CN113380675A - Wet cleaning equipment for wafer photoetching - Google Patents
Wet cleaning equipment for wafer photoetching Download PDFInfo
- Publication number
- CN113380675A CN113380675A CN202110736896.XA CN202110736896A CN113380675A CN 113380675 A CN113380675 A CN 113380675A CN 202110736896 A CN202110736896 A CN 202110736896A CN 113380675 A CN113380675 A CN 113380675A
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- water
- groove
- water guide
- wafer
- block
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- 238000004140 cleaning Methods 0.000 title claims abstract description 70
- 238000001259 photo etching Methods 0.000 title abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 96
- 230000001680 brushing effect Effects 0.000 claims abstract description 21
- 239000007921 spray Substances 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims description 16
- 238000005406 washing Methods 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 11
- 238000001459 lithography Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 45
- 238000009826 distribution Methods 0.000 description 14
- 239000013618 particulate matter Substances 0.000 description 11
- 230000002349 favourable effect Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses wet cleaning equipment for wafer photoetching processing, which structurally comprises a bottom box, a main body and a control panel, wherein the top end of the bottom box is provided with the main body, the control panel is arranged at the front end of the main body, the main body comprises a sliding groove, cleaning equipment, a water spray pipe and a supporting seat, the cleaning equipment comprises a clamping shaft, a reset spring, a cleaning device and a fixing frame, the cleaning device comprises a connecting rod, a rotating shaft and a brushing device, the brushing device comprises a fixing seat, a movable groove, a tension spring and a brushing head, and the brushing head comprises a clamping head, a brush and a deformation groove.
Description
Technical Field
The invention relates to the field of wafer photoetching development, in particular to wet cleaning equipment for wafer photoetching processing.
Background
In a semiconductor manufacturing shop, it is generally necessary to clean the surface of a wafer by using a wafer cleaning device to remove particulate matter remaining on the surface of the wafer after dicing, and when the wafer is cleaned by using the cleaning device, the cleaning device brushes the wafer by using the rotation of a cleaning brush to contact the end face of the wafer, so as to brush away the particulate matter placed on the end face of the wafer.
Based on the above findings, the present inventors found that the conventional wet cleaning apparatus for wafer lithography mainly has the following disadvantages, for example: when the cleaning brush cleans the wafer, the cleaning brush rotates to drive the particulate matter to be separated from the end face of the wafer, and simultaneously the particulate matter is thrown out through inertia, so that the cleaned end face of the wafer is attached with the particulate matter, and the wafer is not cleaned cleanly.
Disclosure of Invention
In order to solve the problems, the invention provides wet cleaning equipment for wafer photoetching processing.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a wafer is wet process cleaning equipment for lithography process, its structure includes under casing, main part, control panel, the top of under casing is equipped with the main part, control panel sets up the front end directly under the main part, the main part includes sliding tray, cleaning device, spray pipe, supporting seat, the sliding tray is equipped with two, and is located the inside both ends of main part respectively, the cleaning device block is in the sliding tray, the spray pipe is equipped with two and is located the main part respectively about both ends, the supporting seat sets up in the bottom centre of main part.
Furthermore, cleaning equipment includes block axle, reset spring, belt cleaning device, fixed frame, block axle's side inlays intrinsic reset spring, reset spring is equipped with eight, and uses two to be a set of and be around the form and arrange, belt cleaning device is equipped with eight, and uses two to be a set of, arranges between two sets of reset spring, fixed frame is equipped with four, and is connected every reset spring of group and belt cleaning device's end, reset spring and fixed frame clearance fit.
Furthermore, belt cleaning device includes connecting rod, pivot, brushing device, the connecting rod is equipped with two, and mutual block between two connecting rods, the pivot is connected between two connecting rods, brushing device is equipped with more than four, and transverse arrangement in the bottom of connecting rod, the connecting rod blocks with the side looks block of block axle.
Furthermore, the brushing device comprises a fixed seat, two movable grooves, two extension springs and brushing heads, wherein the movable grooves are formed in the fixed seat, the extension springs are arranged in the movable grooves, the two extension springs are transversely arranged, the brushing heads are clamped in the movable grooves, and the brushing heads are movably matched with the extension springs.
Furthermore, the brush-washing head comprises a clamping head, a hairbrush and three deformation grooves, wherein the clamping head is clamped in the movable groove, the hairbrushes are more than ten and are transversely arranged at the bottom of the clamping head, the deformation grooves are vertically arranged on the left side of the hairbrush, and the deformation grooves are triangular.
Furthermore, the fixing frame comprises a water falling groove, a water inlet port, water guide blocks, water guide sheets, flow distribution sheets and flow distribution blocks, the water falling groove is formed in the middle of the inside of the fixing frame, the water inlet port is formed in the top end of the water falling groove, the water guide blocks are embedded and fixed at the rear ends of the tops of the water inlet ports, the number of the water guide sheets is four, the water guide sheets are vertically arranged on the left side of the inside of the water falling groove, the flow distribution sheets are vertically embedded on the right side of the inside of the water falling groove, the flow distribution blocks are installed in the middle of the bottom of the flow distribution sheets, and the flow distribution blocks are in.
Further, the flow distribution block comprises a flow distribution body, water inlet grooves, water storage tanks, spraying holes, lower spraying holes and water guide blocks, the water inlet grooves are formed in two ends of the flow distribution body, the width of each water inlet groove is gradually reduced from the outer end to the inner end, the water storage tanks are arranged inside the two water inlet grooves, the spraying holes are more than four, the spraying holes are formed in the end faces of the right sides of the flow distribution body in a transverse arrangement mode, the water guide blocks are fixedly embedded at the left ends of the flow distribution body, and the width of the spraying holes is gradually reduced from the middle to the two ends.
Further, the water guide block includes water guiding body, guiding gutter, holds the chute, the bottom terminal surface of water guiding body is circular-arc, the guiding gutter is equipped with threely, and transverse arrangement in the terminal surface of water guiding body, it sets up the inside bottom at the guiding gutter to hold the chute, the up end of guiding gutter is circular-arc, and the contained angle that guiding gutter and guiding body bottom formed is 30 degrees.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the clamping shaft rotary transfer cleaning device is thrown outwards through inertia, so that the cleaning area of the cleaning device on the end face of the wafer is increased, the cleaning equipment can comprehensively clean the end face of the wafer, and the condition that particulate matters are attached to the end face of the wafer after cleaning is avoided.
2. The invention utilizes the shunting block to be divided into two parts, one part is used for cleaning the wafer, and the other part is used for scouring the particulate matters which are not thrown out from the end face of the wafer due to inertia, so that the particulate matters can be separated from the end face of the wafer by the scouring of water flow, and the particulate matters on the end face of the wafer can be scrubbed.
Drawings
Fig. 1 is a schematic front view of a wet cleaning apparatus for wafer lithography according to the present invention.
Fig. 2 is a schematic front view of the main body of the present invention.
FIG. 3 is a schematic top view of the cleaning apparatus of the present invention.
Fig. 4 is a schematic front view of the cleaning device of the present invention.
Fig. 5 is a schematic front view of the brushing device of the present invention.
Fig. 6 is a front view of the brush head according to the present invention.
Fig. 7 is a schematic sectional view of the fixing frame of the present invention.
Fig. 8 is a schematic front view of a diverter block according to the present invention.
Fig. 9 is a front view structural diagram of the water guide block of the present invention.
In the figure: the cleaning device comprises a bottom box 1, a main body 2, a control panel 3, a sliding groove 21, a cleaning device 22, a water spray pipe 23, a supporting seat 24, a clamping shaft 221, a return spring 222, a cleaning device 223, a fixing frame 224, a connecting rod a1, a rotating shaft a2, a brushing device a3, a fixing seat a31, a movable groove a32, an extension spring a33, a brushing head a34, a clamping head b1, a hairbrush b2, a deformation groove b3, a water falling groove c1, a water inlet port c2, a water guide block c3, a water guide sheet c4, a flow distribution sheet c5, a flow distribution block c6, a flow distribution body c61, a water inlet groove c62, a water storage groove c63, a spraying hole c64, a lower spraying hole c65, a water guide block c66, a water guide body d1, a water guide groove d2 and a water storage groove d 3.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows: referring to fig. 1-6, the embodiments of the present invention are as follows:
its structure includes under casing 1, main part 2, control panel 3, the top of under casing 1 is equipped with main part 2, control panel 3 sets up at main part 2 positive front end, main part 2 includes sliding tray 21, cleaning equipment 22, spray pipe 23, supporting seat 24, sliding tray 21 is equipped with two, and is located the inside both ends of main part 2 respectively, cleaning equipment 22 block is in sliding tray 21, spray pipe 23 is equipped with two and is located main part 2 both ends about respectively, supporting seat 24 sets up in the middle of the bottom of main part 2 is positive.
The cleaning device 223 comprises two connecting rods a1, a rotating shaft a2 and a brushing device a3, wherein the two connecting rods a1 are clamped with each other, the two connecting rods a1 are connected with each other through the rotating shaft a2, the two connecting rods a1 are connected with each other through the rotating shaft a2, the number of the brushing devices a3 is more than four, the brushing devices a3 are transversely arranged at the bottom of the connecting rods a1, and the connecting rods a1 are clamped with the side ends of the clamping shafts 221, so that the outward brushing is facilitated to be carried out through the folding of the connecting rods a1 through swinging and the influence of inertia generated by rotation.
Brushing device a3 includes fixing base a31, activity groove a32, extension spring a33, brush-washing head a34, the inside of fixing base a31 is equipped with activity groove a32, the inside of activity groove a32 is equipped with extension spring a33, extension spring a33 is equipped with two, and is horizontal arrangement, brush-washing head a34 block in the inside of activity groove a32, brush-washing head a34 and extension spring a33 clearance fit, be favorable to restoring to throne through extension spring a33 and drive brush-washing head a34 and move down.
Brush head a34 includes snap head b1, brush b2, deformation groove b3, snap head b1 block in activity groove a32, brush b2 is equipped with more than ten, and transversely arranges in the bottom of snap head b1, deformation groove b3 is equipped with three, and arranges perpendicularly on the left side of brush b2, deformation groove b3 is the triangle-shaped, is favorable to enlarging the flexibility of brush b2 through deformation groove b 3.
Based on the above embodiment, the specific working principle is as follows: when the cleaning device 22 moves outwards to clean the end face of the wafer, the cleaning device 23 is matched to spray cleaning agent to the end face of the wafer, the end face of the wafer can be sufficiently cleaned, then the clamping shaft 221 rotates to enable the cleaning device 223 to swing outwards through inertia, so that the cleaning area of the end face of the wafer by the cleaning device 223 is increased, when the clamping shaft 221 stops rotating, the reset spring 222 resets to drive the fixing frame 224 to contract inwards, so that the cleaning device 223 resets, the connecting rod a1 is clamped with the side end of the clamping shaft 221, so that the connecting rod a1 is folded through swinging and is influenced by inertia generated by rotation, the connecting rod a1 is brushed outwards to increase the cleaning area of the end face of the wafer, and then the tension spring a33 resets to drive the brush head a34 to move downwards, thereby increase the frictional force of brush head a34 and wafer terminal surface, avoid attaching the dirty condition of the particulate matter washing of wafer terminal surface, utilize deformation groove b3 to increase the pliability of brush b2 at last, avoid brush b2 to cause the condition of fish tail to the wafer terminal surface to can let cleaning equipment 22 carry out comprehensive washing to the terminal surface of wafer, avoid having the particulate matter to attach the condition at the wafer terminal surface after wasing.
Example two: referring to fig. 7-9, the embodiment of the present invention is as follows:
the fixing frame 224 comprises a water falling groove c1, a water inlet port c2, a water guide block c3, a water guide sheet c4, a splitter sheet c5 and splitter blocks c6, the water falling groove c1 is arranged in the middle of the inside of the fixing frame 224, the water inlet port c2 is arranged at the top end of the water falling groove c1, the water guide block c3 is embedded at the rear end of the top of the water inlet port c2, the four water guide sheets c4 are vertically arranged on the left side of the inside of the water falling groove c1, the splitter sheet c5 is vertically embedded on the right side of the inside of the water falling groove c1, the splitter block c6 is arranged in the middle of the bottom of the splitter sheet c5, the splitter block c6 is in a shape of a Chinese character, so that water flowing downwards from the water falling groove c1 is favorably washed by the splitter block c6, one part is wafer cleaning, and the other part washes particulate matters which are not thrown away from the end faces of the wafers due.
The flow dividing block c6 comprises a flow dividing body c61, water inlet grooves c62, water storage grooves c63, spraying holes c64, lower spraying holes c65 and water guide blocks c66, the water inlet grooves c62 are arranged at two ends of the flow dividing body c61, the width of the water inlet grooves c62 is gradually reduced from the outer ends to the inner ends, the water storage grooves c63 are arranged inside the two water inlet grooves c62, the spraying holes c64 are more than four and are transversely arranged on the end face of the right side of the flow dividing body c61, the water guide blocks c66 are fixedly embedded at the left end of the flow dividing body c61, the width of the spraying holes c64 is gradually reduced from the middle to the two ends, water flow concentration through the spraying holes c64 is facilitated, and then downward spraying in a diffusion shape is achieved.
Water guide block c66 includes water conservancy diversion body d1, guiding gutter d2, holds chute d3, the bottom terminal surface of guiding gutter d1 is circular-arc, guiding gutter d2 is equipped with threely, and transverse arrangement in the terminal surface of guiding gutter d1, it sets up the inside bottom at guiding gutter d2 to hold chute d3, guiding gutter d 2's up end is circular-arc, and the contained angle that guiding gutter d2 and guiding gutter d1 bottom formed is 30 degrees, is favorable to leading rivers through guiding gutter d2 for rivers can be the slope form and spray.
Based on the above embodiment, the specific working principle is as follows: utilize and set up the reposition of redundant personnel piece c6 to the chevron form, can be with the rivers that fall water tank c1 down flows, divide into two parts through reposition of redundant personnel piece c6, partly is the wafer washing, another part is not to the particulate matter that throws away from the wafer terminal surface because inertia, make the particulate matter receive the washing away of rivers can break away from the terminal surface of wafer, reuse sprays hole c64 and concentrates rivers, it sprays downwards to be the diffusion form, make the up end that falls on the wafer that rivers can be even, improve cleaning equipment 22 and to the cleaning performance of wafer, utilize guiding gutter d2 to lead rivers at last, make rivers can be the slope form and spray, go on outwards to the particulate matter that attaches at the wafer terminal surface and erode, make the particulate matter of wafer terminal surface can be scrubbed totally.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a wafer is wet cleaning equipment for lithography process, its structure includes under casing (1), main part (2), control panel (3), the top of under casing (1) is equipped with main part (2), control panel (3) set up at main part (2) positive front end, its characterized in that:
the main part (2) includes sliding tray (21), cleaning equipment (22), spray pipe (23), supporting seat (24), sliding tray (21) are equipped with two, and are located the inside both ends of main part (2) respectively, cleaning equipment (22) block is in sliding tray (21), spray pipe (23) are equipped with two and are located the left and right sides both ends of main part (2) respectively, supporting seat (24) set up in the middle of the bottom of main part (2) is positive.
2. The wet cleaning apparatus for wafer lithography processing according to claim 1, wherein: the cleaning equipment (22) comprises a clamping shaft (221), reset springs (222), cleaning devices (223) and a fixing frame (224), the reset springs (222) are embedded into the side ends of the clamping shaft (221), the number of the reset springs (222) is eight, the two reset springs are arranged in a surrounding mode, the number of the reset springs is two, the two reset springs are arranged in one group and arranged between the two groups of the reset springs (222), the number of the fixing frame (224) is four, and the reset springs (222) in each group are connected with the tail ends of the cleaning devices (223).
3. The wet cleaning apparatus for wafer lithography processing according to claim 2, wherein: the cleaning device (223) comprises two connecting rods (a 1), a rotating shaft (a 2) and a brushing device (a 3), the two connecting rods (a 1) are clamped with each other, the two connecting rods (a 1) are connected through the rotating shaft (a 2), the two connecting rods (a 1) are connected with each other, and the brushing device (a 3) is provided with more than four connecting rods and is transversely arranged at the bottom of the connecting rod (a 1).
4. The wet cleaning apparatus for wafer lithography processing according to claim 3, wherein: brushing device (a 3) is including fixing base (a 31), activity groove (a 32), extension spring (a 33), brush-washing head (a 34), the inside of fixing base (a 31) is equipped with activity groove (a 32), the inside of activity groove (a 32) is equipped with extension spring (a 33), extension spring (a 33) are equipped with two, and are transverse arrangement, brush-washing head (a 34) block in the inside of activity groove (a 32).
5. The wet cleaning apparatus for wafer lithography processing according to claim 4, wherein: the brush-washing head (a 34) comprises a clamping head (b 1), a brush (b 2) and a deformation groove (b 3), wherein the clamping head (b 1) is clamped in the movable groove (a 32), the number of the brushes (b 2) is more than ten, the brushes are transversely arranged at the bottom of the clamping head (b 1), the number of the deformation grooves (b 3) is three, and the brushes (b 2) are vertically arranged at the left side.
6. The wet cleaning apparatus for wafer lithography processing according to claim 2, wherein: the fixed frame (224) comprises a water falling groove (c 1), a water inlet port (c 2), a water guide block (c 3), a water guide sheet (c 4), a splitter plate (c 5) and a splitter block (c 6), wherein the water falling groove (c 1) is arranged in the middle of the inside of the fixed frame (224), the water inlet port (c 2) is arranged at the top end of the water falling groove (c 1), the water guide block (c 3) is embedded at the rear end of the top of the water inlet port (c 2), the water guide sheets (c 4) are four in number and are vertically arranged on the left side of the inside of the water falling groove (c 1), the splitter plate (c 5) is vertically embedded on the right side of the inside of the water falling groove (c 1), and the splitter block (c 6) is arranged in the middle of the bottom of the splitter plate (c 5).
7. The wet cleaning apparatus for wafer lithography processing according to claim 6, wherein: the flow dividing block (c 6) comprises a flow dividing body (c 61), a water inlet groove (c 62), a water storage groove (c 63), a spraying hole (c 64), a lower spraying hole (c 65) and a water guide block (c 66), wherein the water inlet groove (c 62) is arranged at two ends of the flow dividing body (c 61), the width of the water inlet groove (c 62) is gradually reduced from the outer end to the inner end, the water storage groove (c 63) is arranged inside the two water inlet grooves (c 62), the spraying hole (c 64) is provided with more than four, the water inlet grooves are transversely arranged on the right end face of the flow dividing body (c 61), and the water guide block (c 66) is fixedly embedded at the left end of the flow dividing body (c 61).
8. The wet cleaning apparatus for wafer lithography processing according to claim 7, wherein: the water guide block (c 66) comprises a water guide body (d 1), water guide grooves (d 2) and water storage grooves (d 3), the end face of the bottom of the water guide body (d 1) is arc-shaped, the number of the water guide grooves (d 2) is three, the water guide grooves are transversely arranged on the end face of the water guide body (d 1), and the water storage grooves (d 3) are arranged at the bottom end of the inside of the water guide grooves (d 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736896.XA CN113380675B (en) | 2021-06-30 | 2021-06-30 | Wet cleaning equipment for wafer photoetching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110736896.XA CN113380675B (en) | 2021-06-30 | 2021-06-30 | Wet cleaning equipment for wafer photoetching |
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| Publication Number | Publication Date |
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| CN113380675A true CN113380675A (en) | 2021-09-10 |
| CN113380675B CN113380675B (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110736896.XA Active CN113380675B (en) | 2021-06-30 | 2021-06-30 | Wet cleaning equipment for wafer photoetching |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090093199A1 (en) * | 2007-10-08 | 2009-04-09 | Doosan Mecatec Co., Ltd | Cleaning device for chemical mechanical polishing equipment |
| US20130078810A1 (en) * | 2011-09-22 | 2013-03-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for performing a polishing process in semiconductor fabrication |
| CN103947469A (en) * | 2014-04-20 | 2014-07-30 | 李慧敏 | Light source control technology for indoor culture of red soybean sprouting vegetables |
| CN107413746A (en) * | 2017-08-25 | 2017-12-01 | 北京南轩兴达电子科技有限公司 | Full-automatic LED Wafer Cleaning equipment |
| CN110369371A (en) * | 2019-07-23 | 2019-10-25 | 天津中环领先材料技术有限公司 | Large-size silicon wafer cleaning device and cleaning process thereof |
| CN112750688A (en) * | 2020-12-31 | 2021-05-04 | 至微半导体(上海)有限公司 | Wafer cleaning method |
-
2021
- 2021-06-30 CN CN202110736896.XA patent/CN113380675B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090093199A1 (en) * | 2007-10-08 | 2009-04-09 | Doosan Mecatec Co., Ltd | Cleaning device for chemical mechanical polishing equipment |
| US20130078810A1 (en) * | 2011-09-22 | 2013-03-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for performing a polishing process in semiconductor fabrication |
| CN103947469A (en) * | 2014-04-20 | 2014-07-30 | 李慧敏 | Light source control technology for indoor culture of red soybean sprouting vegetables |
| CN107413746A (en) * | 2017-08-25 | 2017-12-01 | 北京南轩兴达电子科技有限公司 | Full-automatic LED Wafer Cleaning equipment |
| CN110369371A (en) * | 2019-07-23 | 2019-10-25 | 天津中环领先材料技术有限公司 | Large-size silicon wafer cleaning device and cleaning process thereof |
| CN112750688A (en) * | 2020-12-31 | 2021-05-04 | 至微半导体(上海)有限公司 | Wafer cleaning method |
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| Publication number | Publication date |
|---|---|
| CN113380675B (en) | 2022-11-25 |
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