate, so that the protrusions push the sub-carrier plate.
10. The positioning apparatus according to claim 1, wherein the predetermined area is an area where the conveyor is used for loading or unloading silicon wafers onto or from the carrier.
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| CN202110660491.2A CN113394152B (en) | 2021-06-15 | 2021-06-15 | Positioning device of support plate |
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|---|---|---|---|
| CN202110660491.2A CN113394152B (en) | 2021-06-15 | 2021-06-15 | Positioning device of support plate |
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| CN113394152B true CN113394152B (en) | 2022-09-20 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002321095A (en) * | 2001-04-27 | 2002-11-05 | Meiki Co Ltd | Levitation mechanism of carrier plate in multistage press device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| AU2003902270A0 (en) * | 2003-05-09 | 2003-05-29 | Origin Energy Solar Pty Ltd | Separating and assembling semiconductor strips |
| JP4458379B2 (en) * | 2007-12-14 | 2010-04-28 | キヤノン株式会社 | Organic EL display device |
| DE102009016811A1 (en) * | 2009-04-09 | 2010-10-14 | Aes Motomation Gmbh | Method for automatically measuring and teaching positional positions of objects within a substrate processing system by means of sensor carriers and associated sensor carriers |
| CN209127533U (en) * | 2018-10-12 | 2019-07-19 | 君泰创新（北京）科技有限公司 | A kind of solar battery carrier plate location device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002321095A (en) * | 2001-04-27 | 2002-11-05 | Meiki Co Ltd | Levitation mechanism of carrier plate in multistage press device |
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