CN113345842A - Ceramic four-side flat package shell and ceramic four-side flat package device - Google Patents
Ceramic four-side flat package shell and ceramic four-side flat package device Download PDFInfo
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- CN113345842A CN113345842A CN202110425537.2A CN202110425537A CN113345842A CN 113345842 A CN113345842 A CN 113345842A CN 202110425537 A CN202110425537 A CN 202110425537A CN 113345842 A CN113345842 A CN 113345842A
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- ceramic
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- shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a ceramic four-side flat package shell and a ceramic four-side flat package device. The ceramic four-side flat package shell comprises a ceramic shell and a plurality of leads, wherein the ceramic shell is used for bearing a chip, the leads are led out from the bottom of the ceramic shell to the periphery, a boss extending downwards is further arranged at the bottom of the ceramic shell, and the height difference from the bottom plane of the boss to the lowest point of the leads is 0-0.15 mm. Because the difference in height from the bottom plane of the boss to the lowest point of the lead is 0-0.15 mm, and the gap between the existing packaging shell and the PCB is about 0.50-1.0 mm, the gap between the ceramic four-side flat packaging shell and the PCB is reduced, so that the thickness of a glue layer for reinforcement is reduced, the plate-level reinforcement is reliable, the stress of the lead can be effectively reduced, the lead is prevented from being deformed or damaged, and the device has higher reliability after being installed.
Description
Technical Field
The invention belongs to the technical field of microelectronic integrated circuit packaging, and particularly relates to a ceramic quad flat package shell and a ceramic quad flat package device.
Background
A Ceramic Quad Flat Package (CQFP) is a surface-mount component package type, and is widely used by core devices such as a Field Programmable Gate Array (FPGA), a Digital Signal Processor (DSP) and the like due to its small external dimension, small parasitic parameters, mature manufacturing technology, excellent electrical performance and heat dissipation performance, high reliability and the like, and is widely applied to high-reliability fields such as military, aviation, aerospace, medical electronics, large computers and the like.
When the CQFP device is connected with a PCB, the height difference of 0.5-1 mm exists between the bottom of the ceramic four-side flat packaging shell and the lowest point of the lead, so when the lead is connected with the PCB, the gap between the bottom of the shell and the PCB is 0.5-1 mm, and after the number of the lead of the CQFP device is increased, the lead becomes thin and soft, the lead of the device is difficult to be ensured not to be deformed or damaged in subsequent debugging and testing by welding alone, and the mechanical reinforcement treatment is generally carried out on the CQFP device body by using special glue after welding in the process for reducing the stress influence on the root of the welding point of the device under the external vibration condition.
The currently adopted reinforcement process mainly comprises two types: 1) firstly, welding spot soldering is completed through reflow soldering, then epoxy adhesive is injected into the bottom of the device through a preformed hole of the PCB, and the epoxy adhesive is cured at room temperature; 2) and (3) point-sealing an epoxy adhesive at the bottom of the device, then pasting the adhesive, curing at room temperature, and manually completing welding spot soldering. Because the clearance of casing bottom and PCB board is great, the glue film thickness of event bonding is big for device and PCB board are under a large amount of grades of vibrations and harsh temperature variation environment, and the easy reinforcing unstability that appears causes the solder joint fracture, influences the reliability of installation back device.
Disclosure of Invention
It is an object of the present invention to provide a ceramic quad flat package housing with reduced height difference between the bottom of the housing and the lowest point of the lead.
In order to achieve the purpose, the invention adopts the technical scheme that: the invention provides a ceramic four-side flat package shell which comprises a ceramic shell and a plurality of leads, wherein the ceramic shell is used for bearing a chip, the leads are led out from the bottom of the ceramic shell to the periphery, a boss extending downwards is further arranged at the bottom of the ceramic shell, and the height difference from the bottom plane of the boss to the lowest point of the leads is 0-0.15 mm.
With reference to the first aspect, in a possible implementation manner, the boss is a ceramic boss, the ceramic boss is made of a boss raw ceramic piece, and the boss raw ceramic piece and the ceramic shell raw ceramic piece are bonded and then sintered into a whole.
With reference to the first aspect, in a possible implementation manner, a through hole penetrating through the boss is formed in the ceramic boss, tungsten metal used for being electrically connected with a ground wire of a chip is filled in the through hole, tungsten is printed on the outer surface of the ceramic boss to achieve metallization of the ceramic boss, and nickel plating and gold plating are sequentially performed on the ceramic boss, so that the ceramic boss can be welded with a PCB.
With reference to the first aspect, in a possible implementation manner, the boss is a metal boss, and the metal boss is welded to the ceramic shell.
With reference to the first aspect, in a possible implementation manner, a cavity for accommodating the boss is formed in the bottom of the ceramic shell, the lead is connected to the periphery of the connection surface of the cavity and the boss, a hole for the lead to pass through is formed in the circumferential direction of the ceramic shell, and the lead passes through the hole of the ceramic shell and extends to the periphery of the ceramic shell.
With reference to the first aspect, in one possible implementation manner, the ceramic quad flat package housing further includes a sealing ring for providing a mounting space.
In a second aspect, the invention further provides a ceramic quad flat package device, which comprises a ceramic quad flat package housing, a chip arranged in the ceramic housing, and a cover plate for sealing the ceramic housing.
The ceramic four-side flat packaging shell provided by the invention has the beneficial effects that: compared with the prior art, the bottom of the ceramic shell in the ceramic four-side flat package shell is provided with a lug boss extending downwards, when the ceramic quad flat package device packaged with the ceramic quad flat package housing is connected to a PCB board, since the height difference from the bottom plane of the boss to the lowest point of the lead is 0-0.15 mm, the gap between the ceramic quad flat package housing and the PCB is also 0-0.15 mm, the gap between the package housing and the PCB is reduced, so that when the device and the PCB are reinforced, the thickness of the adhesive layer for reinforcement is reduced, the adhesive effect is improved, so that when the device is under the environment of a large amount of vibration and severe temperature change, can effectively reduce the stress of the lead and reduce the stress influence of the external environment on the welding point, therefore, the lead is prevented from being deformed or damaged, and the device has higher reliability after being installed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic front view of an assembly of a ceramic quad flat package device and a PCB according to an embodiment of the present invention;
FIG. 2 is a schematic bottom view of a ceramic quad flat package housing according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a front view of the ceramic quad flat package housing of FIG. 2;
FIG. 4 is a schematic top view of the ceramic quad flat package housing of FIG. 2;
FIG. 5 is a schematic bottom view of the quad flat ceramic package housing of FIG. 2 with the leads located in the middle of the ceramic part;
FIG. 6 is a schematic diagram of a front view of the ceramic quad flat package housing of FIG. 5;
fig. 7 is a schematic top view of the ceramic quad flat package housing of fig. 5.
In the figure: 1. a ceramic four-side flat packaging shell; 11. a ceramic housing; 12. a lead wire; 13. a boss; 131. a through hole; 14. a sealing ring; 15. a concave cavity; 2. a PCB board; 3. and (7) a cover plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 7, the ceramic quad flat package 1 includes a ceramic case 11 and a plurality of leads 12, the ceramic case 11 is used for carrying a chip, the leads 12 are led out from the bottom of the ceramic case 11 to the periphery, the bottom of the ceramic case 11 is further provided with a downwardly extending boss 13, and a height difference between a bottom plane of the boss 13 and the lowest point of the leads 12 is 0 to 0.15 mm.
Compared with the prior art, the bottom of the ceramic shell 11 in the ceramic quad flat package shell 1 of the invention is provided with a boss 13 extending downwards, when the ceramic quad flat package device packaged with the ceramic quad flat package housing 1 is connected with the PCB board 2, since the height difference from the bottom plane of the boss 13 to the lowest point of the lead 12 is 0-0.15 mm, the gap between the ceramic quad flat package housing 1 and the PCB 2 is also 0-0.15 mm, the gap between the existing package housing and the PCB 2 is reduced, and when the device and the PCB are reinforced, the thickness of the adhesive layer for reinforcement is reduced, the adhesive effect is improved, so that when the device is under the environment of a large amount of vibration and severe temperature change, the stress on the lead 12 can be effectively reduced, the stress influence on the welding point caused by the external environment can be reduced, thereby preventing the leads 12 from being deformed or damaged to ensure high reliability of the mounted device.
The boss 13 in the ceramic four-side flat packaging shell 1 can be a ceramic boss, the ceramic boss is made of a boss raw ceramic part, and the boss raw ceramic part is bonded with the ceramic shell raw ceramic part and then sintered into a whole. It should be noted that if the ceramic shell green ceramic piece is sintered alone to form the ceramic shell.
The concrete process of the ceramic boss molding is as follows:
step 1, respectively manufacturing ceramic shell green ceramic pieces of an array and boss green ceramic pieces of the array; specifically, a single-layer material sheet is formed after casing is subjected to tape casting and hot cutting, and the single-layer material sheet is subjected to cavity punching, punching and hole metallization, and then is subjected to printing, positioning and laminating to form the array green ceramic part.
And 2, cutting the boss array raw ceramic piece to generate a single boss raw ceramic piece.
And 4, cutting to form a single integral green ceramic piece.
And 5, sintering the whole green ceramic part to enable the ceramic boss and the ceramic shell to be sintered into a whole.
It should be noted that the boss positioning tool is a metal plate, a cavity with the same size as the boss green ceramic piece is arranged on the boss positioning tool, a positioning hole corresponding to the ceramic shell array green ceramic piece is arranged at the edge of the end face of the boss positioning tool, and the boss positioning tool and the ceramic shell array green ceramic piece can be detachably connected together through the positioning hole. However, due to the limitation of the processing technology, the four corners of the cavity of the boss positioning tool cannot realize right angles, the radius of a fillet formed at the four corners is 0.10mm at the minimum, and interference can exist when the boss green ceramic piece is placed in the cavity. If increase the size of cavity for boss green porcelain spare can be put into the cavity, for example, when boss green porcelain spare size 23.81mm, set up the size of cavity to 24.11mm, but increase behind the cavity size, just also increased the clearance between boss green porcelain spare and the cavity, lead to boss green porcelain spare to produce great deviation at the actual position and the theoretical position of ceramic housing array green porcelain spare back, cause the inaccurate problem of location.
In order to solve the problem of inaccurate positioning of the boss green ceramic part, the cavity shape on the boss positioning tool is optimized, an external fillet is added at the four corners, when the cavity size is consistent with the boss green ceramic part size due to the arrangement mode, interference does not occur, the machining error exists in the machining process is considered, the deviation of the cavity size can be set to be 0.05-0.10 mm, the deviation of the actual position and the theoretical position of the boss green ceramic part at the back of the ceramic shell array green ceramic part can be 0.025-0.05 mm, and the position precision of the boss green ceramic part is well improved.
As shown in fig. 1, a through hole 131 penetrating through the boss is formed in the ceramic boss, tungsten metal for electrically connecting with a ground line of the chip is filled in the through hole 131, tungsten is printed on the outer surface of the ceramic boss to achieve metallization of the ceramic boss, and nickel plating and gold plating are sequentially performed on the ceramic boss, so that the ceramic boss can be welded with the PCB 2.
The tungsten metal in the through hole 131 is electrically connected with the ground wire of the chip, the tungsten is printed outside the ceramic boss to metalize the ceramic boss, and the nickel plating and gold plating treatment are sequentially carried out on the ceramic boss, so that when the ceramic boss is communicated with the ground plane of the PCB 2, the good grounding of the chip can be realized, and the electrical property of the device is improved. And after the ceramic boss is subjected to nickel plating and gold plating, the ceramic boss can be welded with the PCB 2, and the welding connection improves the connection strength of the ceramic four-side flat package shell 1 and the PCB 2. Specifically, solder paste is printed on the PCB 2 at a position corresponding to the ceramic boss and a position corresponding to the lead 12, then the ceramic four-side flat package housing 1 is placed on the PCB 2, and the ceramic four-side flat package housing and the heating table are placed on a heating furnace or a heating table for heating simultaneously, so that simultaneous welding is realized. The lead 12 and the ceramic boss are welded with the PCB 2 at the same time, so that the requirement on the operation method of an operator in the operation process is reduced, and the working efficiency is improved.
The boss 13 may be a metal boss. The metal boss can be made of iron-nickel alloy, iron-nickel-cobalt alloy, tungsten-copper alloy, molybdenum-copper, CPC alloy or CMC alloy. Wherein the metal boss is connected with the ceramic shell 11 by silver copper solder welding. And the metal boss can be directly welded with the cold plate of the PCB 2, so that good heat dissipation and grounding of the high-power chip are realized, and the heat dissipation performance and the electrical property of the chip are optimized while the board-level installation reliability is improved.
Referring to fig. 5 to 7, a cavity 15 for accommodating the boss 13 is formed at the bottom of the ceramic case 11, the lead 12 is connected to the periphery of the connection surface of the cavity 15 and the boss 13, a hole for the lead 12 to pass through is formed in the circumferential direction of the ceramic case 11, and the lead 12 passes through the hole of the ceramic case 11 and extends toward the periphery of the ceramic case 11.
In order to effectively reduce the total height of the device, the lead 12 is disposed at the bottom in the cavity 15 of the ceramic case 11, so that the overall height of the device is reduced, thereby achieving miniaturization of the device. It should be noted that the ceramic shell 11 with the cavity 15 may be connected to the metal boss by bonding or welding. The connecting process of the ceramic shell 11 with the cavity 15 and the ceramic boss is similar to the processing process of the ceramic boss, firstly, a single-layer material sheet is formed after casting and hot cutting of the shell, the single-layer material sheet forms an array green ceramic piece after cavity punching, hole punching and hole metallization, printing, positioning and laminating, then the cavity 15 is processed on the array green ceramic piece, then the single green ceramic piece is produced by cutting, and then the single ceramic shell is formed after sintering, brazing, nickel plating and gold plating.
Referring to fig. 1 to 7, when a chip is mounted in a ceramic quad flat package 1, a cap plate 3 is required to cover a cavity opening for carrying the chip so that the chip is sealed in a ceramic case 11, but since the height of the chip is different, a sealing ring 14 may be provided above the opening of the ceramic case 11 in order to ensure that the ceramic case 11 can be effectively sealed after the chip is mounted. That is, if the height of the chip does not affect the sealing of the cover plate 3 to the ceramic housing 11, the sealing ring 14 is not needed, and if the height of the chip is such that the cover plate 3 cannot be in sealing contact with the opening of the ceramic housing 11 when the ceramic housing 11 is sealed, the sealing ring 14 may be disposed above the ceramic housing 11, and then the cover plate 3 is covered, so that the cover plate 3 can seal the ceramic housing 11 by means of the sealing ring 14.
After a chip is loaded in the ceramic quad flat package housing 1, a cover plate 3 is covered on the ceramic shell 11, and the ceramic quad flat package device can be formed.
In the invention, the ceramic case 11 of the ceramic quad flat package housing 1 may carry not only a chip but also electronic components such as an electronic component and a capacitor. Arranging electronic component in pottery four sides flat package shell 1 and through apron 3 sealed back formation pottery four sides flat package device, wherein pottery four sides flat package device is connected with PCB board 2, connects the back in order to guarantee the reliability of board level installation, can use special glue to consolidate pottery four sides flat package device after lead wire 12 welds, need notice, need not flow to lead wire 12 department of bending with gluing when consolidating. The reinforcing method generally includes two types of local cementation and integral encapsulation, and the local cementation is recommended, namely, glue is dispensed on four corners of the ceramic shell 11, and the four corners are connected with the PCB 2 through reinforcing glue, so that the external force borne by pins on the ceramic four-side flat package shell 1 in the use and test process is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The ceramic four-side flat package shell comprises a ceramic shell and a plurality of leads, wherein the ceramic shell is used for bearing a chip, and the leads are led out from the bottom of the ceramic shell to the periphery, and the ceramic four-side flat package shell is characterized in that a boss extending downwards is further arranged at the bottom of the ceramic shell, and the height difference from the bottom plane of the boss to the lowest point of the leads is 0-0.15 mm.
2. The ceramic quad flat package housing of claim 1, wherein the boss is a ceramic boss, the ceramic boss is made of boss green ceramic, and the boss green ceramic is bonded with the ceramic shell green ceramic and then sintered into a whole.
3. The ceramic quad flat package housing of claim 2, wherein the ceramic boss is provided with a through hole penetrating through the boss, the through hole is filled with tungsten metal for electrically connecting with a ground wire of a chip, the outer surface of the ceramic boss is printed with tungsten to realize metallization of the ceramic boss, and the ceramic boss is sequentially plated with nickel and gold to enable the ceramic boss to be welded with a PCB.
4. The ceramic quad flat package housing of claim 1, wherein the bosses are metal bosses, and the metal bosses are welded to the ceramic shell.
5. The ceramic quad flat package housing as claimed in claim 1, wherein the bottom of the ceramic shell is provided with a cavity for receiving the boss, the lead is connected to the periphery of the connection surface of the cavity and the boss, the ceramic shell is circumferentially provided with a hole for the lead to pass through, and the lead passes through the hole of the ceramic shell and extends to the periphery of the ceramic shell.
6. The ceramic quad flat pack housing of claim 1, wherein said ceramic quad flat pack housing further comprises a sealing ring for providing a mounting space.
7. A ceramic quad flat package device comprising the ceramic quad flat package housing according to any one of claims 1 to 6, further comprising a chip disposed in the ceramic housing and a cover plate for sealing the ceramic housing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110425537.2A CN113345842B (en) | 2021-04-20 | 2021-04-20 | Ceramic four-side flat package shell and ceramic four-side flat package device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110425537.2A CN113345842B (en) | 2021-04-20 | 2021-04-20 | Ceramic four-side flat package shell and ceramic four-side flat package device |
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| CN113345842A true CN113345842A (en) | 2021-09-03 |
| CN113345842B CN113345842B (en) | 2023-03-24 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201374327Y (en) * | 2009-04-02 | 2009-12-30 | 中国电子科技集团公司第十三研究所 | Ceramic small-shape shell |
| CN204614771U (en) * | 2015-05-29 | 2015-09-02 | 中国电子科技集团公司第十三研究所 | Adopt the ceramic package of PowerPAD packing forms |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
| CN108022901A (en) * | 2017-12-29 | 2018-05-11 | 中国电子科技集团公司第十三研究所 | The ceramic four side lead flat packages of flip-chip installation |
| CN211208423U (en) * | 2019-09-16 | 2020-08-07 | 中国电子科技集团公司第五十五研究所 | Ceramic flat shell structure |
-
2021
- 2021-04-20 CN CN202110425537.2A patent/CN113345842B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201374327Y (en) * | 2009-04-02 | 2009-12-30 | 中国电子科技集团公司第十三研究所 | Ceramic small-shape shell |
| CN204614771U (en) * | 2015-05-29 | 2015-09-02 | 中国电子科技集团公司第十三研究所 | Adopt the ceramic package of PowerPAD packing forms |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
| CN108022901A (en) * | 2017-12-29 | 2018-05-11 | 中国电子科技集团公司第十三研究所 | The ceramic four side lead flat packages of flip-chip installation |
| CN211208423U (en) * | 2019-09-16 | 2020-08-07 | 中国电子科技集团公司第五十五研究所 | Ceramic flat shell structure |
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| CN113345842B (en) | 2023-03-24 |
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