CN211678942U - Silicon chip is with scrubbing mechanism - Google Patents
Silicon chip is with scrubbing mechanism Download PDFInfo
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- CN211678942U CN211678942U CN201922190264.9U CN201922190264U CN211678942U CN 211678942 U CN211678942 U CN 211678942U CN 201922190264 U CN201922190264 U CN 201922190264U CN 211678942 U CN211678942 U CN 211678942U
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- silicon wafer
- silicon chip
- brush
- scrubbing mechanism
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Abstract
The utility model relates to a scrubbing mechanism for silicon wafers, which comprises a base, wherein the top of the base is provided with a power mechanism used for driving the base to rotate; the top of the power mechanism is provided with a pressing piece for driving the base to move up and down; a liquid spraying pipe extending downwards is arranged in the base; the bottom of base is equipped with the brush of being convenient for toward outer exhaust with spray tube spun liquid, the utility model discloses a silicon chip is with scrubbing mechanism, simple structure, and the modified is with low costs, when the brush washs the silicon chip, the past discharge that washing liquid and abluent foreign matter can be quick, and can not be detained on the silicon chip to avoid the foreign matter to cause the pollution to the silicon chip, promoted the cleaning efficiency and the effect to the silicon chip, accorded with the abluent high accuracy demand of silicon chip.
Description
Technical Field
The utility model relates to a mechanism of scrubbing especially relates to a mechanism of scrubbing for silicon chip is abluent.
Background
In the cleaning process of the silicon wafer, the cleaning of the silicon wafer by the matching of the brushing mechanism and the cleaning liquid is an important part, and the current brushing mechanism mainly cleans the silicon wafer by a brush.
When the existing brush is used for cleaning the silicon wafer, the cleaning mode is as follows: firstly, a nozzle sprays cleaning liquid onto a silicon wafer, then a brush presses the silicon wafer downwards by using a pressing mechanism and simultaneously uses an automatic rotating mechanism to rotationally clean the silicon wafer, but in the cleaning process, when the brush is used for cleaning foreign matters on the silicon wafer, one part of the foreign matters are cleaned outside the silicon wafer, the other part of the foreign matters enter the central part of the brush and finally move into the brush, so that when the brush is cleaned, the foreign matters are pressed on the silicon wafer again to be attached, and secondary pollution to the silicon wafer is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art and providing an improvement with low costs, the cleaning performance is good, can not cause secondary pollution's silicon chip with scrubbing mechanism.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a silicon wafer scrubbing mechanism comprising:
the top of the base is provided with a power mechanism for driving the base to rotate;
the top of the power mechanism is provided with a pressing piece for driving the base to move up and down;
a liquid spraying pipe extending downwards is arranged in the base;
the bottom of the base is provided with a brush which is convenient for discharging the liquid sprayed by the liquid spraying pipe outwards.
Further, the brush comprises a brush body, a round hole is formed in the center of the brush body, and the liquid spraying pipe is arranged in the round hole; the brush body is provided with a plurality of flow guide grooves communicated with the round holes.
Furthermore, the number of the diversion trenches is four, and each diversion trench is in a long strip shape; the four diversion trenches are in a cross shape.
Further, the brush is composed of a plurality of small brushes, and the small brushes are distributed at the bottom of the base in a circular array with the liquid spraying pipe as the center.
Further, the number of the brushes is four.
Further, the power mechanism is a motor.
Further, the pressing piece is an air cylinder.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses the silicon chip of scheme is with scrubbing mechanism, simple structure, the modified is with low costs, when the brush washs the silicon chip, the past discharge that washing liquid and abluent foreign matter can be quick, and can not be detained on the silicon chip to avoid the foreign matter to cause the pollution to the silicon chip, promoted cleaning efficiency and the effect to the silicon chip, accorded with the abluent high accuracy demand of silicon chip.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a schematic structural diagram of a first embodiment of the present invention;
FIG. 2 is a bottom view of FIG. 1;
fig. 3 is a schematic structural diagram of a second embodiment of the present invention;
FIG. 4 is a bottom view of FIG. 3;
wherein: the brush comprises a base 1, a power mechanism 2, a pressing piece 3, a liquid spraying pipe 4, a brush body 20, a round hole 21, a diversion trench 22 and a small brush 30.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-4, the brushing mechanism for silicon wafer of the present invention comprises: the device comprises a base 1, wherein the top of the base 1 is provided with a power mechanism 2 for driving the base 1 to rotate; the top of the power mechanism 2 is provided with a pressing piece 3 for driving the base 1 to move up and down; a liquid spraying pipe 4 extending downwards is arranged in the base 1; the bottom of the base 1 is provided with a brush which is convenient for discharging the liquid sprayed from the liquid spraying pipe 4 outwards.
The power mechanism 2 is a motor, the base 1 is driven by the motor to rotate, the pressing piece 3 is a cylinder and drives the base 1 to move up and down, and the power mechanism 2 and the pressing piece 3 can be of other structures as long as the function can be realized.
The first embodiment is as follows:
referring to fig. 1-2, in the present embodiment, the brush includes a brush body 20, a circular hole 21 is disposed at a center of the brush body 20, the liquid spray pipe 4 is disposed in the circular hole 21, the brush body 20 is provided with a plurality of flow guide grooves 22 communicated with the circular hole 21, the number of the flow guide grooves 22 is four, each flow guide groove 22 is in a long strip shape, the four flow guide grooves are distributed on the brush body 20 in a cross shape,
when the brushing mechanism works, the brush body 20 moves up and down through the cylinder to press the silicon wafer down, the cleaning liquid is sprayed out through the liquid spraying pipe, and then the brush body 20 automatically rotates under the control of the motor to clean the silicon wafer in a self-rotating manner; in the process of scrubbing the silicon wafer, the cleaning liquid and the foreign matters flow out of the brush body 20 through the round holes and the corresponding guide grooves 11, so that the brush can prevent the foreign matters from being pressed on the silicon wafer again in the process of cleaning the silicon wafer to be attached to the silicon wafer, and secondary pollution to the silicon wafer is prevented.
Example two:
referring to fig. 3-4, in the present embodiment, the brush is composed of four small brushes 30, and a plurality of the small brushes 30 are distributed on the bottom of the base 1 in a circular array with the liquid spray tube 4 as the center.
When the brushing mechanism works, the four small brushes 30 move up and down through the cylinder to press the silicon wafer down, the cleaning liquid is sprayed out from the liquid spraying pipe, and then the four small brushes 30 automatically rotate under the control of the motor to clean the silicon wafer in a self-rotating way; in the process of scrubbing the silicon wafer, because of the large gaps among the small brushes, the cleaning liquid and the foreign matters cannot be retained on the silicon wafer, and the cleaning liquid and the foreign matters can be discharged outwards quickly, so that the foreign matters are prevented from being pressed on the silicon wafer again to be attached, and secondary pollution to the silicon wafer is prevented.
The utility model discloses a silicon chip is with scrubbing mechanism, simple structure, the modified is with low costs, when the brush washs the silicon chip, the past discharge that washing liquid and abluent foreign matter can be quick, and can not be detained on the silicon chip to avoid the foreign matter to cause the pollution to the silicon chip, promoted cleaning efficiency and the effect to the silicon chip, accorded with the abluent high accuracy demand of silicon chip.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (7)
1. A silicon wafer scrubbing mechanism, comprising:
the top of the base is provided with a power mechanism for driving the base to rotate;
the top of the power mechanism is provided with a pressing piece for driving the base to move up and down;
a liquid spraying pipe extending downwards is arranged in the base;
the bottom of the base is provided with a brush which is convenient for discharging the liquid sprayed by the liquid spraying pipe outwards.
2. The silicon wafer scrubbing mechanism of claim 1, wherein; the brush comprises a brush body, a round hole is formed in the center of the brush body, and the liquid spraying pipe is arranged in the round hole; the brush body is provided with a plurality of flow guide grooves communicated with the round holes.
3. The silicon wafer scrubbing mechanism of claim 2, wherein; the number of the diversion trenches is four, and each diversion trench is in a long strip shape; the four diversion trenches are in a cross shape.
4. The silicon wafer scrubbing mechanism of claim 1, wherein; the brush is composed of a plurality of small brushes, and the small brushes are distributed at the bottom of the base in a circular array with the liquid spraying pipe as the center.
5. The silicon wafer scrubbing mechanism of claim 4, wherein; the number of the brushes is four.
6. The silicon wafer scrubbing mechanism according to claim 1, wherein: the power mechanism is a motor.
7. The silicon wafer scrubbing mechanism according to claim 1, wherein: the compressing piece is an air cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922190264.9U CN211678942U (en) | 2019-12-09 | 2019-12-09 | Silicon chip is with scrubbing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922190264.9U CN211678942U (en) | 2019-12-09 | 2019-12-09 | Silicon chip is with scrubbing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211678942U true CN211678942U (en) | 2020-10-16 |
Family
ID=72790284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922190264.9U Active CN211678942U (en) | 2019-12-09 | 2019-12-09 | Silicon chip is with scrubbing mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN211678942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974324A (en) * | 2021-03-01 | 2021-06-18 | 长江存储科技有限责任公司 | Wafer cleaning brush and wafer cleaning device |
-
2019
- 2019-12-09 CN CN201922190264.9U patent/CN211678942U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974324A (en) * | 2021-03-01 | 2021-06-18 | 长江存储科技有限责任公司 | Wafer cleaning brush and wafer cleaning device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Patentee after: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. Address before: 215000 Room 214, 23 Blocks, Zhongbei District, No. 99 Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province Patentee before: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |