KR100612328B1 - Molding Apparutus of Semiconductor Package - Google Patents

Abstract

The present invention relates to a semiconductor package molding apparatus using a thermoplastic resin and a semiconductor package molding method using the same.

According to the present invention, in a semiconductor package molding apparatus, an encapsulating resin is formed from a water support by mutual coupling between a lower mold for placing a common substrate on which a plurality of semiconductor chips as a molded object are adhered to a bottom surface and the lower mold. And a top mold formed at a tip of the gate to be introduced and positioned at a rear side of the gate to form a common substrate settled portion, which is a molded space for receiving an encapsulation resin from the gate, wherein the lower mold and the upper mold are mutually intersected. The air vent buffer may be formed between the common substrate settled portion and the rear boundary of the lower mold and the upper mold so that the encapsulation resin may be introduced by the coupling and the air in the common substrate settled portion may be exhausted. According to the above configuration, there is an advantage that the molding process can be shortened by using a thermoplastic resin.

Semiconductor Package, Molding Device, Thermoplastic

Description

Semiconductor package molding device {Molding Apparutus of Semiconductor Package}

1 is a cross-sectional view of a common substrate to which a semiconductor chip is generally fixed.

2A is an exemplary diagram of encapsulating a plurality of semiconductor chips according to the prior art.

FIG. 2B is a state diagram in which a plurality of semiconductor chips are encapsulated by the related art of FIG. 2A.

3A illustrates an example of encapsulating a plurality of semiconductor chips according to another example of the related art.

3B is a state diagram in which a plurality of semiconductor chips are encapsulated by the prior art of FIG. 3A.

4 is a cross-sectional view of a semiconductor package molding apparatus according to an embodiment of the present invention.

5 is a plan view of an internal space formed by the upper mold and the lower mold according to FIG. 4.

6 is a longitudinal cross-sectional view illustrating an operation of molding a semiconductor package using a molding apparatus of FIG. 4.

FIG. 7 is an operation cross-sectional view of thermoplastic resin molding a semiconductor package using the molding apparatus of FIG. 4.

8 is a state diagram filled with a thermoplastic resin by the configuration of FIG.

FIG. 9 is a perspective view of a thermoplastic resin encapsulation molded in a common substrate after the upper mold and the lower mold are separated in FIG. 4.

       Explanation of symbols on the main parts of the drawings

10; Lower mold 10a; Bottom mold bottom

20; Upper mold B1; Air Vent Buffer

G; Gate C; Common board

B2; Fluidity control buffer part B2 _T ; Top of buffer part for fluidity adjustment

30; Common substrate 35; Semiconductor chip

40; Thermoplastic resin 400; Thermosetting resin

50; Cylinder 52; piston

100; Dispenser 200; Squeezer

RT; Rear boundary of lower mold and upper mold

40 '; Thermoplastic Encapsulation

40 ″; Thermoplastic Encapsulation Layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package molding apparatus and a molding method using the same. More specifically, the present invention relates to a molding method by using a resin, in particular, a thermoplastic resin, as an encapsulant, and forming a buffer portion capable of removing voids behind a common substrate mounting portion of a mold. The present invention relates to a semiconductor package molding apparatus having a short time and excellent heat resistance, and a molding method using the same.

Recently, in the manufacturing process of a semiconductor package, a plurality of semiconductor chips, which are diced and separated from a wafer, are fixed to a common substrate, and then the plurality of semiconductor chips are encapsulated with a common encapsulant, and the encapsulant and the common substrate are encapsulated on a common substrate. It is cut out along a preprinted pattern, and as a result, individual semiconductor packages are completed.

FIG. 1 is a cross-sectional view of a common substrate 30 in which a plurality of general semiconductor chips 35 are bonded.

The semiconductor chip 35 and the common substrate 30 shown in FIG. 1 are electrically connected to each other, and the bottom surface of the common substrate 30 has an external electrode pattern so that the semiconductor chip 35 is mounted on a printed circuit board (PCB) as a semiconductor chip element. When connected with other devices.

When the plurality of semiconductor chips 35, for example, several hundreds are fixed to the common substrate 30 and electrical connection is completed, a process of encapsulating the fixed semiconductor chips 35 with an encapsulant is performed.

Hereinafter, a method of encapsulating a plurality of semiconductor chips according to the prior art will be described with reference to FIGS. 2A to 3B.

2A is an exemplary diagram illustrating a process of encapsulating a semiconductor chip according to the prior art.

In the encapsulation process illustrated in FIG. 2A, a predetermined amount of encapsulant 400 is dropped from the dispenser 100 in a dispensing process to encapsulate all semiconductor chips with a common encapsulation layer.

2B illustrates a state diagram in which a plurality of semiconductor chips are encapsulated with a common encapsulation layer 400 ′ by the dispensing process of FIG. 2A. As shown in FIG. 2B, a plurality of semiconductor chips 35 are commonly encapsulated by a common encapsulation layer 400 ′.

3A is an exemplary diagram illustrating a process of encapsulating a semiconductor chip by another conventional technique. The encapsulation process illustrated in FIG. 3A encapsulates a plurality of semiconductor chips 35 by squeezing the encapsulant 400 by a squeezer 200 in a screen printing process.

3B illustrates a state diagram in which a plurality of semiconductor chips are encapsulated with a common encapsulation layer 400 ′ by the screen printing process of FIG. 3A.

However, the process of encapsulating a plurality of semiconductor chips in a common substrate according to the prior art as described above has the following problems.

First, the dispensing process according to the prior art has the following problems.

First, in the dispensing process, it is necessary to maintain proper fluidity in order to discharge the encapsulant 400. In this case, the viscosity of the encapsulant is lowered, so that the edge of the encapsulation layer 400 ′ is shown in FIG. 2B. Crumbling problem occurs.

Second, in the dispensing process, the process conditions must be changed every time according to the physical properties of the encapsulant 400. In this case, process control such as height control of the encapsulation layer 400 'becomes very difficult, and as a result, the productivity of the product However, there is a problem that the mass productivity is lowered.

In addition, the screen printing process according to the related art has a problem that it is very difficult to uniformly manage the thickness of the entire area of the printed encapsulation layer 400 ′.

That is, in the case of the screen printing process, a phenomenon in which the encapsulant is attracted by the squeegee 200 during printing may occur, and the center portion may be recessed as shown in B of FIG. 3B. The central depression as described above has been pointed out as a problem that requires an additional process and lowers the material utilization rate.

The present invention was created to solve the problems of the prior art as described above. The semiconductor package molding apparatus according to the present invention and the semiconductor package molding method using the same include a thin large-area semiconductor package using a resin, in particular, a thermoplastic resin and a mold. The present invention provides a molding apparatus and a molding method for molding.

Another object of the present invention is to provide a semiconductor package molding apparatus and a molding method using the same to prevent internal voids from occurring when molding a semiconductor package using a resin, in particular, a thermoplastic resin.

The semiconductor package molding apparatus of the present invention for achieving the above object is a lower mold having a bottom surface for placing a common substrate on which a plurality of semiconductor chips as a molded body is fixed, and by the mutual coupling with the lower mold And an upper mold for forming a common substrate settling portion, which is a molding space, wherein a gate for introducing a thermoplastic resin from a water support is formed at a front end side of the mold to communicate with the common substrate settled portion, and the thermoplastic resin introduced from the gate. Is formed over the entire surface of the mold near the front end of the common substrate settled portion so that the common substrate settled portion is introduced into the common substrate settled portion, and a buffer portion for controlling the fluidity of the thermoplastic resin is formed. The rear end of the common substrate Over the front of the mold is characterized in that the additional flow regulating buffer air vent that is formed in parallel to the buffer portion and provided.

The semiconductor package molding method of the present invention for achieving the above object, the process of fixing the common substrate to which the plurality of semiconductor chips are fixed to the lower mold and placed in the lower mold, by coupling the upper mold to the lower mold and the inside of the gate and common substrate Forming an air vent buffer portion behind the tooth portion and the air plate settled portion, injecting a thermoplastic resin into the common substrate settled portion, and sealing the plurality of semiconductor chips with a common thermoplastic resin encapsulation layer; It is characterized in that it comprises a step of removing the thermoplastic resin is injected and cured into the negative portion and the thermoplastic resin encapsulation layer and the common substrate to be cut into individual semiconductor chip units.

Next will be described in detail with reference to the accompanying drawings, a preferred embodiment of the present invention semiconductor package molding device and a semiconductor package molding method using the same.

4 shows a molding apparatus according to an embodiment of the present invention. As shown in FIG. 4, the molding apparatus according to an embodiment of the present invention includes a lower mold 10 and an upper mold 20.

The lower mold 10 fixes and seats the common substrate 10 to which the plurality of semiconductor chips, which are to be molded, are fixed, is fixed to the bottom surface 10a.

In addition, the upper mold 20 flows encapsulating resin into the common substrate settling portion C and the common substrate settled portion C, which are spaces to be molded of the semiconductor package, by mutual coupling with the lower mold 10. The gate G which is a passage for forming is formed.

In addition, the upper mold 20 and the lower mold 10 form an air vent buffer part B1 and a fluidity control buffer part B2 by mutual coupling.

The air vent buffer portion B1 is located behind the common substrate settlement C, that is, the rear boundary portion RT of the common substrate settlement C and the lower mold and the upper mold (hereinafter, simply referred to as the rear boundary portion RT). It is formed between the ') and the thermoplastic resin to fill the common substrate set-up portion (C) when filling the air in the common substrate set-up portion (C) and at the same time voids (void) and inside the common substrate set-up (C) It is a space in which the thermoplastic resin, which is an encapsulant, may be introduced so that an unfilled space does not occur.

In addition, the fluidity control buffer part B2 is formed between the gate G and the common substrate setter C, so that the encapsulating resin flowing from the gate G is uniformly pressured. The space part for discharging to inside.

In addition, the upper surface B2 _T of the fluidity control buffer part B2 is implemented in a curved shape, and the gate G is tapered so that the bottom surface G _B is inclined upward.

5 is a plan view of an inner space formed by the lower mold 10 and the upper mold 20. As shown in Figure 5, the width of the gate (G) is implemented in a shape that is wider from the entrance to the exit, that is, a line narrowed halo shape.

Next, a process of molding the semiconductor package by the thermoplastic resin by the lower mold 10 and the upper mold 20 having the shape and structure as described above will be described.

FIG. 6 is a longitudinal cross-sectional view of an operation of molding a semiconductor package using a molding apparatus of FIG. 4.

The cylinder 50 is connected to the inlet of the gate G to discharge the thermoplastic resin 40 by the pressure of the piston 52.

In one embodiment of the present invention, the thermoplastic resin used as the encapsulant is, for example, Liquid Crystal Polymers (LCP) or Poly Phenylene Sulfide (PPS).

Thermoplastic resin used in one embodiment of the present invention is excellent in high heat resistance (melting point 260 ℃ or more).

6 illustrates a cross-sectional flow of resin in which the thermoplastic resin 40 is discharged through the gate G by the pressure of the piston 52 and flows into the common substrate setter C. have.

7 is an operation cross-sectional view of thermoplastic resin molding of a semiconductor package using the molding apparatus of FIG. 4. In FIG. 7, the thermoplastic resin 40 is discharged through the gate G to form the inside of the common substrate mounting portion C. FIG. The planar flow of resin entering the furnace is shown.

As shown in FIG. 6 and FIG. 7, the thermoplastic resin 40 introduced into the gate G by the pressure of the piston 52 is common to the fluidity control buffer part B2 by the shape of the gate G. FIG. It discharges, forming a high discharge pressure and uniform resin flow to the board | substrate set-up part C. FIG.

In other words, the flow that is curled by the shape of the gate G of the line narrowing backlight is not formed, and at the same time, the flow is uniformly formed on the entire surface. Since the upper surface B2 _T of the gate G is formed to be curved, a phenomenon in which the resin flow is curled does not occur.

In addition, since the bottom surface G _B is formed to be inclined upwardly, the exit of the gate G is very narrow compared to the inlet, so that the discharge pressure of the thermoplastic resin becomes very high, and as a result, the thermoplastic flows into the flow control buffer part B2. The speed of the resin is very fast.

The thermoplastic resin that has passed through the gate G flows into the fluid control buffer portion B2 before flowing into the molding region in which the common substrate 30 is placed. In this case, the fluid control buffer portion B2 is injected with the thermoplastic resin. The pressure is adjusted to allow the thermoplastic resin 40 to flow into the common substrate set-up portion C at a uniform pressure across the entire surface.

The thermoplastic resin 40 that has passed through the gate G fills all of the fluidity control buffer part B2 and then has a common substrate mounting part C, which is a molding region in which the common substrate 30 is fixed and held at a uniform injection pressure. Flows into.

The common substrate 30 may flow due to the resin flow of the thermoplastic resin injected into the common substrate setter C. In an embodiment of the present invention, a heat resistant double-sided adhesive tape (not shown) is used. The common substrate 30 is fixed to the lower mold 20.

In another embodiment of fixing the common substrate 30 to the lower mold 20, the common substrate 30 and the lower mold 20 may be fastened by fixing pins (not shown).

The thermoplastic resin introduced into the common substrate mounting portion C encapsulates the plurality of semiconductor chips 35 while forming a resin flow as shown in FIGS. 6 and 7.

In the process of encapsulating the common substrate 30, the air inside the common substrate mounting portion C is exhausted to the air vent buffer portion B1. In an embodiment of the present invention, since the thickness of the common substrate 30 is 0.2 to 0.3 mm, the thickness of the semiconductor chip 35 is 0.35 mm, and the height of the common substrate settlement portion C is 0.6 to 1.2 mm, All of the trace amount of air inside the substrate set-up portion C can be discharged to the air vent buffer portion B1. As a result, it is possible to remove the voids that may occur during the sealing process by the thermoplastic resin.

The thermoplastic resin 40 encapsulating the plurality of semiconductor chips 35 of the common substrate setter C is introduced into the air vent buffer unit B1 while filling the common substrate setter C.

8 is a state diagram filled with the thermoplastic resin by the above process. As shown in FIG. 8, the air vent buffer portion B1 may be formed at the common substrate settlement C and the rear boundary RT, and thus may be formed in the rear upper region C1 of the common substrate settlement C. As shown in FIG. Unfilled resin does not occur.

That is, since the region filled with the thermoplastic resin is not terminated by the common substrate settlement portion C but extends to the air vent buffer portion B1, the resin is not filled in the rear upper region C1 of the common substrate settlement portion C. The phenomenon does not occur.

As shown in FIG. 11, the voids V, which can be trapped in the actual common substrate settlement portion C, are sent to the air vent buffer portion B1, and the voids V are formed in the common substrate settlement portion C region. There is no.

FIG. 9 is a perspective view of a molded thermoplastic resin encapsulation body 40 '(hereinafter referred to simply as an encapsulation body 40') in the case where the upper mold and the lower mold are separated after encapsulating the semiconductor chip with a thermoplastic resin. Is shown.

After the encapsulation process is completed, a portion of the encapsulation body 40 'that is molded by the gate G, the air vent buffer part B1, and the fluidity control buffer part B2 is cured to remove the cured thermoplastic resin part. The process is carried out.

As shown in FIG. 9, since the bottom surface G _B of the gate G is formed to be inclined upward, it is difficult to remove the part molded by the gate G from the thermoplastic resin encapsulation 40 ′ of FIG. 9. It becomes easy.

The molding portion formed by the air vent buffer portion B1 and the fluidity control buffer portion B2 is independent of the semiconductor package because the molded portion is not related to the semiconductor package.

After removing each of the gate G, the air vent buffer part B1, and the fluidity control buffer part B2 from the encapsulation body 40 'as described above, the thermoplastic resin encapsulation layer 40 ″ and the common substrate 30 are removed. The semiconductor package is completed by cutting the N in a pattern printed in advance on the common substrate 30.

The above embodiments of the present invention are merely one embodiment of the technical idea of the present invention, and of course, other modifications are possible within the technical idea of the present invention.

The semiconductor package molding apparatus and the semiconductor package molding method using the same according to the present invention having the above configuration and process have the following effects.

First, in the case of using a conventional thermosetting resin, the molding time is long because the molding temperature is increased while the mold temperature is increased. Molding process time is shortened.

Second, since the heat resistant thermoplastic resin is used as the encapsulating material, the heat resistance characteristics of the semiconductor package are improved, and as a result, the high heat resistant semiconductor package according to the present invention can be used even in a Pb-free real PCB mounting environment. It can be effective.

Third, since the molding process time is faster as described above, there is an effect of increasing the productivity of the product.

Fourth, since the thermoplastic resin is used as the encapsulant, there is an effect that the encapsulant can be recycled.

Fifth, when the thermoplastic resin used as the encapsulant as the PPS, the product cost is significantly reduced.

Claims (6)

In a semiconductor package molding device: A lower mold having a bottom surface on which a common substrate on which a plurality of semiconductor chips, which are to be molded, are fixed, is placed; Comprising an upper mold to form a common substrate set-up portion to be molded space by mutual coupling with the lower mold, A gate for introducing a thermoplastic resin from a water support is formed at the tip side of the mold in communication with the common substrate settled portion. A buffer portion for adjusting fluidity of the thermoplastic resin is formed over the entire surface of the mold near the front end of the common substrate settled portion so that the thermoplastic resin flowing from the gate flows into the common substrate settled portion at a uniform pressure. And an air vent buffer portion formed parallel to the fluidity control buffer portion over the entire surface of the mold near the rear end of the common substrate settle portion so that air in the common substrate settled portion into which the thermoplastic resin flows is exhausted. Semiconductor package molding apparatus. delete According to claim 1, wherein the fluidity control buffer unit, The semiconductor package molding apparatus, characterized in that the upper surface is formed by the curved shape when viewed in section. delete The method of claim 1, wherein the gate, The semiconductor package molding apparatus, characterized in that the bottom surface is provided with an inclined upward surface when viewed from the cross section so that the discharge pressure of the thermoplastic resin is increased. delete

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