CN113324487B - Substrate inspection device and substrate inspection method - Google Patents

Substrate inspection device and substrate inspection method Download PDF

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Publication number
CN113324487B
CN113324487B CN202110505263.8A CN202110505263A CN113324487B CN 113324487 B CN113324487 B CN 113324487B CN 202110505263 A CN202110505263 A CN 202110505263A CN 113324487 B CN113324487 B CN 113324487B
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region
coating film
light
substrate
interference data
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CN113324487A (en
Inventor
洪映周
洪德和
金玟奎
崔桢熏
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Gaoying Technology Co ltd
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Gaoying Technology Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0658—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of emissivity or reradiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

The substrate inspection apparatus of the present disclosure may include: a first light source that irradiates ultraviolet rays toward a coating film of a substrate mixed with a fluorescent dye; a first light sensor that captures fluorescence generated from the coating film irradiated with the ultraviolet light and obtains a two-dimensional image of the substrate; a processor that derives one of a plurality of regions of the substrate based on the two-dimensional image; a second light source that irradiates laser light toward the one region; and a second optical sensor that obtains optical interference data generated from the one region by means of the laser light; the processor may derive a thickness of the coating film with respect to the one region based on the light interference data.

Description

Substrate inspection device and substrate inspection method
The application relates to a Chinese patent application number 201811433244.3, a substrate inspection device and a substrate inspection method, and a divisional application of patent application of which the application date is 2018, 11 and 28.
Technical Field
The present disclosure relates to a substrate inspection apparatus and a substrate inspection method.
Background
In the processing step of the substrate, the substrate may be coated in order to protect the elements on the substrate. Such coating may be referred to as conformal coating (conformal coating). In order to confirm whether or not the coating film on the substrate generated by means of coating is uniformly coated to a given thickness, a thickness check of the conformal coating film may be performed.
For thickness inspection of the coating film, a two-Dimensional (2-Dimensional) photograph photographing inspection may be performed. The two-dimensional photograph photographing inspection for obtaining a two-dimensional image on the object and inspecting the object may include a two-dimensional fluoroscopic photographing inspection. However, the two-dimensional photograph photographing inspection can only perform qualitative inspection of the thickness of the coating film, and cannot measure an accurate thickness value of the coating film. In addition, two-dimensional photograph photographing inspection may be difficult in thickness measurement when the coating film is thin (for example, about 30 μm).
In addition, for thickness inspection of the coating film, a confocal microscope (confocal microscope) may be used. However, measurement by means of a confocal microscope has a problem that a large amount of time is required. In addition, for thickness inspection of the coating film, measurement by OCT (Optical Coherence Tomography ) can be performed. However, in OCT measurement, there is a limitation in improving the depth-direction resolution and measuring depth range, and saturation (saturation) phenomenon due to light used for OCT occurs at an electrode portion of an element on a substrate, which hinders accurate measurement.
Disclosure of Invention
The present disclosure is to solve the above-described problems, and provides a technique for measuring a coating film thickness of a substrate.
As one aspect of the present disclosure, a substrate inspection apparatus may be proposed. The substrate inspection apparatus of one aspect of the present disclosure may include: a first light source that irradiates ultraviolet rays toward a coating film of a substrate mixed with a fluorescent dye; a first light sensor that captures fluorescence generated from the coating film irradiated with the ultraviolet light and obtains a two-dimensional image of the substrate; a processor that derives one of a plurality of regions of the substrate based on the two-dimensional image; a second light source that irradiates laser light toward the one region; and a second optical sensor that obtains optical interference data generated from the one region by means of the laser light; the processor may derive a thickness of the coating film with respect to the one region based on the light interference data.
In one embodiment, the processor may derive a coating amount of the coating film with respect to each of the plurality of regions based on the two-dimensional image, and determine a region of the plurality of regions, of which the coating amount is less than a preset amount, as the one region.
In one embodiment, the substrate inspection apparatus may further include a memory storing information about the region of interest set in advance by a user; the processor may determine the one region based on information about the region of interest.
In one embodiment, the region of interest may be a region of the substrate that includes electrodes of elements.
In one embodiment, the processor may determine the area of the substrate determined to be defective as the one area based on the two-dimensional image.
In one embodiment, the memory may further store element arrangement information showing an arrangement of the elements on the substrate, and the processor may derive the region including the electrode using the element arrangement information.
In one embodiment, the reflected light reflected from the surface of the coating film may be used as the reference light.
In one embodiment, the processor may obtain a cross-sectional image showing a cross-section along a first axis direction corresponding to a depth direction of the coating film based on the light interference data, and determine the thickness of the coating film with respect to the one region based on a boundary line on the cross-sectional image.
In one embodiment, the reflectance of the laser light by the surface of the coating film may be determined according to a fluorescent dye mixing rate of the coating film mixed with the fluorescent dye, and the fluorescent dye mixing rate may be set to a value such that the reflectance exceeds a preset reference value.
In one embodiment, the coating film may be formed by means of at least one selected from the group consisting of acrylic, uratam, polyurethane, silicon, epoxy, UV (Ultra Violet) cured substance and IR (Infra Red) cured substance.
In one embodiment, the surface of the coating film may be formed in a curved surface.
As one aspect of the present disclosure, a substrate inspection method may be proposed. The substrate inspection method of one aspect of the present disclosure may include: a step of irradiating ultraviolet rays toward the coating film of the substrate mixed with the fluorescent dye; capturing fluorescence generated from the coating film irradiated with the ultraviolet rays and obtaining a two-dimensional image of the substrate; a step of deriving one of a plurality of regions of the substrate based on the two-dimensional image; a step of irradiating laser light toward the one region to obtain optical interference data generated from the one region by means of the laser light; and deriving a thickness of the coating film with respect to the one region based on the light interference data.
In one embodiment, the step of deriving an area may include: a step of deriving a coating amount of the coating film with respect to each of the plurality of areas based on the two-dimensional image; and determining, as the one region, a region in which the coating amount is equal to or less than a preset amount among the plurality of regions.
In one embodiment, the step of deriving an area may include: and deciding the one region based on information about the region of interest set in advance by a user.
In one embodiment, the region of interest may be a region of the substrate that includes electrodes of the element.
In one embodiment, the step of deriving an area may include: and determining a region of the substrate determined to be defective as the one region based on the two-dimensional image.
In one embodiment, the region including the electrode may be derived based on element arrangement information showing an arrangement of the elements on the substrate.
In one embodiment, reflected light reflected from the surface of the coating film may be used as the reference light.
In one embodiment, the step of deriving the thickness of the coating film with respect to an area may comprise: a step of obtaining a cross-sectional image showing a cross-section along a first axis direction corresponding to a depth direction of the coating film based on the light interference data; and determining the thickness of the coating film with respect to the one region based on a boundary line on the sectional image.
In one embodiment, the reflectivity of the surface of the coating film to the laser light may be determined according to a fluorescent dye mixing rate of the coating film mixed with the fluorescent dye, and the fluorescent dye mixing rate may be set to a value such that the reflectivity exceeds a preset reference value.
In one embodiment, the coating film may be formed by means of at least one selected from the group consisting of acrylic, uratam, polyurethane, silicon, epoxy, UV (Ultra Violet) cured substance and IR (Infra Red) cured substance.
In one embodiment, the surface of the coating film may be formed in a curved surface.
According to various embodiments of the present disclosure, the substrate inspection apparatus is capable of performing accurate thickness measurement even in a case where the coating film is thin below a predetermined thickness (for example, about 30 μm).
According to various embodiments of the present disclosure, the substrate inspection apparatus can sample through a specific region, shortening the time required for measuring the thickness of the coating film of the entire substrate.
Drawings
Fig. 1 is a diagram showing an embodiment of an operation process of the substrate inspection apparatus of the present disclosure.
Fig. 2 is a diagram showing a block diagram of an inspection apparatus of various embodiments of the present disclosure.
Fig. 3 is a diagram showing a process in which an inspection apparatus according to an embodiment of the present disclosure derives an OCT measurement target area from an element arrangement.
Fig. 4 is a diagram showing a process in which an inspection apparatus of one embodiment of the present disclosure derives an OCT measurement target area from a defective area.
Fig. 5 is a diagram showing a procedure in which an inspection apparatus according to an embodiment of the present disclosure additionally measures a peripheral region of an OCT measurement target region derived.
Fig. 6 is a diagram showing a first OCT portion of one embodiment of the present disclosure.
Fig. 7 is a diagram showing a second OCT portion of one embodiment of the present disclosure.
Fig. 8 is a diagram showing a cross-sectional image and a boundary line displayed on the cross-sectional image according to an embodiment of the present disclosure.
Fig. 9 is a diagram showing measurement ranges of a first OCT portion and a second OCT portion of one embodiment of the present disclosure.
Fig. 10 is a diagram showing one embodiment of a substrate inspection method that can be performed by means of the inspection apparatus of the present disclosure.
Detailed Description
The various embodiments described herein are presented for the purpose of clearly illustrating the technical ideas of the present disclosure, and are not intended to be limited to specific embodiments. The technical idea of the present disclosure includes embodiments in which all or part of various modifications (equivalents) and alternatives (alternatives) of the embodiments described herein are selectively combined. The scope of the technical idea of the present disclosure is not limited to the various examples presented below or the specific description thereof.
Including technical or scientific terms, which are not differently defined, the terms used herein may have the meanings commonly understood by one of ordinary skill in the art to which this disclosure pertains.
As used herein, expressions such as "comprising," "including," "having," "providing," "having," "can have," and the like, mean that there are features (e.g., functions, operations, or components, etc.) that are the subject, and that the presence of other additional features is not precluded. That is, such expressions should be understood to include open-ended terms (open-ended terms) that would include the possibilities of other embodiments.
As used herein, singular forms "a", "an" and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise.
The terms "first," "second," or "first," "second," and the like, as used herein, refer to a plurality of identical objects and are not intended to limit the order or importance of one object to another, as long as they are not physically distinct.
As used herein, the expression "A, B and C", "A, B or C", "A, B, and/or C" or "at least one of A, B and C", "at least one of A, B or C", "at least one of A, B and/or C", etc., may mean each listed item or all possible combinations of listed items. For example, "at least one of A or B" may refer collectively to (1) at least one A, (2) at least one B, (3) at least one A, and at least one B.
The expression "based on" to "as used herein is used to describe one or more factors that affect a determined or judged action or action described in a sentence or article containing the corresponding expression, and the expression does not exclude additional factors that affect the corresponding determined or judged action or action.
The expression that a certain component (for example, a first component) is "connected to" or "connected to" another component (for example, a second component) as used herein means that the certain component is not only directly connected to or connected to the another component, but also connected to or connected to the another component via a new component (for example, a third component).
The expression "configured to" as used herein may have meanings such as "configured to", "having-ability", "changed to", "formed to", "can be performed to", and the like, depending on the theory. The corresponding expression is not limited to the meaning of "specially designed in hardware", for example, a processor configured to perform a specific operation may mean a general-purpose processor (general-purpose processor) capable of performing its specific operation by running software.
To illustrate various embodiments of the present disclosure, rectangular coordinate systems having X, Y, and Z axes orthogonal to one another may be defined. The expressions "X-axis direction", "Y-axis direction", "Z-axis direction", and the like of the rectangular coordinate system used herein may mean directions on both sides of the extension of each axis of the rectangular coordinate system unless otherwise specifically defined in the corresponding description. The + sign added to the front of each axial direction may mean a positive direction which is one of the two directions extending in the corresponding axial direction, and the-sign added to the front of each axial direction may mean a negative direction which is the remaining one of the two directions extending in the corresponding axial direction.
In the present disclosure, a substrate (substrate) is used as a board or a container on which elements such as semiconductor chips are mounted, and functions as a connection path for electrical signals between the elements. The substrate may be used for manufacturing an integrated circuit or the like, and may be formed of a material such as silicon. For example, the substrate may be a printed circuit board (PCB, printed Circuit Board), which may be referred to as a wafer (wafer) or the like, according to an embodiment.
In the present disclosure, the coating film may be a thin film generated on the substrate by means of coating intended to protect elements on the substrate. When the coating film is thick, the film may be broken and also affect the operation of the substrate, so that the coating film needs to be coated relatively thin and uniformly to prevent the coating film from being broken. In one embodiment, the coating film may be formed by at least one selected from an acrylic, uratam, polyurethane, silicon, epoxy, UV (Ultra Violet) curable substance, IR (infrared) curable substance. The coating film formed by the above-described substance can improve the reflectance of the surface of the coating film and/or the backscattering of the coating film, which will be described later, as compared with the other coating film.
In the present disclosure, OCT (Optical Coherence Tomography) may be an imaging technique that captures an image in a subject using an interference phenomenon of light. With OCT, an image showing the inside of the object body from the surface of the object body to the depth direction can be obtained. Generally, the depth direction resolution of an object is different depending on the wavelength of light used based on an interferometer. Compared with a confocal microscope (confocal microscope) which is another optical technique, the object body can be penetrated deeper and an image can be obtained.
Various embodiments of the present disclosure are described below with reference to the accompanying drawings. In the drawings and the description of the drawings, the same or substantially equivalent (substantially equivalent) components may be given the same reference numerals. In the following description of various embodiments, the same or corresponding components may be omitted from repeated descriptions, but this does not mean that the corresponding components are not included in the embodiment.
Fig. 1 is a diagram showing an embodiment of an operation process of the substrate inspection apparatus of the present disclosure. The substrate inspection apparatus of the present disclosure may be embodied by means of the inspection apparatus 10 of various embodiments. The inspection apparatus 10 of various embodiments of the present disclosure may measure the thickness of a coating film coated on a substrate. In one embodiment, the inspection apparatus 10 may perform a photograph inspection using fluorescent dye on the entire region of the substrate, derive a specific region from a predetermined reference, and additionally perform OCT-based thickness measurement on the derived region.
The inspection apparatus 10 may first perform a photograph taking inspection using fluorescent dye on the substrate 2. The photo taking inspection may be a fluoroscopic photo taking inspection. For this inspection, a fluorescent dye may be mixed in advance in the coating film coated on the substrate 2. The first light source 130 of the inspection apparatus 10 may radiate ultraviolet rays toward the coating film of the substrate. The irradiated ultraviolet rays may excite the fluorescent dye mixed in the coating film to generate fluorescence. The first light sensor 140 of the inspection apparatus 10 can capture the fluorescence to obtain a two-dimensional image of the substrate coating film. The two-dimensional image may be a two-dimensional fluoroscopic image, according to an embodiment.
The inspection device 10 can derive one or more regions 3 on the substrate 2 based on the result of the photograph taking inspection based on a predetermined reference. In one embodiment, the inspection apparatus 10 may derive the coating amounts of the coating films coated on the respective regions of the substrate 2 from the two-dimensional image, and may derive the predetermined regions 3 from the derived coating amounts. In one embodiment, the two-dimensional image may display the elements mounted on the substrate 2, or predetermined characteristics (features) or defects (defects) on the substrate generated in accordance with various processes, and the inspection apparatus 10 may derive the predetermined region 3 based on these characteristics.
After that, the inspection apparatus 10 can additionally perform thickness measurement by OCT for the derived region 3. The OCT portion 170 of the inspection apparatus 10 can obtain optical interference data about the derived region 3, and additionally measure the thickness of the coating film coated on the corresponding region 3 on the substrate based on the obtained optical interference data.
In one embodiment, the inspection apparatus 10 may derive from the two-dimensional image an important area to be protected with the coating film on the substrate 2. The important area to be protected by the coating film may be, for example, an area including the electrode portion of the component, which can be derived by comparing information stored in advance in the memory with the two-dimensional image. The inspection apparatus 10 can additionally perform thickness measurement by OCT on the derived important region.
In one embodiment, the examination apparatus 10 may perform thickness measurement using the OCT portion 170 with respect to a region of interest set in advance by a user. The memory of the inspection apparatus 10 may store information on the region of interest set in advance by the user, and based on this information, the processor of the inspection apparatus 10 may decide the region corresponding to the region of interest as the target region where the thickness measurement is to be performed by means of OCT. In one embodiment, the region of interest may be a region including the aforementioned component-to-element electrode portion. In one embodiment, the process of deriving the portion corresponding to the region of interest may be performed using a two-dimensional image of the substrate.
In the present disclosure, the optical interference data in the object measurement based on the OCT system may mean data obtained by interference light generated by interference of measurement light reflected from the object by the irradiated light and reference light reflected from the reference mirror or the like by the irradiated light. Based on the difference in the characteristics (optical path, wavelength, etc.) between the measurement light and the reference light, an interference phenomenon occurs, which can be captured by the optical sensor to obtain optical interference data. In addition, a cross-sectional image showing a cross-section of the coating film in the depth direction may be generated based on the optical interference data. The optical interference data may also be referred to as interference signals.
According to various embodiments of the present disclosure, the inspection apparatus 10 can measure an accurate thickness of a coating film using the OCT portion 170. The inspection apparatus 10 can also measure the thickness of a thin coating film, for example, a coating film having a thickness of about 30 μm or less.
According to various embodiments of the present disclosure, the inspection apparatus 10 derives the coating amounts of the coating film with respect to the respective areas of the substrate 2 from the two-dimensional image of the substrate 2, samples the specific areas according to a predetermined reference, and additionally performs thickness measurement of the specific areas through the OCT portion 170, so that unlike the two-dimensional photographing inspection, it is possible to shorten the measurement time as compared with measuring the coating film thickness of the entire substrate using OCT while achieving accurate thickness measurement.
Fig. 2 is a diagram showing a block diagram of an inspection apparatus 10 according to various embodiments of the present disclosure. The substrate inspection apparatus of the present disclosure described above may be displayed as the illustrated inspection apparatus 10. According to one embodiment, the inspection device 10 may include a first light source 130, a first light sensor 140, a second light source 150, a second light sensor 160, a processor 110, and/or a memory 120. In one embodiment, at least one of these components of the inspection apparatus 10 may be omitted, or other components may be added to the inspection apparatus 10. In an embodiment, a part of the constituent elements may be integrally formed or may be formed in a single unit or a plurality of units in addition to or instead of (in alternative to).
At least some of the components inside and outside the inspection apparatus 10 may be connected to each other via a bus, GPIO (general purpose input/output), SPI (serial peripheral interface ), MIPI (mobile industry processor interface, mobile industry processor interface), or the like, and transmit/receive data and/or signals.
The first light source 130 may radiate ultraviolet rays toward the coating film of the substrate 2 mixed with the fluorescent dye. The first light source 130 may be provided to irradiate ultraviolet rays toward the substrate, and the relative position of the first light source 130 with respect to the substrate, the irradiation angle of the ultraviolet rays, the brightness of the ultraviolet rays, and the like may be variously configured (configured), respectively. In one embodiment, the inspection device 10 may include a plurality of first light sources 130.
The first light sensor 140 may capture fluorescence generated from the coating film of the substrate 2 by means of the irradiated ultraviolet rays. Specifically, if the fluorescent dye within the coating film is excited by the irradiated ultraviolet rays, fluorescence occurs, and the first photosensor 140 can capture the fluorescence, obtaining a two-dimensional image of the coating film with respect to the substrate 2. In one embodiment, the inspection device 10 may include a plurality of first light sensors 140. The first photosensor 140 may be embodied by means of a CCD (Charged Coupled Device, charge coupled device) or CMOS (Complementary Metal-Oxide-Semiconductor, complementary metal Oxide Semiconductor).
The processor 110 may drive software (e.g., a program) to control at least one component of the inspection apparatus 10 connected to the processor 110. In addition, the processor 110 may perform various operations of algorithms, processing, data generation, processing, etc. related to the present disclosure. In addition, the processor 110 may load data or the like from the memory 120 or store the data in the memory 120.
The processor 110 may derive one of the plurality of regions of the substrate 2 based on the two-dimensional image obtained by means of the first light sensor 140. An area may be derived from a predetermined reference. The substrate 2 may be divided into a plurality of regions. The plurality of regions may be regions that are virtually divided on the surface of the substrate 2, and may be regions that are divided in advance according to a predetermined reference.
In one embodiment, the processor 110 may derive the coating amounts of the coating films with respect to each of the plurality of regions of the substrate 2, and may derive the one region based on the coating amounts. Specifically, the processor 110 may obtain luminance (luminance) information about each of a plurality of regions of the substrate 2 from the obtained two-dimensional image. In the present disclosure, brightness may mean the luminosity per unit area, i.e., the amount of light that diverges per unit area, of a certain light source or one surface that reflects light. The luminance information about one region may be information representing the luminance of fluorescence generated in the region. The processor 110 may derive the coating amounts of the coating films respectively coated on the plurality of regions of the substrate 2 based on the obtained luminance information. The coating film of the substrate 2 may have characteristics of unevenness, curvature, etc. according to elements present on the substrate 2, predetermined characteristics or defects on the substrate 2, or the degree to which the coating film is uniformly distributed. The amount of the fluorescent dye applied to each region of the coating film varies depending on the characteristics such as the unevenness and the curvature of the substrate 2. If ultraviolet rays are irradiated, brightness in each region of the coating film may appear differently depending on the amount of fluorescent dye. The processor 110 can derive the coating amount of the coating film in each region using the brightness of each region. The processor 110 may derive a region (e.g., a first region) in which the coating amount of the coating film in the plurality of regions of the substrate 2 is a preset amount or less. The preset amount may be determined according to the intention of the designer, and information about this may be stored in the memory 120.
The processor 110 may control the OCT portion 170 to measure the thickness of the coating film of one region (e.g., first region) derived. The processor 110 may obtain optical interference data (e.g., first optical interference data) determined by interference light occurring from one region (e.g., first region) derived. The processor 110 may derive the thickness of the coating film with respect to one region (e.g., the first region) derived using the obtained light interference data (e.g., the first light interference data).
OCT portion 170 may include a second light source 150 and/or a second light sensor 160. Specifically, the processor 110 may control the second light source 150 and the second light sensor 160 to perform the above operation. OCT portion 170 may be embodied in a variety of types as described below.
The second light source 150 may irradiate laser toward the coating film of the substrate 2. The arrangement of the second light source 150, the relative position with respect to the substrate, and the like may be variously constituted (configured), and may be variously embodied depending on the type of the OCT portion 170, in particular. In one embodiment, the second light source 150 may use a laser capable of converting a wavelength in a short time, whereby light interference data corresponding to different wavelengths may be obtained. In one embodiment, the inspection device 10 may also include a plurality of second light sources 150. The second light source 150 is controlled by the processor 110, and can irradiate laser light toward one region (for example, the first region) derived as described above.
The second light sensor 160 may capture interference light generated from the coating film by means of laser light. Specifically, when the first OCT portion described later is used, the second light sensor 160 can capture reflected light (reference light) of the laser light reflected by the reference mirror and interference light generated according to measurement light reflected from the coating film. Using light interference data obtained by capturing such interference light, a profile image with respect to the reference mirror surface can be generated. In addition, according to the embodiment, when the second OCT portion described later is utilized, the second light sensor 160 can capture interference light that occurs by reflected light reflected at the surface of the coating film by means of laser light and scattered light that is scattered backward after being transmitted from the coating film to a predetermined depth. The reflected light reflected on the surface of the coating film can function as reference light, and the scattered light can function as measurement light. By using light interference data obtained by capturing such interference light, a cross-sectional image with the coating film surface as a reference can be generated. In one embodiment, the inspection device 10 may include a plurality of second light sensors 160. The second light sensor 160 may be embodied by means of a CCD or CMOS. The second optical sensor 160 is controlled by the processor 110, and can obtain optical interference data (for example, first optical interference data) determined by interference light generated from one region (for example, first region, etc.) derived from the above by the laser light.
The memory 120 may store various data. The data stored in the memory 120 may include software (e.g., a program) as data obtained, processed, or used by at least one component of the inspection apparatus 10. Memory 120 may include volatile and/or nonvolatile memory. The memory 120 may store data obtained from the first light sensor 140 and the second light sensor 160. In addition, the memory 120 may store luminance information of each region of the substrate 2 derived from the two-dimensional image, coating film thickness information derived by means of the processor 110, and the like. In addition, the memory 120 may store element arrangement information 1000, element density information 2000, information about predetermined features on the substrate, defect regions, electrode position information 3000 on the substrate, information about regions of interest set in advance by a user, and the like in advance.
In the present disclosure, the element arrangement information 1000 may be information showing an arrangement of elements arranged on the substrate 2. The component arrangement information 1000 may be information such as the position, direction, or occupied size of the components mounted on the substrate 2. The element arrangement information 1000 may become a basis for adjusting the brightness information or specifying a predetermined region in the substrate. In one embodiment, the inspection apparatus 10 may derive the coating amounts of the coating films with respect to the respective plural regions of the substrate based on the element arrangement information and the two-dimensional image.
In the present disclosure, the element density information 2000 may be information showing the degree of element density on the substrate 2. The element density information 2000 may show the degree of element density in each region of the substrate 2, taking into consideration the area ratio of the element per unit area, the electrode of the element, the solder ball, the metal wire, the lead frame, and the like. The component density information 2000 may be derived based on the component arrangement information 1000.
In the present disclosure, the program may include, as software stored in the memory, an operating system for controlling the resources of the inspection apparatus, an application program, middleware that provides the application program with various functions so that the application program can utilize the resources of the inspection apparatus, and the like.
In one embodiment, the inspection device 10 may further include a communication interface (not shown). The communication interface may perform wireless or wired communication between the inspection device 10 and other servers or between the inspection device 10 and other external electronic devices. For example, the communication interface may perform wireless communication based on LTE (long-term evolution), LTE-a (LTE advanced, long-term evolution), CDMA (code division multiple access ), WCDMA (wideband CDMA, wideband code division multiple access), wiBro (Wireless Broadband ), wiFi (wireless fidelity, wireless fidelity), bluetooth (Bluetooth), NFC (near field communication ), GPS (Global Positioning System, global positioning system) or GNSS (global navigation satellite system ), and the like. For example, the communication interface may perform wired communication based on USB (universal serial bus ), HDMI (high definition multimedia interface, high definition multimedia interface), RS-232 (recommended standard 232), or POTS (plain old telephone service ), or the like.
In one embodiment, the processor 110 may control the communication interface to obtain information from the server. Information obtained from the server may be stored in memory 120. In one embodiment, the information obtained from the server may include the aforementioned element arrangement information 1000, element concentration information 2000, information about predetermined features on the substrate, defect regions, electrode position information 3000 on the substrate, information about regions of interest set in advance by the user, and the like.
In one embodiment, the inspection device 10 may further include an input device (not shown). The input device may be a device that receives input of data for transmission to at least one component of the inspection device 10 from the outside. The input device may accept input of information about a region of interest of the user from the user. For example, the input device may include a mouse, a keyboard, a touch pad, and the like.
In one embodiment, the inspection device 10 may further include an output device (not shown). The output device may be a device for visually providing various data such as the inspection result and the operation state of the inspection device 10 to the user. For example, the output device may include a display device, a projector, a hologram, and the like.
In one embodiment, the inspection device 10 may be a variety of devices. For example, the inspection device may be a portable communication device, a computer device, a portable multimedia device, a wearable device, or a device that is one or a combination of more of the foregoing. The inspection apparatus of the present disclosure is not limited to the foregoing apparatus.
Various embodiments of the inspection apparatus 10 of the present disclosure may be combined with one another. The various embodiments may be combined according to all possible circumstances, and the combined embodiments of the inspection apparatus 10 are also within the scope of the present disclosure. In addition, the internal/external components of the inspection apparatus 10 of the present disclosure described above may be added, changed, substituted, or deleted according to the embodiment. The internal and external components of the inspection apparatus 10 may be embodied as hardware components.
Fig. 3 is a diagram showing a process in which the inspection apparatus 10 of one embodiment of the present disclosure derives an OCT measurement target area from an element arrangement. In one embodiment, the processor 110 can derive a region (e.g., a first region) where the coating amount derived from the two-dimensional image is less than a preset amount and a region (e.g., a second region) where the arrangement of the elements is the same or similar, control the OCT portion 170, and derive a thickness with respect to the region (e.g., the second region). In other words, the processor 110 can derive a region for which the arrangement of elements is the same or similar, for which thickness measurement using OCT is performed, based on the element arrangement information 1000.
The thickness values of the applied coating film will be similar for the same or similar arrangement of elements. When a certain area is judged to be a preset amount or less in the inspection by the two-dimensional image, the area where the elements are arranged the same as or similar to the area will have a similar coating amount of the coating film. Therefore, in order to improve the accuracy of the inspection of the entire coating film thickness, the inspection apparatus 10 may also perform the same operation in the present embodiment.
The processor 110 can derive the region (for example, the first region) 3 where the coating amount obtained by the two-dimensional image is a preset amount or less, as described above. In one embodiment, the processor 110 can measure the thickness of the region 3 using the OCT portion 170.
The processor 110 may derive an area 4 on the same substrate 2 as the derived area 3 on the basis of this. The corresponding region (e.g., second region) 4 may be selected among regions in which the coating amount derived from the two-dimensional image exceeds a preset amount (i.e., regions other than the first region). The processor 110 may derive the corresponding area 4 based on the aforementioned element arrangement information 1000.
The processor 110 can derive the thickness of the corresponding region 4 with respect to the additional derivation using the OCT portion 170. The processor 110 may control the second light source 150 and the second light sensor 160 to obtain light interference data (e.g., second light interference data) generated by means of the laser light reflected from the corresponding region 4. The processor 110 may output information about the thickness of the coating film coated on the corresponding region 4 based on the obtained light interference data. In the present disclosure, the processor 110 controlling the second light source 150 and the second light sensor 160 and obtaining light interference data of one region may mean that the second light source 150 irradiates laser light toward the corresponding one region, and the second light sensor 160 obtains light interference data determined by interference light occurring from the corresponding one region.
In one embodiment, the processor 110 may derive a region 4 with a similar arrangement of elements as the region 3 that was derived by means of the two-dimensional image, for which region 4 also a thickness measurement using OCT is performed. Wherein whether the element arrangement is similar or not can be judged based on the element arrangement information 1000 about the two areas 3, 4. The processor 110 may calculate the element arrangement similarity between the two regions based on the area occupied by the elements in the regions 3 and 4, the arrangement, type, shape, electrode position of the elements, and the like, and determine whether the element arrangements between the two regions are similar based on the calculated similarity.
In one embodiment, the processor 110 may adjust the brightness information according to the arrangement of the elements and the density of the elements on the substrate 2, and derive the coating film coating amount of the corresponding region based on the adjusted brightness information. Specifically, the processor 110 may obtain the element arrangement information 1000 representing the arrangement of the elements on the substrate 2 from the memory 120. The processor 110 may derive the element concentration information 2000 about each region on the substrate 2 based on the aforementioned element arrangement information 1000. The processor 110 may adjust luminance information derived from the two-dimensional image based on the element concentration information 2000. In the region of the substrate 2 where the element density is high, the coating of the fluorescent dye may not be sufficiently uniform. In areas where the element concentration is high, i.e., the element concentration, the brightness is measured high due to the accumulation of fluorescent dye. The processor 110 may adjust the obtained luminance information in consideration of the luminance distortion caused by the element density. In such adjustment, accumulated information representing the relationship between the element density and the luminance may be used, and the information may be made into a database and stored in the memory 120. The processor 110 may derive coating amounts for the respective areas on the substrate 2 based on the adjusted brightness information.
Fig. 4 is a diagram showing a process in which the inspection apparatus 10 of one embodiment of the present disclosure derives an OCT measurement target area from a defective area. In one embodiment, the processor 110 may derive the region (e.g., third region) 5 determined to be defective on the substrate 2 based on the element arrangement information 1000 and/or the two-dimensional image, control the OCT portion 170, and derive the thickness with respect to the region (e.g., third region).
Predetermined defects of the substrate 2 or the coating film, such as cracks (crack), peeling, irregularities, bends, etc., may have errors in the measurement of the coating amount by two-dimensional photograph inspection. Therefore, the region 5 determined to have a predetermined defect based on the element arrangement information 1000 and/or the two-dimensional image can additionally perform the coating film thickness measurement by the OCT portion 170.
The processor 110 may determine the region 5 on the substrate 2 judged to have the predetermined defect based on the element arrangement information 1000 and/or the two-dimensional image obtained from the memory 120. The two-dimensional image may be a photograph of the actual substrate 2 and the form of the coating film. The element arrangement information 1000 may indicate the form of the substrate 2 and the expected coating form of the coating film according to a predetermined specification (specification). The processor 110 can compare the element arrangement information 1000 with the two-dimensional image to determine the areas where the substrate 2 and the coating film now have features exceeding the predetermined specification. That is, the processor 110 may determine the corresponding feature as defective. The processor 110 may derive the region 5 where the defect exists.
The processor 110 can derive the thickness of the region 5 with respect to the derivation using the OCT portion 170. The processor 110 may control the second light source 150 and the second light sensor 160 to obtain light interference data (e.g., third light interference data) generated by means of the laser light reflected from the corresponding region 5. The processor 110 may derive information about the thickness of the coating film applied at the corresponding region 5 based on the obtained light interference data (e.g., third light interference data).
In one embodiment, the derivation of the additional measurement object region based on the defect region may be performed independently of the aforementioned derivation of the additional measurement object region based on the two-dimensional image.
In addition, in one embodiment, the processor 110 may derive a region including the electrode portion (for example, a fourth region) based on the electrode position information 3000 representing the position of the electrode that the element has on the substrate 2, control the OCT portion 170, and perform additional thickness measurement for the region (for example, the fourth region). In the present disclosure, the electrode position information 3000 may show the positions of electrodes that the element has on the substrate 2. For example, the elements may have electrode portions for connecting the elements with fine wirings on the substrate, respectively. The electrodes may also be referred to as pins of a component or chip. The electrode position information 3000 may represent where the electrodes of the element are located on the substrate 2. In general, the electrode portion of the element may have a coagulation phenomenon of fluorescent dye with the density of the element pins, and thus, thickness measurement based on a two-dimensional image may be not accurate enough. Therefore, the accuracy of the whole thickness measurement process can be improved by performing additional thickness measurement using OCT at the portion where the electrode of the element is located.
The processor 110 can know where the electrodes of the elements on the substrate 2 are located based on the electrode position information 3000 obtained from the memory 120. The processor 110 may derive the area (e.g., fourth area) on the substrate 2 where the electrode is located. In one embodiment, the corresponding region (e.g., fourth region) may be selected among regions where the coating amount obtained by the two-dimensional image exceeds a preset amount (i.e., regions other than the first region).
The processor 110 may derive the thickness for the derived region (e.g., fourth region) using the OCT portion 170. The processor 110 may control the second light source 150 and the second light sensor 160 to obtain light interference data (e.g., fourth light interference data) generated by means of laser light reflected from the corresponding region (e.g., fourth region). The processor 110 may derive the thickness of the coating film coated at the corresponding region (e.g., fourth region) based on the obtained light interference data (e.g., fourth light interference data).
Fig. 5 is a diagram showing a procedure of adding a peripheral region of an OCT measurement target region derived by measurement to the inspection apparatus 10 according to one embodiment of the present disclosure. The inspection device 10 may perform additional thickness measurement by OCT for the region 8 adjacent to the region 7, which is a region on the substrate 2 derived according to various embodiments of the present disclosure, that is, the region 7 where the thickness measurement is additionally performed by OCT.
The derived corresponding region 7 is where the thickness measurement using OCT can be additionally performed after the two-dimensional photograph photographing inspection in terms of accuracy of the coating film thickness measurement. The adjoining areas of the respective areas 7 may be associated with the substrate 2 or the coating film, having similar characteristics as the respective areas 7. Therefore, in order to ensure the accuracy of the overall thickness measurement process, additional thickness measurement using OCT can be performed for the adjacent region.
Here, the adjacent region may mean a region arranged adjacent to the corresponding region 7 when dividing the substrate 2 into a plurality of regions. In one embodiment, the adjoining region may mean a region bordering the boundary line of the corresponding region 7 among the plurality of regions. In one embodiment, the contiguous region may mean a region within a given radius from the center of the corresponding region 7, among a plurality of regions. In one embodiment, when axes corresponding to the lateral and longitudinal directions of the substrate are referred to as an X-axis and a Y-axis, respectively, the adjacent regions may be regions located in +x-axis direction, -X-axis direction, +y-axis direction, -Y-axis direction of the corresponding region 7 and sharing boundary lines with the corresponding region 7. In one embodiment, the contiguous region may include a region sharing vertices with the corresponding region 7 and located on a diagonal line among the plurality of regions.
In one embodiment, the processor 110 may again perform a thickness measurement with OCT based on the coating amount derived by means of the two-dimensional image and the thickness value measured by means of the OCT portion 170. According to an embodiment, a difference value of a qualitative thickness value of the coating film of the respective region derivable from the coating amount and a thickness value measured by means of OCT may be derived, and when the difference value is above a predefined value, the thickness measurement using OCT may be performed again for the respective region. In addition, according to the embodiment, based on the derived coating amount and thickness value, when both values do not satisfy a predetermined reference, the thickness measurement may be performed again. Wherein, the predetermined reference may be a reference used when it is determined that the value of at least one of the derived coating amount or thickness is measured in error, in view of the relation between the measured coating amount and thickness. That is, when the coating amount and the thickness value are taken into consideration, if it is determined that the measurement is erroneous, the measurement may be performed again. In addition, in one embodiment, the processor 110 may control the OCT portion 170 to measure the thickness again for the adjacent region of the corresponding region based on the coating amount of one region derived by means of the two-dimensional image and the thickness value of the region measured by means of the OCT portion 170.
Fig. 6 is a diagram showing a first OCT portion of one embodiment of the present disclosure. The aforementioned OCT portion 170 may be embodied in either a first OCT portion or a second OCT portion according to an embodiment.
The first OCT portion may further include a reference mirror 172 and a beam splitter 171 in addition to the second light source and the second light sensor. The beam splitter 171 may adjust an optical path of the laser light irradiated from the second light source 150, and the reference mirror 172 may reflect the laser light transmitted from the beam splitter 171 to generate the reference light. The first OCT portion may be used to obtain optical interference data from interference light formed by interference of measurement light of laser light reflected by the coating film of the substrate 2 and reference light of laser light reflected by the reference mirror 172.
Specifically, the second light source 150 may radiate laser light. In one embodiment, the second light source 150 may directly irradiate laser light toward the beam splitter 171. In one embodiment, the second light source 150 may transmit laser light to the convex lens 173 through the optical fiber 174, and the laser light transmitted through the convex lens 173 may be transmitted toward the beam splitter 171.
The beam splitter 171 may adjust an optical path so as to pass a part of the laser light received from the second light source 150 toward the coating film of the substrate 2, and may adjust an optical path so as to reflect another part of the laser light toward the reference mirror 172.
The optical path is adjusted so that a part of the laser light that is directed toward the coating film of the substrate 2 may be reflected in the coating film of the substrate 2. As described above, the laser light may be reflected from the surface of the coating film, or may be transmitted to a predetermined depth from the surface of the coating film according to the wavelength of the laser light and then scattered backward. This reflected light, or even scattered light, may be referred to as measurement light. The measurement light proceeds toward the beam splitter 171, and may be transferred to the second light sensor 160 by the beam splitter 171.
The optical path is adjusted so that another portion of the laser light toward the reference mirror 172 may be reflected by the reference mirror 172. The reflected light may be referred to as reference light. The reference light may be transmitted to the second light sensor 160 through the beam splitter 171.
The second light sensor 160 may capture interference light formed by means of the measurement light and the reference light. The second light sensor 160 may capture the interference light to obtain light interference data (e.g., first light interference data). The processor 110 may obtain the light interference data from the second light sensor 160, on the basis of which a cross-sectional image is generated with respect to the coating film, deriving the thickness of the coating film applied at the corresponding region of the substrate 2.
Fig. 7 is a diagram showing a second OCT portion of one embodiment of the present disclosure. The second OCT portion may include a second light source 150 and/or a second light sensor 160. The second OCT portion may not require the reference mirror 172 and the beam splitter 171. The second OCT portion may be used for interference light formed by interference of reflected light reflected from the laser light by the surface of the coating film of the substrate 2 and scattered light of the laser light passing through the coating film and scattered backward from the interface between the coating film and the substrate 2 coated with the corresponding coating film, to obtain optical interference data. The reflected light reflected on the surface of the coating film can function as the reference light, and the scattered light can function as the measurement light.
Specifically, the second light source 150 may irradiate laser light toward the coating film of the substrate 2. At this time, the laser light may be irradiated in the first direction. The first direction may be a direction corresponding to a straight line inclined at a predetermined angle from a normal direction of the substrate. According to an embodiment, the first direction may also be the same as the normal direction of the substrate. The axis corresponding to the normal direction of the substrate may be referred to as a Z axis. The Z-axis direction may be a direction corresponding to the depth direction of the coating film. As described above, the second light source 150 may directly irradiate the laser light, or may irradiate the laser light through the optical fiber 174 and/or the convex lens 173.
The laser light may be reflected at the surface of the coating film. Specifically, the laser light may be reflected at the illustrated first face. In addition, the laser light may pass through the coating film, and be scattered backward at an interface between the coating film and the substrate coated with the coating film. In particular, the laser light may be scattered back at the second face as shown. The reflected light and the scattered light form interference light, and the interference light can travel in a direction opposite to the first direction. That is, the irradiated laser light and the interference light may travel coaxially and in opposite directions to each other. The second light sensor may capture interference light traveling in a direction opposite to the first direction. The second light sensor 160 may obtain light interference data (e.g., first light interference data) from the captured interference light. The processor 110 may obtain the light interference data from the second light sensor 160, based on which a cross-sectional image is generated, deriving the thickness of the coating film applied at the corresponding region of the substrate 2.
In the thickness measurement based on the second OCT portion, the above-described reflected light and scattered light can perform the functions of the reference light and the reflected light of the first OCT portion, respectively. That is, the coating film surface itself can perform the aforementioned reference mirror 172 function of the first OCT portion.
In one embodiment, when the reflectivity of the coated film surface is above a predetermined reference value, the same type of OCT portion as the second OCT portion may be used. The predetermined reference value may be a minimum reflectance required for the coated film surface to perform the function of the reference mirror 172. In one embodiment, the irradiation angle of the irradiated laser light may be adjusted so that the reflectance of the surface of the coating film reaches a reference value or more. In one embodiment, laser light may be irradiated to a region of the surface of the coating film parallel to the substrate so that the reflectivity of the surface of the coating film reaches a reference value or more. In the thickness measurement based on the second OCT portion of the present disclosure, the reflectance of the coating film surface may mean a ratio between reflected light generated by reflection from the coating film surface and laser light irradiated to the coating film.
In one embodiment, the reflectivity of the coated film surface may be determined according to the mixing ratio of the fluorescent dyes of the corresponding coated film. In one embodiment, the coated film mixed with the fluorescent dye may have a higher reflectivity of the surface of the coated film than the other substrate. The higher the mixing ratio of the fluorescent dye of the coating film, the higher the reflectivity of the surface of the coating film. That is, if a coating film mixed with a fluorescent dye is used, the reflectance of the surface of the coating film increases, and therefore, thickness measurement based on the second OCT portion can be easily performed. In one embodiment, the fluorescent dye mixing ratio of the coating film may be set to a value such that the reflectance of the surface of the coating film exceeds a preset reference value. According to an embodiment, the reference value may be either a minimum reflectance required for the coated film surface to perform the function of the reference mirror 172 or a value arbitrarily set according to the intention of the practitioner.
In addition, in one embodiment, the backscattering ratio of the coating film may also be determined according to the fluorescent dye mixing ratio of the corresponding coating film. In one embodiment, the coated film mixed with the fluorescent dye may have a higher backscattering rate than the other substrate. In the thickness measurement based on the second OCT portion of the present disclosure, the backscattering ratio of the coating film may mean the ratio between the above-described scattered light scattered backward and the laser light irradiated to the coating film. The higher the fluorescent dye mixing ratio of the coating film, the higher the backscattering ratio of the coating film. That is, if a coating film mixed with a fluorescent dye is used, the backscattering ratio of the coating film increases, and therefore, thickness measurement based on the second OCT portion can be easily performed. In one embodiment, the fluorescent dye mixing rate of the coating film may be set to a value such that the backscattering rate of the coating film exceeds a preset reference value.
In one embodiment, the surface of the coating film may be formed in a curved surface. In one embodiment, the surface of the coating film may be formed in a convex curved surface, a concave curved surface, or a curved surface having an arbitrary (arbitrary) shape with respect to the substrate. In one embodiment, when the surface of the coating film is curved, the thickness measurement based on the second OCT portion can be easily performed as compared with the case where the surface of the coating film is planar.
In one embodiment, the second OCT portion may not dispose an additional component such as a window glass on the coating film of the substrate 2. The second OCT portion of the present disclosure can obtain optical interference data using reflected light reflected by the surface of the coating film for the same purpose as the reference light, and thus does not require addition of additional elements such as a window glass necessary for reference light generation.
Fig. 8 is a diagram showing a cross-sectional image and a boundary line displayed on the cross-sectional image according to an embodiment of the present disclosure. The processor 110 may derive the thickness of the coating film coated on the predetermined region from the obtained light interference data. The processor 110 can generate a profile image from the optical interference data and derive the thickness of the coating film using information on the profile image.
In the present disclosure, the cross-sectional image may mean a cross-section along the depth direction of the object (coating film) displayed in a two-dimensional image in the object measurement based on the OCT system. The profile image may be generated based on the measured light interference data. The cross-sectional image may have boundary lines (boundary stripes) corresponding to the interfaces between the air and the coating film, and the coating film and the substrate.
Specifically, the processor 110 may obtain a cross-sectional image as shown using the light interference data captured by the second light sensor 160. The cross-sectional image may be an image showing a cross section in the-Z axis direction, that is, in the depth direction, with respect to the substrate 2 and the coating film. That is, the sectional image may show the coating film and the inside of the substrate passing through from the surface of the coating film in the depth direction.
The illustrated cross-sectional image 8010 may be a cross-sectional image that can be obtained by means of the aforementioned first OCT component. The cross-sectional image 8010 may have one or more boundary lines 8050. The boundary lines 8050 may be interfaces between air and the coating films, in other words, boundary lines corresponding to surfaces of the coating films, or boundary lines corresponding to interfaces between the coating films and the substrate 2 coated with the respective coating films to the electrodes, respectively. The processor 110 may derive the thickness of the coating film using the intervals between the boundary lines corresponding to the respective interfaces.
Specifically, when the first OCT portion is used, a cross-sectional image 8010 with the reference mirror surface as the reference can be obtained. The processor 110 may determine a boundary line representing an interface between air and the coating film from the illustrated cross-sectional image 8010. In addition, the processor 110 may determine a boundary line representing an interface between the coating film and the substrate 2 coated by the corresponding coating film from the cross-sectional image 8010. The processor 110 can derive the longitudinal distance between the two determined boundary lines on the cross-sectional image 8010, and determine the longitudinal distance as the thickness of the coating film. In one embodiment, the processor 110 may apply a predetermined scaling factor (scaling factor) in the derived longitudinal distance, determining the derived value as the thickness of the coating film.
In one embodiment, the processor 110 may use a predetermined differentiation (segmentation) algorithm in order to differentiate boundary lines representing an interface between air and the coating film and boundary lines representing an interface between the coating film and the substrate 2 from the plurality of boundary lines 8050 displayed on the cross-sectional image 8010. In addition, the processor 110 may perform the above-described boundary line distinction by using the accumulated information representing the relationship of the boundary line of the air, the coating film, the substrate and the cross-sectional image, which is made into a database and stored in the memory 120. In one embodiment, the processor 110 may first determine which direction in the longitudinal or transverse direction of the cross-sectional image 8010 to begin sensing the boundary line (boundary stripe), and then sense the boundary line from the determined direction. In one embodiment, the processor 110 may distinguish between perceived boundary lines that are repeated due to multiple reflections, excluding thickness measurement derivatives.
On the other hand, when the second OCT portion is used, a cross-sectional image 8020 based on the coating film surface can be obtained. The cross-sectional image 8020 may have one or more boundary lines 8040. One of the boundary lines 8040 may be a boundary line corresponding to an interface between the coating film and the substrate 2 coated with the corresponding coating film, or even the electrode. The processor 110 can derive the thickness of the coating film using the interval between the corresponding boundary line 8040 and the upper edge 8030 of the cross-sectional image 8020.
Specifically, when using the second OCT portion, the processor 110 may perceive the boundary line 8040 representing the interface between the coating film and the substrate 2 coated by the corresponding coating film. The processor 110 may determine a boundary line that first appears from the upper side of the sectional image 8020 in the depth direction as a corresponding boundary line 8040. In addition, in the second OCT portion, since light interference data is generated by using reflected light reflected from the surface of the coating film, the cross-sectional image can show a cross section in the-Z axis direction, i.e., in the depth direction, from the surface of the coating film with the surface of the coating film as the origin. Therefore, the upper side 8030 of the cross-sectional image 8020 obtained by means of the second OCT portion can correspond to the surface of the coating film. The processor 110 can derive the longitudinal distance between the perceived boundary line 8040 and the upper edge 8030 of the cross-sectional image 8020, and determine the longitudinal distance as the thickness of the coating film. In one embodiment, the processor 110 may apply a predetermined scaling factor in the derived longitudinal distance, determining the derived value as the thickness of the coating film.
In one embodiment, substrate coating film thickness measurements using OCT may also be performed by vacuum or other medium. That is, the laser irradiation of the OCT portion 170 and the movement of the reflected light may be performed by a vacuum or other medium other than air.
Fig. 9 is a diagram showing measurement ranges of a first OCT portion and a second OCT portion of one embodiment of the present disclosure. The illustrated cross-sectional image 9010 may be a cross-sectional image obtained by means of the first OCT component. The corresponding cross-sectional image 9010 may have a boundary line representing an interface between air and the coating film, and a boundary line representing an interface between the coating film and the substrate (PCB). In addition, the illustrated cross-sectional image 9020 may be a cross-sectional image obtained by means of the second OCT portion. The corresponding cross-sectional image 9020 may have a boundary line representing an interface between the coating film and the substrate (PCB).
In one embodiment, the cross-sectional image 9010 may be larger than the cross-sectional image 9020. That is, the cross-sectional image 9010 may have a larger data amount than the cross-sectional image 9020. This is because, in the case of measurement based on the second OCT portion, unlike the first OCT portion, reflected light reflected from the surface of the coating film is used as reference light, and thus the depth direction (-Z axis direction) measurement range is limited to the range from the surface of the coating film.
In the illustrated cross-sectional view 9030, in order to obtain a meaningful measurement result in terms of the coating film thickness measurement using the first OCT portion, it is necessary to fully consider the measurement range 9040 of the height difference due to the element mounted on the substrate 2. However, in the case of the coating film thickness measurement using the second OCT portion, a meaningful thickness measurement result can be obtained using only the measurement range 9050 corresponding to the maximum expected thickness of the coating film. That is, the inspection apparatus 10 can reduce the measurement range in the depth direction required for the coating film thickness measurement, and can reduce the calculation capacity required for processing the measurement result and the memory required for storing, depending on the type of the OCT portion 170.
In addition, with respect to the coating film thickness measurement using the second OCT portion, since the reference mirror 172 is not used, the possibility of measurement error due to the saturation phenomenon of reflected light can be reduced. If the light output of the irradiated light exceeds a predetermined amount, the amount of reflected light increases, and the light interference data and the interference signal appearing on the sectional image become saturated. If the saturation state is reached, an interference signal appears irrespective of an interference signal generated by the measurement object, which may prevent accurate measurement. This saturation phenomenon can occur more easily with the first OCT portion of the reference mirror 172 that uses high reflectivity. The second OCT section eliminates the use of a reference mirror, so that measurement errors due to saturation can be reduced.
Fig. 10 is a diagram showing one embodiment of a substrate inspection method that may be performed by means of the inspection apparatus 10 of the present disclosure. In the illustrated flowchart, the steps of the method or algorithm of the present disclosure are sequentially described, but the steps may be performed in an order that can be arbitrarily combined in the present disclosure, in addition to being performed sequentially. The description based on the present flow chart does not exclude the case of applying a change or revision to a method or algorithm and does not mean that any step is necessary or preferred. In one embodiment, at least a portion of the steps may be performed in parallel, iteratively, or heuristically. In one embodiment, at least a portion of the steps may be omitted, or other steps may be added.
The inspection apparatus 10 of the present disclosure may perform the substrate inspection method of various embodiments of the present disclosure in performing the substrate inspection. The substrate inspection method of one embodiment of the present disclosure may include: a step S100 of irradiating ultraviolet rays to the coating film of the substrate; a step S200 of obtaining a two-dimensional image of the substrate; a step S300 of deriving one of a plurality of regions of the substrate based on the two-dimensional image; a step S400 of irradiating laser light toward one region and obtaining optical interference data generated from the one region; and/or deriving a thickness of the coating film with respect to one region based on the light interference data S500.
In step S100, the first light source 130 of the inspection apparatus 10 may irradiate ultraviolet rays toward the coating film of the substrate 2 mixed with the fluorescent dye. In step S200, the first light sensor 140 of the inspection apparatus 10 may capture fluorescence generated from the ultraviolet-irradiated coating film and obtain a two-dimensional image of the substrate. In step S300, the processor 110 of the inspection apparatus 10 may derive one of a plurality of regions of the substrate based on the two-dimensional image. In step S400, the second light source 150 may irradiate laser light toward the derived one region, and the second light sensor 160 may obtain light interference data (e.g., first light interference data, etc.) generated from the one region by means of the laser light. The optical interference data may be determined by interference light of reference light and measurement light formed by the first OCT portion or interference light of reflected light (reference light action) and scattered light (measurement light action) formed by the second OCT portion. In step S500, the processor 110 may derive the thickness of the coating film coated on one region of the substrate 2 based on the light interference data. In the present disclosure, the coating amount may be derived based on a two-dimensional image according to various embodiments. In addition, the thickness can be measured using OCT portion 170 according to various embodiments.
In one embodiment, the step S300 of deriving an area may include: a step in which the processor 110 derives the coating amounts of the coating films for the respective plural regions based on the two-dimensional image of the substrate 2; and/or determining a region having a coating amount of not more than a preset amount among the plurality of regions as the one region.
In one embodiment, the step S300 of deriving an area may include: the processor 110 decides one of the above-described areas based on information about the area of interest set in advance by the user.
In one embodiment, the region of interest may be a region of the substrate that includes electrodes of the element.
In one embodiment, the step S300 of deriving an area may include: the processor 110 determines the region of the substrate determined to be defective as the one region based on the two-dimensional image.
In one embodiment, the region including the electrodes may be derived by means of the processor 110 based on element arrangement information showing the element arrangement on the substrate.
In one embodiment, the reflected light reflected from the surface of the coating film may be used as the reference light. In one embodiment, the second light source 150 of the second OCT portion may irradiate laser light toward the coating film of the substrate 2 in the first direction. In addition, the second light sensor 160 of the second OCT portion can capture interference light traveling in the opposite direction of the first direction.
In one embodiment, the interference light may be interference light that occurs by interference of reflected light of the laser light reflected from the surface of the coating film and scattered light that passes through the coating film and is scattered from the interface between the coating film and the substrate. The interference light may be interference light generated in the above-described one region derived from a plurality of regions.
In one embodiment, the step S500 of deriving the thickness of the coating film with respect to one region may include: a step in which the processor 110 obtains a cross-sectional image showing a cross-section along a first axis (for example, Z axis) direction corresponding to the depth direction of the coating film, based on the above-described light interference data (for example, first light interference data, etc.); and/or determining a thickness of the coating film applied to the one region based on the boundary line on the sectional image.
Various embodiments of the present disclosure may be embodied as software in a machine-readable storage medium (machine-readable storage medium). The software may be software for embodying various embodiments of the present disclosure. Software may be deduced from various embodiments of the present disclosure by programmers in the art to which the present disclosure pertains. For example, the software may be a program comprising machine-readable instructions (e.g., code or code fragments). The machine may be a computer, for example, as a device operable according to a command read from a storage medium. In one embodiment, the machine may be the inspection device 10 of an embodiment of the present disclosure. In one embodiment, the processor of the machine may execute the read commands and the constituent elements of the machine may perform the functions corresponding to the respective commands. In one embodiment, the processor may be the processor 110 of an embodiment of the present disclosure. The storage medium may mean all kinds of recording media (recording media) that store data by machine readable. The storage medium may include, for example, ROM (read only memory), RAM (random access memory), CD-ROM (compact disc read only drive), magnetic tape, floppy disk, optical data storage device, and the like. In one embodiment, the storage medium may be memory 120. In one embodiment, the storage medium may be distributed among computer systems or the like connected via a network. The software may be stored, run, etc. distributed across computer systems and the like. The storage medium may be a non-transitory (non-transitory) storage medium. A non-transitory storage medium means a medium (a real medium) that exists virtually independent of semi-permanent or temporary storage of data, excluding signals that are propagated temporarily.
The technical idea of the present disclosure has been described above according to various embodiments, and includes various substitutions, modifications and alterations that can be realized within the scope of the technical idea of the present disclosure that can be understood by those of ordinary skill in the art. Further, such substitutions, modifications, and alterations are to be understood as being encompassed by the appended claims.

Claims (18)

1. A substrate inspection apparatus, comprising:
a first light source that irradiates ultraviolet rays toward a coating film of a substrate mixed with a fluorescent dye;
a first light sensor that captures fluorescence generated from the coating film irradiated with the ultraviolet light and obtains a two-dimensional image of the substrate;
a memory that stores information indicating a region of interest set in advance on the substrate;
a processor that derives a first region of a plurality of regions of the substrate based on information representing the region of interest;
a second light source that irradiates laser light toward the first region; and
A second optical sensor that obtains optical interference data generated from the first region by means of the laser light,
the processor derives a thickness of the coating film with respect to the first region based on the light interference data.
2. The substrate inspection apparatus according to claim 1, wherein,
the processor derives a coating amount of the coating film with respect to each of the plurality of regions based on the two-dimensional image, decides a region in which the coating amount is less than a preset amount in the plurality of regions as a second region,
the second light source irradiates laser light toward the second region, the second light sensor obtains light interference data occurring from the second region, and the processor derives a thickness of the coating film with respect to the second region based on the light interference data from the second region.
3. The substrate inspection apparatus according to claim 1, wherein,
the processor decides a region judged to be defective in the substrate as a third region based on the two-dimensional image,
the second light source irradiates laser light toward the third region, the second light sensor obtains light interference data occurring from the third region, and the processor derives a thickness of the coating film with respect to the third region based on the light interference data from the third region.
4. The substrate inspection apparatus according to claim 1, wherein,
the memory further stores element arrangement information showing an arrangement of a plurality of elements on the substrate,
The processor compares the element arrangement information with the two-dimensional image, derives a fourth region including an electrode of the element from the plurality of regions,
the second light source irradiates laser light toward the fourth region, the second light sensor obtains light interference data occurring from the fourth region, and the processor derives a thickness of the coating film with respect to the fourth region based on the light interference data from the fourth region.
5. The substrate inspection apparatus according to claim 1, wherein,
the reflected light reflected from the surface of the coating film is used as reference light.
6. The substrate inspection apparatus according to claim 5, wherein,
the processor obtains a cross-sectional image showing a cross-section along a first axis direction corresponding to a depth direction of the coating film based on light interference data from the first region,
the thickness of the coating film with respect to the first region is determined based on a boundary line on the sectional image.
7. The substrate inspection apparatus according to claim 5, wherein,
the reflectivity of the surface of the coating film to the laser light is determined by the mixing ratio of the fluorescent dye of the coating film mixed with the fluorescent dye,
The fluorescent dye mixing ratio is set to a value such that the reflectance exceeds a preset reference value.
8. The substrate inspection apparatus according to claim 5, wherein,
the coating film is formed by means of at least one selected from the group consisting of acrylic, uratam, polyurethane, silicon, epoxy, ultraviolet-curable substances, and infrared-curable substances.
9. The substrate inspection apparatus according to claim 5, wherein,
the surface of the coating film is formed in a curved surface.
10. A substrate inspection method, comprising:
a step of irradiating ultraviolet rays toward the coating film of the substrate mixed with the fluorescent dye;
capturing fluorescence generated from the coating film irradiated with the ultraviolet rays and obtaining a two-dimensional image of the substrate;
a step of deriving a first region of a plurality of regions of the substrate based on the two-dimensional image and information indicating a region of interest set in advance on the substrate;
a step of irradiating the first region with a laser beam to obtain optical interference data generated from the first region by the laser beam; and
Deriving a thickness of the coating film with respect to the first region based on the light interference data.
11. The substrate inspection method according to claim 10, further comprising:
a step of deriving a coating amount of the coating film with respect to each of the plurality of regions based on the two-dimensional image;
a step of determining a region in which the coating amount in the plurality of regions is less than a preset amount as a second region,
a step of irradiating the second region with laser light to obtain optical interference data generated from the second region; and
And deriving the thickness of the coating film with respect to the second region based on the light interference data from the second region.
12. The substrate inspection method according to claim 10, further comprising:
determining a region of the substrate determined to be defective as a third region based on the two-dimensional image;
a step of irradiating the third region with laser light to obtain optical interference data generated from the third region; and
Deriving a thickness of the coating film with respect to the third region based on the light interference data from the third region.
13. The substrate inspection method according to claim 10, wherein,
a step of comparing element arrangement information showing an arrangement of a plurality of elements on the substrate with the two-dimensional image to derive a fourth region including an electrode of the element among the plurality of regions;
A step of irradiating the fourth region with laser light to obtain optical interference data generated from the fourth region; and
Deriving a thickness of the coating film with respect to the fourth region based on the light interference data from the fourth region.
14. The substrate inspection method according to claim 10, wherein,
the reflected light reflected from the surface of the coating film is used as reference light.
15. The substrate inspection method according to claim 14, wherein,
the step of deriving the thickness of the coating film with respect to the first region further comprises:
a step of obtaining a cross-sectional image showing a cross-section along a first axis direction corresponding to a depth direction of the coating film based on light interference data from the first region; and
And determining the thickness of the coating film in relation to the first region based on a boundary line on the sectional image.
16. The substrate inspection method according to claim 14, wherein,
the reflectivity of the surface of the coating film to the laser light is determined by the mixing ratio of the fluorescent dye of the coating film mixed with the fluorescent dye,
the fluorescent dye mixing ratio is set to a value such that the reflectance exceeds a preset reference value.
17. The substrate inspection method according to claim 14, wherein,
the coating film is formed by means of at least one selected from the group consisting of acrylic, uratam, polyurethane, silicon, epoxy, ultraviolet-curable substances, and infrared-curable substances.
18. The substrate inspection method according to claim 14, wherein,
the surface of the coating film is formed in a curved surface.
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