CN113390787A - Abrasive particle bonding force testing device and method for diamond dresser - Google Patents
Abrasive particle bonding force testing device and method for diamond dresser Download PDFInfo
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- CN113390787A CN113390787A CN202110649662.1A CN202110649662A CN113390787A CN 113390787 A CN113390787 A CN 113390787A CN 202110649662 A CN202110649662 A CN 202110649662A CN 113390787 A CN113390787 A CN 113390787A
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- clipper
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
Abstract
The invention discloses a testing device and a testing method for abrasive particle bonding force of a diamond dresser, wherein the testing device comprises a movable platform, a clamping piece, a mounting bracket, a force measuring module and a clipper tool; the clamping piece is fixed on the movable platform, the push-shear cutter is fixedly arranged on the mounting support and is positioned above the clamping piece, when the movable platform moves, the push-shear cutter and the diamond dresser on the clamping piece move relatively, the push-shear cutter pushes abrasive particles on the diamond dresser, and the force measuring module is used for acquiring the push-shear force of interaction generated when the push-shear cutter and the diamond dresser push shears; it has the following advantages: the overall test and evaluation of the binding force of all abrasive particles on the diamond dresser are realized, and the test device is novel in structure and test method, ingenious and high in operability.
Description
Technical Field
The invention relates to the field of detection of machining tools, in particular to a device and a method for testing abrasive particle bonding force of a diamond dresser.
Background
For diamond tools with abrasive particles, failure of diamond particles is often used as a measure of the durability of the diamond tool and is a major factor in determining the performance and working life of the diamond tool. When the bonding force of the abrasive grains in the diamond tool is insufficient, the diamond abrasive grains are separated from the bond during the machining process. Therefore, the bonding force of the diamond tool is widely studied.
Because the diamond tool is mainly subjected to shearing action in the actual use process, the abrasive grain binding force obtained through a shearing (push-shear) test has a better reference value.
According to the prior art data, a plurality of scholars research and evaluate the bonding force of single abrasive grains, namely, the bonding force of the abrasive grains of the integral diamond tool is reflected by only one abrasive grain on the diamond tool. Aiming at the method of reflecting the bonding force of the whole abrasive particles by only adopting a single abrasive particle, the shape of the diamond tool needs to be screened, the diamond tool which is more suitable for hair clipper and observation is selected, and the joint of the diamond and the substrate is also processed to ensure the accuracy of the single hair clipper. However, in the industrial diamond product in which surface abrasive particles are continuously arranged, such as a diamond dresser of a chemical mechanical polishing pad, the shape of diamonds on the industrial diamond product is not completely consistent, and the relative height between the diamonds and a substrate has a small error due to the process, so that the bonding force condition of the whole abrasive particles cannot be accurately and objectively reflected by the existing measurement of the bonding force of a single abrasive particle, and no learner currently evaluates the characteristics of the diamond dresser by measuring the bonding force of a plurality of abrasive particles on the surface of the diamond dresser.
The diamond dresser of the chemical mechanical polishing pad can do planetary motion in the dressing process and can rotate, surface abrasive particles of the diamond dresser can rotate together with the dresser, the polishing pad is dressed through the abrasive particles of the diamond dresser, and surface impurities of the polishing pad are removed.
The diamond dresser aims at the chemical mechanical polishing pad, and the abrasive particles on the diamond dresser are mostly arranged vertically or in a leaf order, and are regularly and compactly arranged. The evaluation of the bonding force of the abrasive particles on the surface of the disc with a plurality of rows of abrasive particles needs to be innovated on the structure of a clipper mechanism, a test method and a statistical method.
Disclosure of Invention
The invention provides a testing device and a testing method for abrasive particle bonding force of a diamond dresser, which overcome the defects of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an abrasive particle bonding force testing device of a diamond dresser comprises a movable platform, a clamping piece, a mounting bracket, a force measuring module and a hair clipper cutter, wherein the movable platform can realize XYZ three-dimensional space movement and rotation around the Z direction; the clamping piece is fixed on the movable platform, the hair clipper tool is fixedly arranged on the mounting support and positioned above the clamping piece, when the movable platform moves, the hair clipper tool and the diamond dresser on the clamping piece form relative movement, the hair clipper tool carries out hair clipper on abrasive particles on the diamond dresser, and the force measuring module is used for acquiring the hair clipper force generated by the interaction between the hair clipper tool and the diamond dresser during hair clipper; the force measuring device further comprises a data processing module with a controller, and the force measuring module is electrically connected with the data processing module and can realize data interaction with the data processing module.
In one embodiment: the force measuring module is fixedly arranged on the mounting bracket, and the clipper tool is fixedly arranged on the force measuring module.
In one embodiment: the hair clipper also comprises a camera module used for acquiring image information in the hair clipper process, and the camera module is fixed on the mounting bracket through a fixing structure.
In one embodiment: still including being used for providing the light filling lamp of the luminance of making a video recording, this light filling lamp is fixed on the installing support through this fixed knot constructs.
In one embodiment: the fixing structure comprises a dovetail joint convexly arranged on the mounting bracket, a connecting block with a dovetail groove and a plurality of screws, wherein the dovetail groove is matched with the dovetail joint, and the plurality of screws are screwed on the connecting block and the tip ends of the screws tightly abut against the mounting bracket so that the connecting block is fastened on the dovetail joint.
In one embodiment: the width T of the hair clipper part of the hair clipper cutter, which is in contact with the abrasive grain hair clipper, is more than or equal to D, and T < (2D-D), wherein D is the abrasive grain interval, and D is the abrasive grain diameter.
In one embodiment: the width of the clipper portion of the clipper blade is 0.2-2 mm.
A method for testing the bonding force of abrasive particles of a diamond dresser comprises the following steps:
and 4, processing data of the numerical value of the shearing force.
In one embodiment: in the step 1, only a single abrasive grain is sheared at the same time in the shearing process.
In one embodiment: in the step 2, the cutting speed of the cutting tool is less than 1mm/s and more than 0.00001 mm/s.
In one embodiment: the data processing method in the step 4 comprises the following steps:
Step 12, according to formula
Finding out a clipper area ajAverage value of the cutting force
To characterize the region atThe bonding force of the abrasive particles is large;
according to the formula
Finding out a clipper area ajStandard deviation s of the push-shear forcetOr variance st 2To characterize the region atNon-uniformity of the bonding force of each abrasive particle;
according to the formula
Finding all areas a of the clipper1,a2,a3...atAverage value of the shearing force
To characterize the bond strength of the abrasive particles of the entire diamond conditioner;
according to the formula
Finding all areas a of the clipper1,a2,a3...atS or s variance of the cutting force2To characterize the non-uniformity of the bonding force of each abrasive particle throughout the diamond conditioner.
Compared with the background technology, the technical scheme has the following advantages:
1. a testing device for abrasive particle bonding force of a diamond dresser realizes the shearing movement of the diamond dresser and a shearing tool, simulates the shearing force applied to the diamond dresser in the actual working process, and simultaneously measures the shearing force in the shearing process in real time so as to judge the condition of the abrasive particle bonding force; the device has novel structure and stable operation.
2. The width T of the hair clipper part of the hair clipper cutter, which is in contact with the abrasive grain hair clipper, is more than or equal to D, and T < (2D-D), wherein D is the abrasive grain interval, and D is the abrasive grain diameter. Only a single abrasive grain is cut by the clipper at the same time, so that the situation that a plurality of abrasive grains are cut by the clipper simultaneously in the cutting process is avoided, and the binding force of each abrasive grain cut by the clipper sequentially in the stroke process is obtained.
3. A method for testing the abrasive particle bonding force of a diamond dresser can simulate the shearing force applied to the diamond dresser in the actual working process, integrate the bonding force conditions of a plurality of abrasive particles, measure and evaluate the bonding force of the abrasive particles of the diamond dresser and provide a measurement reference for the durability and the service life of the diamond dresser; the method is unique and ingenious, has strong operability, and can accurately reflect the binding force condition of the abrasive particles of the diamond dresser.
Drawings
The invention is further illustrated by the following figures and examples.
Fig. 1 is a partially enlarged schematic view of an abrasive grain bonding force testing apparatus of a diamond conditioner.
Fig. 2 is a general schematic view of an apparatus for testing bonding force of abrasive particles in a diamond conditioner.
FIG. 3 is a schematic diagram of the cutting state of the clipper and the diamond dresser during the testing of the bonding force of the abrasive particles of the diamond dresser.
FIG. 4 is a schematic diagram of a disk surface structure of diamond conditioners arranged in a staggered manner.
FIG. 5 is a schematic view of a disk surface structure of a diamond dresser arranged in a phyllotactic manner.
Detailed Description
Referring to fig. 1 and 2, an apparatus for testing the bonding force of abrasive particles in a diamond dresser includes a movable platform 1 capable of moving in XYZ three-dimensional space and rotating in a Z direction, a holder 2 for holding the diamond dresser, a mounting bracket 3, a force measuring module 4, and a clipper 5; the clamping piece 2 is fixed on the movable platform 1, the clipper 5 is fixedly arranged on the mounting support 3 and positioned above the clamping piece 2, when the movable platform 1 moves, the clipper 5 and the diamond dresser 100 on the clamping piece 2 move relatively, the clipper 5 carries out clipping on abrasive particles on the diamond dresser 100, and the force measuring module 4 is used for acquiring the clipping force generated by interaction when the clipper 5 and the diamond dresser 100 carry out clipping; the force measuring device also comprises a data processing module with a controller, and the force measuring module 4 is electrically connected with the data processing module and can realize data interaction with the data processing module. The data processing module is used for carrying out data processing and statistical analysis on the shearing force data acquired by the force measuring module 4, so as to obtain the condition of the abrasive particle binding force of the diamond dresser 100.
The force measuring module 4 can be fixed on the mounting bracket 3, the clipper tool 5 is fixed on the force measuring module, the pushing force obtained by the clipper tool can act on the force measuring module, and the force measuring module obtains the pushing force received by the clipper tool 5; in addition, the force measuring module 4 may be disposed on the movable platform 1 for receiving the cutting force applied to the diamond dresser 100. The shearing force applied to the shearing tool 5 and the shearing force applied to the diamond dresser 100 are in a relationship of an acting force and a reaction force, and they are equivalent.
In this embodiment, the holder 2 is a three-jaw chuck or a four-jaw chuck. The precision of the three-jaw chuck is less than 0.03 mm. The diamond dresser 10 is disk-shaped, and positive or negative clamping using a three-jaw chuck is selected according to the size of the diamond dresser 100. The three-jaw chuck is connected with the movable platform by adopting an adapter plate 6.
In this embodiment, the movable stage 1 and the mounting bracket 3 are mounted on an optical stage 7. The mounting bracket 3 is a portal frame.
In this embodiment, the cutting tool 5 may be disposed perpendicular to the surface of the diamond dresser 100 to be tested, or may be disposed obliquely at a certain angle, so as to ensure that the cutting tool 5 and the abrasive particles on the diamond dresser 100 form a certain angle during the cutting. Generally, the hair-clipper portion (blade) of the hair-clipper blade 5 is replaceable so that the hair-clipper portion worn by the hair-clipper can be replaced at any time. The width T of the hair clipper part of the hair clipper cutter 5, which is in contact with the abrasive grain clipper, is more than or equal to D, and T < (2D-D), wherein D is the abrasive grain interval, and D is the abrasive grain diameter. Only a single abrasive grain is cut at the same time in the cutting process, so that the cutter 5 of the cutting tool is prevented from interfering with or unnecessarily contacting with the row which is not related to measurement, and the accurate bonding force of the single abrasive grain in the cutting process is obtained. The width of the hair-cutting portion of the hair-cutting clipper is generally set at 0.2-2 mm.
The movable platform 1 includes a combined movable table 11 movable in the X and Y directions on a horizontal plane, a rotary table 12 rotatable on the horizontal plane, and an elevating table 13 movable in the height direction. Therefore, the movable stage 1 can drive the diamond dresser 100 to move and rotate in three dimensions, i.e., multi-dimensional movement. The movable platform can be adjusted manually or controlled by a program in the intelligent control module. In this embodiment, the repositioning accuracy of the combined moving stage 11 is less than 20 micrometers, the repositioning accuracy of the rotating stage is 0.05 mm, the end jump accuracy is less than 50 micrometers, and the repositioning accuracy of the lifting stage is 0.01 mm.
Still including the camera module 8 that is used for acquireing clipper process image information, this camera module 8 is fixed on installing support 3 through fixed knot structure, and this camera module 8 can set up one or more, can lay respectively on the position of difference when a plurality of to convenient observation. Still including being used for providing the light filling lamp 9 of the luminance of making a video recording, this light filling lamp 9 is fixed on installing support 3 through this fixed knot constructs.
The fixing structure comprises a dovetail 31 convexly arranged on the mounting bracket 3, a connecting block 32 with a dovetail groove and a plurality of screws 33, wherein the dovetail groove is matched with the dovetail 31, the plurality of screws 33 are screwed on the connecting block 32, and the tips of the screws 33 tightly abut against the mounting bracket 3 so that the connecting block 32 is fastened on the dovetail 31.
In the specific operation, please refer to fig. 4, the diamond dresser 100 is loaded on the clamping member, the movable platform 1 is used for moving the part to be measured to the position below the clipper 5, the clipper part of the clipper 5 is adjusted to a certain height on the diamond dresser substrate 100, the force measuring module 4 is started, the movable platform 1 is controlled to move along a certain track, the clipper 5 can clip the abrasive particles 101 on the diamond dresser 100 in the moving process, the force measuring module 4 obtains corresponding clipper force data in real time, and the measured clipper force can be processed through the data processing module so as to obtain the corresponding abrasive particle bonding force.
Referring to fig. 3, a method for testing the bonding force of abrasive particles in a diamond conditioner includes the following steps:
for example, referring to fig. 4, on a diamond dresser having disk surface abrasive grains 101 arranged in a staggered manner in the horizontal and vertical directions, a middle square region of a distribution region of the diamond dresser abrasive grains 101, and 5 regions of diamond abrasive grains 101 in the same square region in the upper, lower, left, and right directions near the outer ring are selected for shearing, and the five regions of diamond abrasive grains 101 are sheared to obtain the bonding force thereof so as to evaluate the bonding force of the disk surface abrasive grains 101 of the diamond dresser 100 to be measured; the same number of rows can be selected from both sides of the central axis (including the central axis), and each row is used as an area for hair cutting.
For another example, referring to fig. 5, on a diamond dresser with abrasive grains 101 on the disk surface arranged in a phyllotactic manner, all the abrasive grains 101 on even-numbered leaves or odd-numbered leaves can be sheared; and the face abrasive particles 101 can be sheared by an even number of turns or an odd number of turns from inside to outside.
in order to ensure that a stable and high-precision height distance is kept between the clipper tool 5 and the diamond dresser 100 substrate 102 during clipper, before clipper, the disc surface reference calibration of the diamond dresser 100 is firstly carried out, and the disc surface reference calibration refers to that before clipper, a laser interferometer is used for calibrating and adjusting the substrate 102 of the diamond dresser 100, so that the substrate 102 is positioned on a calibration reference, and the position precision of the substrate 102 is ensured. In order to improve the testing precision, the clipper 5 should be replaced before the diamond abrasive grains 101 on each area of the clipper disk to reduce the force measuring error caused by the cutter abrasion, and the clipper 5 should be readjusted to the designated height after the clipper 5 is replaced to perform the clipping. When in hair cutting, the movable platform can realize multi-axis cooperative motion so as to adapt to the cutting of the diamond dresser 100 with a curved surface shape and ensure that the abrasive particles 101 on the diamond dresser 100 are always cut with the same cutting force arm in the hair cutting process.
and 4, processing data of the numerical value of the shearing force.
In the step 2, the cutting speed of the cutting tool 5 is less than 1mm/s and more than 0.00001mm/s, so that the static cutting is formed.
The data processing method in the step 4 comprises the following steps:
Step 12, according to formula
Finding out a clipper area ajAverage value of the cutting force
To characterize the region ajThe bonding force of the abrasive particles is large;
according to the formula
Finding out a clipper area ajStandard deviation s of the push-shear forcetOr variance st 2To characterize the region atNon-uniformity of the bonding force of each abrasive particle;
according to the formula
Finding all areas a of the clipper1,a2,a3...atAverage value of the shearing force
To characterize the bond strength of the abrasive particles of the entire diamond conditioner;
according to the formula
Finding all areas a of the clipper1,a2,a3...atS or s variance of the cutting force2To characterize the non-uniformity of the bonding force of each abrasive particle throughout the diamond conditioner.
The smaller the standard deviation is, the lower the data dispersion is, and the better the bonding quality consistency of the abrasive grains on the disc surface is. The variance is the square of the standard deviation and also reflects the dispersion of the data, the uniformity of the grain size, and the uniformity of the grain bonding process.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (11)
1. The utility model provides an abrasive particle cohesion testing arrangement of diamond dresser which characterized in that: the device comprises a movable platform capable of realizing XYZ three-dimensional space movement and rotation around the Z direction, a clamping piece for clamping a diamond dresser, a mounting bracket, a force measuring module and a hair clipper tool; the clamping piece is fixed on the movable platform, the hair clipper tool is fixedly arranged on the mounting support and positioned above the clamping piece, when the movable platform moves, the hair clipper tool and the diamond dresser on the clamping piece form relative movement, the hair clipper tool carries out hair clipper on abrasive particles on the diamond dresser, and the force measuring module is used for acquiring the hair clipper force generated by the interaction between the hair clipper tool and the diamond dresser during hair clipper; the force measuring device further comprises a data processing module with a controller, and the force measuring module is electrically connected with the data processing module and can realize data interaction with the data processing module.
2. The apparatus of claim 1, wherein the apparatus is configured to test the bonding force of the abrasive particles to the diamond conditioner, and further comprises: the force measuring module is fixedly arranged on the mounting bracket, and the clipper tool is fixedly arranged on the force measuring module.
3. The apparatus for testing bonding force of abrasive particles in a diamond conditioner according to claim 1, wherein: the hair clipper also comprises a camera module used for acquiring image information in the hair clipper process, and the camera module is fixed on the mounting bracket through a fixing structure.
4. The apparatus of claim 3, wherein the apparatus is configured to: still including being used for providing the light filling lamp of the luminance of making a video recording, this light filling lamp is fixed on the installing support through this fixed knot constructs.
5. The apparatus for testing bonding force of abrasive particles in a diamond conditioner according to claim 3 or 4, wherein: the fixing structure comprises a dovetail joint convexly arranged on the mounting bracket, a connecting block with a dovetail groove and a plurality of screws, wherein the dovetail groove is matched with the dovetail joint, and the plurality of screws are screwed on the connecting block and the tip ends of the screws tightly abut against the mounting bracket so that the connecting block is fastened on the dovetail joint.
6. The apparatus of claim 1, wherein the apparatus is configured to test the bonding force of the abrasive particles to the diamond conditioner, and further comprises: the width T of the hair clipper part of the hair clipper cutter, which is in contact with the abrasive grain hair clipper, is more than or equal to D, and T < (2D-D), wherein D is the abrasive grain interval, and D is the abrasive grain diameter.
7. The apparatus of claim 7, wherein the apparatus is configured to test the bonding force of the abrasive particles in the diamond conditioner, and further comprises: the width of the clipper portion of the clipper blade is 0.2-2 mm.
8. A method for testing the bonding force of abrasive particles of a diamond dresser is characterized by comprising the following steps:
the method comprises the following steps:
step 1, selecting a plurality of shearing areas on a diamond dresser, wherein the plurality of shearing areas are arranged on the disk surface of the diamond dresser in a centrosymmetric manner, and the number of abrasive particles on all the selected areas is more than or equal to 20% of the total number of the abrasive particles;
step 2, performing shearing on the abrasive particles in each shearing area, wherein the distance between a shearing tool and a substrate of the diamond dresser is kept constant in the shearing stroke, and the shearing speed of the shearing tool is kept constant;
step 3, acquiring the shearing force generated by interaction between the shearing tool and the diamond dresser during the shearing process of the shearing tool and recording the numerical value of the shearing force;
and 4, processing data of the numerical value of the shearing force.
9. The method of claim 8, wherein the method comprises: in the step 1, only a single abrasive grain is sheared at the same time in the shearing process.
10. The method of claim 9, wherein the method comprises: in the step 2, the cutting speed of the cutting tool is less than 1mm/s and more than 0.00001 mm/s.
11. The method of testing the bonding force of abrasive particles in a diamond conditioner according to claim 1, wherein: the data processing method in the step 4 comprises the following steps:
step 11, setting the selected hair-clipper area as a1,a2,a3...atRejecting invalid cutting force value smaller than set threshold, taking each peak value of cutting force value curve of each cutting area as cutting force value F of each abrasive grainj1,Fj2,Fj3...Fjn；
Step 12, according to formula
Finding out a clipper area ajAverage value of the cutting force
To characterize the region atThe bonding force of the abrasive particles is large;
according to the formula
Finding out a clipper area ajStandard deviation s of the push-shear forcetOr variance st 2To characterize the region atNon-uniformity of the bonding force of each abrasive particle;
according to the formula
Finding all areas a of the clipper1,a2,a3...atAverage value of the shearing force
To characterize the bond strength of the abrasive particles of the entire diamond conditioner;
according to the formula
Finding all areas a of the clipper1,a2,a3...atS or s variance of the cutting force2To characterize the non-uniformity of the bonding force of each abrasive particle throughout the diamond conditioner.
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Application publication date: 20210914 |