CN113334874B - High-strength low-melting-point layered bimetal mutually-embedded composite material and preparation process thereof - Google Patents
High-strength low-melting-point layered bimetal mutually-embedded composite material and preparation process thereof Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000005266 casting Methods 0.000 claims abstract description 17
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 14
- 239000010951 brass Substances 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 41
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 36
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 28
- 230000008018 melting Effects 0.000 claims description 27
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 12
- 238000002791 soaking Methods 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 10
- 244000137852 Petrea volubilis Species 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 150000002739 metals Chemical class 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
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- 238000010438 heat treatment Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/16—Casting in, on, or around objects which form part of the product for making compound objects cast of two or more different metals, e.g. for making rolls for rolling mills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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Abstract
The invention discloses a high-strength low-melting-point layered bimetal inter-embedding composite material and a preparation process thereof, wherein the high-strength low-melting-point layered bimetal inter-embedding composite material comprises an H62 brass layer and a Sn-58Bi layer, cu, zn and Sn can realize a better mutual dissolving effect, and the high-strength low-melting-point layered bimetal inter-embedding composite material has good mechanical bonding and metallurgical bonding. The invention also discloses a preparation process of the layered bimetal composite material, which comprises the preparation of the micropore array preform and the solid-liquid method composite casting. The composite material is mechanically embedded and metallurgically bonded, so that the composite material retains the characteristics of the low-melting-point body alloy, the integral strength of the composite material is improved by utilizing the high-strength reinforcing body, and the micropore array can ensure the gas circulation of the structure after the low-melting-point alloy is melted. The method has the advantages of simple equipment requirement, wide and easy operation of process conditions, better combination of composite interfaces, full play of the respective physical characteristics of the dissimilar metals, contribution to large-scale production and industrial application value.
Description
Technical Field
The invention belongs to the field of preparation of layered bimetal composite materials, and particularly relates to a method for preparing a layered mutually embedded composite material by compounding a micropore array preform and a low-melting-point alloy by a solid-liquid method.
Background
The low-melting point alloy is binary, ternary, quaternary and other alloys containing Bi, pb, sn, cd, in, ga, zn, sb and other metals with melting point below 310 ℃, and is often used as an electronic packaging material, a temperature-sensitive spraying system and a high-pressure fusible valve. Under the general condition, the strength of the low-melting-point alloy is less than 100MPa, and the strength of the tin-bismuth base alloy is more less than 80MPa, so that the use of the tin-bismuth base alloy under the working condition of higher strength is limited to a great extent.
With the continuous development of modern industrial technology, the comprehensive performance requirements of the industry on materials are higher and higher, and under many working conditions, the technical requirements of single metal materials are difficult to meet. The bimetal composite material is a novel material obtained by utilizing a composite technology to realize firm metallurgical bonding between two or more metals with different physical, chemical and mechanical properties. Wherein each layer of metal still maintains the original characteristics. But the physical, chemical and mechanical properties of the whole material are greatly improved compared with those of single metal, so that the material can meet the requirements on the material properties in special environments. Compared with a single metal material, the metal material has the following two main advantages: (1) excellent physical, chemical and mechanical properties; (2) The designability is strong, and the overall performance of the material can be easily changed by changing the volume fraction of the components.
The solid-liquid composite casting technology for bimetal material is a technology which utilizes casting technology to obtain two or more than two metal materials and implement metallurgical bonding on interface so as to prepare new material. The technology has low cost and simple process, and is easy to popularize and apply in industry. Meanwhile, the technology has good interface combination and stable material performance. But under the general condition, the corresponding mechanical combination is lacking, and the low-melting-point alloy has insufficient strength and cannot adapt to the working condition with higher strength.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the high-strength low-melting-point layered bimetal inter-embedded composite material and the preparation process thereof, solves the problems that the strength of low-melting-point alloy is insufficient and cannot adapt to the working condition with higher strength, and the like, and solves the problem of interface combination between two alloys.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the high-strength low-melting-point layered bimetal inter-embedded composite material comprises a copper alloy micropore array layer and a tin-bismuth alloy layer, wherein the copper alloy micropore array layer adopts commercial H62 brass and consists of the following components in percentage by weight: 60.5 to 63.5 percent of copper and the balance of zinc; the tin-bismuth alloy layer adopts commercial Sn-58Bi alloy and consists of the following components in percentage by weight: 42% tin and the balance bismuth.
Further, a through hole array is arranged on the copper alloy micropore array layer, and the tin-bismuth alloy layer is filled in the through holes on the copper alloy micropore array layer and at two sides of the copper alloy micropore array layer.
Further, the pitch between adjacent through holes is 2 times the hole diameter of the through holes.
Further, the aperture of the through hole is 1-2mm.
Further, the copper alloy micropore array layer accounts for 50% of the volume fraction of the high-strength low-melting-point layered bimetal inter-embedded composite material.
A preparation process of a high-strength low-melting-point layered bimetal inter-embedded composite material comprises the following steps:
(1) Preparing a micropore array preform by using an H62 copper alloy plate;
(2) Carrying out surface treatment on the micropore preform to obtain a copper alloy micropore array layer;
(3) And casting and preparing the bimetal layered composite material by using a solid-liquid method.
Further, the step (1) specifically comprises: and drilling through holes on the copper alloy plate by using a drilling machine and a hard alloy drill bit to prepare a micropore array preform.
Further, the step (2) specifically comprises: and (3) performing acetone soaking ultrasonic cleaning on the microporous preform for 10min, and polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper in sequence, and performing acetone soaking ultrasonic cleaning for 10min.
Further, the solid-liquid method in the step (3) is divided into three stages: the first stage is a melting stage, wherein the copper alloy micropore array layer obtained in the step (2) and the tin-bismuth alloy are placed in a smelting furnace together, the melting temperature is higher than the melting point of the tin-bismuth alloy and the generation temperature of a bonding layer which is possibly formed, and meanwhile, the melting temperature is lower than the melting point of the copper alloy, and the temperature is kept until the tin-bismuth alloy is melted; the second stage is a heat preservation stage, wherein the heat preservation temperature is the same as the melting temperature, and the heat preservation is carried out until the two alloy elements fully diffuse to form a bonding layer; the third stage is a cooling stage, and the cooling mode adopts a furnace cooling mode.
Compared with the prior art, the invention has the following beneficial technical effects:
compared with the traditional alloy material, the high-strength low-melting-point layered bimetal inter-embedding composite material disclosed by the invention has the advantages that the high-strength characteristic of a reinforcement (copper alloy) and the physical characteristic of low melting point of a low-melting-point alloy (tin-bismuth alloy) are taken into account, the room-temperature mechanical property of the tin-bismuth alloy is improved, the material has a lower failure temperature, and the high-strength low-melting-point layered bimetal inter-embedding composite material has better mechanical property and a low failure temperature; the room temperature strength of the composite material is 130-160MPa, the melting point of the composite body is 140-160 ℃, the requirement of allowing fluid to pass through at a specific temperature is met, and the gas can pass through the prefabricated hole array and the space left after the tin-bismuth alloy is melted at 170+/-30 ℃.
Furthermore, compared with the common layered bimetal composite material, the invention generates metallurgical bonding while mechanically embedding, so that the composite material keeps the characteristic of low-melting-point body alloy, the integral strength of the composite material is improved by utilizing the high-strength reinforcing body, and the structural design of the micropore array of the layered bimetal inter-embedded composite material can ensure the gas circulation of the structure after the low-melting-point alloy is melted.
The method has the advantages of simple process equipment requirements, wide and easy operation of process conditions, better combination of composite interfaces, full play of the respective physical characteristics of the dissimilar metals, contribution to large-scale production, industrial application value, lower equipment requirements compared with a single liquid-liquid composite method, lower requirements on the appearance and the size of materials and strong designability; compared with a single solid-solid composite method, the method solves the problem of metallurgical bonding at the interface, and enables the mechanical property of the layered bimetal inter-embedded composite material to reach a higher level.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
FIG. 1 is a schematic flow chart of a process for preparing a high-strength low-melting-point layered bimetal inter-embedded composite material.
FIG. 2 is a scanning electron microscope image of an interface metallographic structure of the brass-tin-bismuth layered bimetal intermeshed composite material prepared in example 1.
Fig. 3 is a graph of the distribution of several principal elements at the interface of fig. 2, wherein (a), (b), (c), and (d) are Sn, cu, bi, zn in sequence.
Fig. 4 is a stress strain curve of a eutectic tin-bismuth alloy.
FIG. 5 is an engineering stress strain curve of the high strength low melting point layered bimetallic intermeshed composite materials prepared in example 1 and example 2.
Detailed Description
The invention is described in further detail below:
the high-strength low-melting-point layered bimetal inter-embedded composite material comprises a copper alloy micropore array layer and a tin-bismuth alloy layer, wherein the copper alloy layer is commercial H62 brass and consists of the following components in percentage by weight: 60.5 to 63.5 percent of copper and the balance of zinc; the tin-bismuth alloy layer is commercial Sn-58Bi alloy and consists of the following components in percentage by weight: 42% tin and the balance bismuth.
The copper alloy micropore array layer is provided with a through hole array, the pitch of the through holes is twice of the aperture, and the aperture can be in a reasonable size range, such as 1-2mm; the tin-bismuth alloy is completely filled into the through holes of the copper alloy micropore array layer in the preparation process, and the copper alloy accounts for about 50% of the volume fraction of the high-strength low-melting-point layered bimetal inter-embedded composite material.
A preparation process of a high-strength low-melting-point layered bimetal inter-embedded composite material comprises a preparation step of a micropore array preform and a solid-liquid method composite casting step, and is shown in figure 1.
The preparation steps of the micropore array preform specifically comprise:
and (3) machining: drilling through holes on the reinforcement plate according to a certain aperture and a certain hole distance (such as aperture 2mm and hole distance 4 mm) by using a drilling machine and a hard alloy drill bit to prepare a micropore array preform;
surface treatment: and (3) carrying out surface treatment on the microporous preform, soaking the microporous preform in acetone, ultrasonically cleaning for 10min to remove greasy dirt brought by machining, polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper, and then soaking the microporous preform in acetone, ultrasonically cleaning for 10min.
The solid-liquid method composite casting specifically comprises the following steps:
presetting a preform: placing the treated preform and the tin-bismuth alloy in a casting mold cavity;
casting and combining: heating the surface treated microporous prefabricated body and the tin-bismuth alloy in a cavity, preserving heat, cooling and casting to form the layered bimetal inter-embedded composite material. The selected reinforcement comprises a metal or alloy having a melting point higher than the melting point of the selected low melting point alloy (tin bismuth alloy).
In the casting bonding step, the method mainly comprises three stages: the first stage is a melting stage, wherein the surface-treated microporous preform and the tin-bismuth alloy are placed in a smelting furnace together, the melting temperature is higher than the melting point of the tin-bismuth alloy and the generation temperature of a bonding layer which is possibly formed, and the temperature is kept until the tin-bismuth alloy is melted; the second stage is a heat preservation stage, the heat preservation temperature is the same as the melting temperature, and the heat preservation time is set so that two alloy elements can be fully diffused to form a bonding layer; the third stage is a cooling stage, and the cooling mode adopts a furnace cooling mode.
The invention adopts eutectic tin-bismuth alloy, and the mass fractions of the components are as follows: tin 42%, bismuth 58%, micro Vickers hardness about 20Hv, tensile strength 58-62 MPa, elongation after break greater than 10%, melting point 138 ℃, is a typical low melting point alloy. Meanwhile, the tin-bismuth alloy is green solder, has good wettability with various metal materials, can form better metallurgical bonding, and can be used for welding various metal materials.
The present invention will be described in detail with reference to examples. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
The following detailed description is of embodiments, and is intended to provide further details of the invention. Unless defined otherwise, all technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention.
Example 1
The embodiment relates to a preparation process of a high-strength low-melting-point layered bimetal inter-embedded composite material, which comprises the following steps:
step one: drilling through holes on a brass plate according to the aperture of 2mm and the pitch of 4mm by using a drilling machine and a hard alloy drill bit to prepare a micropore array preform;
step two: performing surface treatment on the microporous preform, soaking the microporous preform in acetone, ultrasonically cleaning for 10min to remove greasy dirt brought by machining, polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper, and then soaking the microporous preform in acetone, ultrasonically cleaning for 10min;
step three: placing the treated brass preform and tin-bismuth alloy in a casting mold cavity;
step four: and heating the brass micropore preform subjected to surface treatment and the tin-bismuth alloy to 450 ℃ in a cavity, so that the tin-bismuth alloy is fully melted, preserving heat for 90min, cooling in a furnace, and casting to form the high-strength low-melting-point layered bimetal inter-embedded composite material.
The metallographic structure photo at the interface of the prepared high-strength low-melting-point layered composite material is shown in figure 2, a relatively obvious bonding layer is formed between brass and tin bismuth, and the contrast is obviously different from that of the two alloys. The distribution of the elements at the interface is shown in fig. 3, which demonstrates that a better metallurgical bond occurs at the bond layer. The stress-strain curve of the prepared alloy is shown in the example 1 curve of fig. 5, and compared with the stress-strain curve of the tin-bismuth eutectic alloy of fig. 4, the strength is obviously improved from 57MPa to 160MPa.
Example 2
The embodiment relates to a preparation process of a high-strength low-melting-point layered bimetal inter-embedded composite material, which comprises the following steps:
step one: drilling through holes on a brass plate according to the aperture of 2mm and the pitch of 4mm by using a drilling machine and a hard alloy drill bit to prepare a micropore array preform;
step two: performing surface treatment on the microporous preform, soaking the microporous preform in acetone, ultrasonically cleaning for 10min to remove greasy dirt brought by machining, polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper, and then soaking the microporous preform in acetone, ultrasonically cleaning for 10min;
step three: placing the treated brass preform and tin-bismuth alloy in a casting mold cavity;
step four: and heating the brass micropore preform subjected to surface treatment and the tin-bismuth alloy to 260 ℃ in a cavity, fully melting the tin-bismuth alloy, preserving heat for 90min, cooling in a furnace, and casting to form the high-strength low-melting-point layered bimetal inter-embedded composite material.
The prepared high-strength low-melting-point layered composite material has continuously distributed intermetallic compounds at the interface, which indicates that metallurgical bonding is formed between the two alloys. The stress-strain curve of the prepared alloy is shown as an example 2 curve of fig. 5, and compared with the stress-strain curve of the tin-bismuth eutectic alloy of fig. 4, the strength is obviously improved from 57MPa to 130MPa.
Example 3
The embodiment relates to a preparation process of a high-strength low-melting-point layered bimetal inter-embedded composite material, which comprises the following steps:
step one: drilling through holes on a brass plate by using a drilling machine and a hard alloy drill bit according to the aperture of 1mm and the pitch of 2mm to prepare a micropore array preform;
step two: performing surface treatment on the microporous preform, soaking the microporous preform in acetone, ultrasonically cleaning for 10min to remove greasy dirt brought by machining, polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper, and then soaking the microporous preform in acetone, ultrasonically cleaning for 10min;
step three: placing the treated brass preform and tin-bismuth alloy in a casting mold cavity;
step four: and heating the brass micropore preform subjected to surface treatment and the tin-bismuth alloy in a cavity to 280 ℃ so that the tin-bismuth alloy is fully melted, preserving heat for 90min, cooling in a furnace, and casting to form the high-strength low-melting-point layered bimetal inter-embedded composite material.
The above-described embodiments are only preferred embodiments of the present invention, and should not be construed as limiting the present invention, and the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without collision. The protection scope of the present invention is defined by the claims, and the protection scope includes equivalent alternatives to the technical features of the claims. I.e., equivalent replacement modifications within the scope of this invention are also within the scope of the invention.
Claims (1)
1. The high-strength low-melting-point layered bimetal inter-embedded composite material is characterized by comprising a copper alloy micropore array layer and a tin-bismuth alloy layer, wherein the copper alloy micropore array layer adopts commercial H62 brass and consists of the following components in percentage by weight: 60.5 to 63.5 percent of copper and the balance of zinc; the tin-bismuth alloy layer adopts commercial Sn-58Bi alloy and consists of the following components in percentage by weight: 42% tin and the balance bismuth;
the copper alloy micropore array layer is provided with a through hole array, and the tin-bismuth alloy layer is filled in the through holes on the copper alloy micropore array layer and at two sides of the copper alloy micropore array layer;
the pitch between adjacent through holes is 2 times of the aperture of the through hole;
the aperture of the through hole is 2mm;
the copper alloy micropore array layer accounts for 50% of the volume fraction of the high-strength low-melting-point layered bimetal inter-embedded composite material;
the preparation process of the high-strength low-melting-point layered bimetal inter-embedded composite material comprises the following steps of:
(1) Preparing a micropore array preform by using an H62 copper alloy plate, specifically: drilling a through hole in the copper alloy plate by using a drilling machine and a hard alloy drill bit to prepare a micropore array preform;
(2) Carrying out surface treatment on the micropore preform to obtain a copper alloy micropore array layer, specifically: performing acetone soaking ultrasonic cleaning on the microporous preform for 10min, and sequentially polishing the surfaces of the through holes and the plates by using 240-mesh, 320-mesh, 400-mesh and 600-mesh SiC sand paper, and performing acetone soaking ultrasonic cleaning for 10min;
(3) Casting preparation of the bimetal layered composite material is carried out by utilizing a solid-liquid method, wherein the solid-liquid method comprises three stages: the first stage is a melting stage, wherein the copper alloy micropore array layer obtained in the step (2) and the tin-bismuth alloy are placed in a smelting furnace together, the melting temperature is 450 ℃, the melting temperature is higher than the melting point of the tin-bismuth alloy and the generation temperature of a bonding layer possibly formed, and meanwhile, the melting temperature is lower than the melting point of the copper alloy, and the temperature is kept until the tin-bismuth alloy is melted; the second stage is a heat preservation stage, wherein the heat preservation temperature is the same as the melting temperature, the heat preservation time is 90min, and the heat preservation is carried out until the two alloy elements fully diffuse to form a bonding layer; the third stage is a cooling stage, and the cooling mode adopts a furnace cooling mode.
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