CN113314427B - Occlusion degassing type circuit packaging method - Google Patents
Occlusion degassing type circuit packaging method Download PDFInfo
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- CN113314427B CN113314427B CN202110457595.3A CN202110457595A CN113314427B CN 113314427 B CN113314427 B CN 113314427B CN 202110457595 A CN202110457595 A CN 202110457595A CN 113314427 B CN113314427 B CN 113314427B
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- 238000007872 degassing Methods 0.000 title claims abstract description 69
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000005022 packaging material Substances 0.000 claims abstract description 80
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000001301 oxygen Substances 0.000 claims abstract description 50
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000003302 ferromagnetic material Substances 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
Abstract
The invention discloses a method for packaging a circuit by occluding and degassing, which belongs to the technical field of circuit packaging, wherein the method can discharge air in an injection mold by introducing oxygen in advance, ensure that the gas in a packaging material is basically oxygen, then uniformly mix in a degassing balloon, trigger the occluding action of the degassing balloon by utilizing an intermittent magnetic field, inhale a large amount of packaging materials when the degassing balloon is opened, then occlude under the action of gravity, squeeze the packaging materials, force the oxygen contained in the packaging materials to release and be absorbed, then discharge the packaging materials except the degassing balloon, repeat the occluding action, not only can effectively absorb the oxygen contained in the packaging materials, but also can improve the packing compactness and fluidity of the packaging materials, greatly reduce the air hole defects easily appearing in the circuit packaging process, and improve the strength and the electrical insulation of the plastic packaging body.
Description
Technical Field
The invention relates to the technical field of circuit packaging, in particular to a method for packaging a meshing degassing circuit.
Background
The package of integrated circuit is a process technology to wrap the chip on the circuit board to avoid the contact between the chip and the outside and to prevent the damage of the outside to the chip. Impurities and bad gases in the air, and even water vapor, can corrode the precision circuits on the chip, thereby causing degradation of electrical properties.
After the package of the integrated circuit is changed in the plug-in type and the surface mounting type, a new package structure, namely a direct bonding type, has been developed and tried to achieve the value of commercialization and has been developed more greatly. The direct bonding type package can be rapidly developed, and the most important factors are that it can be suitable for large-scale automatic or semi-automatic production with multiple leads, small spacing and low cost, and the package structure and assembly process are simplified.
The memory capacity of the integrated circuit is increased by several times every 1-2 years, and the plastic package appearance of the chip is miniaturized forward. The thinning direction is developed. Therefore, the semiconductor packaging industry is increasingly important, and higher requirements are put on the plastic packaging mold. The packaging material (plastic packaging material) is a mixture with epoxy resin as a base water component and added with various additives, and has the characteristics of moisture resistance, flame resistance, easy preservation, good flowing filling property, high electrical insulation, low stress, high strength, good reliability and the like, and is applied to surface low-pressure packaging of integrated circuits, semiconductors and passive devices for a long time.
However, the existing injection molding process is easy to generate air hole defects, the strength of the plastic package body is reduced due to the generation of air bubbles, the moisture resistance and the electrical insulation performance are greatly reduced, the reliability of the integrated circuit in safe use is greatly affected, the integrated circuit manufacturing failure is caused due to serious conditions, and potential safety hazards are left for the use of electric appliances.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a method for packaging a circuit by occluding and degassing, which can discharge air in an injection mold by introducing oxygen in advance, ensure that the gas in the packaging material is basically oxygen, then uniformly mixing in a degassing balloon, triggering the occluding action of the degassing balloon by utilizing an intermittent magnetic field, sucking a large amount of packaging material when the degassing balloon is opened, then occluding under the action of gravity, extruding the packaging material, forcing the oxygen contained in the packaging material to be released and absorbed, and then discharging the packaging material except the degassing balloon, thereby not only effectively absorbing the oxygen contained in the packaging material, but also improving the packing compactness and the flowability of the packaging material, greatly reducing the air hole defects easily appearing in the circuit packaging process, and improving the strength and the electrical insulation of the plastic packaging body.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
A method of bite degassing circuit packaging comprising the steps of:
s1, printing a circuit on a substrate, installing an injection mold around the substrate, and introducing oxygen to exhaust air in the mold;
s2, injecting packaging materials into a pouring opening of the injection mold, and uniformly mixing a plurality of balloon removal balls into the packaging materials;
s3, after the pouring of the packaging material is finished, applying a discontinuous magnetic field above the die to force the balloon to engage in the packaging material, so that oxygen in the packaging material is absorbed;
s4, taking out the balloon after lasting for 5-10min, and then supplementing packaging materials to the inner cavity of the filling mould;
s5, after the packaging material is solidified to form a plastic package body, the injection mold is taken down.
Further, the substrate is any one of an alumina substrate, a glass fiber reinforced epoxy resin plate or a glass substrate.
Further, the packaging material comprises the following raw materials in parts by weight: 18-20% of epoxy resin, 9-12% of hardener, 0.1-1% of wax, 5-6% of stress release agent, 1-1.5% of flame retardant, 0.2-0.4% of colorant and the balance of silicon micropowder.
Further, the deaeration ball includes the upper jaw hemisphere, lower jaw hemisphere and many telescopic links, the telescopic link evenly connected is between upper jaw hemisphere and lower jaw hemisphere, and the upper jaw hemisphere is located the upside of lower jaw hemisphere, the deaeration groove has been seted up to lower jaw hemisphere upper end, deaeration groove opening part is connected with the partition plate, set up a plurality of evenly distributed accuse gas pocket on the partition plate, the activity is inlayed in the accuse gas pocket has assorted open bag, be connected with open ejector pin between open bag and the upper jaw hemisphere, upper jaw hemisphere lower extreme is connected with a plurality of evenly distributed elastic filament, the elastic filament lower extreme is connected with the pore-forming microballon, and after upper jaw hemisphere and pore-forming microballon received the magnetic field effect, upper jaw hemisphere and pore-forming microballon all can move up and leave the lower jaw hemisphere to inhale a large amount of packaging material and get into between upper jaw hemisphere and the lower jaw hemisphere, after the magnetic field is removed, the pore-forming microballon resets under the elastic action of elastic filament and extrudees the open bag, carries out the pressurization to the deaeration inslot, and then the oxygen gas is gradually released to the inside the surface of the air channel in the extrusion groove, and the oxygen is gradually the atmospheric pressure is removed to the oxygen is gradually in the atmospheric pressure is gradually the extrusion groove, and the oxygen is blown out the outside the oxygen is gradually in the air channel is formed in the face of the air channel because of the air channel is closed.
Further, the open bag comprises a substrate, an elastic variable film and an air compression column, wherein the elastic variable film is connected to the upper end of the substrate, the air compression column is connected to the lower end of the elastic variable film, penetrates through the substrate and extends to the inner side of the degassing tank, after being extruded by the pore-forming microspheres, the elastic variable film deforms to push the air compression column to descend, then gas in the degassing tank is extruded to increase the air pressure, at the moment, the position of the substrate is unchanged and still can seal the air control hole, when the chin hemisphere is extruded by means of the open ejector rod, the substrate moves downwards to open the air control hole, and the gas in the degassing tank leaks outwards and presses oxygen on the surface of the partition plate to enter the degassing tank for reaction.
Furthermore, the degassing tank is filled with inert gas and enough reducing iron powder, the inert gas is nitrogen, on one hand, the inert gas does not react with the reducing iron powder, on the other hand, even if the phenomenon of micro leakage occurs, the influence on the packaging material is small, and on the other hand, the density of the nitrogen is lower than that of the oxygen, so that the oxygen is easier to enter the degassing tank to react with the reducing iron powder under the action of gravity.
Furthermore, the lower end face of the partition plate is adhered with a material separating film, the material separating film is made of a waterproof breathable film, the material separating film can not block interaction of gas on one hand, and packaging materials can be prevented from entering the degassing tank on the other hand.
Furthermore, the upper jaw hemisphere and the pore-forming microsphere are made of ferromagnetic materials, the lower jaw hemisphere is made of heat-insulating materials, the density of the lower jaw hemisphere is larger than that of the upper jaw hemisphere, the upper jaw hemisphere and the pore-forming microsphere can move upwards under the action of a magnetic field, and the heat-insulating effect of the lower jaw hemisphere can ensure that the ambient temperature in a degassing tank is lower, so that irregular movement of gas is reduced.
Further, the elastic wire is made of elastic materials, the length of the elastic wire is larger than the maximum extension distance of the telescopic rod, the elastic force of the elastic wire is overcome after the pore-forming microsphere is subjected to the action of a magnetic field, the elastic wire is quickly reset under the action of the elastic force after the magnetic field is removed, on one hand, the elastic wire can reset before the palate hemisphere, due to the fact that the speed is high, the mobility of the packaging material cannot keep up with the moving speed of the pore-forming microsphere, a vacuum gas flow channel can be formed, the packaging material can enter the gas flow channel and flow to the surface of the partition plate under the condition of containing oxygen, on the other hand, the elastic variable film can be extruded, the compression effect on the degassing tank gas is improved, in addition, the resetting speed of the palate hemisphere is low, the packaging material can be gradually extruded, and oxygen on the surface of the partition plate can be fully interacted with the environment in the degassing tank to be reacted, and the oxygen cannot be easily caused to reentry into the packaging material due to the fact that the extrusion speed is high.
Further, the injection molding temperature of the packaging material in the step S2 is 170-180 ℃, and the injection molding pressure is 1-5Mpa.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) According to the scheme, the air in the injection mold can be exhausted by introducing oxygen in advance, so that the gas in the packaging material is basically oxygen, then the balloon is evenly mixed, the intermittent magnetic field is utilized to trigger the occlusion action of the balloon, a large amount of packaging material can be inhaled when the balloon is opened, then the balloon is occluded under the action of gravity, so that the packaging material is extruded, the oxygen contained in the packaging material is forced to be released and absorbed, then the packaging material is exhausted except the balloon, the occlusion action is repeated, the oxygen contained in the packaging material can be effectively absorbed, the packing compactness and the fluidity of the packaging material can be improved, the air hole defects easily appearing in the circuit packaging process are greatly reduced, and the strength and the electrical insulation of the plastic packaging body are improved.
(2) The deaeration ball includes the upper jaw hemisphere, lower jaw hemisphere and many telescopic links, the telescopic link evenly connects between upper jaw hemisphere and lower jaw hemisphere, and the upper jaw hemisphere is located the upside of lower jaw hemisphere, the deaeration groove has been seted up to the lower jaw hemisphere upper end, deaeration groove opening part is connected with the partition plate, set up a plurality of evenly distributed accuse gas pockets on the partition plate, the activity is inlayed in the accuse gas pocket has assorted open bag, be connected with the open ejector pin between open bag and the upper jaw hemisphere, the upper jaw hemisphere lower extreme is connected with a plurality of evenly distributed elastic yarn, the elastic yarn lower extreme is connected with the pore-forming microballon, after upper jaw hemisphere and pore-forming microballon received the magnetic field effect, upper jaw hemisphere and pore-forming microballon all can move up away from the lower jaw hemisphere, thereby inhale a large amount of packaging material and get into between upper jaw hemisphere and the lower jaw hemisphere, after the magnetic field removes, the back resets under the elastic force effect of elastic yarn and extrudees the open bag, at first, pressurize the deaeration inslot through the open bag, the open bag is carried out to the pressure in the motion, can form the gas runner in the packaging material internal motion, be connected with the oxygen gas runner, the oxygen is carried out the oxygen to the outside the air pressure of the air impeller is more than the air pressure of the air vent is gradually and the extrusion groove is opened through the ejector pin, the atmospheric pressure is more than the atmospheric pressure of the air vent is more gradually, the atmospheric pressure is discharged to the internal, the external pressure of the air pressure is more than the air pressure of the air vent is more gradually forced down and the air pressure controller is opened.
(3) The open bag comprises a substrate, an elastic variable film and an air compressing column, wherein the elastic variable film is connected to the upper end of the substrate, the air compressing column is connected to the lower end of the elastic variable film, and penetrates through the substrate and extends to the inner side of a degassing tank, after being extruded by a pore-forming microsphere, the elastic variable film deforms to push the air compressing column to descend, then gas in the degassing tank is extruded to increase the air pressure, at the moment, the position of the substrate is unchanged and still can seal a gas control hole, when a chin hemisphere is extruded by means of an open ejector rod, the substrate moves downwards to open the gas control hole, and the gas in the degassing tank leaks and presses oxygen on the surface of a partition plate to enter the degassing tank to react.
(4) The degassing tank is filled with inert gas and enough reducing iron powder, the inert gas is nitrogen, on one hand, the inert gas does not react with the reducing iron powder, on the other hand, even if the phenomenon of micro leakage occurs, the influence on the packaging material is small, and on the other hand, the density of the nitrogen is lower than that of the oxygen, so that the oxygen is easier to enter the degassing tank to react with the reducing iron powder under the action of gravity.
(5) The lower end face of the partition board is adhered with a material separating film, the material separating film is made of a waterproof breathable film, the material separating film can not block interaction of gas on one hand, and packaging materials can be prevented from entering the degassing tank on the other hand.
(6) The upper jaw hemisphere and the pore-forming microsphere are both made of ferromagnetic materials, the lower jaw hemisphere is made of heat-insulating materials, the density of the lower jaw hemisphere is larger than that of the upper jaw hemisphere, the upper jaw hemisphere and the pore-forming microsphere can move upwards under the action of a magnetic field, and the heat-insulating effect of the lower jaw hemisphere can ensure that the environment temperature in a degassing tank is lower, so that irregular movement of gas is reduced.
(7) The elastic wire is made of elastic materials, the length of the elastic wire is larger than the maximum extension distance of the telescopic rod, the elastic force of the elastic wire is overcome after the pore-forming microsphere is subjected to the action of a magnetic field, the elastic wire is quickly reset under the action of the elastic force of the elastic wire after the magnetic field is removed, on one hand, the elastic wire can be reset before the palate hemisphere, due to the fact that the speed is high, the mobility of the packaging material cannot keep up with the moving speed of the pore-forming microsphere, a vacuum gas runner can be formed, the packaging material can enter the gas runner and flow to the surface of the partition plate under the condition of containing oxygen, on the other hand, the elastic variable film can be extruded, the compression effect on the degassing tank gas is improved, in addition, the resetting speed of the palate hemisphere is low, the packaging material can be gradually extruded, and oxygen on the surface of the partition plate can be fully interacted with the environment in the degassing tank to be reacted, and the oxygen cannot be easily reentered into the packaging material due to the fact that the extruding speed is too high.
Drawings
FIG. 1 is a schematic flow chart of the present invention;
FIG. 2 is a schematic view of the structure in an injection mold according to the present invention;
FIG. 3 is a schematic view of the structure of the balloon according to the present invention;
FIG. 4 is a schematic diagram of the structure shown at A in FIG. 3;
FIG. 5 is a schematic view of the structure of the open bladder of the present invention before and after changing;
FIG. 6 is a schematic view of the structure of the degassing ball before and after occlusion.
The reference numerals in the figures illustrate:
1 upper jaw hemisphere, 2 lower jaw hemisphere, 3 telescopic link, 4 degassing tank, 5 partition panel, 6 open ejector pin, 7 elasticity variable film, 8 pressure gas column, 9 material separating film, 10 pore-forming microballoon, 11 stretch yarn.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1:
referring to fig. 1-2, a method for packaging a bite degassing circuit includes the steps of:
s1, printing a circuit on a substrate, installing an injection mold around the substrate, and introducing oxygen to exhaust air in the mold;
s2, injecting packaging materials into a pouring opening of the injection mold, and uniformly mixing a plurality of balloon removal balls into the packaging materials;
s3, after the pouring of the packaging material is finished, applying a discontinuous magnetic field above the die to force the balloon to engage in the packaging material, so that oxygen in the packaging material is absorbed;
s4, taking out the balloon after lasting for 5-10min, and then supplementing packaging materials to the inner cavity of the filling mould;
s5, after the packaging material is solidified to form a plastic package body, the injection mold is taken down.
The substrate is any one of an alumina substrate, a glass fiber reinforced epoxy resin plate or a glass substrate.
The packaging material comprises the following raw materials in parts by weight: 18-20% of epoxy resin, 9-12% of hardener, 0.1-1% of wax, 5-6% of stress release agent, 1-1.5% of flame retardant, 0.2-0.4% of colorant and the balance of silicon micropowder.
Referring to fig. 3-4, the degassing ball comprises an upper jaw hemisphere 1, a lower jaw hemisphere 2 and a plurality of telescopic rods 3, wherein the telescopic rods 3 are uniformly connected between the upper jaw hemisphere 1 and the lower jaw hemisphere 2, the upper jaw hemisphere 1 is positioned at the upper side of the lower jaw hemisphere 2, a degassing groove 4 is arranged at the upper end of the lower jaw hemisphere 2, a partition plate 5 is connected at the opening of the degassing groove 4, a plurality of uniformly distributed air control holes are arranged on the partition plate 5, matched open bags are movably embedded in the air control holes, an open ejector rod 6 is connected between the open bags and the upper jaw hemisphere 1, a plurality of uniformly distributed elastic wires 11 are connected at the lower end of the upper jaw hemisphere 1, pore-forming microspheres 10 are connected at the lower ends of the elastic wires 11, after the upper jaw hemisphere 1 and the pore-forming microspheres 10 are subjected to magnetic fields, the upper jaw hemisphere 1 and the pore-forming microspheres 10 are moved upwards away from the lower jaw hemisphere 2, thereby inhale a large amount of packaging material and get into between the palate hemisphere 1 and the chin hemisphere 2, after the magnetic field is removed, pore-forming microballon 10 resets under the elasticity effect of stretch yarn 11 and extrudes open bag, at first pressurize in the degassing tank 4 through open bag, secondly pore-forming microballon 10 can form the gas flow path in the packaging material internal motion process, guide the oxygen that contains to the partition panel 5 surface, then the palate hemisphere 1 is reset gradually under the action of gravity, extrude packaging material, and further extrude open bag through open ejector pin 6, force it to break away from accuse gas pocket and external intercommunication, the atmospheric pressure is great in the degassing tank 4 can appear the condition of gas leakage, and with the oxygen recoil interaction of partition panel 5 surface, in the gradual consumption of oxygen, the gas that leaks can get back into degassing tank 4 again because of atmospheric pressure relation, accomplish the absorption of round oxygen this moment.
The open bag comprises a substrate, an elastic variable film 7 and an air compressing column 8, wherein the elastic variable film 7 is connected to the upper end of the substrate, the air compressing column 8 is connected to the lower end of the elastic variable film 7, the air compressing column 8 penetrates through the substrate and extends to the inner side of the degassing tank 4, after being extruded by the pore-forming microspheres 10, the elastic variable film 7 deforms to push the air compressing column 8 to descend, then gas in the degassing tank 4 is extruded to increase the air pressure, the position of the substrate is unchanged at the moment to still seal the air control hole, when the chin hemisphere 2 is extruded by means of the open ejector rod 6, the substrate moves downwards to open the air control hole, and the gas in the degassing tank 4 leaks and presses oxygen on the surface of the partition plate 5 to enter the degassing tank 4 for reaction.
The degassing tank 4 is filled with inert gas and enough reducing iron powder, the inert gas is nitrogen, the inert gas does not react with the reducing iron powder on one hand, on the other hand, even if the phenomenon of micro leakage occurs, the influence on the packaging material is small, and the density of the nitrogen is lower than that of the oxygen, so that the oxygen is easier to enter the degassing tank 4 to react with the reducing iron powder under the action of gravity.
The lower end face of the partition board 5 is adhered with a material separating film 9, the material separating film 9 is made of a waterproof breathable film, the material separating film 9 can not block interaction of gas on one hand, and packaging materials can be prevented from entering the degassing tank 4 on the other hand.
The upper jaw hemisphere 1 and the pore-forming microsphere 10 are made of ferromagnetic materials, the lower jaw hemisphere 2 is made of heat-insulating materials, the density of the lower jaw hemisphere 2 is larger than that of the upper jaw hemisphere 1, the upper jaw hemisphere 1 and the pore-forming microsphere 10 can move upwards under the action of a magnetic field, and the environment temperature in the degassing tank 4 can be guaranteed to be low due to the heat-insulating effect of the lower jaw hemisphere 2, so that irregular movement of gas is reduced.
The elastic wire 11 is made of elastic materials, the length of the elastic wire 11 is larger than the maximum extension distance of the telescopic rod 3, the elastic force of the elastic wire 11 is overcome after the pore-forming microsphere 10 is subjected to the action of a magnetic field, the elastic wire is quickly reset under the action of the elastic force of the elastic wire 11 after the magnetic field is removed, on one hand, the elastic wire can reset before the palate hemisphere 1, and on the other hand, due to the fact that the speed is high, the mobility of the packaging material cannot keep up with the moving speed of the pore-forming microsphere 10, a vacuum gas flow channel can be formed, the packaging material can enter the gas flow channel and flow to the surface of the partition board 5 under the condition of containing oxygen, on the other hand, the elastic deformation film 7 can be extruded, the compression effect on the gas of the degassing tank 4 is improved, in addition, the resetting speed of the palate hemisphere 1 is low, the packaging material can be gradually extruded, the oxygen on the surface of the partition board 5 can be fully interacted with the environment in the degassing tank 4 to be reacted, and the oxygen cannot be easily reentered into the packaging material due to the fact that the extrusion speed is too high.
The injection molding temperature of the packaging material in the step S2 is 170-180 ℃, and the injection molding pressure is 1-5Mpa.
Referring to fig. 5 to 6, the air in the injection mold can be exhausted by introducing oxygen in advance, so that the gas in the packaging material is basically oxygen, then the degassing balloon is uniformly mixed, the intermittent magnetic field is utilized to trigger the meshing action of the degassing balloon, a large amount of packaging material is sucked into the degassing balloon when the degassing balloon is opened, and then the degassing balloon is meshed under the action of gravity, so that the packaging material is extruded to force the oxygen contained in the degassing balloon to be released and absorbed, and then the packaging material is exhausted except the degassing balloon, and the meshing action is repeated, so that the oxygen contained in the packaging material can be effectively absorbed, the packing compactness and the flowability of the packaging material can be improved, the air hole defect easily occurring in the circuit packaging process can be greatly reduced, and the strength and the electrical insulation of the plastic package body can be improved.
The above is only a preferred embodiment of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art should, within the scope of the present disclosure, cover the protection scope of the present invention by equivalent substitutions or modifications according to the technical solution and the improved concept thereof.
Claims (4)
1. A method for packaging a meshing degassing circuit is characterized by comprising the following steps of: the method comprises the following steps:
s1, printing a circuit on a substrate, installing an injection mold around the substrate, and introducing oxygen to exhaust air in the mold;
s2, injecting packaging materials into a pouring opening of the injection mold, and uniformly mixing a plurality of balloon removal balls into the packaging materials;
s3, after the pouring of the packaging material is finished, applying a discontinuous magnetic field above the die to force the balloon to engage in the packaging material, so that oxygen in the packaging material is absorbed;
s4, taking out the balloon after lasting for 5-10min, and then supplementing packaging materials to the inner cavity of the filling mould;
s5, after the packaging material is solidified to form a plastic package body, taking down the injection mold;
the degassing ball comprises an upper jaw hemisphere (1), a lower jaw hemisphere (2) and a plurality of telescopic rods (3), wherein the telescopic rods (3) are uniformly connected between the upper jaw hemisphere (1) and the lower jaw hemisphere (2), the upper jaw hemisphere (1) is positioned on the upper side of the lower jaw hemisphere (2), a degassing groove (4) is formed in the upper end of the lower jaw hemisphere (2), a partition plate (5) is connected to the opening of the degassing groove (4), a plurality of uniformly distributed air control holes are formed in the partition plate (5), matched open bags are movably embedded in the air control holes, an open ejector rod (6) is connected between the open bags and the upper jaw hemisphere (1), a plurality of uniformly distributed elastic wires (11) are connected to the lower end of the upper jaw hemisphere (1), and pore-forming microspheres (10) are connected to the lower end of the elastic wires (11).
The open bag comprises a substrate, an elastic variable film (7) and an air compressing column (8), wherein the elastic variable film (7) is connected to the upper end of the substrate, the air compressing column (8) is connected to the lower end of the elastic variable film (7), and the air compressing column (8) penetrates through the substrate and extends to the inner side of the degassing groove (4);
the degassing tank (4) is filled with inert gas and sufficient reducing iron powder, and the inert gas is nitrogen;
a material separating film (9) is adhered to the lower end surface of the partition plate (5), and the material separating film (9) is made of a waterproof breathable film;
the upper jaw hemisphere (1) and the pore-forming microsphere (10) are made of ferromagnetic materials, the lower jaw hemisphere (2) is made of heat insulation materials, and the density of the lower jaw hemisphere (2) is greater than that of the upper jaw hemisphere (1);
the elastic yarn (11) is made of elastic materials, and the length of the elastic yarn (11) is larger than the maximum extension distance of the telescopic rod (3).
2. The bite degassing circuit packaging method of claim 1, wherein: the substrate is any one of an alumina substrate, a glass fiber reinforced epoxy resin plate or a glass substrate.
3. The bite degassing circuit packaging method of claim 1, wherein: the packaging material comprises the following raw materials in parts by weight: 18-20% of epoxy resin, 9-12% of hardener, 0.1-1% of wax, 5-6% of stress release agent, 1-1.5% of flame retardant, 0.2-0.4% of colorant and the balance of silicon micropowder.
4. The bite degassing circuit packaging method of claim 1, wherein: the injection molding temperature of the packaging material in the step S2 is 170-180 ℃, and the injection molding pressure is 1-5Mpa.
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| KR100612328B1 (en) * | 2003-09-09 | 2006-08-16 | 하영수 | Molding Apparutus of Semiconductor Package |
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