CN113375412A - Return air temperature control mechanism, return air temperature control method, operation control device and refrigerator - Google Patents

Return air temperature control mechanism, return air temperature control method, operation control device and refrigerator Download PDF

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Publication number
CN113375412A
CN113375412A CN202010116864.5A CN202010116864A CN113375412A CN 113375412 A CN113375412 A CN 113375412A CN 202010116864 A CN202010116864 A CN 202010116864A CN 113375412 A CN113375412 A CN 113375412A
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CN
China
Prior art keywords
temperature control
temperature
communication
air
turntable
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Granted
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CN202010116864.5A
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Chinese (zh)
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CN113375412B (en
Inventor
盛庆赫
唐学强
刘运斌
刘华
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Hefei Hualing Co Ltd
Midea Group Co Ltd
Hefei Midea Refrigerator Co Ltd
Original Assignee
Hefei Hualing Co Ltd
Midea Group Co Ltd
Hefei Midea Refrigerator Co Ltd
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Priority to CN202010116864.5A priority Critical patent/CN113375412B/en
Publication of CN113375412A publication Critical patent/CN113375412A/en
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Publication of CN113375412B publication Critical patent/CN113375412B/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F25D29/005—Mounting of control devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F25D11/022—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures with two or more evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042—Air treating means within refrigerated spaces
    • F25D17/045—Air flow control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F25D29/003—Arrangement or mounting of control or safety devices for movable devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/06—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation
    • F25D2317/067—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation characterised by air ducts

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)

Abstract

The invention discloses a return air temperature control mechanism, a return air temperature control method, an operation control device and a refrigerator, wherein the return air temperature control mechanism comprises a rotary table, a driving device for controlling the rotary table to rotate and at least one temperature control compartment group, the temperature control compartment group comprises two temperature control compartments which are adjacently arranged, a semiconductor refrigeration component is arranged in each temperature control compartment in a penetrating way, each semiconductor refrigeration component comprises a hot end and a cold end, the hot end faces one of the temperature control compartments, the cold end faces the other temperature control compartment, each temperature control compartment comprises an air supply opening and a return air opening, the rotary table is provided with a communication opening capable of corresponding to the return air opening, the semiconductor refrigeration component can control the temperature of the cold end and the hot end according to the temperature requirement of the temperature control compartments, therefore, different temperature control can be carried out on a plurality of different temperature control rooms at the same time, the temperature change range of the temperature control rooms can be expanded, and wide temperature adjustment of the temperature control rooms is realized.

Description

Return air temperature control mechanism, return air temperature control method, operation control device and refrigerator
Technical Field
The invention relates to the field of refrigerators, in particular to a return air temperature control mechanism, a return air temperature control method, an operation control device and a refrigerator.
Background
With the subdivision of temperature zones brought by the technical upgrade of users and the increasingly abundant purchasing of food materials by users, a plurality of refined storage spaces are needed, and the demand of creating a refrigerator with multiple temperature zones to realize different functions is urgent. At present, the method for realizing multiple temperature zones mostly adopts a mode of conveying the cold energy of an evaporator to a temperature control chamber through an air door for regulation and control, and the temperature regulation and control range is limited.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a return air temperature control mechanism, a return air temperature control method, an operation control device and a refrigerator, which can effectively expand the temperature change range of a temperature control chamber and realize wide temperature adjustment of the temperature control chamber under the condition of meeting the temperature control requests of a plurality of temperature zones.
The return air temperature control mechanism is applied to a refrigerator and comprises a rotary table, a driving device and at least one temperature control room group, wherein the driving device is used for controlling the rotary table to rotate, the temperature control room group comprises two temperature control rooms which are adjacently arranged, a semiconductor refrigeration assembly penetrates through the two temperature control rooms, the semiconductor refrigeration assembly comprises a hot end and a cold end, the hot end faces one of the temperature control rooms, the cold end faces the other temperature control room, the temperature control rooms comprise an air supply opening and an air return opening, and the rotary table is provided with a communication opening which can correspond to the air return opening.
The temperature control of the existing temperature control chamber is mainly realized by utilizing a heat exchange mode of air outside the temperature control chamber and air inside the temperature control chamber, and because the temperature control chamber is limited by the temperature condition of the air outside the temperature control chamber, the temperature range which can be controlled by the temperature chamber is narrow, and the temperature of a plurality of temperature control chambers cannot be controlled simultaneously. In the embodiment of the invention, the semiconductor refrigeration components are arranged between two adjacent temperature control rooms in a penetrating way, and the temperature control rooms are relatively closed independent spaces, so that the temperature of the air outside the temperature control rooms is not influenced when the semiconductor refrigeration components control the temperature of the temperature control rooms, the temperature control requirement range of the temperature control rooms is not limited by the temperature of the air outside the temperature control rooms, when the semiconductor refrigeration components start to work, the semiconductor refrigeration components can control the temperature of a cold end and a hot end according to the temperature requirement of the temperature control rooms, the cold end can refrigerate one temperature control room, the hot end can simultaneously heat the other temperature control room, thus different temperature control can be simultaneously carried out on a plurality of different temperature control rooms, and the temperature change range of the temperature control rooms can be expanded, realize the wide-width temperature adjustment of the temperature control chamber.
According to some embodiments of the invention, a projection of the return air opening to the direction of the turntable overlaps with a rotation path of the communication opening. The rotating path of the communication port is an area formed in the process that the communication port rotates around the rotating shaft of the rotating disk. When the turntable rotates, a rotating path can be formed in the rotating process of the communication port, and because the projection of the center of the air return port to the direction of the turntable is overlapped with the rotating path of the communication port, the projection of the communication port and the air return port to the direction of the turntable can be at least partially overlapped by controlling the rotation of the turntable, so that the communication port is communicated with the air return port of the temperature control chamber, and the communication state of the air return port is controlled.
According to some embodiments of the invention, the number of the communication ports provided on the turntable is one or more than two. The number of the communication ports on the turntable is not limited, and the number of the communication ports can be one or more than two. When the number of the communication ports on the turntable is one, the communication ports can be controlled to be communicated with the air return ports of the temperature control chambers one by one, so that the temperature control of the temperature control chambers is realized, in addition, more than two communication ports can be arranged, and the communication ports are used for controlling the communication state of the air return ports of the temperature control chambers at more than two times simultaneously, so that the temperature control of the temperature control chambers is realized.
According to some embodiments of the present invention, the driving device drives the communication port on the turntable to rotate according to the temperature requirement of the temperature-controlled compartment, and controls the communication state of the air return port of the temperature-controlled compartment corresponding to the temperature control request.
The temperature control chamber is provided with an air supply outlet and an air return opening, the temperature control chamber realizes the circulation with the air outside the temperature control chamber through the air supply outlet and the air return opening, the air outside the temperature control chamber can enter the temperature control chamber from the air supply outlet and flow out from the air return opening, and the heat exchange between the inside and the outside of the temperature control chamber can be realized through the flow of the air in the process.
By controlling the rotation angle of the turntable, the communication port on the turntable can be communicated with the air return port of the temperature control chamber, and the communication port on the turntable can also be staggered with the air return port of the temperature control chamber, so that the air return port is closed. The communicating port on the control turntable can be controlled to be communicated with the air return ports of the temperature control rooms with required temperature control, so that the communicating state of the air return ports of the temperature control rooms can be controlled through the turntable, and the temperature of the temperature control rooms can be controlled.
It should be noted that, after the air return opening is closed, the air subsequently entering the temperature control chamber through the air supply opening cannot flow out from the closed air return opening, so that the air pressure in the temperature control chamber is higher than the air pressure outside the air return opening, and therefore, under the action of the air pressure difference between the air return opening and the air return opening, after the communication opening of the driving device controlling the turntable is communicated with the air return opening, and before the air pressure of the communication opening and the air return opening is balanced, the air in the temperature control chamber can flow out from the air return opening rapidly, so that the temperature regulation efficiency of the temperature control chamber can be improved.
According to some embodiments of the invention, the two temperature-controlled compartments include a first temperature-controlled compartment and a second temperature-controlled compartment, the first temperature-controlled compartment includes a first air return opening, the second temperature-controlled compartment includes a second air return opening, the semiconductor refrigeration assembly controls the hot end to heat the first temperature-controlled compartment and controls the cold end to refrigerate the second temperature-controlled compartment according to the temperature requirement of the temperature-controlled compartment, the driving device controls the communication opening of the rotary disc to rotate from a first communication position to a second communication position according to the temperature requirement of the temperature-controlled compartment, the first communication position corresponds to the first air return opening, the second communication position corresponds to the second air return opening, or the driving device controls the communication opening of the rotary disc to rotate from the first communication position to the first closing position according to the temperature requirement of the temperature-controlled compartment, so that all the air return openings on the air temperature-controlled mechanism are closed, or the driving device controls the communication port of the turntable to rotate from the first closed position to the second communication position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication port of the turntable to rotate from the second communication position to the first closed position according to the temperature requirement of the temperature control chamber.
When the hot end of the semiconductor refrigeration assembly heats the first temperature control chamber through the embodiment, the communication ports controlling different positions rotate to the positions of the non-first communication positions, so that the communication state of the communication ports and the air return openings is changed, and the different temperature control requirements of the plurality of temperature control chambers can be met.
According to some embodiments of the present invention, the temperature control device further comprises a third temperature control chamber, the third temperature control chamber comprises a third air return opening, the driving device controls the communication opening of the rotary plate to rotate from the first communication position to a third communication position according to the temperature requirement of the temperature control chamber, the third communication position corresponds to the third air return opening, or the driving device controls the communication opening of the rotary plate to rotate from the first closing position to the third communication position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication opening of the rotary plate to rotate from the third communication position to the first closing position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication opening of the rotary plate to rotate from the third communication position to the second communication position according to the temperature requirement of the temperature control chamber, and controlling the communication port of the rotary disc to rotate from the second communication position to the third communication position.
The above embodiment is provided with a first temperature control chamber, a second temperature control chamber and a third temperature control chamber, the semiconductor refrigeration assembly is arranged in the first temperature control chamber and the second temperature control chamber which are adjacently arranged in a penetrating manner, the third temperature control chamber is a temperature control chamber which is not influenced by the starting temperature control of the semiconductor refrigeration assembly or stops the semiconductor refrigeration assembly corresponding to the third temperature control chamber, when the hot end of the semiconductor refrigeration assembly heats the first temperature control chamber, the cold end simultaneously refrigerates the second temperature control chamber, the turntable can control the communication port to rotate to or keep at other positions except the first communication position, the communication state of the temperature control chambers is controlled by controlling the communication port, and the starting and stopping of the semiconductor refrigeration assembly are matched, so that the temperature control of a plurality of different temperature control chambers is realized simultaneously.
According to some embodiments of the invention, the driving device controls the communication port of the rotary disc to be kept at the second communication position according to the temperature requirement of the temperature-controlled compartment, and controls the communication port of the rotary disc to rotate from the second communication position to the third communication position after the first set condition is met.
When a plurality of temperature control compartments need temperature control, the driving device can control the communication port of the turntable to rotate to the second communication position and keep the second communication position, after the first set condition is achieved, the communication port of the turntable can be controlled to rotate to the third communication position from the second communication position, namely, the driving device can process the temperatures of the plurality of temperature control compartments in sequence according to the set condition, and therefore the temperature control of the plurality of temperature control compartments is achieved.
Further, the first setting condition includes at least one of:
the temperature of the second temperature control chamber reaches a first target temperature;
the communication port of the dial is maintained at the second communication position for a first period of time.
According to some embodiments of the invention, the temperature control room array comprises two temperature control rooms, the turntable is arranged on one side of the temperature control room array, the turntable is a disc covering the air return openings of the four temperature control rooms, and the air supply opening of each temperature control room is arranged on one side of the temperature control room array corresponding to the turntable and avoids the coverage range of the disc. Disc and the combination of the control by temperature change room array of field style of calligraphy, can reduce return air control mechanism's occupation space, and because return air inlet and supply-air outlet can set up the one side at control by temperature change room array, when return air temperature control mechanism uses when the refrigerator, can also simplify the wind channel design, and because two control by temperature change room organizes the interior semiconductor refrigeration subassembly that is provided with respectively, the semiconductor refrigeration subassembly of two different control by temperature change room groups can be according to the temperature of the work of opening simultaneously of control by temperature change request and adjustment hot junction and cold junction, the intercommunication state through the return air inlet of the intercommunication mouth control by temperature change room of cooperation carousel, thereby realize carrying out temperature control to a plurality of control by temperature change rooms simultaneously.
According to some embodiments of the invention, the air conditioner further comprises an evaporator air duct, and the return air inlet of the temperature control compartment is communicated with the evaporator air duct through the communication port of the turntable.
The rotary plate is arranged close to the evaporator air channel, the communication between the air return opening and the evaporator air channel can be controlled through the rotary plate or the communication is sealed, the air pressure of the evaporator air channel can be directly utilized to control the temperature of the temperature control chamber, other air supply parts are not required to be added, and therefore the cost is reduced.
According to some embodiments of the invention, the evaporator air duct comprises an air outlet duct located above the evaporator and a return air duct located below the evaporator, the air supply outlet of the temperature-controlled compartment is communicated with the air outlet duct, and the return air inlet of the temperature-controlled compartment is communicated with the return air duct.
The air outlet duct above the evaporator can convey air from the evaporator, and the return air duct below the evaporator can convey air to the evaporator, so that the air supply outlet of the temperature control chamber can be communicated with the air outlet duct and the return air inlet can be communicated with the return air duct, the air from the evaporator can be conveyed into the temperature control chamber through the air supply outlet by using the air outlet duct, meanwhile, the air in the temperature control chamber is conveyed into the return air duct through the return air inlet by using a channel for forming air circulation between the air supply outlet and the return air inlet of the temperature control chamber, and the temperature of the temperature control chamber is controlled.
According to some embodiments of the invention, the drive means controls the rotational position of the carousel in accordance with a priority of the temperature requirements of the temperature-controlled compartment.
If the temperatures of the temperature control rooms need to be controlled, the driving device can control the rotating positions of the rotating discs according to the priorities of the temperature requirements of the temperature control rooms, so that the temperature requirements of the temperature control rooms can be met orderly.
Further, the priority of the temperature requirement of the temperature-controlled compartment includes one of:
the temperature requirement corresponding to the temperature control chamber with the temperature difference larger than the threshold value is prior, and the temperature difference is the difference value between the current temperature and the preset temperature of the temperature control chamber;
in order to prevent the food in the temperature control chamber from easily deteriorating due to large temperature difference, the driving device can control the communication port of the turntable to be preferentially communicated with the air return port in the temperature control chamber and preferentially adjust the temperature of the temperature control chamber, so that the risk of food deterioration is reduced;
and assigning the temperature requirement corresponding to the temperature control room with high priority level to be prior.
When the temperature control room with high priority level is used, the temperature control room with high temperature sensitivity can be used for storing food with high temperature sensitivity, the driving device can control the communication port of the turntable to be communicated with the air return port in the temperature control room with high priority level preferentially, and the temperature of the temperature control room is adjusted preferentially, so that the risk of food deterioration is reduced.
The return air temperature control method is applied to a refrigerator, the refrigerator comprises a rotary table, a driving device for controlling the rotary table to rotate and at least one temperature control room group, the temperature control room group comprises two temperature control rooms which are adjacently arranged, a semiconductor refrigeration assembly penetrates through the two temperature control rooms, the semiconductor refrigeration assembly comprises a hot end and a cold end, the hot end faces one of the temperature control rooms, the cold end faces the other temperature control room, the temperature control rooms comprise an air supply opening and a return air opening, the rotary table is provided with a communication opening which can correspond to the return air opening, and the return air temperature control method comprises the following steps:
acquiring a first temperature control request for controlling the temperature of the temperature control compartment;
and controlling the temperatures of the cold end and the hot end of the semiconductor refrigeration assembly according to the first temperature control request.
The temperature control of the existing temperature control chamber is mainly realized by utilizing a heat exchange mode of air outside the temperature control chamber and air inside the temperature control chamber, and because the temperature control chamber is limited by the temperature condition of the air outside the temperature control chamber, the temperature range which can be controlled by the temperature chamber is narrow, and the temperature of a plurality of temperature control chambers cannot be controlled simultaneously. In the embodiment of the invention, the semiconductor refrigeration components are arranged between two adjacent temperature control rooms in a penetrating way, and the temperature control rooms are relatively closed independent spaces, so the temperature of the air outside the temperature control rooms is not influenced when the semiconductor refrigeration components control the temperature of the temperature control rooms, the temperature control requirement range of the temperature control rooms is not limited by the temperature of the air outside the temperature control rooms, when the semiconductor refrigeration components are controlled to start to work, the temperatures of the cold end and the hot end of the semiconductor refrigeration components can be controlled according to the first temperature control request, the cold end of the semiconductor refrigeration components can refrigerate one temperature control room, and the hot end of the semiconductor refrigeration components can simultaneously heat the other temperature control room, thereby simultaneously carrying out different temperature control on a plurality of different temperature control rooms, and the temperature change range of the temperature control chamber can be enlarged, and the wide temperature adjustment of the temperature control chamber is realized.
According to some embodiments of the invention, the driving device is controlled to drive the rotary disc to rotate according to the first temperature control request, and the communication state of the air return opening of the temperature control compartment corresponding to the first temperature control request is controlled.
The temperature control chamber is provided with an air supply outlet and an air return inlet, the temperature control chamber realizes the circulation with air outside the temperature control chamber through the air supply outlet and the air return inlet, the air outside the temperature control chamber can enter the temperature control chamber from the air supply outlet and flow out from the air return inlet, and in the process, the heat exchange between the inside and the outside of the temperature control chamber can be realized through the flow of the air; and controlling the driving device to drive the turntable to rotate according to the first temperature control request, controlling the communication state of the air return opening of the temperature control chamber corresponding to the temperature control request, and forming a channel for air circulation between the air supply opening and the air return opening of the corresponding temperature control chamber, thereby realizing the temperature regulation of the temperature control chamber.
By controlling the rotation angle of the turntable, the communication port on the turntable can be communicated with the air return port of the temperature control chamber, and the communication port on the turntable can also be staggered with the air return port of the temperature control chamber, so that the air return port is closed.
The communicating port on the control turntable can be controlled to be communicated with the air return ports of the temperature control rooms with required temperature control, so that the communicating state of the air return ports of the temperature control rooms can be controlled through the turntable, and the temperature of the temperature control rooms can be controlled.
According to some embodiments of the present invention, the set of temperature-controlled compartments includes a first temperature-controlled compartment and a second temperature-controlled compartment, the first temperature-controlled compartment includes a first air return opening, the second temperature-controlled compartment includes a second air return opening, and the semiconductor refrigeration component controls the hot end to heat the first temperature-controlled compartment and controls the cold end to refrigerate the second temperature-controlled compartment according to a first temperature control request;
the driving device is controlled to drive the rotary table to rotate according to the first temperature control request, and the communication state of the air return opening of the temperature control compartment corresponding to the first temperature control request is controlled, wherein the communication state comprises one of the following states:
controlling a communication port of the rotary disc to rotate from a first communication position to a second communication position according to a first temperature control request, wherein the first communication position corresponds to a first communication port, and the second communication position corresponds to a second communication port;
controlling the communication port of the turntable to rotate from a first communication position to a first closing position according to a first temperature control request, so that all return air ports on the return air temperature control mechanism are closed;
controlling a communication port of the turntable to rotate from a second communication position to a first closing position according to a first temperature control request;
and controlling the communication port of the turntable to rotate from the first closed position to the second communication position according to the first temperature control request.
When the semiconductor refrigeration assembly is controlled to heat the first temperature control chamber through the embodiment, the communication ports in different positions are controlled to rotate at positions other than the first communication position according to the first temperature control request, and the communication state of the communication ports and the air return opening is changed, so that the different temperature control requirements of the plurality of temperature control chambers can be met.
According to some embodiments of the invention, further comprising a third temperature-controlled compartment, the third temperature-controlled compartment comprising a third air return;
controlling the driving device to drive the turntable to rotate according to the first temperature control request, and controlling the communication state of the air return opening of the temperature control compartment corresponding to the first temperature control request, wherein the communication state comprises at least one of the following states:
controlling a communication port of the turntable to rotate from a first communication position to a third communication position according to a first temperature control request, wherein the third communication position corresponds to a third communication port;
controlling a communication port of the turntable to rotate from a first closed position to a third communication position according to a first temperature control request;
controlling a communication port of the turntable to rotate from a second communication position to a third communication position according to a first temperature control request;
controlling a communication port of the turntable to rotate from a third communication position to a second communication position according to a first temperature control request;
controlling the communication port of the turntable to be kept at a second communication position according to the first temperature control request, and controlling the communication port of the turntable to rotate from the second communication position to a third communication position after a first set condition is reached;
and controlling the communication port of the turntable to be kept at a third communication position according to the first temperature control request, and controlling the communication port of the turntable to rotate from the third communication position to a second communication position after a first set condition is reached.
The above-mentioned embodiment is provided with first temperature control room, second temperature control room and third temperature control room, semiconductor refrigeration subassembly is worn to establish by first temperature control room and the second temperature control room of adjacent setting, the temperature control room that the third temperature control room is not influenced by semiconductor refrigeration subassembly start-up accuse temperature or its corresponding semiconductor refrigeration subassembly stop work, when control semiconductor refrigeration subassembly heats first temperature control room, can control the intercommunication mouth of carousel and rotate or keep other positions outside the first intercommunication position of non-, can control the intercommunication state of a plurality of temperature control rooms through the intercommunication mouth of control carousel, and cooperate opening of semiconductor refrigeration subassembly to open, thereby realize controlling the temperature of a plurality of different temperature control rooms simultaneously.
Further, the first setting condition includes at least one of:
the temperature of the second temperature control chamber reaches a first target temperature;
the communication port of the dial is maintained at the second communication position for a first period of time.
According to some embodiments of the invention, the obtaining a first temperature control request for controlling the temperature of the temperature-controlled compartment comprises: acquiring more than two temperature control requests; judging the priority of the more than two temperature control requests, and determining the temperature control request with the highest priority as a first temperature control request.
If more than two temperature control requests are obtained, the temperature control requests with the highest priority level can be determined to be the first temperature control request by sequencing according to the priority levels of the temperature control requests, the driving device is controlled to drive the rotary disc to rotate according to the first temperature control request, the communication port is communicated with the air return port of the temperature control chamber corresponding to the first temperature control request, and therefore the first temperature control request can sequentially meet the temperature control requests.
According to some embodiments of the invention, the determining the temperature control request with the highest priority level is a first temperature control request, and comprises one of the following steps:
appointing a temperature control request corresponding to a temperature control room with a high priority level as a first temperature control request;
if a plurality of temperature control requests occur and at least one temperature control request corresponding to a temperature control room with a high assigned priority level exists, in order to ensure the freshness of food in the temperature control room, the temperature control request corresponding to the temperature control room with the high assigned priority level is determined as a first temperature control request, and the rotating disc is driven to rotate according to the first temperature control request driving device, so that the communication port is communicated with the return air port of the temperature control room corresponding to the first temperature control request, the temperature control requirement of the temperature control room with the high assigned priority level can be met preferentially, and the risk of food deterioration is reduced.
And determining a first temperature control request according to a temperature difference of a temperature control room corresponding to the temperature control request, wherein the temperature difference is a difference value between the current temperature of the temperature control room and a preset temperature.
If a plurality of temperature control requests occur, the temperature control requests can be sequenced according to the temperature difference of the temperature control chamber corresponding to the temperature control requests, the temperature control request corresponding to the temperature control chamber with the larger temperature difference can be determined as a first temperature control request, and the driving device is controlled to drive the turntable to rotate according to the first temperature control request, so that the communication port is communicated with the return air inlet of the temperature control chamber corresponding to the first temperature control request, and the temperature control requirements of the temperature control chambers with different temperature differences are met.
According to some embodiments of the invention, the determining the first temperature control request according to the temperature difference of the temperature control compartment corresponding to the temperature control request comprises:
and the temperature control request corresponding to the temperature control chamber with the temperature difference value larger than the threshold value is the first temperature control request.
If a plurality of temperature control requests occur and at least one temperature control request corresponding to the temperature control chamber with the temperature difference larger than the threshold exists, the difference between the food in the temperature control chamber with the temperature difference larger than the threshold and the effective fresh-keeping temperature is large, the risk of food deterioration is easy to occur, the temperature control request corresponding to the temperature control chamber with the temperature difference larger than the threshold can be determined as the first temperature control request, so that the temperature control requirement of the temperature control chamber with the temperature difference larger than the threshold can be preferentially met, and the risk of food deterioration is reduced.
According to some embodiments of the invention, the controlling the driving device to drive the turntable to rotate comprises:
and controlling the turntable to rotate clockwise or anticlockwise according to the distance parameter, wherein the distance parameter is the distance value between the communication port and the air return port of the temperature control compartment needing temperature control.
The rotating path with a smaller distance value between the communication port and the air return opening of the temperature control chamber needing temperature control can be selected, the rotating disc is controlled to rotate clockwise or anticlockwise according to the selected rotating path, and when the communication port rotates towards the air return opening of the temperature control chamber corresponding to the temperature control request, the number of the air return openings of the temperature control chamber corresponding to the non-temperature control request is as small as possible, so that the influence degree on the temperature in the temperature control chambers of other non-temperature control requests is reduced.
According to some embodiments of the invention, the communication area of the communication port to the air return port is adjusted by adjusting a rotation angle of the rotary disc. Through reducing or increasing the area of intercommunication mouth and return-air inlet, can adjust the flow velocity of the indoor air of control by temperature change to the temperature variation speed of adjustment control by temperature change room can carry out accurate temperature control to the control by temperature change room.
According to the operation control device of the third aspect of the embodiment of the present invention, when the operation control device is applied to a refrigerator, a temperature control request for controlling the temperature of the temperature control compartments can be obtained, and the temperatures of the cold end and the hot end of the semiconductor refrigeration assembly can be controlled according to the temperature requirement of the temperature control compartments, so that the cold end of the semiconductor refrigeration assembly can refrigerate one temperature control compartment, and the hot end of the semiconductor refrigeration assembly can simultaneously heat another temperature control compartment, thereby simultaneously performing different temperature controls on a plurality of different temperature control compartments, expanding the temperature change range of the temperature control compartments, and realizing wide temperature adjustment of the temperature control compartments.
A refrigerator according to a fourth aspect embodiment of the present invention includes: the temperature control room group comprises two temperature control rooms which are adjacently arranged, a semiconductor refrigeration assembly is arranged between the two temperature control rooms, each temperature control room comprises an air supply opening and an air return opening, and the rotary disc is provided with a communication opening which can correspond to the air return opening; the operation control device can obtain a temperature control request for controlling the temperature of the temperature control rooms, and can control the temperature of the cold end and the hot end of the semiconductor refrigeration assembly according to the temperature requirement of the temperature control rooms, so that the cold end of the semiconductor refrigeration assembly can refrigerate one temperature control room, and the hot end of the semiconductor refrigeration assembly can simultaneously heat the other temperature control room, thereby simultaneously carrying out different temperature control on a plurality of different temperature control rooms, expanding the temperature change range of the temperature control rooms and realizing wide temperature adjustment of the temperature control rooms.
A computer-readable storage medium according to an embodiment of the fifth aspect of the present invention stores computer-executable instructions for executing the return air temperature control method of the second aspect described above.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a refrigerator provided with a return air temperature control mechanism according to an embodiment of the present invention;
fig. 2 is a schematic view of a return air temperature control mechanism and an operation control device according to an embodiment of the present invention;
fig. 3 is a schematic view of a rotary plate of a return air temperature control mechanism according to an embodiment of the present invention;
fig. 4 is a schematic layout view of two temperature-controlled compartments of a return air temperature-controlling mechanism according to an embodiment of the present invention;
fig. 5 is a schematic view of a communication port of a return air temperature control mechanism in a first communication position according to an embodiment of the present invention;
fig. 6 is a schematic view of a communication port of the return air temperature control mechanism in a second communication position according to an embodiment of the present invention;
fig. 7 is a schematic view of a communication port of a return air temperature control mechanism in a first closed position according to an embodiment of the present invention;
fig. 8 is a schematic layout view of three temperature-controlled compartments of a return air temperature-controlling mechanism according to another embodiment of the present invention;
fig. 9 is a schematic view of a communication port of a return air temperature control mechanism in a first communication position according to another embodiment of the present invention;
fig. 10 is a schematic view of a communication port of a return air temperature control mechanism according to another embodiment of the present invention in a second communication position;
fig. 11 is a schematic view of a communication port of a return air temperature control mechanism according to another embodiment of the present invention in a third communication position;
fig. 12 is a schematic view of a communication port of a return air temperature control mechanism according to another embodiment of the present invention in a first closed position;
fig. 13 is a schematic view of a return air temperature control mechanism according to another embodiment of the present invention;
fig. 14 is a flowchart of a return air temperature control method according to an embodiment of the present invention;
fig. 15 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
fig. 16 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
fig. 17 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
fig. 18 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
fig. 19 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
fig. 20 is a flow chart of a return air temperature control method according to another embodiment of the present invention;
FIG. 21 is a schematic view of an operation control apparatus provided in accordance with an embodiment of the present invention;
fig. 22 is a schematic view of a refrigerator according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, at least two means are one or more, a plurality means are at least two, and greater than, less than, more than, etc. are understood as excluding the present numbers, and above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
With the subdivision of temperature zones brought by the technical upgrade of users and the increasingly abundant purchasing of food materials by users, a plurality of refined storage spaces are needed, and the demand of creating a refrigerator with multiple temperature zones to realize different functions is urgent. At present, the method for realizing the multi-temperature zone mostly adopts a mode of conveying the cold quantity of an evaporator to a temperature control chamber through an air door for regulation and control, the temperature control chamber is arranged in a refrigerating chamber, the temperature of the refrigerating chamber needs to be met while the temperature of the temperature control chamber is regulated, and in order to prevent the temperature of the refrigerating chamber from being too low, a refrigerating fan cannot be opened for a long time, so that the temperature change range of the temperature control chamber is very small.
Based on this, the invention provides a return air temperature control mechanism, a return air temperature control method, an operation control device and a refrigerator, wherein the return air temperature control mechanism comprises: the carousel, be used for controlling carousel pivoted drive arrangement and at least one temperature control room group, room group includes between two temperature controls of adjacent setting room between the temperature control, and semiconductor refrigeration subassembly is worn to be equipped with in two temperature control rooms, and semiconductor refrigeration subassembly includes hot junction and cold junction, and the hot junction is towards one of them temperature control room between the cold junction, and the cold junction is towards another temperature control room between the temperature control room includes supply-air outlet and return air inlet, and the carousel is provided with the intercommunication mouth that can correspond with the return air inlet. The semiconductor refrigeration components are arranged between two adjacent temperature control chambers in a penetrating way, the temperature control chamber is a relatively closed independent space, so that the temperature of the air outside the temperature control chamber is not influenced when the semiconductor refrigeration component controls the temperature of the temperature control chamber, and the temperature control requirement range of the temperature control chamber is not limited by the temperature of the air outside the temperature control chamber, when the semiconductor refrigeration component is controlled to start to work, the temperature of the hot end and the cold end of the semiconductor refrigeration component can be controlled according to the temperature requirement of the temperature control chamber, so that the hot end of the semiconductor refrigeration component can refrigerate one temperature control chamber, the cold end of the temperature control room can also heat another temperature control room at the same time, so that the temperature of a plurality of different temperature control rooms can be controlled at the same time, and the temperature change range of the temperature control rooms can be enlarged.
The embodiments of the present invention will be further explained with reference to the drawings.
The return air temperature control mechanism provided by an embodiment of the invention is applied to a refrigerator shown in fig. 1, the refrigerator comprises a refrigerating chamber 110 and a freezing chamber 120, the refrigerating chamber 110 comprises a refrigerating area 111, a refrigerating evaporator air duct, a refrigerating fan 112, a refrigerating evaporator 113, at least one temperature control chamber group, a driving device 115, a turntable 116 and a semiconductor refrigerating assembly 119, one temperature control chamber group comprises two temperature control chambers 114, the two temperature control chambers are provided with the semiconductor refrigerating assembly 119 in a penetrating manner, the refrigerating fan 112 and the refrigerating evaporator 113 are arranged in the refrigerating evaporator air duct, the temperature control chamber group is arranged in the refrigerating area 111, the temperature control chambers comprise an air supply opening 117 and an air return opening 118, the temperature control chambers 114 are communicated with the refrigerating evaporator air duct through the air supply opening 117 and the air return opening 118, the turntable 116 is arranged between the air return opening 118 and the refrigerating evaporator, the driving device 115 is connected with the turntable 116, the freezing chamber 120 comprises a freezing area 121, The freezing fan 122, the freezing evaporator 123 and the freezing evaporator air duct, wherein the freezing evaporator 123 and the freezing fan 122 are arranged in the freezing evaporator air duct.
Referring to fig. 2 to 3, the return air temperature control mechanism according to the embodiment of the present invention includes a turntable 116, a driving device 115 for controlling the rotation of the turntable 116, and at least one temperature control compartment group, where one temperature control compartment group includes two temperature control compartments 114 arranged adjacently, a semiconductor refrigeration assembly 119 is inserted in the two temperature control compartments 114, the semiconductor refrigeration assembly 119 includes a hot end and a cold end, the hot end faces one of the temperature control compartments, the cold end faces the other temperature control compartment, the temperature control compartment 114 includes an air supply opening 117 and a return air opening 118, and the turntable 116 is provided with a communication opening 310 capable of corresponding to the return air opening 118.
It should be noted that the return air temperature control mechanism is not limited to be used in the refrigerating chamber of the refrigerator, but may be used in the freezing chamber or other chambers of the refrigerator. The semiconductor refrigerating assembly 119 can be a semiconductor refrigerating sheet or a semiconductor refrigerator
In practical use, the temperature requirements of customers for storing food are various, such as high-temperature food storage and/or low-temperature food storage, the temperature control of the existing temperature-control compartment 114 is mainly realized by using a heat exchange mode between air outside the temperature-control compartment 114 and air inside the temperature-control compartment 114, and due to the limitation of the temperature condition of the air outside the temperature-control compartment 114, the range of the temperature that can be controlled by the temperature-control compartment 114 is narrow, and the temperatures of a plurality of temperature-control compartments 114 cannot be controlled at the same time. The semiconductor refrigeration component 119 can be arranged between two temperature control rooms 114, because the semiconductor refrigeration component 119 is arranged between two adjacent temperature control rooms 114 and the temperature control rooms are relatively closed independent spaces, the temperature of the air outside the temperature control rooms 114 cannot be influenced when the semiconductor refrigeration component 119 controls the temperature of the temperature control rooms 114, the range of the temperature control requirement of the temperature control rooms 114 cannot be limited by the temperature of the air outside the temperature control rooms 114, the semiconductor refrigeration component can control the temperatures of a cold end and a hot end according to the temperature requirement of the temperature control rooms, the cold end can refrigerate one temperature control room 114, and the hot end can simultaneously heat the other temperature control room 114, so that different temperature controls can be simultaneously carried out on a plurality of different temperature control rooms 114, and the temperature change range of the temperature control rooms 114 can be expanded, wide temperature adjustment of the temperature control compartment 114 is achieved.
It should be noted that the temperature control room 114 heated or cooled by the semiconductor cooling module 119 may be fixedly disposed, or may be disposed according to use needs, and the temperature control room 114 at one end of the temperature control of the semiconductor cooling module 119 may be set as the high temperature storage temperature control room 114, and the temperature control room 114 at the other end may be set as the low temperature storage temperature control room 114. The high-temperature storage temperature control compartment 114 can be used for storing food which needs to be kept at a high temperature, the temperature control range of the high-temperature storage temperature control compartment 114 can be set to be 8-20 ℃, the low-temperature storage temperature control compartment 114 can be used for storing food which needs to be kept at a low temperature, and the temperature control range of the low-temperature storage temperature control compartment 114 can be set to be minus centigrade.
Further, the cold side and/or the hot side are disposed adjacent to the temperature controlled compartment 114 or within the temperature controlled compartment 114. When the cold end and/or the hot end are arranged adjacent to the temperature control compartment 114, the cold end and/or the hot end can be arranged close to the inner wall of the temperature control compartment 114, and the temperature of the cold end and/or the hot end can be transmitted into the temperature control compartment 114 through the inner wall of the temperature control compartment 114, so that the temperature of the temperature control compartment 114 can be controlled; if the cold end and/or the hot end are disposed in the temperature-controlled compartment 114, the temperature of the cold end and/or the hot end can directly affect the temperature in the temperature-controlled compartment 114, thereby controlling the temperature of the temperature-controlled compartment 114.
Further, the driving device 115 drives the communication port 310 of the turntable 116 to rotate according to the temperature request of the temperature-controlled compartment 114, and controls the communication state of the return air port 118 of the temperature-controlled compartment 114 corresponding to the temperature request.
Because the temperature-controlled compartment 114 is provided with the air supply outlet 117 and the air return outlet 118, the temperature-controlled compartment 114 realizes the circulation with the air outside the temperature-controlled compartment 114 through the air supply outlet 117 and the air return outlet 118, the air outside the temperature-controlled compartment 114 can enter the temperature-controlled compartment 114 from the air supply outlet 117 and flow out from the air return outlet 118, and in the process, the heat exchange between the inside and the outside of the temperature-controlled compartment 114 can be realized through the flow of the air, therefore, the temperature of the temperature-controlled compartment 114 can be adjusted by controlling the circulation state of the air flow channel, in the embodiment of the invention, the communication state of the air return outlets 118 of more than two temperature-controlled compartments 114 is controlled by the communication outlet 310 on the turntable 116, based on the control of the rotation of the turntable 116 by the driving device 115 according to the temperature control request, the communication outlet 310 is communicated with the air return outlet 118 of the temperature-controlled compartment 114 corresponding to the temperature-controlled compartment 114, and a passage for the circulation of the air is formed between the air supply outlet 117 and the air return outlet 118 of the corresponding temperature-controlled compartment 114, thereby achieving the adjustment of the temperature controlled compartment 114. Note that the temperature control request is used to control the temperature of the temperature control compartment 114.
It should be noted that, in the embodiment of the present invention, the communication port 310 on the control dial 116 is in communication with the air return opening 118 of the temperature-controlled compartment 114 requiring temperature control, so as to control the temperature of the temperature-controlled compartment 114, and therefore, the shape or area of the communication port 310 is different from the size of the air return opening 118, which does not cause the situation that the temperature of the temperature-controlled compartment 114 cannot be controlled. Based on this, the embodiment of the present invention does not limit the shape of the communication port 310, the communication port 310 may be in a fan shape, a square shape, a circular shape, or other irregular shapes, or the area of the communication port 310 is not limited, and the area of the communication port 310 may be larger than the air return opening 118 or smaller than the air return opening 118.
It should be noted that, if the communication port 310 and the air return opening 118 have the same shape, but the area of the communication port 310 is smaller than that of the air return opening 118, the air flowing out of the air return opening 118 is affected by the flux of the communication port 310, so as to reduce the temperature control efficiency of the temperature-controlled compartment 114, and therefore, in an embodiment of the present invention, the shape and the area of the communication port 310 and the air return opening 118 may be set to be the same, and when the communication port 310 and the air return opening 118 are controlled to be communicated, since the shape and the size of the communication port 310 and the air return opening 118 are the same and are matched to be communicated, the air flowing out through the air return opening 118 can flow out completely without affecting the air flowing out speed.
The number of the communication ports 310 provided on the turntable 116 may be one or more than two, and when the number of the communication ports 310 provided on the turntable 116 is one, the communication ports 310 can be controlled to be communicated with the air return openings 118 of the plurality of temperature control compartments 114 one by one, so as to realize temperature control of the plurality of temperature control compartments 114, in addition, more than two communication ports 310 may be provided, and the communication ports 310 are used for simultaneously controlling the communication state of the air return openings 118 of the more than two temperature control compartments 114, so as to realize temperature control of the plurality of temperature control compartments 114.
The connection between the driving device 115 and the turntable 116 includes:
in the first aspect, the driving device 115 is provided with a rotating shaft, the rotating shaft can be connected with the center of the turntable 116, and the turntable 116 can be driven to rotate by the rotation of the rotating shaft, so that the control of the turntable 116 is realized.
In a second aspect, the driving device 115 is provided with a rotating wheel, and the rotating wheel is connected with the edge of the rotating disc 116, and the edge motion can be controlled through the rotation of the rotating wheel, so as to drive the rotating disc 116 to rotate.
The connection between the driving device 115 and the turntable 116 is not limited to the above connection, and may be another connection. The drive device 115 may be a servo motor, stepper motor, or other rotating device.
Further, the projection of the return air opening 118 in the direction of the turntable 116 overlaps with the rotation path of the communication opening 310. When the turntable 116 rotates, the communication port 310 can form a rotation path in the rotation process, and since the projection of the center of the air return opening 118 to the direction of the turntable 116 is overlapped with the rotation path of the communication port 310, the communication port 310 and the projection of the air return opening 118 to the direction of the turntable 116 can be at least partially overlapped by controlling the rotation of the turntable 116, so that the communication port 310 is communicated with the air return opening 118 of the temperature-controlled compartment, and the communication state of the air return opening 118 is controlled.
The rotation path is a region formed during the rotation of the communication port 310 about the rotation axis of the turntable 116, that is, the rotation path of the communication port 310 may be a set of arbitrary positions during the rotation of the communication port 310 about the rotation axis of the turntable 116.
For example, the communication port 310 may be a circular hole, and a circular rotation path may be formed when the communication port 310 rotates once in one direction around the rotation axis of the turntable 116. For example, the communication port 310 may be a circular hole, and when the communication port 310 is rotated by a predetermined angle in one direction around the rotational axis of the turntable 116, an arc-shaped rotation path having semicircular ends can be formed. Another example is: the communication port 310 may be a rectangular hole, and a circular rotation path can be formed when the communication port 310 rotates once in one direction around the rotation axis of the turntable 116. For example, the communication port 310 may be a rectangular hole, and when the communication port 310 is rotated by a predetermined angle in one direction around the rotational axis of the turntable 116, an arc-shaped rotational path having both ends at right angles can be formed.
It should be noted that, overlapping means that the positions and shapes of two components or reference figures are identical in space, and overlapping means that at least a part of the intersection exists between the two components or reference figures.
In an embodiment, the communication port 310 and the air return port 118 are circular holes with the same size, the communication port 310 rotates to form a rotation path, and since the projection of the air return port 118 to the direction of the turntable 116 is overlapped with the rotation path of the communication port 310, a state exists, so that the center of the communication port 310 can be overlapped with the projection of the center of the air return port 118 to the direction of the turntable 116, at this time, the air return port 118 and the communication port 310 can completely correspond to each other, the communication port 310 is communicated with the air return port 118 of the temperature control compartment, and thus the temperature of the plurality of temperature control compartments 114 can be better controlled.
By controlling the rotation angle of the turntable 116, the communication port 310 on the turntable 116 can be communicated with the air return port 118 of the temperature-controlled compartment 114 corresponding to the temperature control request, or the communication port 310 on the turntable 116 can be staggered with the air return port 118 of the temperature-controlled compartment 114, so that the air return port 118 closes the communication state of the communication port 310 on the controllable turntable 116 and the air return port 118 of the temperature-controlled compartment 114 requiring temperature control, and therefore, the communication state of the air return ports 118 of the plurality of temperature-controlled compartments 114 can be controlled through the turntable 116, and the temperature of the plurality of temperature-controlled compartments 114 can be controlled.
Further, after the air return opening 118 is closed, the air subsequently entering the temperature-controlled compartment 114 through the air supply opening 117 cannot flow out from the closed air return opening 118, so that the air pressure in the temperature-controlled compartment 114 is higher than the air pressure outside the air return opening 118, and therefore, under the action of the air pressure difference between the air pressure and the air pressure, after the communication opening 310 of the driving device 115 controls the turntable 116 to be communicated with the air return opening 118 and before the air pressure of the air return opening and the air pressure of the air return opening are balanced, the air in the temperature-controlled compartment 114 can quickly flow out from the air return opening 118. Therefore, compared with the conventional method of controlling the temperature of the temperature-controlled compartment 114 through a plurality of air supply dampers, the temperature regulation of the temperature-controlled compartment 114 is more efficient by controlling the opening and closing of the air return opening 118 through the turntable 116 in the present embodiment.
Referring to fig. 2, the return air temperature control mechanism of the above embodiment may cooperate with an operation control device to implement the temperature control operation on the temperature-controlled compartment 114, wherein the operation control device includes a control processor 210 and a memory 220, the control processor 210 and the memory 220 may be connected by a bus, the control processor 210 is electrically connected to the driving device 115 in the return air temperature control mechanism, and the control processor 210 may invoke a return air temperature control program stored in the memory 220, so as to issue a temperature control instruction corresponding to the relevant temperature control request to the driving device 115.
Referring to fig. 4 to 7, two temperature-controlled compartments 114 in the set of temperature-controlled compartments include a first temperature-controlled compartment 410 and a second temperature-controlled compartment 420, the first temperature-controlled compartment 410 includes a first air return opening 411, the second temperature-controlled compartment 420 includes a second air return opening 421, and the semiconductor cooling module 119 controls the hot end to heat the first temperature-controlled compartment 410 and controls the cold end to cool the second temperature-controlled compartment 420 according to the temperature requirement of the temperature-controlled compartment 114;
the driving device 115 controls the communication port 310 of the turntable to rotate from a first communication position to a second communication position according to the temperature requirement of the temperature control compartment 114, wherein the first communication position corresponds to the first air return port 411, and the second communication position corresponds to the second air return port 421;
or, the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the first communication position to the first closing position according to the temperature requirement of the temperature control compartment 114 and the temperature control request of the driving device 115, so as to close all the return air ports on the return air temperature control mechanism;
alternatively, the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the first closed position to the second communication position according to the temperature requirement of the temperature-controlled compartment 114;
alternatively, the driving device 115 controls the communication port 310 of the dial 116 to rotate from the second communication position to the first closed position in accordance with the temperature requirement of the temperature-controlled compartment 114.
When the communication port 310 is communicated with the first air return port 411 at the first communication position, if the first temperature-controlled compartment 410 needs to be heated, the second temperature-controlled compartment 420 does not need temperature control, the semiconductor refrigeration assembly can start heating operation on the first temperature-controlled compartment 410, the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the first communication position to the first closing position according to the temperature control request, that is, when the first temperature-controlled compartment 410 needs to be heated, the turntable 116 can be controlled to close the first air return port 411, heat of the first temperature-controlled compartment 410 can be prevented from flowing out through the first air return port 411, and therefore heating efficiency of the first temperature-controlled compartment 410 is improved.
When the communication port 310 is communicated with the first air return opening 411 at the first communication position, if the first temperature-control compartment 410 needs to be heated and the second temperature-control compartment 420 needs to be temperature-controlled, the semiconductor refrigeration assembly can start heating operation for the first temperature-control compartment 410, the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the first communication position to the second communication position according to the temperature-control request, so that the communication port 310 is communicated with the second air return opening 421, and temperature control for the second temperature-control compartment 420 is realized.
When the communication port 310 is located at the first closed position, if the first temperature-control compartment 410 needs to be heated, and the second temperature-control compartment 420 needs to be temperature-controlled, the semiconductor refrigeration assembly can start heating operation on the first temperature-control compartment 410, and the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the first closed position to the second communication position according to the temperature-control request, so that the communication port 310 is communicated with the second air return opening 421, and temperature control on the second temperature-control compartment 420 is realized.
When the communication port 310 is located at the second communication position, if the first temperature-control compartment 410 needs to be heated, and the temperature of the second temperature-control compartment 420 reaches the target temperature, the semiconductor refrigeration assembly can start heating operation on the first temperature-control compartment 410, the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the second communication position to the first closed position according to the temperature control request, and the turntable 116 closes the second air return opening 421, so that heat preservation of the second temperature-control compartment 420 is realized.
Further, referring to fig. 8 to 12, a third temperature-controlled compartment 810 is further included, and the third temperature-controlled compartment 810 includes a third air return opening 811;
the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the first communication position to a third communication position according to the temperature requirement of the temperature control compartment 114, wherein the third communication position corresponds to a third air return port;
or, the driving device 115 controls the communication port of the turntable to rotate from the first closed position to the third communication position according to the temperature requirement of the temperature control compartment 114;
or, the driving device 115 controls the communication port of the turntable to rotate from the third communication position to the first closed position according to the temperature requirement of the temperature control compartment 114;
or the driving device 115 controls the communication port of the turntable to rotate from the third communication position to the second communication position according to the temperature requirement of the temperature control compartment 114;
or the driving device 115 controls the communication port of the turntable to rotate from the second communication position to the third communication position according to the temperature requirement of the temperature control compartment 114.
When the communication port 310 is communicated with the first air return opening 411 at the first communication position, if the first temperature-controlled compartment 410 needs to be heated, and the third temperature-controlled compartment 810 needs to be temperature-controlled, the semiconductor refrigeration assembly 119 can start heating operation for the first temperature-controlled compartment 410, and the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the first communication position to the third communication position according to the temperature control request, so as to realize temperature control for the plurality of temperature-controlled compartments 114.
When the communication port 310 is communicated with the third air return port 811 at the third communication position, if the first temperature-controlled compartment 410 needs to be heated, and the temperature of the third temperature-controlled compartment 810 reaches the target temperature, the semiconductor refrigeration assembly 119 may start heating operation for the first temperature-controlled compartment 410, and the driving device 115 may control the communication port 310 of the turntable 116 to rotate from the third communication position to the first closed position according to the temperature control request, thereby implementing temperature control for the plurality of temperature-controlled compartments 114.
When the communication port 310 is communicated with the third air return port 811 at the third communication position, if the first temperature-control compartment 410 needs to be heated and the second temperature-control compartment 420 needs to be temperature-controlled, the semiconductor refrigeration assembly 119 can start heating operation for the first temperature-control compartment 410, and the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the third communication position to the second communication position according to the temperature control request, thereby realizing temperature control of the plurality of temperature-control compartments 114.
When the communication port 310 is communicated with the second air return opening 421 at the second communication position, if the first temperature-control compartment 410 needs to be heated, and the third temperature-control compartment 810 needs to be temperature-controlled, the semiconductor refrigeration assembly 119 can start heating operation on the first temperature-control compartment 410, and the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the second communication position to the third communication position according to the temperature control request, so as to realize temperature control on the plurality of temperature-control compartments 114.
When the communication port 310 is communicated with the third air return opening 421 at the third communication position, if the first temperature-control compartment 410 needs to be heated, and the second temperature-control compartment 810 needs to be temperature-controlled, the semiconductor refrigeration assembly 119 can start heating operation on the first temperature-control compartment 410, and the driving device 115 can control the communication port 310 of the turntable 116 to rotate from the third communication position to the second communication position according to the temperature control request, so as to realize temperature control on the plurality of temperature-control compartments 114.
Namely, a first temperature control room 410, a second temperature control room 420 and a third temperature control room 810 are arranged, a semiconductor refrigerating assembly 119 is arranged between the first temperature control room 410 and the second temperature control room 420 which are adjacently arranged, when the semiconductor refrigerating assembly 119 heats the first temperature control room 410, the second temperature control room 420 is refrigerated, the communication port 310 of the turntable 116 can rotate to other positions except the first communication position, the communication state of the temperature control room 114 can be controlled by the turntable 116 through controlling the communication port 310, and the semiconductor refrigerating assembly 119 is matched to start and stop, so that the temperature of a plurality of different temperature control rooms 114 can be controlled simultaneously.
It should be noted that the third temperature-controlled compartment 810 is the temperature-controlled compartment 114 in the temperature-controlled state of the non-semiconductor cooling device 119 or in the temperature-controlled state of the non-semiconductor cooling device 119.
Further, a first setting condition may be set, so that the communication port 310 may be maintained at the second communication position, after the first setting condition is reached, the driving device 115 controls the communication port 310 of the turntable to rotate from the second communication position to the third communication position again, or the communication port 310 may be maintained at the third communication position, and after the first setting condition is reached, the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the third communication position to the second communication position again.
It should be noted that one side of the plurality of temperature-controlled compartments 114 constitutes an outer compartment wall, and the turntable 116 is disposed on one side of the outer compartment wall, and a position corresponding to a portion of the outer compartment wall excluding the return air opening is defined as a first closed position.
In practical applications, the rotating disc 116 may rotate frequently according to a temperature control request, and there is an error in mechanical rotation, where the error is accumulated continuously when there is an error in one rotation, and the error is increased and decreased due to the error, and the setting of the fixed closing position is equivalent to resetting the rotating disc 116, and the error can be cleared.
In another embodiment of the first closing position, the first closing position is a near position, the near position may be a position relatively close to the first communication position and any other two communication positions, and in practical applications, the position relatively close to the first communication position and any other two communication positions may be selected according to the first communication position of the communication port 310, and the communication port 310 is controlled to rotate to the near position, so that the rotating distance of the driving device 115 can be reduced, and the service life of the driving device 115 can be prolonged.
Of course, one skilled in the art can also randomly set the closed position of the communication port 310 of the dial 116. The return air opening 118 can be controlled to be closed by staggering the communication opening 310 and the return air opening 118.
In one embodiment, the first setting condition may be that the temperature of the second temperature-controlled compartment 420 reaches the first target temperature.
For example: when the temperature of the plurality of temperature-control compartments 114 needs to be controlled, the communication port 310 can be maintained at the second communication position, after the temperature of the second temperature-control compartment 420 reaches the first target temperature, the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the second communication position to the third communication position, and the communication port 310 can be maintained at the third communication position until the temperature of the third temperature-control compartment 810 reaches the first target temperature, that is, the driving device 115 can sequentially process the temperatures of the plurality of temperature-control compartments 114 according to the set conditions, so that the temperatures of the plurality of temperature-control compartments 114 can be controlled.
In another embodiment, the first set condition is that the communication port 310 of the dial 116 is maintained at the second communication position for a first period of time.
For example: when a plurality of temperature control compartments 114 need to be temperature-controlled, the driving device 115 may control the communication port 310 of the turntable 116 to rotate to the second communication position according to the temperature control request, the communication port 310 may be maintained at the second communication position, and after the retention time reaches the first duration, the driving device 115 controls the communication port 310 of the turntable 116 to rotate from the second communication position to the third communication position again, and the communication port 310 may be maintained at the third communication position until the retention time reaches the first duration. That is, the drive device 115 can sequentially control the temperatures of the plurality of temperature-controlled compartments 114 in accordance with the set conditions, thereby controlling the temperatures of the plurality of temperature-controlled compartments 114.
Referring to fig. 13, in another embodiment of the return air temperature control mechanism of the present invention, the return air temperature control mechanism includes a rectangular temperature control compartment array formed by two temperature control compartment groups, a rotary table 116 is disposed at one side of the temperature control compartment array, the rotary table 116 is a disk covering the return air inlets 118 of the four temperature control compartments 114, and the air supply outlet 117 of the temperature control compartments 114 is disposed at one side of the temperature control compartment array corresponding to the rotary table 116 and avoids the coverage of the disk.
For example: the disc is arranged on one side of the temperature control room array in a shape like a Chinese character tian, the projection of the disc can completely fall on one side of the temperature control room array, the position where the disc is arranged can cover the air return openings 118 of the four temperature control rooms 114, one side of the temperature control room array can be enabled to leave a certain area except the coverage area of the projection of the disc by the four temperature control rooms 114, the area can be provided with the air supply opening 117, the structural design can reduce the occupied space of an air return control mechanism, the air return openings 118 and the air supply opening 117 can be arranged on the same side of the temperature control room array, and when the air return temperature control mechanism is applied to a refrigerator, the air duct design can be simplified.
Referring to fig. 1, the return air temperature control mechanism of the present invention is applied to an embodiment of a refrigerator, the refrigerator comprises an evaporator air duct, the evaporator air duct is an air duct in which an evaporator of the refrigerator is located, for providing cold air to the refrigerating chamber 111 or the freezing chamber 121 of the refrigerator, the air return opening 118 of the temperature control compartment 114 can be communicated with the evaporator air duct through the communication opening 310 of the turntable 116, in the present embodiment, the temperature-controlled compartment 114 is disposed in the cooling area, so that the air supply opening 117 of the temperature-controlled compartment 114 and the communication opening 310 of the turntable 116 communicate with the evaporator air duct corresponding to the refrigerating compartment 111, in addition, the rotary plate 116 is arranged close to the evaporator air duct, so that the communication or the sealing between the air return opening 118 and the evaporator air duct can be controlled by the rotary plate 116, the air pressure of the evaporator air duct can be directly utilized to control the temperature of the temperature control compartment 114, and other air supply parts are not required to be added, so that the cost is reduced.
The temperature-controlled compartment 114 may be provided in the freezing zone or in a separate zone. Only the air supply outlet 117 of the temperature control chamber 114 and the communication opening 310 of the turntable 116 need to be communicated with the corresponding evaporator air duct, so that a channel for air circulation can be formed between the air supply outlet 117 and the air return opening 118 of the corresponding temperature control chamber 114, and the temperature of the temperature control chamber 114 can be adjusted.
It should be noted that the evaporator air duct may be a refrigeration evaporator air duct, or other evaporator air ducts. The evaporator may be the refrigerating evaporator 113 installed in the refrigerating evaporator air duct, the freezing evaporator 123 installed in the freezing evaporator air duct, or an evaporator installed in another evaporator air duct.
Further, the evaporator air duct further comprises an air outlet air duct positioned above the evaporator and a return air duct arranged below the evaporator, the air supply outlet 117 of the temperature control compartment 114 is communicated with the air outlet air duct, and the return air inlet 118 of the temperature control compartment 114 is communicated with the return air duct.
Because the air outlet duct above the evaporator can convey cold, the air return duct below the evaporator can convey heat to the evaporator, based on which, the air supply outlet 117 of the temperature control room 114 can be communicated with the air outlet duct, and the air return inlet 118 is communicated with the air return duct, cold is conveyed to the temperature control room 114 through the air supply outlet 117 by using the air pressure of the air outlet duct, and then the heat in the temperature control room 114 is conveyed to the air return duct through the air return inlet 118, so that the temperature of the temperature control room 114 can be controlled by using the air outlet duct above the evaporator.
According to the return air temperature control mechanism in the above embodiment, in practical applications, a plurality of temperature control requests may often occur, and in order for the driving device 115 to normally and orderly control the communication port 310 of the turntable 116 to rotate, so as to meet the temperature control requirements of the plurality of temperature control compartments 114, the plurality of temperature control requests need to be sorted according to the priorities of the temperature control requests, so that the driving device 115 can control the rotation position of the turntable 116 according to the priorities of the temperature control requests.
It should be noted that the priority of the temperature requirement of the temperature-controlled compartment includes the following two aspects:
in a first aspect: the temperature requirement corresponding to the temperature control chamber 114 with the temperature difference larger than the threshold value is prioritized, and the temperature difference is the difference between the current temperature of the temperature control chamber 114 and the preset temperature. When the temperature control device is used, a plurality of temperature control requests occur, one temperature requirement is a temperature requirement corresponding to the temperature control chamber 114 with the temperature difference larger than the threshold value, at this time, the food in the temperature control chamber 114 with the temperature difference larger than the threshold value is greatly influenced by the temperature, and the risk of deterioration is easy to occur, the driving device 115 can control the communication port 310 of the turntable 116 to be preferentially communicated with the air return port 118 in the temperature control chamber 114, and preferentially adjust the temperature of the temperature control chamber 114, so that the risk of deterioration of the food is reduced.
In a second aspect: the temperature requirement corresponding to the temperature-controlled room 114 having a high priority level is given priority. In actual use, food with higher temperature sensitivity is placed in the temperature control chamber 114 with higher priority, and when the temperature control chamber 114 with higher priority needs temperature control, in order to ensure that the storage of such food is not affected by temperature, the driving device 115 can control the communication port 310 of the turntable 116 to be preferentially communicated with the air return port 118 in the temperature control chamber 114 with higher priority, and preferentially adjust the temperature of the temperature control chamber 114, thereby reducing the risk of food deterioration.
It should be noted that the priority level of the temperature control compartment 114 may be a default setting or may be set by a user, and the invention is not limited thereto.
The embodiment of the invention provides a return air temperature control method, which is applied to an operation control device of a return air temperature control mechanism in the embodiment, wherein the return air temperature control mechanism is described in detail in the embodiment and is not described again. Referring to fig. 14, the return air temperature control method according to the embodiment of the present invention includes the following steps:
s1410: acquiring a first temperature control request for controlling the temperature of a temperature control compartment;
when the temperature of the temperature-controlled compartment does not reach the target temperature, a first temperature-controlled request for controlling the temperature of the temperature-controlled compartment can be acquired, and according to the temperature control condition of the temperature-controlled compartment, the first temperature-controlled request may include: a cooling request, a heating request.
The temperature control chamber is a high-temperature chamber, and the temperature of the temperature chamber is lower than the target temperature, so that the first temperature control request is correspondingly a heating request;
the temperature control chamber is a low-temperature chamber, the temperature of the temperature control chamber is higher than the target temperature, and the first temperature control request corresponds to a refrigeration request.
S1420: controlling the temperature of the cold end and the hot end of the semiconductor refrigeration assembly according to the first temperature control request;
in practical use, the temperature requirements of customers for the storage of food are various, such as high-temperature food storage and/or low-temperature food storage, while the temperature control of the existing temperature control chamber is mainly realized by utilizing a heat exchange mode between air outside the temperature control chamber and air inside the temperature control chamber, and due to the limitation of the temperature condition of the air outside the temperature control chamber, the temperature range which can be controlled by the temperature chamber is narrow, and the temperatures of a plurality of temperature control chambers cannot be controlled simultaneously. In the embodiment of the invention, the semiconductor refrigeration components are arranged between two adjacent temperature control rooms in a penetrating way, and the temperature control rooms are relatively closed independent spaces, so that the temperature of the air outside the temperature control rooms is not influenced when the semiconductor refrigeration components control the temperature of the temperature control rooms, the temperature control requirement range of the temperature control rooms is not limited by the temperature of the air outside the temperature control rooms, when the semiconductor refrigeration components are controlled to start to work, the temperatures of the cold end and the hot end of the semiconductor refrigeration components can be controlled according to the first temperature control request, the cold end of the semiconductor refrigeration components can refrigerate one temperature control room, and the hot end can simultaneously heat the other temperature control room, thereby simultaneously carrying out different temperature control on a plurality of different temperature control rooms and expanding the temperature change range of the temperature control rooms, realize the wide-width temperature adjustment of the temperature control chamber.
All semiconductor refrigeration assemblies arranged in more than two greenhouse groups corresponding to the first control temperature control request can be started to work at the same time, or part of the semiconductor refrigeration assemblies can be started to work, namely the work of each semiconductor refrigeration assembly is independently controlled along with the temperature control request, and the work of each semiconductor refrigeration assembly is not influenced by other semiconductor refrigeration assemblies.
S1430: and controlling the driving device to drive the turntable to rotate according to the first temperature control request, and controlling the communication state of the air return opening of the temperature control chamber corresponding to the first temperature control request.
The temperature control chamber is provided with an air supply outlet and an air return inlet, the temperature control chamber realizes the circulation with the air outside the temperature control chamber through the air supply outlet and the air return inlet, the air outside the temperature control chamber can enter the temperature control chamber from the air supply outlet and flow out from the air return inlet, and in the process, the heat exchange between the inside and the outside of the temperature control chamber can be realized through the flow of the air; and controlling the driving device to drive the turntable to rotate according to the first temperature control request, controlling the communication state of the air return opening of the temperature control chamber corresponding to the first temperature control request, and enabling a channel for air circulation to be formed between the air supply opening and the air return opening of the corresponding temperature control chamber, thereby realizing the temperature regulation of the temperature control chamber.
By controlling the rotation angle of the turntable, the communication port on the turntable can be communicated with the air return port of the temperature control chamber, and the communication port on the turntable can also be staggered with the air return port of the temperature control chamber, so that the air return port is closed.
The communicating port on the control turntable can be controlled to be communicated with the air return ports of the temperature control rooms with required temperature control, so that the communicating state of the air return ports of the temperature control rooms can be controlled through the turntable, and the temperature of the temperature control rooms can be controlled.
It should be noted that, because the current position of the communication port may be determined according to the prior control, when different temperature control requests are obtained, the driving device may be controlled to drive the communication port of the turntable to rotate according to the current position of the communication port, the heating condition of the semiconductor refrigeration assembly to the temperature-controlled compartment, and the temperature control requirement of the non-heated temperature-controlled compartment, so as to control the communication state of the air return port of the temperature-controlled compartment corresponding to the temperature control request.
In one embodiment, the device comprises a first temperature control chamber, a second temperature control chamber and a third temperature control chamber, wherein the first temperature control chamber comprises a first air return opening, the second temperature control chamber comprises a second air return opening, the third temperature control chamber comprises a third air return opening, the first temperature control chamber and the second temperature control chamber are adjacently arranged, a semiconductor refrigeration component is arranged between the first temperature control chamber and the second temperature control chamber, the first temperature control chamber, the second temperature control chamber and the third temperature control chamber form a temperature control chamber array, a turntable is arranged on one side of the temperature control chamber array and can cover three air return openings, a communication opening is formed in the turntable and can be communicated with the three air return openings one by one according to the rotation of the turntable, the communication opening can rotate to a first communication position, a second communication position, a third communication position and a first closing position according to the rotation of the turntable, the first communication position corresponds to the first air return opening, the second communication position corresponds to the second air return opening, the third communication position corresponds to the third air return opening, and the first closing position is a position capable of closing the three air return openings. The step of controlling the driving device to drive the turntable to rotate according to the temperature control request and controlling the communication state of the return air inlet of the temperature control chamber corresponding to the temperature control request can comprise the following nine aspects:
in a first aspect: the semiconductor refrigeration assembly can be controlled to start, the first temperature control chamber is heated, the second temperature control chamber is refrigerated, meanwhile, the communication port of the turntable can be controlled to rotate to the second communication position from the first communication position, the refrigeration efficiency of the second temperature control chamber can be improved through the semiconductor refrigeration assembly and the communication port, meanwhile, the first temperature control chamber can be prevented from being affected by cold energy through the sealing effect of the turntable, and the heating effect of the first temperature control chamber can be improved.
In a second aspect: the temperature control request for heating of the first temperature control chamber is acquired when the communication port is located at the first communication position, the first temperature control chamber can be heated by controlling the starting of the semiconductor refrigeration assembly, and meanwhile, the communication port of the turntable can be controlled to rotate to the first closed position from the first communication position, so that the three air return ports are closed, the influence of cold quantity on the first temperature control chamber can be prevented, and the heating effect of the first temperature control chamber can be improved.
In a third aspect: when the communication port is located at the second communication position, a temperature control request for heating of the first temperature control room is acquired, the temperature of the second temperature control room is close to a target temperature, the first temperature control room can be heated by controlling the starting of the semiconductor refrigeration assembly, the second temperature control room is refrigerated, the communication port of the turntable can be controlled to rotate to the first closing position from the second communication position, the heating request of the first temperature control room is met, and meanwhile, the temperature of the second temperature control room can be effectively prevented from being too low.
In a fourth aspect: when the communication port is located at the second communication position, a temperature control request for heating of the first temperature control chamber is acquired, the first temperature control chamber can be heated by controlling the starting of the semiconductor refrigeration assembly, the communication port of the turntable can be controlled to be kept at the second communication position, and after a first set condition is reached, the communication port of the turntable is controlled to rotate to the first closing position from the second communication position.
In a fifth aspect: the temperature control request for controlling the temperature of the temperature control rooms is acquired when the communication port is located at the first communication position, the temperature control request comprises a heating request of the first temperature control room, a refrigerating request of the second temperature control room and a refrigerating request of the third temperature control room, the semiconductor refrigerating assembly can be controlled to start, the first temperature control room is heated, the second temperature control room is refrigerated, the communication port of the turntable can be controlled to rotate to the third communication position from the first communication position, the temperatures of the first temperature control room and the second temperature control room are controlled through the semiconductor refrigerating assembly, meanwhile, the communication port is communicated with the third return air port, the temperature of the third temperature control room is controlled, and the temperature control of the temperature control rooms can be achieved simultaneously.
In a sixth aspect, when the communication port is located at the third communication position, the temperature of the third temperature-control compartment reaches the target temperature, and the communication port of the turntable can be controlled to rotate from the third communication position to the first closed position, so that the three return air inlets are closed, and the temperatures of the three temperature-control compartments can be kept stable.
In a seventh aspect, when the communication port is in the third communication position, the temperature of the second temperature-control compartment needs to be controlled, and the communication port of the turntable can be controlled to rotate from the third communication position to the second communication position, so that temperature control of the second temperature-control compartment is realized.
In the ninth aspect, when the communication port is located at the second communication position, the temperature of the third temperature control chamber needs to be controlled, the communication port of the turntable can be controlled to be kept at the second communication position, and after the first set condition is met, the communication port of the turntable can be controlled to rotate to the third communication position from the second communication position, so that the temperature of the plurality of temperature control chambers can be controlled, and the problem that the temperature control request of the second temperature control chamber cannot be met is effectively avoided.
In the ninth aspect, when the communication port is located at the third communication position, the temperature of the second temperature control chamber needs to be controlled, the communication port of the turntable can be controlled to be kept at the third communication position, and after the first set condition is met, the communication port of the turntable can be controlled to rotate to the second communication position from the third communication position, so that the temperature of the plurality of temperature control chambers can be controlled, and the problem that the temperature control request of the third temperature control chamber cannot be met is effectively avoided.
It should be noted that, in the return air temperature control method, the method for controlling the rotation of the communication port includes, but is not limited to, the nine aspects listed above, and other methods are also possible, and are not listed here.
Through the return air temperature control method, when the hot end of the semiconductor refrigeration assembly heats the first temperature control room, the communication ports in different positions are controlled to rotate or be kept in positions other than the first communication position, and the communication state of the communication ports and the return air inlet can be changed, so that the different temperature control requirements of the temperature control rooms are met.
The first setting condition includes the following two aspects:
in a first aspect: the temperature of the second temperature-controlled compartment reaches the first target temperature. When the temperature control request of the third temperature control chamber is acquired, the driving device controls the communication port of the turntable to rotate to the third communication position, the situation that the second temperature control request is not met is possible, a first set condition can be set, the communication port is kept at the second communication position, after the temperature of the second temperature control chamber reaches the first target temperature, the communication port of the turntable is controlled to rotate to the third communication position from the second communication position, and the problem that the second temperature control request cannot be met is effectively avoided.
In a second aspect: the communication port of the dial is held at the second communication position for a first period of time. When the temperature control request of the third temperature control chamber is acquired, the driving device controls the communication port of the turntable to rotate to the second communication position, the situation that the second temperature control request is not met is possible, a first set condition can be set, the communication port is kept at the second communication position, after the time reaches the first time length, the communication port of the turntable is controlled to rotate to the third communication position from the second communication position, and the problem that the first temperature control request cannot be met is effectively avoided.
The first setting condition includes, but is not limited to, the above-described conditions in both aspects, and may be other conditions, which are not described here.
Another embodiment of the present application further provides a method for controlling temperature of return air, as shown in fig. 15, fig. 15 is a schematic diagram of an embodiment of a refinement procedure of step S1410 in fig. 14, where step S1410 includes but is not limited to:
s1510, acquiring more than two temperature control requests;
more than two temperature control requests are acquired, and the temperature control requests can be acquired simultaneously or sequentially in the time dimension; the priority dimension may be the same priority or different priorities.
S1520, judging the priority of more than two temperature control requests, and determining the temperature control request with the highest priority as the first temperature control request.
The obtained more than two temperature control requests are judged according to the priority, the temperature control request with the highest priority is determined as the first temperature control request, the judgment on the first temperature control request can be carried out according to the time sequence of obtaining the temperature control requests, can be carried out according to the distance between the communication port and the air return opening of the temperature control chamber corresponding to the temperature control request, can be carried out according to the priority of the temperature control chamber corresponding to the temperature control request, and can also be carried out according to the difference between the current temperature of the temperature control chamber and the target temperature. The determination of priority includes, but is not limited to, the above listed priority conditions, and other priority conditions may be used, which are not listed here. The driving device can be controlled to drive the rotary disc to rotate according to the first temperature control request, the communication state of the air return opening of the temperature control chamber corresponding to the temperature control request is controlled, and a channel for air circulation is formed between the air supply opening and the air return opening of the corresponding temperature control chamber, so that the temperature of the temperature control chambers with a plurality of non-heating requests can be adjusted.
Another embodiment of the present application further provides a return air temperature control method, as shown in fig. 16, fig. 16 is a schematic diagram of an embodiment of a detailed process of step S1520 in fig. 15, where the step S1520 includes but is not limited to:
and S1600, designating the temperature control request corresponding to the temperature control chamber with the high priority level as a first temperature control request.
If a plurality of temperature control requests exist and at least one temperature control request corresponding to a temperature control room with a high assigned priority level exists, in order to ensure the freshness of food in the temperature control room, the temperature control request corresponding to the temperature control room with the high assigned priority level is determined as a first temperature control request, and the driving device is controlled to drive the turntable to rotate according to the first temperature control request, so that the communication port is communicated with the return air port of the temperature control room corresponding to the first temperature control request, and the temperature control requirement of the temperature control room with the high assigned priority level can be met preferentially.
It should be noted that the priority level of the temperature control compartment may be a default setting or may be set by a user, and the present invention is not limited thereto.
In an embodiment, in the process of daily use, a customer can set the priority of a temperature control room for storing food according to the importance of the food or according to the characteristics of the food, for example, for dry food, the food needs to be stored at a stable low temperature, if the temperature change of the stored temperature control room is large, the food may absorb moisture and mildew, so that the temperature control requirement of the temperature control room for storing the food needs to be preferentially processed, the temperature control room for the food can be set as a high-priority temperature control room, therefore, when three temperature control requests are obtained simultaneously, the temperature control rooms corresponding to the three temperature control requests comprise one high-priority temperature control room, the temperature control request corresponding to the high-priority temperature control room can be designated as a first temperature control request, the driving device is controlled to drive the turntable to rotate, so that the communication port is communicated with the return air port of the temperature control room corresponding to the first temperature control request, a channel for air circulation is formed between the air supply outlet and the air return inlet of the temperature control chamber with high priority level, so that the temperature of the temperature control chamber can be preferentially adjusted, and the risk of moisture absorption and mildew of food is reduced.
In an embodiment, a customer can put food into a temperature control chamber with high priority according to the importance of the food storage or according to the characteristics of the food, for example, for ice cream, the food needs to be stored at a stable low temperature, if the temperature of the temperature control chamber is increased more, the food may be melted, so that the temperature control requirement of the temperature control chamber in which the food is stored needs to be preferentially processed, and the food can be put into a default or preset temperature control chamber with high priority, so when two temperature control requests are obtained at different times, the temperature control chamber corresponding to the subsequent temperature control request is the temperature control chamber with high priority, the temperature control request corresponding to the temperature control chamber with high priority can be designated as the first temperature control request, and the communication state of the communication port and the return air port of the temperature control chamber corresponding to the prior temperature control request does not need to be judged, the driving device can be controlled to drive the rotary disc to rotate, the communication port is communicated with the air return port of the temperature control chamber corresponding to the first temperature control request, a channel for air circulation is formed between the air supply port and the air return port of the temperature control chamber with the high priority level, the temperature of the temperature control chamber can be preferentially regulated, and the risk of food melting is reduced.
Another embodiment of the present application further provides a return air temperature control method, as shown in fig. 17, fig. 15 is a schematic diagram of an embodiment of a detailed process of step S1530 in fig. 15, where step S1530 includes, but is not limited to:
s1700, determining a first temperature control request according to a temperature difference of a temperature control chamber corresponding to the temperature control request, wherein the temperature difference is a difference value between the current temperature of the temperature control chamber and a preset temperature.
If a plurality of temperature control requests occur, the temperature control requests can be sequenced according to the temperature difference of the temperature control chamber corresponding to the temperature control requests, the temperature control request corresponding to the temperature control chamber with the larger temperature difference can be determined as a first temperature control request, and the driving device is controlled to drive the turntable to rotate according to the first temperature control request, so that the communication port is communicated with the return air inlet of the temperature control chamber corresponding to the first temperature control request, and the temperature control requirements of the temperature control chambers with different temperature differences are met.
In one embodiment, when two temperature control requests are acquired, the priority of the temperature control rooms corresponding to the two temperature control requests is the same, the difference value between the current temperature and the preset temperature of the temperature control chamber corresponding to the subsequent temperature control request is larger than that of the temperature control chamber corresponding to the previous temperature control request, the temperature control request corresponding to the temperature control compartment with a larger difference between the current temperature and the preset temperature can be designated as the first temperature control request without judging the communication state of the communication port and the return air inlet of the temperature control compartment corresponding to the prior temperature control request, the driving device can be controlled to drive the rotary disc to rotate according to the first temperature control request, so that the communication port is communicated with the air return port of the temperature control chamber corresponding to the first temperature control request, and a channel for air circulation is formed between the air supply port and the air return port of the temperature control chamber with the high priority level, so that the temperature of the temperature control chamber can be preferentially regulated, and the risk of food deterioration is reduced.
In one embodiment, when the communication port is communicated with the second air return port of the second temperature control compartment, two temperature control requests are obtained, the priority of the temperature control compartments corresponding to the two temperature control requests is the same, the difference between the current temperature and the preset temperature of the temperature control compartment corresponding to the subsequent temperature control request is greater than that of the temperature control compartment corresponding to the prior temperature control request, the temperature control request corresponding to the temperature control compartment with the greater difference between the current temperature and the preset temperature can be designated as the first temperature control request, after the temperature of the second temperature control compartment reaches the preset temperature, the driving device can be controlled to drive the rotary disc to rotate according to the first temperature control request, so that the communication port is communicated with the air return port of the temperature control compartment corresponding to the first temperature control request, and a channel for air circulation is formed between the air supply port and the air return port of the temperature control compartment with the greater difference between the temperature and the preset temperature, thereby realizing the preferential adjustment of the temperature control compartment, reducing the risk of food spoilage.
Another embodiment of the present application further provides a return air temperature control method, as shown in fig. 18, fig. 18 is a schematic diagram of an embodiment of a refinement procedure of step S1700 in fig. 18, where step S1700 includes, but is not limited to:
s1800: and the temperature control request corresponding to the temperature control chamber with the temperature difference value larger than the threshold value is a first temperature control request.
If a plurality of temperature control requests occur and at least one temperature control request corresponding to the temperature control chamber with the temperature difference larger than the threshold exists, the difference between the food in the temperature control chamber with the temperature difference larger than the threshold and the effective fresh-keeping temperature is large, the risk of food deterioration is easy to occur, the temperature control request corresponding to the temperature control chamber with the temperature difference larger than the threshold can be determined as the first temperature control request, so that the temperature control requirement of the temperature control chamber with the temperature difference larger than the threshold can be preferentially met, and the risk of food deterioration is eliminated.
In one embodiment, when the communication port is communicated with the second air return port of the second temperature control chamber, two temperature control requests are obtained, the priority of the temperature control chamber corresponding to the two temperature control requests is the same, the difference value between the current temperature of the temperature control compartment corresponding to the subsequent temperature control request and the preset temperature is larger than the threshold value, the temperature control request corresponding to the temperature control chamber with a larger difference between the current temperature and the preset temperature can be designated as the first temperature control request without waiting for the temperature of the second temperature control chamber to reach the preset temperature, the driving device can be directly controlled to drive the rotary disc to rotate according to the first temperature control request, the communication port is communicated with the air return port of the temperature control chamber corresponding to the first temperature control request, a channel for air circulation is formed between the air supply port and the air return port of the temperature control chamber with the larger difference value between the temperature and the preset temperature, the temperature of the temperature control chamber can be preferentially regulated, and the risk of food deterioration is reduced.
In one embodiment, when the communication port is communicated with a second air return port of a second temperature control compartment, the second temperature control compartment is a high-priority temperature control compartment, two temperature control requests are obtained, the priorities of the temperature control compartments corresponding to the two temperature control requests are the same, the difference value between the current temperature and the preset temperature of the temperature control compartment corresponding to the subsequent temperature control request is greater than a threshold value, the temperature control request corresponding to the temperature control compartment with the greater difference value between the current temperature and the preset temperature can be designated as a first temperature control request, after the temperature of the second temperature control compartment reaches the preset temperature, the driving device can be controlled to drive the turntable to rotate according to the first temperature control request, so that the communication port is communicated with the air return port of the temperature control compartment corresponding to the first temperature control request, a passage for air circulation is formed between the air supply port and the air return port of the temperature control compartment with the greater difference value between the temperature and the preset temperature, and the preferential adjustment of the temperature control compartment is realized, reducing the risk of food spoilage.
Another embodiment of the present application further provides a return air temperature control method, as shown in fig. 19, fig. 19 is a schematic diagram of an embodiment of a refinement procedure of step S1430 in fig. 14, where the step S1430 includes but is not limited to:
and S1900, controlling the turntable to rotate clockwise or anticlockwise according to the distance parameter, wherein the distance parameter is the distance value between the communication port and the air return port of the temperature control chamber needing temperature control.
The turntable is provided with a communication port, in the process of controlling the communication port of the turntable to rotate according to the temperature control request, the return air inlet of the temperature control chamber corresponding to the non-temperature control request on the rotating path can be communicated passively, the communication time of the communication port and the return air inlet is short, and after the return air inlet is communicated passively for many times, part of air in the temperature control chamber can be conveyed out through the return air inlet, so that the temperature of the temperature control chamber corresponding to the passively communicated return air inlet is influenced. In order to solve the problems, the rotation path of the turntable can be confirmed according to the distance parameter, namely, the rotation path with a smaller distance value between the communication port and the air return opening of the temperature control chamber needing temperature control is selected, the turntable is controlled to rotate clockwise or anticlockwise according to the selected rotation path, so that when the communication port rotates towards the air opening of the temperature control chamber corresponding to the temperature control request, the number of the air return openings of the temperature control chamber corresponding to the non-temperature control request is as small as possible, and the influence degree on the temperature in the temperature control chambers of other non-temperature control requests is reduced.
Another embodiment of the present application further provides a return air temperature control method, as shown in fig. 20, fig. 20 is a schematic diagram of an embodiment of a refinement procedure of step S1430 in fig. 14, where the step S1430 includes but is not limited to:
and S2000, adjusting the rotation angle of the rotary disc to adjust the communication area of the communication port to the return air inlet.
In the process that the communication port is communicated with the air return port, the driving device can adjust the rotating angle of the rotary disc according to the temperature control request to adjust the communication area of the communication port to the air return port, and the flow speed of the air in the temperature control chamber can be adjusted by reducing or increasing the communication area of the communication port and the air return port, so that the temperature change speed of the temperature control chamber is adjusted, and the temperature of the temperature control chamber can be accurately controlled.
Referring to fig. 21, fig. 21 is a schematic view of an operation control apparatus of a refrigerator according to an embodiment of the present invention. The operation control device according to the embodiment of the present invention is built in the refrigerator, and includes one or more control processors 210 and a memory 220, and fig. 21 illustrates one control processor 210 and one memory 220 as an example.
The control processor 210 and the memory 220 may be connected by a bus or other means, and the bus connection is exemplified in fig. 21.
The memory 220, which is a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. Further, the memory 220 may include high speed random access memory 220, and may also include non-transitory memory 220, such as at least one piece of disk memory 220, flash memory device, or other non-transitory solid state memory 220. In some embodiments, the memory 220 may optionally include memory 220 remotely located from the control processor 210, and these remote memories 220 may be connected to the operation control device via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
Those skilled in the art will appreciate that the configuration of the apparatus shown in fig. 21 does not constitute a limitation of the operation control apparatus and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The non-transitory software programs and instructions required to implement the return air temperature control method applied to the operation control device in the above-described embodiment are stored in the memory 220, and when executed by the control processor 210, the return air temperature control method applied to the operation control device in the above-described embodiment is executed, for example, the method steps S1410 to S1430 in fig. 14, the method steps S1510 to S1520 in fig. 15, the method step S1600 in fig. 16, the method step S1700 in fig. 17, the method steps S1800 in fig. 18, the method step S1900 in fig. 19, and the method step S2000 in fig. 20, which are described above, are executed.
Since the refrigerator in this embodiment has the operation control device in any of the above embodiments, the refrigerator in this embodiment has the hardware structure of the operation control device in the above embodiments, and the control processor 210 in the operation control device can call the control program of the refrigerator stored in the memory 220 to control the return air temperature control mechanism.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Referring to fig. 22, fig. 22 is a refrigerator according to an embodiment of the present invention, which includes an operation control device 2220 according to the above embodiment and a return air temperature control mechanism 2210 according to the above embodiment.
The semiconductor refrigeration components penetrate through the two temperature control rooms, the temperature of air outside the temperature control rooms is not influenced when the temperature of the temperature control rooms is controlled by the semiconductor refrigeration components, the temperature control requirement range of the temperature control rooms is not limited by the temperature of the air outside the temperature control rooms, when the semiconductor refrigeration components are controlled to start, the temperatures of the cold end and the hot end of the semiconductor refrigeration components can be controlled according to a first temperature control request, the cold end of the semiconductor refrigeration components can refrigerate one temperature control room, the hot end of the semiconductor refrigeration components can also heat another temperature control room, different temperature control can be conducted on a plurality of different temperature control rooms simultaneously, the temperature change range of the temperature control rooms can be expanded, and wide temperature adjustment of the temperature control rooms is achieved.
It should be noted that the refrigerator may include the return air temperature control mechanism 2210 of the above-described embodiment or the operation control device 2220 of the above-described embodiment.
Furthermore, an embodiment of the present invention also provides a computer-readable storage medium, which stores computer-executable instructions that are executed by one or more control processors 210, for example, by one of the control processors 210 in fig. 16, and can cause the one or more control processors 210 to execute the return air temperature control method in the above-described method embodiment, for example, execute the above-described method steps S1410 to S1430 in fig. 14, the method steps S1510 to S1520 in fig. 15, the method step S1600 in fig. 16, the method step S1700 in fig. 17, the method steps S1800 in fig. 18, the method step S1900 in fig. 19, and the method step S2000 in fig. 20.
One of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory 220 technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.

Claims (25)

1. The utility model provides a return air temperature control mechanism, is applied to the refrigerator, its characterized in that, including the carousel, be used for control carousel pivoted drive arrangement and at least one temperature control room group, temperature control room group is including two temperature control rooms of adjacent setting, semiconductor refrigeration subassembly is worn to be equipped with in two temperature control rooms, semiconductor refrigeration subassembly includes hot junction and cold junction, the hot junction is towards one of them temperature control room, the cold junction is towards another temperature control room, temperature control room includes supply-air outlet and return air inlet, the carousel be provided with can with the intercommunication mouth that the return air inlet corresponds.
2. A return air temperature control mechanism according to claim 1, characterized in that: and the projection of the air return opening to the direction of the turntable is overlapped with the rotating path of the communication opening.
3. A return air temperature control mechanism according to claim 1, characterized in that: the number of the communication ports arranged on the turntable is one or more than two.
4. A return air temperature control mechanism according to any one of claims 1 to 4, characterized in that: the driving device drives the communication port on the turntable to rotate according to the temperature requirement of the temperature control chamber, and controls the communication state of the air return port of the temperature control chamber corresponding to the temperature control request.
5. A return air temperature control mechanism according to claim 4, characterized in that: the two temperature control chambers comprise a first temperature control chamber and a second temperature control chamber, the first temperature control chamber comprises a first air return opening, the second temperature control chamber comprises a second air return opening, the semiconductor refrigeration assembly controls the hot end to heat the first temperature control chamber and controls the cold end to refrigerate the second temperature control chamber according to the temperature requirement of the temperature control chambers, the driving device controls the communication opening of the rotary disc to rotate from a first communication position to a second communication position according to the temperature requirement of the temperature control chambers, the first communication position corresponds to the first air return opening, the second communication position corresponds to the second air return opening, or the driving device controls the communication opening of the rotary disc to rotate from the first communication position to a first closing position according to the temperature requirement of the temperature control chambers, so that all the air return openings on the air temperature control mechanism are closed, or the driving device controls the communication port of the turntable to rotate from the first closed position to the second communication position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication port of the turntable to rotate from the second communication position to the first closed position according to the temperature requirement of the temperature control chamber.
6. A return air temperature control mechanism according to claim 5, characterized in that: the third temperature control chamber comprises a third air return port, the driving device controls the communication port of the turntable to rotate from the first communication position to the third communication position according to the temperature requirement of the temperature control chamber, the third communication position corresponds to the third air return port, or the driving device controls the communication port of the turntable to rotate from the first closing position to the third communication position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication port of the turntable to rotate from the third communication position to the first closing position according to the temperature requirement of the temperature control chamber, or the driving device controls the communication port of the turntable to rotate from the third communication position to the second communication position according to the temperature requirement of the temperature control chamber, and controlling the communication port of the rotary disc to rotate from the second communication position to the third communication position.
7. The return air temperature control mechanism of claim 6, wherein: and the driving device controls the communication port of the turntable to be kept at the second communication position according to the temperature requirement of the temperature control chamber, and controls the communication port of the turntable to rotate from the second communication position to the third communication position after the first set condition is met.
8. A return air temperature control mechanism according to claim 7, wherein: the first setting condition includes at least one of:
the temperature of the second temperature control chamber reaches a first target temperature;
the communication port of the dial is maintained at the second communication position for a first period of time.
9. A return air temperature control mechanism according to claim 1, characterized in that: the temperature control room comprises a field-shaped temperature control room array formed by two temperature control room groups, wherein the rotary disc is arranged on one side of the temperature control room array, the rotary disc is a disc covering air return openings of the four temperature control room groups, an air supply opening of the temperature control room is arranged on one side of the temperature control room array corresponding to the rotary disc, and the coverage range of the disc is avoided.
10. A return air temperature control mechanism according to claim 1 or 9, wherein: the temperature control chamber is characterized by further comprising an evaporator air duct, and an air return opening of the temperature control chamber is communicated with the evaporator air duct through a communication opening of the turntable.
11. A return air temperature control mechanism according to claim 10, wherein: the evaporator air duct comprises an air outlet air duct positioned above the evaporator and an air return air duct arranged below the evaporator, an air supply outlet of the temperature control chamber is communicated with the air outlet air duct, and a return air inlet of the temperature control chamber is communicated with the air return air duct.
12. A return air temperature control mechanism according to claim 4, characterized in that: the driving device controls the rotating position of the rotating disc according to the priority of the temperature requirement of the temperature control chamber.
13. A return air temperature control mechanism according to claim 12, wherein: the priority of the temperature requirement of the temperature controlled compartment comprises one of:
the temperature requirement corresponding to the temperature control chamber with the temperature difference larger than the threshold value is prior, and the temperature difference is the difference value between the current temperature of the temperature control chamber and the preset temperature;
and assigning the temperature requirement corresponding to the temperature control room with high priority level to be prior.
14. The return air temperature control method is applied to a refrigerator and is characterized in that the refrigerator comprises a rotary table, a driving device used for controlling the rotary table to rotate and at least one temperature control room group, the temperature control room group comprises two temperature control rooms which are adjacently arranged, a semiconductor refrigeration assembly is arranged between the two temperature control rooms, the semiconductor refrigeration assembly comprises a hot end and a cold end, the hot end faces one of the temperature control rooms, the cold end faces the other temperature control room, the temperature control rooms comprise an air supply opening and a return air opening, the rotary table is provided with a communication opening which can correspond to the return air opening, and the return air temperature control method comprises the following steps:
acquiring a first temperature control request for controlling the temperature of the temperature control compartment;
and controlling the temperatures of the cold end and the hot end of the semiconductor refrigeration assembly according to the first temperature control request.
15. The return air temperature control method according to claim 14, further comprising controlling the driving device to drive the turntable to rotate according to the first temperature control request, and controlling a communication state of the return air inlet of the temperature control compartment corresponding to the first temperature control request.
16. The return air temperature control method according to claim 15, wherein the temperature control compartment group comprises a first temperature control compartment and a second temperature control compartment, the first temperature control compartment comprises a first return air inlet, the second temperature control compartment comprises a second return air inlet, and the semiconductor refrigeration component controls the hot end to heat the first temperature control compartment and controls the cold end to refrigerate the second temperature control compartment according to a first temperature control request;
the driving device is controlled to drive the rotary table to rotate according to the first temperature control request, and the communication state of the air return opening of the temperature control compartment corresponding to the first temperature control request is controlled, wherein the communication state comprises one of the following states:
controlling a communication port of the rotary disc to rotate from a first communication position to a second communication position according to a first temperature control request, wherein the first communication position corresponds to the first air return port, and the second communication position corresponds to the second air return port;
controlling the communication port of the turntable to rotate from a first communication position to a first closing position according to a first temperature control request, so that all return air ports on the return air temperature control mechanism are closed;
controlling a communication port of the turntable to rotate from a second communication position to a first closing position according to a first temperature control request;
and controlling the communication port of the turntable to rotate from the first closed position to the second communication position according to the first temperature control request.
17. The return air temperature control method according to claim 16, further comprising a third temperature control compartment, wherein the third temperature control compartment comprises a third return air inlet;
the driving device is controlled to drive the rotary table to rotate according to the first temperature control request, and the communication state of the air return opening of the temperature control compartment corresponding to the first temperature control request is controlled, wherein the communication state comprises one of the following states:
controlling a communication port of the rotary disc to rotate from a first communication position to a third communication position according to a first temperature control request, wherein the third communication position corresponds to a third air return port;
controlling a communication port of the turntable to rotate from a first closed position to a third communication position according to a first temperature control request;
controlling a communication port of the turntable to rotate from a second communication position to a third communication position according to a first temperature control request;
controlling a communication port of the turntable to rotate from a third communication position to a second communication position according to a first temperature control request;
controlling the communication port of the turntable to be kept at a second communication position according to the first temperature control request, and controlling the communication port of the turntable to rotate from the second communication position to a third communication position after a first set condition is reached;
and controlling the communication port of the turntable to be kept at a third communication position according to the first temperature control request, and controlling the communication port of the turntable to rotate from the third communication position to a second communication position after a first set condition is reached.
18. The return air temperature control method according to claim 17, wherein the first set condition includes at least one of:
the temperature of the second temperature control chamber reaches a first target temperature;
the communication port of the dial is maintained at the second communication position for a first period of time.
19. The return air temperature control method according to claim 15, wherein the acquiring of the first temperature control request for controlling the temperature of the temperature-controlled compartment includes:
acquiring more than two temperature control requests;
judging the priority of the more than two temperature control requests, and determining the temperature control request with the highest priority as a first temperature control request.
20. The return air temperature control method according to claim 19, wherein the temperature control request with the highest priority level is determined as the first temperature control request, and the method comprises one of the following steps:
appointing a temperature control request corresponding to a temperature control room with a high priority level as a first temperature control request;
and determining a first temperature control request according to a temperature difference of a temperature control room corresponding to the temperature control request, wherein the temperature difference is a difference value between the current temperature of the temperature control room and a preset temperature.
21. The return air temperature control method according to claim 20, wherein the determining of the first temperature control request according to the temperature difference of the temperature control compartment corresponding to the temperature control request includes:
and the temperature control request corresponding to the temperature control chamber with the temperature difference value larger than the threshold value is the first temperature control request.
22. The return air temperature control method according to claim 15, wherein the controlling the driving device to drive the turntable to rotate comprises:
controlling the turntable to rotate clockwise or anticlockwise according to a distance parameter, wherein the distance parameter is a distance value between the communication port and the air return port of the temperature control compartment needing temperature control;
and adjusting the rotation angle of the turntable to adjust the communication area of the communication port to the air return port.
23. An operation control device comprising at least one control processor and a memory for communicative connection with the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform a return air temperature control method as claimed in any one of claims 14 to 22.
24. A refrigerator comprising an operation control device as claimed in claim 23 and/or a return air temperature control mechanism as claimed in any one of claims 1 to 13.
25. A computer-readable storage medium having stored thereon computer-executable instructions for causing a computer to perform the return air temperature control method of any one of claims 14 to 22.
CN202010116864.5A 2020-02-25 2020-02-25 Return air temperature control mechanism, return air temperature control method, operation control device and refrigerator Active CN113375412B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2754031Y (en) * 2004-09-14 2006-01-25 广东科龙电器股份有限公司 Electric refrigerator with precise temperature control device
CN102313426A (en) * 2011-09-30 2012-01-11 合肥美的荣事达电冰箱有限公司 Refrigerator
CN106369913A (en) * 2016-08-30 2017-02-01 青岛海尔股份有限公司 Refrigerator
CN206817860U (en) * 2017-04-14 2017-12-29 青岛海尔股份有限公司 Exhaust apparatus and the refrigerator with the exhaust apparatus
CN108592511A (en) * 2018-04-02 2018-09-28 合肥华凌股份有限公司 The temprature control method and temperature control equipment and refrigerator of refrigerator ice greenhouse

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2754031Y (en) * 2004-09-14 2006-01-25 广东科龙电器股份有限公司 Electric refrigerator with precise temperature control device
CN102313426A (en) * 2011-09-30 2012-01-11 合肥美的荣事达电冰箱有限公司 Refrigerator
CN106369913A (en) * 2016-08-30 2017-02-01 青岛海尔股份有限公司 Refrigerator
CN206817860U (en) * 2017-04-14 2017-12-29 青岛海尔股份有限公司 Exhaust apparatus and the refrigerator with the exhaust apparatus
CN108592511A (en) * 2018-04-02 2018-09-28 合肥华凌股份有限公司 The temprature control method and temperature control equipment and refrigerator of refrigerator ice greenhouse

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