CN113345856A - Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure - Google Patents

Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure Download PDF

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Publication number
CN113345856A
CN113345856A CN202110724465.1A CN202110724465A CN113345856A CN 113345856 A CN113345856 A CN 113345856A CN 202110724465 A CN202110724465 A CN 202110724465A CN 113345856 A CN113345856 A CN 113345856A
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China
Prior art keywords
heat sink
groove
plastic package
radiating fin
chip
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CN202110724465.1A
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Chinese (zh)
Inventor
李利
何正鸿
钟磊
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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Priority to CN202110724465.1A priority Critical patent/CN113345856A/en
Publication of CN113345856A publication Critical patent/CN113345856A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The embodiment of the invention provides a chip packaging radiating fin, a preparation method thereof and a BGA radiating packaging structure, and relates to the technical field of semiconductor packaging. Through two rail structures, can avoid the plastic envelope material to remain on the surface of fin body as far as possible to the heat dispersion and the outward appearance of having guaranteed the chip package fin are clean and tidy. Compared with the prior art, the chip packaging radiating fin, the preparation method thereof and the BGA radiating packaging structure provided by the invention can prevent the plastic packaging material from overflowing to the surface of the radiating fin, avoid the radiating fin from remaining glue overflow, and ensure the radiating efficiency of the radiating fin and the neat appearance of the product.

Description

Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging radiating fin, a preparation method thereof and a BGA radiating packaging structure.
Background
With the rapid development of the semiconductor industry, the BGA Ball Array Package (Ball Grid Array Package) structure is widely used in the semiconductor industry. Heat dissipation is generally achieved by mounting a heat sink in a BGA package structure, which requires the heat sink to satisfy heat dissipation requirements. When the radiating fin is arranged, the radiating fin groove is usually designed on the packaging mold, and when the plastic package body is molded and injected, the top surface of the radiating fin contacts the top of the mold and is attached to a plastic package material under the driving of the mold.
If the top surface of the radiating fin can not effectively contact the top of the mold, a gap exists between the top surface of the radiating fin and the mold, when injection molding plastic package materials are carried out, the plastic package materials are easy to overflow on the surface of the radiating fin, once the overflow glue is left on the top surface of the radiating fin, the radiating efficiency of the radiating fin and the appearance of a product can be directly influenced, glue removing treatment is often carried out, and the packaging cost and the radiating fin damage risk are directly increased.
Disclosure of Invention
The invention provides a chip packaging heat sink, a preparation method thereof and a BGA heat dissipation packaging structure, which can prevent a molding compound from overflowing to the surface of the heat sink, avoid the glue overflow of the heat sink, and ensure the heat dissipation efficiency of the heat sink and the neat appearance of a product.
Embodiments of the invention may be implemented as follows:
in a first aspect, the invention provides a chip package heat sink, which comprises a heat sink body, wherein the heat sink body is provided with an attaching surface and a die pressing surface which are opposite, the attaching surface is used for attaching to a plastic package body, a first groove is formed in the attaching surface, a first fence is formed at the edge of the first groove, and the first fence is arranged around the lower side edge of the heat sink body and used for preventing plastic package materials from overflowing during plastic package; the die pressing surface is used for combining a die, a second groove is formed in the die pressing surface, a second fence is formed at the edge of the second groove, and the second fence is arranged at the edge of the upper side of the radiating fin body in a surrounding mode and used for preventing the plastic package material from laterally climbing to the die pressing surface during plastic package.
In an alternative embodiment, the depth of the first groove is 1/3-1/2 of the thickness of the heat sink body; the depth of the second groove is 1/3-1/2 of the thickness of the heat sink body.
In an optional implementation manner, a first groove is further arranged on the bottom wall of the first groove, the first groove is arranged on the inner side of the first fence and is annularly arranged at the edge of the first groove, and the first groove is used for increasing the contact area between the cooling fin body and the plastic package body during plastic package and preventing the plastic package material from overflowing outwards.
In an optional embodiment, a second groove is further disposed on the bottom wall of the second groove, the second groove is disposed on the inner side of the second rail and is annularly disposed at the edge of the second groove, and the second groove is used for storing the molding compound during plastic packaging so as to prevent the molding compound from overflowing to the middle position of the molding surface.
In an optional embodiment, the number of the first trenches is multiple, the first trenches are arranged in a layer-by-layer surrounding manner, and the widths of the first trenches are the same; the second grooves are arranged in a layer-by-layer surrounding mode and are the same in width.
In an alternative embodiment, the first trench and the second trench are each 1/3-1/2 of the thickness of the heat sink.
In an optional embodiment, the heat sink body is rectangular, and the top corners of the periphery of the heat sink body are provided with fillet structures, so as to improve the separation angle between the heat sink body and the mold.
In an alternative embodiment, the radius of the fillet structure is 2 mm.
In an alternative embodiment, the stamping surface is further electroplated with a metal layer covering the surface of the heat sink body to prevent oxidation of the surface of the heat sink body.
In an optional embodiment, the attaching surface is further coated with a green paint layer or is roughened by electroplating to form a burred layer, so as to improve the bonding force between the attaching surface and the plastic package body.
In a second aspect, the present invention provides a BGA heat dissipation package structure, which includes a substrate, a chip, a plastic package, and the heat sink for chip package according to any one of the foregoing embodiments, wherein the chip is attached to the substrate, the plastic package is disposed on the substrate and covers the chip, and the attachment surface is attached to the plastic package.
In a third aspect, the present invention provides a method for preparing a chip package heat sink, for preparing the aforementioned chip package heat sink, the method includes:
the method comprises the following steps:
providing a radiating fin body, wherein the radiating fin body is provided with a binding surface and a mould pressing surface which are opposite;
forming a first groove on the binding surface through a laser grooving or punching process, and forming a first fence on the edge of the first groove;
forming a second groove on the die pressing surface through a laser grooving or punching process, and forming a second fence on the edge of the second groove;
the first fence is arranged at the lower side edge of the radiating fin body in a surrounding mode and used for preventing plastic package materials from overflowing during plastic package, and the second fence is arranged at the upper side edge of the radiating fin body in a surrounding mode and used for preventing the plastic package materials from laterally climbing to the die pressing surface during plastic package.
The beneficial effects of the embodiment of the invention include, for example:
according to the chip packaging radiating fin, the preparation method thereof and the BGA radiating packaging structure, the first groove and the second groove are formed on the upper side and the lower side of the radiating fin body respectively through the grooves, the first fence is formed on the edge of the first groove, the second fence is formed on the edge of the second groove, when in actual plastic packaging, the first fence is close to the plastic packaging body and used for preventing plastic packaging materials from overflowing during plastic packaging, the second fence is used for preventing the plastic packaging materials from laterally climbing to a mould pressing surface, and the plastic packaging materials can be prevented from remaining on the surface of the radiating fin body as far as possible through the two fence structures, so that the radiating performance and the neat appearance of the chip packaging radiating fin are ensured. Compared with the prior art, the chip packaging radiating fin, the preparation method thereof and the BGA radiating packaging structure provided by the invention can prevent the plastic packaging material from overflowing to the surface of the radiating fin, avoid the radiating fin from remaining glue overflow, and ensure the radiating efficiency of the radiating fin and the neat appearance of the product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a chip package heat sink according to a first embodiment of the present invention in a first view;
fig. 2 is a schematic structural diagram of a chip package heat sink according to a first embodiment of the present invention in a second view;
fig. 3 is a schematic structural diagram of a chip package heat sink according to a first embodiment of the present invention in a third view;
FIG. 4 is a partially enlarged view of IV in FIG. 3;
FIG. 5 is a partial enlarged view of V in FIG. 3;
fig. 6 is a schematic structural diagram of a chip package heat sink according to a second embodiment of the present invention in a first view;
fig. 7 is a schematic structural diagram of a heat sink for a chip package according to a second embodiment of the present invention;
fig. 8 is a schematic partial structure diagram of a heat sink for a chip package according to a second embodiment of the present invention;
fig. 9 is a schematic view of a BGA heat dissipation package structure according to a fourth embodiment of the present invention.
Icon: 100-a chip package heat sink; 110-a heat sink body; 111-fillet configuration; 130-a binding surface; 131-a green paint layer; 150-molding surface; 151-metal layer; 170-a first recess; 171-a first fence; 173-first trench; 190-a second groove; 191-a second pen; 193-second trench; 200-BGA heat dissipation packaging structure; 210-a chip; 230-a substrate; 250-plastic package body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
As disclosed in the background art, the conventional heat dissipation package structure usually requires mounting a heat sink for heat dissipation, and during plastic package, a heat sink groove is designed on a package mold, and the heat sink is installed.
In this case, since the molding compound is in an uncured state and has a strong fluidity under pressure, if the top surface of the heat sink does not effectively contact the top of the mold, a small gap may exist between the mold and the heat sink, and when the molding compound is injection-molded, the molding compound may climb to the top surface of the heat sink along with the side wall of the heat sink, once the top surface of the heat sink has the flash. On the one hand, the effective heat radiating area of fin has been reduced to excessive glue, and then may influence the radiating efficiency of fin, and on the other hand, excessive glue exposes outside after the encapsulation is accomplished, can influence the outward appearance neatness nature of product. Therefore, the prior art often needs a photoresist removing process, which directly increases the packaging cost and the risk of damaging the heat sink.
In order to solve the problems, the invention provides a novel chip packaging heat sink, a preparation method thereof and a BGA heat dissipation packaging structure. It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 to 5, the present embodiment provides a heat sink 100 for a chip package, which is suitable for a BGA heat dissipation package structure 200, and can prevent a molding compound from overflowing to the surface of the heat sink, so as to prevent the heat sink from overflowing, and ensure the heat dissipation efficiency of the heat sink and the neat appearance of the product.
The chip package heat sink 100 provided by the embodiment includes a heat sink body 110, the heat sink body 110 has an opposite attachment surface 130 and a die pressing surface 150, the attachment surface 130 is used for attaching to a plastic package body 250 (see fig. 9), a first groove 170 is arranged on the attachment surface 130, a first rail 171 is formed at the edge of the first groove 170, and the first rail 171 is arranged around the lower side edge of the heat sink body 110 and used for preventing plastic package material from overflowing during plastic package; the die pressing surface 150 is used for combining a die, a second groove 190 is formed in the die pressing surface 150, a second fence 191 is formed at the edge of the second groove 190, and the second fence 191 surrounds the edge of the upper side of the radiating fin body 110 and is used for preventing plastic package materials from climbing to the die pressing surface 150 during plastic package.
In this embodiment, the heat sink body 110 is further provided with a cutting street, which is a track line when the product is cut after the plastic package is completed, that is, the product is cut along the cutting street. Here, the cutting lane is located inside the first and second rails 171 and 191, i.e., after the cutting is completed, the first and second rails 171 and 191 may be cut, thereby ensuring the miniaturization of the package size. It should be noted that the cutting track is a virtual trace, and no mark is made on the heat sink body 110, and the cutting track is disposed close to the first rail 171 and the second rail 191 and is in a ring shape, so that the BGA heat dissipation package structure 200 formed after cutting can completely remove the first rail 171 and the second rail 191, and waste of material of the heat sink body 110 is avoided.
In the present embodiment, the depth of the first groove 170 is 1/3-1/2 of the thickness of the heat sink body 110; the depth of the second groove 190 is 1/3-1/2 of the thickness of the heat sink body 110. Specifically, the first recess 170 extends to the edge of the heat sink body 110 and forms a first rail 171 at the edge of the abutting surface 130 of the heat sink body 110, and the second recess 190 extends to the edge of the heat sink body 110 and forms a second rail 191 at the edge of the stamped surface 150 of the heat sink body 110. Wherein the height of the first rail 171 refers to the depth of the first groove 170 and the height of the second rail 191 refers to the depth of the second groove 190. Preferably, the thickness of the heat sink body 110 is 0.13mm, and the thickness of each of the first and second grooves 170 and 190 is 0.05mm, i.e., the height of each of the first and second rails 171 and 191 is 0.05 mm.
It should be noted that in this embodiment, the overlapping area of the first groove 170 and the second groove 190 is an effective heat dissipation area of the chip package heat sink 100, and the heat dissipation function is realized through the area. This also ensures that the cut chip package heat spreader 100 can remove the first and second rails 171 and 191 to ensure product consistency.
In this embodiment, the first rail 171 and the second rail 191 are symmetrically disposed on the upper side and the lower side of the heat sink body 110, and when the plastic package is actually performed, the second rail 191 can also be matched with a mold, for example, a protruding structure matched with the second groove 190 is formed on the mold, so that the heat sink body 110 and the mold are better attached to each other, and then a gap between the heat sink body 110 and the mold is reduced. The first rail 171 is close to the plastic package body 250, and is used for preventing plastic package material from overflowing during plastic package, and the second rail 191 is used for preventing the plastic package material from laterally climbing to the molding surface 150, so that the plastic package material can be prevented from remaining on the surface of the radiating fin body 110 as far as possible through two rail structures, and the heat radiation performance and the tidy appearance of the chip package radiating fin 100 are ensured.
In this embodiment, the heat sink body 110 is rectangular, and the length-width ratio thereof can be set according to the actual packaging requirements, for example, a 240mm × 76mm heat sink body 110 is adopted, and the size of the specification is larger than that of the final product, so as to ensure that the first rail 171 and the second rail 191 can be cut off after the cutting is completed. Of course, the specification and size of the heat sink body 110 and the specific heights of the first and second rails 171 and 191 are only for illustration and are not intended to be limiting.
In this embodiment, the top corners of the periphery of the heat sink body 110 are provided with fillet structures 111 to increase the separation angle between the heat sink body 110 and the mold. Specifically, R chamfers are designed around the heat sink body 110, the chamfers can increase the separation angle between the heat sink body 110 and the mold groove, and the mold can be better separated after the die is pressed on the chip package heat sink 100.
In this embodiment, the radius of the fillet structure 111 is 2 mm. Namely, the round corners at the top corners of the periphery of the heat sink body 110 are arcs with a radius of 2 mm. Of course, the radius of the fillet structure 111 is merely illustrative and not intended to be limiting.
In the present embodiment, the molding surface 150 is further formed with a metal layer 151 by electroplating, specifically, the heat sink body 110 adopts a copper foil structure, and the metal layer 151 covers the surface of the heat sink body 110 to prevent the surface of the heat sink body 110 from being oxidized. Wherein, metal level 151 is multilayer structure, for example chromium-nickel composite bed, and the outer chromium layer that adopts promptly, the inlayer adopts to be held between the fingers to become, and the chromium material can promote surperficial wearability and anti-oxidation performance, and the nickel layer can promote the cohesion with the copper foil surface to guarantee the stability of structure. Of course, other types of pure metal materials or composite metal materials can be used for the metal layer 151, and this is merely for illustration and is not meant to be limiting.
It should be noted that, in the present embodiment, the step of forming the metal layer 151 by electroplating may be performed before forming the second groove 190, that is, after forming the metal layer 151 by electroplating, forming the second groove 190 by laser grooving, stamping, or the like. Of course, the electroplating operation may be performed after the second groove 190 is formed, so that the surface of the heat sink body 110 is covered with the metal layer 151, thereby ensuring the oxidation resistance.
In this embodiment, the attaching surface 130 is further coated with a green paint layer 131 to improve the bonding force between the attaching surface 130 and the plastic package body 250. Specifically, the surface of the copper foil structure is painted with green paint in a printing mode, and the green paint material can improve the bonding force between the plastic package body 250 and the copper foil. Here, the green paint layer 131 is a solder resist ink and is applied by printing.
In other preferred embodiments of the present invention, instead of printing the green paint, the attaching surface 130 may be formed with a roughened layer by electroplating on the attaching surface 130. Specifically, the nodulation layer is distributed in a honeycomb shape, and the bonding force between the plastic package body 250 and the surface of the copper foil can also be improved. Of course, the electroplating roughening process may also directly form a surface roughness structure on the attachment surface 130, for example, a direct stripe-shaped groove is formed to increase the surface roughness of the attachment surface 130, so as to improve the bonding force between the attachment surface 130 and the plastic package body 250.
It should be noted that in this embodiment, the green paint layer 131 or the knurled layer covers at least the bottom wall surface of the first groove 170, so as to improve the bonding force between the effective heat dissipation area of the heat sink body 110 and the plastic package body 250.
In summary, according to the chip package heat sink 100 provided by the embodiment, by designing the structure of the heat sink body 110, the specification and the size can be designed according to the size of the plastic package body 250, and the fillet structures 111 are designed around, so that the wind force between the mold and the heat sink body 110 is facilitated, meanwhile, the first rail 171 is formed after the adhering surface 130 is grooved, the plastic package material can be effectively prevented from overflowing outwards, the second rail 191 is formed after the mold pressing surface 150 is grooved, the plastic package material can be effectively prevented from climbing to the top surface of the heat sink body 110 during the plastic package process, and the problem of surface glue overflow is solved. Through two rail structures, can avoid as far as possible that the plastic envelope material remains on the surface of fin body 110 to the heat dispersion and the outward appearance that have guaranteed chip package fin 100 are clean and tidy.
Second embodiment
Referring to fig. 6 to 8, the basic structure and principle of the heat sink 100 for chip package provided in the present embodiment and the generated technical effects are the same as those of the first embodiment, and for the sake of brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment. The present embodiment is different from the first embodiment in that a trench structure is added.
The chip packaging heat sink 100 comprises a heat sink body 110, wherein the heat sink body 110 is provided with an attaching surface 130 and a die pressing surface 150 which are opposite, the attaching surface 130 is used for attaching to a plastic package body 250, a first groove 170 is formed in the attaching surface 130, a first fence 171 is formed at the edge of the first groove 170, and the first fence 171 is arranged around the lower side edge of the heat sink body 110 and used for preventing plastic package materials from overflowing during plastic package; the die pressing surface 150 is used for combining a die, a second groove 190 is formed in the die pressing surface 150, a second fence 191 is formed at the edge of the second groove 190, and the second fence 191 surrounds the edge of the upper side of the radiating fin body 110 and is used for preventing plastic package materials from climbing to the die pressing surface 150 during plastic package.
In this embodiment, the bottom wall of the first groove 170 is further provided with a first groove 173, the first groove 173 is disposed inside the first rail 171 and is annularly disposed at the edge of the first groove 170, and the first groove 173 is used for increasing a contact area between the heat sink body 110 and the plastic package body 250 during plastic packaging and preventing the plastic package material from overflowing outwards. Specifically, the first trench 173 may overlap the scribe line, so that the scribe may be performed directly along the first trench 173.
It should be noted that the first groove 173 in this embodiment mainly has two functions, the first is to improve the bonding force between the plastic package material and the heat sink body 110 during plastic package, and the second is to play a role in storing the plastic package material, so as to prevent the plastic package material from overflowing in a large amount to cause a side-climbing phenomenon of the plastic package material.
In this embodiment, the bottom wall of the second groove 190 is further provided with a second groove 193, the second groove 193 is disposed inside the second rail 191 and is annularly disposed at the edge of the second groove 190, and the second groove 193 is used for storing the molding compound during plastic encapsulation so as to prevent the molding compound from overflowing to the middle position of the molding surface 150. Specifically, the second grooves 193 are symmetrical or misaligned with the first grooves 173.
It should be noted that the second groove 193 in this embodiment mainly plays a role of storing the molding compound, and it mainly plays a preventive role, and when the molding compound is too much and causes the side to climb to the molding surface 150, it can play a role of storing the molding compound, and prevent the molding compound from flowing further toward the center of the molding surface 150.
In this embodiment, the depths of the first groove 173 and the second groove 193 may be determined according to actual requirements and the thickness of the heat sink body 110, wherein, when the first groove 173 and the second groove 193 are distributed on the attaching surface 130 and the molding surface 150 in a completely symmetrical manner, the sum of the thicknesses of the first groove 173 and the second groove 193 should be smaller than the distance between the bottom wall of the first groove 170 and the bottom wall of the second groove 190, so as to avoid the penetration of the grooves through the heat sink body 110, for example, when laser grooving is adopted, the groove depth needs to be precisely controlled. When the first grooves 173 and the second grooves 193 are distributed on both sides of the heat sink body 110 in a staggered manner, the individual thickness of the first grooves 173 and the second grooves 193 should be smaller than the distance between the bottom wall of the first recess 170 and the bottom wall of the second recess 190, for example, when the grooves are formed by stamping, the depth of the grooves needs to be controlled.
It should be noted that when the first grooves 173 and the second grooves 193 are completely symmetrically distributed, the cutting track can be simultaneously overlapped with the first grooves 173 and the second grooves 193, so that a smaller thickness can be conveniently cut during cutting, the abrasion of the cutting knife is reduced, and the pressure requirement for cutting is reduced. When the first grooves 173 and the second grooves 193 are distributed in a staggered manner, the first grooves 173 or the second grooves 193 can be overlapped with the cutting tracks, and the monomer depth of the first grooves 173 or the second grooves 193 is deeper than that of the monomer depth of the first grooves 173 or the second grooves 193 which are distributed symmetrically, so that more plastic can be stored, and the glue overflow phenomenon is further prevented.
In this embodiment, the number of the first trenches 173 may be multiple, the plurality of first trenches 173 are disposed in a layer-by-layer manner, and the widths of the plurality of first trenches 173 are the same. The number of the second grooves 193 may also be multiple, the second grooves 193 are disposed layer by layer, and the widths of the second grooves 193 are the same. Specifically, when the first grooves 173 and the second grooves 193 are plural, the plural first grooves 173 are disposed at intervals, the plural second grooves 193 are disposed at intervals, and the plural first grooves 173 and the plural second grooves 193 may correspond to each other one by one, or may be arranged in a staggered manner, and the specific distribution manner is not limited in particular.
It should be noted that in this embodiment, the first rail 171 and the second rail 191 may also be a plurality of rails, the plurality of first rails 171 and the plurality of first grooves 173 are alternately and repeatedly arranged, and the plurality of second rails 191 and the plurality of second grooves 193 are alternately and repeatedly arranged, specifically, refer to fig. 8, which is only an exemplary illustration here, and the specific number and arrangement manner of the first rails 171, the second rails 191, the first grooves 173, and the second grooves 193 are not limited here.
In summary, the chip package heat spreader 100 provided in this embodiment can improve the bonding force between the heat spreader body 110 and the plastic package body 250 by additionally providing the first groove 173 and the second groove 193, and prevent the plastic package material from overflowing to cause the side-climbing phenomenon of the plastic package material. Further avoiding the phenomenon of glue overflow caused by the side climbing of the plastic package material to the mould pressing surface 150.
Third embodiment
The present embodiment provides a method for preparing a chip package heat sink 100, for preparing the chip package heat sink 100 as provided in the first embodiment or the second embodiment, the method comprising:
s1: a heat sink body 110 is provided.
Specifically, the heat sink body 110 has an opposite attaching surface 130 and a molding surface 150, the attaching surface 130 is used for attaching to the plastic package body 250, and the molding surface 150 is used for combining with a mold. Preferably, a copper foil may be provided as a raw material. And electroplate the copper foil surface through the electroplating mode and form metal level 151, prevent that the copper foil surface from oxidizing, its metal level 151 material can be outer chromium, inlayer nickel, wherein chromium material promotes the wearability and the anti zinc oxide of fin body 110, and the nickel layer can promote the cohesion between with the copper foil.
After the electroplating is finished, the surface of the other side of the copper foil can be brushed with green paint in a printing mode, wherein the bonding force between the plastic package body 250 and the copper foil can be improved through the green paint material, or the green paint layer 131 is not made, a honeycomb-shaped nodulated layer is formed on the back surface of the copper foil by adopting an electroplating coarsening process, and the bonding force between the plastic package body 250 and the copper foil can also be improved.
S2: a first recess 170 is formed in the attachment surface 130 through a laser grooving or punching process, and a first rail 171 is formed at an edge of the first recess 170.
Specifically, the first groove 170 may be formed by grooving the green painted side through a laser grooving process or a punching process, and the first groove 170 extends to the edge of the heat sink body 110, thereby forming the first rail 171 at the edge of the first groove 170.
S3: a second groove 190 is formed on the attaching surface 130 through a laser grooving or punching process, and a second rail 191 is formed at an edge of the second groove 190.
Specifically, the second groove 190 may be formed by notching the side electroplated with the metal layer 151 through a laser notching process or a punching process, and the second groove 190 extends to the edge of the heat sink body 110, thereby forming the second rail 191 at the edge of the second groove 190.
It should be noted that, the step of electroplating the metal layer 151 and the step of slotting S3 may be exchanged, that is, the formed heat sink body 110 does not have the metal layer 151, and after the second groove 190 is completed in the step S3, an electroplating process is performed to form the metal layer 151, which can further ensure that the metal layer 151 completely covers the surface of the heat sink body 110.
In this embodiment, the first rail 171 is disposed around the lower edge of the heat sink body 110 for preventing the plastic molding compound from overflowing during plastic molding, and the second rail 191 is disposed around the upper edge of the heat sink body 110 for preventing the plastic molding compound from climbing to the molding surface 150 during plastic molding.
After the grooving operation is completed, the step of separating the heat sink body 110 can be performed, and the size of the separated heat sink body 110 can be designed according to the size of the plastic package body 250.
Note that, in preparing the chip package heat sink 100 as provided in the second embodiment, after performing step S2, the first groove 173 may be formed on the bottom wall of the first recess 170 by a laser grooving or punching process; after performing step S3, a second groove 193 may be formed on the bottom wall of the second groove 190 through a laser grooving or punching process.
According to the preparation method of the chip packaging heat sink 100, the first groove 170 and the second groove 190 are formed on the upper side and the lower side of the heat sink body 110 through the grooves respectively, the first fence 171 is formed at the edge of the first groove 170, and the second fence 191 is formed at the edge of the second groove 190, so that during actual plastic packaging, the first fence 171 is close to the plastic package body 250 and used for preventing plastic package materials from overflowing during plastic packaging, the second fence 191 is used for preventing the plastic package materials from climbing to the die pressing surface 150, and through the two fence structures, the plastic package materials can be prevented from remaining on the surface of the heat sink body 110 as far as possible, and therefore the heat dissipation performance and the neat appearance of the chip packaging heat sink 100 are guaranteed.
Fourth embodiment
Referring to fig. 9, the present embodiment provides a BGA heat dissipation package structure 200, which includes a substrate 230, a chip 210, a molding compound 250 and a chip package heat sink 100. The basic structure and principle of the chip package heat sink 100 and the technical effects thereof are the same as those of the first embodiment or the second embodiment, and for the sake of brief description, no part of this embodiment is mentioned, and reference may be made to the corresponding contents of the first embodiment or the second embodiment.
In this embodiment, the BGA heat dissipation package structure 200 includes a substrate 230, a chip 210, a plastic package body 250 and a chip package heat sink 100, where the chip package heat sink 100 includes a heat sink body 110, the heat sink body 110 has an opposite adhering surface 130 and a molding surface 150, the adhering surface 130 is used for adhering to the plastic package body 250, a first groove 170 is provided on the adhering surface 130, a first rail 171 is formed at an edge of the first groove 170, and the first rail 171 is surrounded at a lower side edge of the heat sink body 110 and used for preventing plastic package material from overflowing during plastic package; the die pressing surface 150 is used for combining a die, a second groove 190 is formed in the die pressing surface 150, a second fence 191 is formed at the edge of the second groove 190, and the second fence 191 surrounds the edge of the upper side of the radiating fin body 110 and is used for preventing plastic package materials from climbing to the die pressing surface 150 during plastic package. The chip 210 is attached to the substrate 230, the plastic package body 250 is disposed on the substrate 230 and covers the chip 210, and the heat sink body 110 is attached to the plastic package body 250 through the attachment surface 130.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (11)

1. The chip packaging radiating fin is characterized by comprising a radiating fin body, wherein the radiating fin body is provided with an attaching surface and a mould pressing surface which are opposite, the attaching surface is used for being attached to a plastic package body, a first groove is formed in the attaching surface, a first fence is formed at the edge of the first groove, and the first fence is arranged at the lower side edge of the radiating fin body in a surrounding mode and used for preventing plastic package materials from overflowing during plastic package; the die pressing surface is used for combining a die, a second groove is formed in the die pressing surface, a second fence is formed at the edge of the second groove, and the second fence is arranged at the edge of the upper side of the radiating fin body in a surrounding mode and used for preventing the plastic package material from laterally climbing to the die pressing surface during plastic package.
2. The chip package heat sink of claim 1, wherein the depth of the first recess is 1/3-1/2 of the thickness of the heat sink body; the depth of the second groove is 1/3-1/2 of the thickness of the heat sink body.
3. The chip package heat sink according to claim 1, wherein a first groove is further disposed on a bottom wall of the first groove, the first groove is disposed inside the first rail and disposed at an edge of the first groove in an annular shape, and the first groove is configured to increase a contact area between the heat sink body and the molding compound during plastic encapsulation and prevent the molding compound from overflowing outwards.
4. The chip package heat sink according to claim 3, wherein a second groove is further disposed on a bottom wall of the second groove, the second groove is disposed inside the second rail and annularly disposed on an edge of the second groove, and the second groove is used for storing the molding compound during molding so as to prevent the molding compound from overflowing to a middle position of the molding surface.
5. The chip package heat sink according to claim 4, wherein the first grooves are plural, the plural first grooves are arranged in a layer surrounding manner, and the widths of the plural first grooves are the same; the second grooves are arranged in a layer-by-layer surrounding mode and are the same in width.
6. The chip package heat sink according to claim 1, wherein the heat sink body is rectangular, and the top corners of the periphery of the heat sink body are provided with a round corner structure to increase the separation angle between the heat sink body and the mold.
7. The chip package heat sink of claim 6, wherein the radius of the fillet structure is 2 mm.
8. The chip package heat sink of claim 1, wherein the die surface is further electroplated with a metal layer, the metal layer covering the surface of the heat sink body to prevent oxidation of the surface of the heat sink body.
9. The chip package heat sink according to claim 8, wherein the adhesion surface is further coated with a green paint layer or roughened by electroplating to form a burred layer, so as to improve the adhesion between the adhesion surface and the plastic package body.
10. A method of making a chip package heat sink according to claim 1, comprising:
providing a radiating fin body, wherein the radiating fin body is provided with a binding surface and a mould pressing surface which are opposite;
forming a first groove on the binding surface through a laser grooving or punching process, and forming a first fence on the edge of the first groove;
forming a second groove on the die pressing surface through a laser grooving or punching process, and forming a second fence on the edge of the second groove;
the first fence is arranged at the lower side edge of the radiating fin body in a surrounding mode and used for preventing plastic package materials from overflowing during plastic package, and the second fence is arranged at the upper side edge of the radiating fin body in a surrounding mode and used for preventing the plastic package materials from laterally climbing to the die pressing surface during plastic package.
11. A BGA heat dissipation package structure, comprising a substrate, a chip, a plastic package and the heat sink of any one of claims 1-9, wherein the chip is attached to the substrate, the plastic package is disposed on the substrate and covers the chip, and the heat sink body is attached to the plastic package through the attachment surface.
CN202110724465.1A 2021-06-29 2021-06-29 Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure Pending CN113345856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110724465.1A CN113345856A (en) 2021-06-29 2021-06-29 Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110724465.1A CN113345856A (en) 2021-06-29 2021-06-29 Chip packaging radiating fin, preparation method thereof and BGA radiating packaging structure

Publications (1)

Publication Number Publication Date
CN113345856A true CN113345856A (en) 2021-09-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN113345856A (en)

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