CN113380504A - Magnetic sheet - Google Patents
Magnetic sheet Download PDFInfo
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- CN113380504A CN113380504A CN202110200703.9A CN202110200703A CN113380504A CN 113380504 A CN113380504 A CN 113380504A CN 202110200703 A CN202110200703 A CN 202110200703A CN 113380504 A CN113380504 A CN 113380504A
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- magnetic
- layer
- resin composition
- magnetic sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Soft Magnetic Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a magnetic sheet with improved magnetic layer singulation difficulty, a manufacturing method thereof, a circuit board obtained by using the magnetic sheet, an inductor substrate and a manufacturing method of the circuit board. The solution of the present invention is a magnetic sheet comprising a support and a plurality of magnetic layers provided on the support at a distance from each other, wherein the plurality of magnetic layers comprise a cured product of a resin composition containing a magnetic powder.
Description
Technical Field
The present invention relates to a magnetic sheet, a method for manufacturing the same, and a circuit board, an inductor board, and a method for manufacturing the circuit board, which are obtained using the magnetic sheet.
Background
A circuit board such as a printed wiring board may be mounted with a component containing magnetic powder such as an inductor component and a magnetic shield. Such a member has been conventionally manufactured using a mold (metal mold) in many cases (patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2003-282344.
Disclosure of Invention
Technical problem to be solved by the invention
Manufacturing using a mold is generally time consuming and costly. Therefore, the present inventors have studied a new component manufacturing technique without using a mold. The following matters are specifically tried: a large-area magnetic layer is produced using a resin composition containing a magnetic powder, and the large-area magnetic layer is cut to be singulated to obtain a magnetic layer having an appropriate size that can be used as a component or a part thereof.
However, the magnetic layer is generally hard and highly brittle because it contains magnetic powder. In particular, in order to improve the magnetic properties of the magnetic layer, it is required to contain a large amount of magnetic powder, and thus the magnetic layer tends to be harder and more brittle. Therefore, it is difficult to cut a large area of the magnetic layer. Further, even when dicing is possible, cracks may be generated in the resulting magnetic layer. Due to such circumstances, it has been difficult to easily manufacture a magnetic layer that has been singulated.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a magnetic sheet in which the ease (easiness) of singulation of a magnetic layer is improved, a method for manufacturing the same, and a circuit board, an inductor board, and a method for manufacturing the circuit board, which are obtained using the magnetic sheet.
Technical scheme for solving technical problem
That is, the present invention includes the following;
[1] a magnetic sheet having:
a support, and
a plurality of magnetic layers arranged on the support at a distance from one another,
the plurality of magnetic layers include a cured product of a resin composition containing a magnetic powder;
[2] the magnetic sheet according to [1], wherein the thickness of each magnetic layer is 0.01mm or more and 0.5mm or less;
[3] the magnetic sheet according to [1] or [2], wherein widths of the magnetic layers in the longitudinal direction and the transverse direction are 0.5mm or more and 10mm or less;
[4] the magnetic sheet according to any one of [1] to [3], wherein a minimum interval between the magnetic layers is 0.1mm or more and 20mm or less;
[5] the magnetic sheet according to any one of [1] to [4], which is used for manufacturing a circuit board;
[6] a circuit board comprising the magnetic layer of the magnetic sheet according to any one of [1] to [5 ];
[7] an inductor substrate comprising the circuit substrate of [6 ];
[8] a method of manufacturing a circuit substrate, comprising:
(1) preparing the magnetic sheet according to any one of [1] to [5],
(2) Step of peeling off support, and
(4) a step of bonding the magnetic layer to the inner layer substrate;
[9] the method of manufacturing a circuit board according to [8], wherein the step (2) and the step (4) include:
(3) a step of supplying the magnetic layer to a mounting machine;
[10] a method of manufacturing a magnetic sheet, comprising:
(A) a step of printing a resin composition containing magnetic powder on a support to form a plurality of resin composition layers; and
(B) curing the resin composition layer;
[11] the method for manufacturing a magnetic sheet according to item [10], wherein the printing is screen printing.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a magnetic sheet in which the ease of singulation of the magnetic layer is improved, a method for manufacturing the magnetic sheet, and a circuit board, an inductor board, and a method for manufacturing the circuit board, which are obtained using the magnetic sheet, can be provided.
Brief description of the drawings
Fig. 1 is a schematic perspective view of a sheet printed with a resin composition on a support as an example;
FIG. 2 is a schematic perspective view of a magnetic sheet as an example;
FIG. 3 is a schematic perspective view showing a roll for supplying a magnetic layer to an assembling machine as an example;
fig. 4 is a schematic cross-sectional view showing a state in which a magnetic layer is bonded to an inner layer substrate as an example.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are only for the purpose of illustrating the shape, size, and arrangement of the constituent elements in a simplified manner to the extent that the invention can be understood. The present invention is not limited to the following embodiments, and each constituent element may be appropriately modified. Further, the configurations relating to the embodiments of the present invention are not necessarily limited to being manufactured or used only by the configurations illustrated in the drawings.
[ magnetic sheet ]
The magnetic sheet of the present invention has a support and a plurality of magnetic layers provided on the support at intervals, wherein the plurality of magnetic layers contain a cured product of a resin composition containing a magnetic powder.
Fig. 2 is a schematic perspective view of a magnetic sheet as an example. The magnetic sheet 1 shown in fig. 2 is provided with a plurality of magnetic layers 3 provided on a support 2 at intervals. Since the magnetic layer 3 of the magnetic sheet 1 has already been singulated, the singulated magnetic layer 3 is obtained only by peeling off the support 2. The shape of the magnetic sheet 1 is arbitrary, and is generally a quadrangle.
The width "a" in the longitudinal direction of each magnetic layer 3 is preferably 0.5mm or more, more preferably 1mm or more, further preferably 2mm or more, further preferably 10mm or less, further preferably 8mm or less, further preferably 6mm or less, from the viewpoint of manufacturing a circuit board with a small size.
The width b of each magnetic layer 3 in the lateral direction is preferably 0.5mm or more, more preferably 1mm or more, further preferably 2mm or more, preferably 10mm or less, further preferably 8mm or less, further preferably 6mm or less, from the viewpoint of manufacturing a circuit board with a small size.
The minimum interval c between the magnetic layers 3 is preferably 0.1mm or more, more preferably 0.5mm or more, further preferably 1mm or more, preferably 20mm or less, more preferably 15mm or less, further more preferably 10mm or less, from the viewpoint of facilitating the singulation of the plurality of magnetic layers 3.
The thickness of the magnetic layer 3 is preferably 0.5mm or less, more preferably 0.3mm or less, further preferably 0.1mm or less, more preferably 0.01mm or more, further preferably 0.03mm or more, and further more preferably 0.05mm or more, from the viewpoint of reduction in thickness.
Hereinafter, each layer constituting the magnetic sheet of the present invention will be described in detail.
< support >
The magnetic sheet has a support. Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.
When a film made of a plastic material is used as the support, examples of the plastic material include: polyester such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), acrylic polymer such as polycarbonate (hereinafter sometimes abbreviated as "PC") and polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and particularly, inexpensive polyethylene terephthalate is preferable.
When a metal foil is used as the support, examples of the metal foil include a copper foil and an aluminum foil, and a copper foil is preferred. As the copper foil, a foil formed of a single metal of copper may be used, and a foil formed of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, or the like) may also be used.
The surface of the support to be bonded to the resin composition layer may be subjected to matting treatment or corona treatment.
Further, as the support, a support with a release layer having a release layer on a surface to be bonded to the magnetic layer can be used. Examples of the release agent used for the release layer of the support with a release layer include 1 or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available supports with release layers can be used.
The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the thickness of the entire support with a release layer is preferably in the above range.
< magnetic layer >
The magnetic sheet has a magnetic layer containing a cured product of a resin composition containing a magnetic powder. The magnetic layers are provided in plurality spaced apart from each other. The plurality of magnetic layers are bonded to the support, and the plurality of magnetic layers are used as a single piece in the production of a circuit board or the like. The resin composition is preferably a composition whose cured product has sufficient hardness and relative magnetic permeability, for example. Hereinafter, each component contained in the resin composition will be described in detail.
Magnetic powder-
The resin composition contains a magnetic powder. By containing the magnetic powder in the resin composition, the relative permeability of the magnetic layer can be improved. The magnetic powder may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
The magnetic powder may be either a soft magnetic powder or a hard magnetic powder, and is preferably a soft magnetic powder from the viewpoint of improving the relative permeability.
Examples of the magnetic powder include: iron oxide powders such as Fe-Mn based ferrite, Fe-Mn-Zn based ferrite, Mg-Zn based ferrite, Mn-Mg based ferrite, Cu-Zn based ferrite, Mg-Mn-Sr based ferrite, Ni-Zn based ferrite, Ba-Mg based ferrite, Ba-Ni based ferrite, Ba-Co based ferrite, Ba-Ni-Co based ferrite, Y based ferrite, iron oxide powder (III), and ferroferric oxide; pure iron powder; an iron alloy-based metal powder such as an Fe-Si-based alloy powder, an Fe-Si-Al-based alloy powder, an Fe-Cr-Si-based alloy powder, an Fe-Ni-Cr-based alloy powder, an Fe-Cr-Al-based alloy powder, an Fe-Ni-Mo-Cu-based alloy powder, an Fe-Co-based alloy powder, or an Fe-Ni-Co-based alloy powder; amorphous alloys such as Co-based amorphous alloys.
Among them, the magnetic powder is preferably at least 1 kind selected from iron oxide powder and iron alloy metal powder. As the iron oxide powder, it preferably contains: a ferrite containing at least 1 element selected from the group consisting of Ni, Cu, Mn and Zn, and more preferably at least 1 element selected from the group consisting of Fe-Mn ferrite and Fe-Mn-Zn ferrite. Further, the iron alloy-based metal powder preferably contains: an iron alloy-based metal powder containing at least 1 element selected from the group consisting of Si, Cr, Al, Ni and Co. Commercially available magnetic powder can be used.
The magnetic powder is preferably spherical. The value (aspect ratio) obtained by dividing the length of the major axis of the magnetic powder by the length of the minor axis is preferably 2 or less, more preferably 1.5 or less, and still more preferably 1.2 or less. Generally, when the magnetic powder has a non-spherical flat shape, the relative permeability is more easily improved. However, in particular, when spherical magnetic powder is used, it is preferable from the viewpoint that magnetic loss is generally reduced and a resin composition having a preferable viscosity is obtained.
From the viewpoint of improving the relative permeability, the average particle diameter of the magnetic powder is preferably 0.01 μm or more, more preferably 0.5 μm or more, and still more preferably 1 μm or more. Further, it is preferably 30 μm or less, more preferably 25 μm or less, further preferably 20 μm or less.
The average particle diameter of the magnetic powder can be measured by a laser diffraction scattering method based on Mie scattering theory. Specifically, the particle size distribution of the magnetic powder can be prepared on a volume basis by a laser diffraction scattering particle size distribution measuring apparatus, and the median particle size is measured as an average particle size. As the measurement sample, a sample obtained by dispersing magnetic powder in water by ultrasonic waves can be preferably used. As the laser diffraction scattering type particle size distribution measuring device, there can be used "LA-960" manufactured by horiba, Ltd., SALD-2200 manufactured by Shimadzu, Ltd.
From the viewpoint of improving the relative permeability, the specific surface area of the magnetic powder is preferably 0.05m2More than g, preferably 0.1m2More preferably 0.3m or more in terms of a molar ratio of the compound to the metal2More than g. Further, it is preferably 10m2A ratio of less than g, more preferably 8m2A total of 5m or less2The ratio of the carbon atoms to the carbon atoms is less than g. The specific surface area of the magnetic powder can be measured by the BET method.
The magnetic powder can be treated with a surface treatment agent from the viewpoint of adjusting the viscosity of the resin composition and further improving moisture resistance and dispersibility. Examples of the surface treatment agent include: vinyl silane coupling agents, (meth) acrylic acid coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxy silane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilicon nitrogen compounds, titanate coupling agents, and the like. The surface treatment agent can be used alone in 1 kind, also can be used in 2 kinds or more arbitrary combination. Further, commercially available surface treatment agents can be used.
From the viewpoint of improving the dispersibility of the magnetic powder, the degree of surface treatment with the surface treatment agent is preferably controlled within a predetermined range. Specifically, 100 parts by mass of the magnetic powder is preferably surface-treated with 0.01 to 5 parts by mass of a surface treatment agent, more preferably 0.05 to 3 parts by mass of a surface treatment agent, and still more preferably 0.1 to 2 parts by mass of a surface treatment agent.
From the viewpoint of improving the relative permeability, the content (volume%) of the magnetic powder is preferably 40 volume% or more, more preferably 50 volume% or more, and still more preferably 60 volume% or more, assuming that the nonvolatile content in the resin composition is 100 volume%. Further, it is preferably 85% by volume or less, more preferably 80% by volume or less, and still more preferably 70% by volume or less.
From the viewpoint of improving the relative permeability, the content (mass%) of the magnetic powder is preferably 60 mass% or more, more preferably 70 mass% or more, and still more preferably 75 mass% or more, assuming that the nonvolatile content in the resin composition is 100 mass%. Further, it is preferably 98% by mass or less, more preferably 95% by mass or less, and still more preferably 90% by mass or less. In the present invention, unless otherwise stated, the content of each component in the resin composition is a value when the nonvolatile content in the resin composition is 100 mass%.
A curable resin-
The resin composition may contain a curable resin as an optional component. The curable resin includes a thermosetting resin, a photocurable resin, and the like, but a thermosetting resin is preferred. As such a thermosetting resin, for example, an epoxy resin is preferable.
Examples of the epoxy resin include: epoxy resins of the glycidoxy (glycidyl) type; bisphenol a type epoxy resin; bisphenol F type epoxy resins; bisphenol S type epoxy resin; bisphenol AF type epoxy resin; dicyclopentadiene type epoxy resins; a trisphenol type epoxy resin; phenol novolac type epoxy resin; t-butyl-catechol-type epoxy resin; epoxy resins having a condensed ring structure such as naphthol novolac type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, and the like; glycidyl amine type epoxy resins; glycidyl ester type epoxy resins; cresol novolac type epoxy resins; biphenyl type epoxy resin; linear aliphatic epoxy resins; an epoxy resin having a butadiene structure; a cycloaliphatic epoxy resin; heterocyclic epoxy resins; epoxy resin containing spiro ring; cyclohexane dimethanol type epoxy resins; a trimethylol type epoxy resin; tetraphenylethane type epoxy resins, and the like. The epoxy resin may be used alone in 1 kind, or in combination of 2 or more kinds. The epoxy resin may be used alone in 1 kind, or 2 or more kinds may be used in combination. Further, a commercially available epoxy resin can be used.
The epoxy resin includes an epoxy resin that is liquid at a temperature of 25 ℃ (hereinafter sometimes referred to as "liquid epoxy resin") and an epoxy resin that is solid at a temperature of 25 ℃ (hereinafter sometimes referred to as "solid epoxy resin"). The epoxy resin may contain only a liquid epoxy resin, may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin.
The epoxy equivalent of the epoxy resin is preferably 50g/eq to 5000g/eq, more preferably 50g/eq to 3000g/eq, still more preferably 80g/eq to 2000g/eq, and still more preferably 110g/eq to 1000g/eq. When the amount is within this range, the crosslinking density of the cured product becomes sufficient, and a magnetic layer having a small surface roughness can be formed. The epoxy equivalent can be measured according to JIS K7236, and is the mass of a resin containing 1 equivalent of an epoxy group.
The weight average molecular weight of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and further preferably 400 to 1500. Here, the weight average molecular weight of the epoxy resin is a weight average molecular weight in terms of polystyrene measured by a Gel Permeation Chromatography (GPC) method.
The thermosetting resin may contain, in addition to the epoxy resin, a component capable of reacting with the epoxy resin and curing the resin composition, such as a phenol-based resin, a naphthol-based resin, a benzoxazine-based resin, an active ester-based resin, a cyanate ester-based resin, a carbodiimide-based resin, an amine-based resin, or an acid anhydride-based resin.
From the viewpoint of obtaining a cured product excellent in mechanical properties and magnetic properties, the content of the curable resin is preferably 1 mass% or more, more preferably 5 mass% or more, and still more preferably 10 mass% or more, with 100 mass% of nonvolatile components in the resin composition. The upper limit is not particularly limited as long as the effects of the present invention can be exerted, and is preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less.
Dispersants-
The resin composition may further contain a dispersant as an arbitrary component. Examples of the dispersant include: phosphate dispersants such as polyoxyethylene alkyl ether phosphate esters; anionic dispersants such as sodium dodecylbenzenesulfonate, sodium laurate and ammonium salts of polyoxyethylene alkyl ether sulfate; and nonionic dispersants such as organosiloxane dispersants, polyoxyalkylene dispersants, acetylene glycol (acetylene glycol), polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkylamines, and polyoxyethylene alkylamides. Among them, nonionic dispersants are preferred. The dispersant may be used alone in 1 kind, or 2 or more kinds may be used in combination. Further, commercially available dispersants can be used.
From the viewpoint of remarkably exerting the effect of the present invention, the content of the dispersant is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, and the upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, further preferably 1% by mass or less, when the nonvolatile content in the resin composition is set to 100% by mass.
Curing accelerators
The resin composition may further contain a curing accelerator as an arbitrary component. Examples of the curing accelerator include: phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators and the like are preferred, and phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators and metal-based curing accelerators are more preferred, and amine-based curing accelerators, imidazole-based curing accelerators and metal-based curing accelerators are still more preferred, and imidazole-based curing accelerators are still more preferred. The curing accelerator may be used alone in 1 kind, or 2 or more kinds may be used in combination. Further, commercially available curing accelerators can be used.
From the viewpoint of obtaining a cured product having more excellent mechanical properties, the content of the curing accelerator is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, further preferably 5% by mass or less, further preferably 3% by mass or less, further preferably 1% by mass or less, with respect to 100% by mass of the nonvolatile component in the resin composition.
Other additives
The resin composition may further contain any additives as needed. Examples of such other additives include: a thermoplastic resin such as a phenoxy resin, a flame retardant, an organic metal compound such as an organic copper compound, an organic zinc compound, and an organic cobalt compound, and a resin additive such as a thickener, a defoaming agent, a leveling agent, an adhesion-imparting agent, and a colorant.
The resin composition can be produced, for example, by a method in which the blend components are stirred by a stirring apparatus such as a three-roll mill or a rotary mixer.
< other layer >
The magnetic sheet may include any layer in addition to the support and the magnetic layer. For example, in the magnetic sheet, a protective film selected for the support may be further laminated on the surface of the magnetic layer not bonded to the support (i.e., the surface on the opposite side to the support). The thickness of the protective film is not particularly limited, and is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust or the like to the surface of the magnetic layer or formation of scratches can be suppressed. The magnetic sheet can be rolled for storage.
[ method for producing magnetic sheet ]
The method for manufacturing a magnetic sheet of the present invention includes: (A) a step of printing a resin composition containing magnetic powder on a support to form a plurality of resin composition layers; and (B) curing the resin composition layer.
< Process (A) >
The step (a) is a step of printing the resin composition on the support to form a resin composition layer. The resin composition is as described in the above description.
Fig. 1 is a perspective view schematically showing an example of a sheet 1A in which a resin composition layer 4 is formed on a support 2. Sheet 1A was obtained by: the resin composition is printed on the support 2 so that the plurality of resin composition layers 4 are provided at intervals. The width in the longitudinal direction of the resin composition layers 4, the width in the lateral direction of the resin composition layers 4, and the minimum interval between the resin composition layers 4 are the same as the width a in the longitudinal direction of the magnetic layers, the width b in the lateral direction of the magnetic layers, and the minimum interval c between the magnetic layers.
As a printing method of the resin composition, screen printing is generally performed, but other methods may be employed. Examples of other printing methods include: a method of printing a resin composition by performing mask printing, a method of printing by intermittent coating, a roll coating method, an ink jet method, and the like.
The step (a) may include, for example: a resin varnish containing a resin composition in an organic solvent is prepared, and the resin varnish is printed on the support 2 and then dried to form the resin composition layer 4. When the resin composition is in the form of paste, the resin composition layer 4 can be formed by directly printing the resin composition on the support 2.
Examples of the organic solvent include: ketones such as acetone, Methyl Ethyl Ketone (MEK) and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone. The organic solvent may be used alone in 1 kind, or may be used in combination of 2 or more kinds.
The drying may be carried out by heating, blowing hot air, or the like. The drying conditions are not particularly limited, and the drying is performed so that the content of the organic solvent in the resin varnish becomes 10% by mass or less, preferably 5% by mass or less. Although the boiling point of the organic solvent in the resin varnish varies, for example, when a resin varnish containing 30 to 60 mass% of the organic solvent is used, the resin composition layer 4 can be formed by drying at 50 to 150 ℃ for 3 to 10 minutes.
< Process (B) >
The step (B) is a step of curing the resin composition layer 4, and the magnetic layer 3 as shown in fig. 2 is formed by curing the resin composition layer 4. When the resin composition contains a thermosetting resin, the step (B) is preferably to cure the resin composition layer 4 by thermosetting.
The curing conditions of the resin composition layer 4 are also different depending on the composition and kind of the resin composition, and the curing temperature is preferably 60 ℃ or higher, more preferably 70 ℃ or higher, further preferably 80 ℃ or higher, preferably 200 ℃ or lower, more preferably 190 ℃ or lower, further preferably 180 ℃ or lower. The curing time of the resin composition layer 4 is preferably 2 minutes or more, more preferably 5 minutes or more, further preferably 8 minutes or more, preferably 120 minutes or less, more preferably 100 minutes or less, further more preferably 90 minutes or less.
Before the resin composition layer 4 is thermally cured, the resin composition layer 4 may be preheated at a temperature lower than the curing temperature. For example, before the resin composition layer 4 is thermally cured, the resin composition layer 4 may be preheated at a temperature of 50 ℃ or more and less than 120 ℃ (preferably 60 ℃ or more and 115 ℃ or less, more preferably 70 ℃ or more and 110 ℃ or less) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, further more preferably 15 minutes to 100 minutes).
The degree of cure of the magnetic layer 3 after the step (B) is preferably 80% or more, more preferably 85% or more, and still more preferably 90% or more. The upper limit of the degree of curing may be 100% or less, 99% or less, or the like. The degree of curing can be measured, for example, using a differential scanning calorimeter.
< use of magnetic layer, Property >
The magnetic layer contains magnetic powder, and thus exhibits a characteristic of high relative permeability. Therefore, the magnetic layer of the magnetic sheet of the present invention can be suitably used as: a magnetic layer of a magnetic sheet for use in the production of a circuit board. Specifically, in order to manufacture the inductor substrate, it can be suitably used as: magnetic layer of a magnetic sheet for use in the manufacture of an inductor substrate. Further, the magnetic layer of the magnetic sheet can be used for magnetic shielding purposes.
The magnetic layer generally exhibits a characteristic of high relative permeability at a frequency of 100 MHz. The magnetic layer preferably has a relative permeability of 3 or more, more preferably 4 or more, and further more preferably 5 or more at a frequency of 100 MHz. The upper limit is not particularly limited, and may be 20 or less.
The magnetic layer generally exhibits a characteristic of low magnetic loss at a frequency of 100 MHz. The magnetic loss of the magnetic layer at a frequency of 100 MHz is preferably 1 or less, more preferably 0.5 or less, and further more preferably 0.2 or less. The lower limit is not particularly limited, and may be 0.001 or more.
The relative permeability and the magnetic loss can be measured in the following manner. An annular magnetic layer having an outer diameter of 20mm and an inner diameter of 9mm was prepared as an evaluation sample. For the evaluation sample, the relative permeability (. mu. ') and the magnetic loss (. mu.') were measured at 23 ℃ at room temperature using "16454A" manufactured by Keysight Technologies, Inc., and the measurement frequency was set to a range of 1MHz to 3 GHz. The loss factor is calculated by the following formula;
tanδ＝μ''/μ'。
[ Circuit Board and method for manufacturing the same ]
The circuit board of the present invention includes a magnetic layer of a magnetic sheet. The circuit board can be manufactured by a method including the following steps (1), (2), and (4), using a magnetic sheet, for example. It is preferable to perform the following steps (1), (2) and (4) in this order;
(1) process for preparing magnetic sheet
(2) Step of peeling off support
(4) And a step of bonding the magnetic layer to the inner layer substrate.
The method for manufacturing a circuit board preferably includes the following step (3) between the steps (2) and (4):
(3) and a step of supplying the magnetic layer to the mounting machine.
The steps (1) to (4) in the production of the circuit board will be described in detail below.
< Process (1) >
The step (1) is a step of preparing a magnetic sheet. The magnetic sheet is as described in the above description.
< Process (2) >
The step (2) is a step of peeling off the support of the magnetic sheet. The support is peeled off, whereby the plurality of magnetic layers can be made into a single piece.
When the magnetic sheet is in a roll form, the support body can be peeled off while the magnetic sheet is conveyed. Further, for example, in the case where the magnetic sheet is a single sheet (e.g., a single-sheet), the support may be peeled off using a peeling device or the like for peeling the support.
< Process (3) >
The step (3) is a step of supplying each of the magnetic layers obtained by the singulation to a mounting machine. By supplying the magnetic layer to the mounting machine, the later-described step (4) can be efficiently performed using the mounting machine.
Fig. 3 is a schematic perspective view showing a roll for supplying a magnetic layer to an assembling machine as an example. The reel 5 accommodates a tape 51 which can be pulled out. In step (2), the magnetic layers 3 separated by peeling off the support are placed on the tape 51 of the roll 5. As one embodiment of the step (3), the tape 51 stored in the reel 5 is drawn out, and the magnetic layers 3 singulated from the leading end of the tape 51 are attached to the tape 51 at predetermined intervals. Then, the tape 51 on which the singulated magnetic layers 3 are placed is stored in the roll 5, whereby the magnetic layers 3 can be supplied to the mounting machine.
< Process (4) >
The step (4) is a step of bonding the magnetic layer to the inner layer substrate. The magnetic layer 3 is laminated on the inner layer substrate 100 and bonded to form a circuit board. When the step (3) is included, the magnetic layer 3 may be laminated on the inner layer substrate 100 via a mounting machine and bonded to form a circuit substrate. In a preferred embodiment of step (4), the circuit board is an inductor board, and a conductor layer (not shown) is formed in a spiral shape on the surface of the inner layer board 100, and the magnetic layer 3 is joined so as to cover the entire conductor layer.
The inner layer substrate 100 is an insulating substrate. Examples of the material of the inner layer substrate include: glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, thermosetting polyphenylene ether substrates, and the like. The inner layer substrate may be an inner layer circuit substrate having a wiring or the like embedded in the thickness thereof.
Examples of the conductor material that can constitute the conductor layer include: a single metal such as gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, indium, or the like; an alloy of 2 or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. Among them, from the viewpoint of versatility, cost, ease of patterning, and the like, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferably used, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or a nickel-chromium alloy is more preferably used, and copper is still more preferably used.
The magnetic layer 3 and the inner layer substrate 100 can be bonded to each other by, for example, heat-pressing the magnetic layer 3 to the inner layer substrate 100. Examples of a member for heat-pressure bonding the magnetic layer 3 to the inner layer substrate 100 (hereinafter also referred to as "heat-pressure bonding member") include a heated metal plate (stainless steel (SUS) end plate, etc.) and a metal roll (SUS roll). It is preferable that the thermocompression bonding member is not directly pressed in contact with the magnetic layer 3, but is pressed through a sheet or the like made of an elastic material such as heat-resistant rubber so that the magnetic layer 3 sufficiently follows the surface irregularities of the inner layer substrate 100.
The temperature at the time of heating and pressure bonding is preferably from 80 to 160 ℃, more preferably from 90 to 140 ℃, further preferably from 100 to 120 ℃, the pressure at the time of heating and pressure bonding is preferably from 0.098MPa to 1.77MPa, more preferably from 0.29MPa to 1.47MPa, and the time at the time of heating and pressure bonding is preferably from 20 seconds to 400 seconds, more preferably from 30 seconds to 300 seconds. The magnetic layer 3 and the inner layer substrate 100 are preferably bonded under a reduced pressure of 26.7hPa or less.
The magnetic layer 3 and the inner layer substrate 100 may be bonded by a commercially available vacuum laminator. Examples of commercially available vacuum laminators include: a vacuum pressure laminator manufactured by Nikko-Materials, vacuum applicators (vacuum applicators) manufactured by Nikko-Materials, and the like. The magnetic layer 3 and the inner layer substrate 100 may be bonded to each other using a commercially available adhesive.
After the magnetic layer 3 and the inner layer substrate 100 are joined, the smoothing treatment of the laminated magnetic layer 3 can be performed by pressing, for example, a heat pressure bonding member from the magnetic layer 3 side under normal pressure (atmospheric pressure). The pressing conditions for the smoothing treatment may be set to the same conditions as the above-described conditions for the heat and pressure bonding of the laminate. The smoothing treatment may be performed by a commercially available laminator. The lamination and smoothing treatment can be continuously performed using a commercially available vacuum laminator as described above.
[ inductor substrate ]
The inductor substrate comprises the circuit substrate of the invention. Such an inductor substrate has an inductor pattern formed of a conductor in at least a part of the periphery of the magnetic layer. As such a sensor substrate, for example, the sensor substrate described in japanese patent laid-open No. 2016-.
The inductor substrate can be used as a wiring board for mounting electronic components such as semiconductor chips, and can also be used as a (multilayer) printed wiring board using the wiring board as an inner layer substrate. The wiring board can be used as a chip inductor component obtained by singulating the wiring board, or as a printed wiring board having the chip inductor component mounted on the surface thereof.
In addition, semiconductor devices of various forms can be manufactured using the wiring board. The semiconductor device including the wiring board can be suitably used for electric products (e.g., computers, mobile phones, digital cameras, televisions, and the like), vehicles (e.g., motorcycles, automobiles, electric trains, ships, aircrafts, and the like), and the like.
Description of the symbols
1 magnetic sheet
1A sheet
2 support body
3 magnetic layer
4 resin composition layer
5 winding drum
51 strap
100 inner layer substrate
a width of the magnetic layer in the longitudinal direction
b width of magnetic layer in transverse direction
c minimum spacing between magnetic layers.
Claims (11)
1. A magnetic sheet having:
a support, and
a plurality of magnetic layers arranged on the support at a distance from one another,
the plurality of magnetic layers include a cured product of a resin composition including a magnetic powder.
2. The magnetic sheet according to claim 1, wherein the thickness of each magnetic layer is 0.01mm or more and 0.5mm or less.
3. The magnetic sheet according to claim 1, wherein each magnetic layer has a width in the longitudinal direction and the transverse direction of 0.5mm or more and 10mm or less.
4. The magnetic sheet according to claim 1, wherein the minimum spacing between the magnetic layers is 0.1mm or more and 20mm or less.
5. The magnetic sheet according to claim 1, used for manufacturing a circuit substrate.
6. A circuit substrate comprising the magnetic layer of the magnetic sheet according to any one of claims 1 to 5.
7. An inductor substrate comprising the circuit substrate of claim 6.
8. A method of manufacturing a circuit substrate, comprising:
(1) preparing the magnetic sheet according to any one of claims 1 to 5;
(2) a step of peeling off the support; and
(4) and a step of bonding the magnetic layer to the inner layer substrate.
9. The method of manufacturing a circuit board according to claim 8, wherein the step (2) and the step (4) include:
(3) and a step of supplying the magnetic layer to the mounting machine.
10. A method of manufacturing a magnetic sheet, comprising:
(A) a step of printing a resin composition containing magnetic powder on a support to form a plurality of resin composition layers; and
(B) and curing the resin composition layer.
11. The method for manufacturing a magnetic sheet according to claim 10, wherein the printing is screen printing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-029650 | 2020-02-25 | ||
| JP2020029650A JP7404927B2 (en) | 2020-02-25 | 2020-02-25 | magnetic sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113380504A true CN113380504A (en) | 2021-09-10 |
Family
ID=77569599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110200703.9A Pending CN113380504A (en) | 2020-02-25 | 2021-02-23 | Magnetic sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7404927B2 (en) |
| KR (1) | KR20210108325A (en) |
| CN (1) | CN113380504A (en) |
| TW (1) | TW202203718A (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128999Y1 (en) * | 1970-09-05 | 1976-07-22 | ||
| JPS62171107A (en) * | 1986-01-23 | 1987-07-28 | ティーディーケイ株式会社 | Manufacture of porcelain capacitor |
| JP2003282344A (en) | 2002-03-22 | 2003-10-03 | Murata Mfg Co Ltd | Chip inductor and manufacturing method thereof |
| JP2005072032A (en) * | 2003-08-22 | 2005-03-17 | Nec Tokin Corp | Thin-film core inductor and manufacturing method thereof |
| JP2018014399A (en) * | 2016-07-20 | 2018-01-25 | 株式会社トーキン | Noise suppressing sheet and electronic equipment |
-
2020
- 2020-02-25 JP JP2020029650A patent/JP7404927B2/en active Active
-
2021
- 2021-02-18 TW TW110105459A patent/TW202203718A/en unknown
- 2021-02-22 KR KR1020210023533A patent/KR20210108325A/en active Search and Examination
- 2021-02-23 CN CN202110200703.9A patent/CN113380504A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210108325A (en) | 2021-09-02 |
| TW202203718A (en) | 2022-01-16 |
| JP7404927B2 (en) | 2023-12-26 |
| JP2021136272A (en) | 2021-09-13 |
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