CN113293420A - Electroplating device for printed circuit board - Google Patents
Electroplating device for printed circuit board Download PDFInfo
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- CN113293420A CN113293420A CN202110631417.8A CN202110631417A CN113293420A CN 113293420 A CN113293420 A CN 113293420A CN 202110631417 A CN202110631417 A CN 202110631417A CN 113293420 A CN113293420 A CN 113293420A
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- electroplating
- circuit board
- printed circuit
- tank body
- propeller blade
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a printed circuit board electroplating device, and belongs to the technical field of printed circuits. The invention relates to a printed circuit board electroplating device, which comprises a rectangular electroplating tank body, an anode, a transmission rod, a transmission gear, a propeller blade, a clamp, a cross beam and a power part, wherein the anode is arranged on the electroplating tank body; anodes are arranged at two ends of the long edge of the electroplating tank body, the printed circuit board is vertically immersed in electroplating solution through the clamp, propellers are arranged between the anodes and the printed circuit board in parallel, and the propellers on two sides of the printed circuit board are arranged at intervals and are immersed in the electroplating solution. According to the invention, the power part drives the transmission rod and the gear to rotate, the transmission assembly pushes the propeller to rotate, the propeller pushes electroplating liquid to flow to the circuit board, and the pressure difference generated on the two surfaces of the board pushes the plating liquid to pass through the drilled holes on the printed circuit board, so that the plating liquid in the holes is fully exchanged, and the electroplating efficiency of the drilled holes with high thickness-diameter ratio is improved. The electroplating device can be used as an accessory to be arranged in the electroplating bath of a gantry line and a vertical continuous electroplating line, and realizes high-efficiency disturbance on the electroplating solution.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a printed circuit board electroplating device.
Background
With the development of 5G technology, electronic products have been reduced in size and increasingly complex in function, and the functions of these electronic products must be realized by means of electronic components and electrical interconnections between the electronic components. The speed of development of printed circuit boards as the primary carrier for electrical interconnections between electronic components necessarily limits the pace at which 5G technology advances. The printed circuit board is gradually developed from a single-layer board to a multi-layer board, and as the functions of electronic products are more complicated, the printed circuit board is continuously developed toward high density, high precision and high reliability.
In order to meet the requirements of smaller volume, lighter weight and higher reliability of electronic products, the technology of buried holes and blind holes is applied to a printed circuit board, and the buried blind holes and through holes are relied to carry out multilevel arbitrary layer interconnection to manufacture a high-density interconnection printed circuit board. With the development of the 5G communication technology, the number of required circuit board layers is increased, the thickness-diameter ratio of the through hole is increased, and the exchange of plating solution in the through hole is difficult, so that the thickness requirement of a copper electroplating layer in the through hole cannot be met. Traditional electroplating equipment gantry line adopts the mode of bottom pumping up, starts to drive the plating solution from the coating bath below and moves from bottom to top for the flow of plating solution improves downthehole plating solution exchange, and perpendicular continuous electroplating line adopts the mode of jet flow more, forces the motion of face plating solution through the efflux of the jet flow pipe just to the face, but this kind of mode is not strong to the pertinence of downthehole aqueduct exchange, and downthehole copper electroplating effect promotes and is not obvious. And jet flow of the jet pipe needs a motor with larger power, so that the energy loss is large and the utilization rate is not high.
Therefore, plating solution exchange is required to be carried out on the micro through holes in electroplating in a targeted manner, the flowing speed of the plating solution in the holes is improved, so that sufficient copper ions and uniformly distributed additives in the plating solution in the holes are ensured, and the electroplating quality of the hole walls is improved. At present, a published patent has been to improve the flowing speed of the plating solution by changing the flow disturbing manner, for example, a flow disturbing component is designed by Yuanwang et al (patent publication No. CN 110629263A) and has sliding blades arranged at both ends of a printed circuit board as the plating solution, and a blade holder of the flow disturbing component drives the blades to swing back and forth along the horizontal direction so as to push the plating solution to flow. The structure of a screw stirring roller and the like arranged at the bottom of an electroplating bath designed by Sunshiming et al (patent publication No. CN 209162229U), wherein the screw stirring roller rotates at the bottom to achieve the effect of disturbing the plating solution. The plating solution uniform stirring device designed by patent publication No. CN 211872138U includes a stirring mechanism rotating horizontally and vertically, and the plating solution is driven to flow by the rotation of a stirring sheet of the stirring mechanism. Niyulin et al (patent publication No. CN 111893544A) designed an electroplating bath device comprising a stirring disc and a swinging mechanism, wherein the stirring disc is in transmission connection with the swinging mechanism, and the uniform stirring of the plating solution is realized by the directional movement of the stirring disc through the swinging mechanism. The gantry type electric spraying device designed by Kangmin et al (patent publication No. CN 207016873U) sucks the plating solution by driving a pump, sprays the plating solution at an anode, and can adjust the gap between a workpiece and the two electrodes and transversely move a nozzle at the anode to change the flow of the sprayed plating solution.
In the above patent, the flow speeds of the plating solutions on the two sides of the printed circuit board are different by disturbing the plating solutions, and pressure difference is generated on the two sides of the printed circuit board to promote the plating solutions to flow in the drilled holes. However, the pertinence of the plating solution to the flowing in the hole is not obvious, the exchange of the plating solution in the hole cannot be ensured to be sufficient, and the prior art cannot meet the current micro-through hole metallization requirement along with the increasing of the thickness-diameter ratio of the 5G communication circuit board, so that an electroplating device capable of effectively carrying out forced convection on the plating solution in the hole needs to be redesigned and developed.
Disclosure of Invention
The invention aims to solve the technical problem that the traditional electroplating device is insufficient in deep plating capacity of drilling holes in a printed circuit board, and provides an electroplating device for the printed circuit board. The plating apparatus of the present invention can be installed in plating baths of gantry lines and vertical continuous plating lines to increase the flow rate of the plating solution.
In order to solve the technical problem, the embodiment of the invention provides a printed circuit board electroplating device, which comprises a rectangular electroplating tank body 1, an anode 2, a transmission rod 3, a transmission gear 4, a propeller blade 5, a clamp 6, a cross beam 7 and a power part, wherein the rectangular electroplating tank body is provided with a plurality of rectangular electroplating tanks;
the electroplating tank body 1 is used for containing electroplating solution, the long side surface of the electroplating tank body 1, the anode 2, the propeller blades 5 and the cross beam 7 are sequentially arranged at intervals, and the anode 2 is fixedly arranged at the bottom of the electroplating tank body 1; the beam 7 is erected on the short side surface of the electroplating tank body 1, a plurality of clamps 6 are arranged on the beam 7, and the clamps 6 are used for clamping a printed circuit board 8 to ensure that the printed circuit board 8 is immersed in the plating solution;
connect drive gear 4 the one end fixed mounting of transfer line 3 electroplates the short side of cell body 1, the other end of transfer line 3 extends to in electroplating cell body 1, drive gear 4 is used for realizing the transmission between the equidirectional transfer line 3, and is a plurality of 5 cross arrangement of propeller blade are in the printed circuit board both sides on the transfer line 3, it is a plurality of 5 be on a parallel with propeller blade 8 directions are placed, power part is a plurality of 5 rotations of propeller blade provide power, transfer line 3 and drive gear 4 give power part energy transfer for a plurality of propeller blade 5, 5 rotations of propeller blade make plating solution force convection current perpendicular flow to printed circuit board 8.
The invention has the beneficial effects that: compared with the traditional jet flow or bubbling, the invention can force convection to make the plating solution flow to the circuit board vertically, and the plating solution in the plating bath forms macroscopic circulation through the stirring of the propeller blade, so that the solution can pass through the micropores more easily, and the rapid mass transfer in the pores is realized. In addition, the circulation flow formed in the plating bath can improve the power efficiency of the plating solution, thereby improving the utilization rate of the energy of power parts and improving the condition that the conventional jet flow device greatly loses kinetic energy when encountering the plate surface after the plating solution is sprayed. Therefore, the invention adopts the mode of forced convection of the propeller blades to improve the flowing speed of the plating solution, and forces the plating solution to flow in the drill hole by increasing the pressure difference of two surfaces of the circuit board, thereby ensuring that various additives flow in the drill hole, obviously improving the electroplating efficiency and the plating quality in the hole, and overcoming the defects of unobvious plating solution exchange effect and low motor energy utilization rate in the drill hole.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, a groove is formed in the side face of the short side of the electroplating tank body 1, an arbor wheel 10 is installed in the groove, and the arbor wheel 10 is used for installing and connecting one end of the transmission rod 3 of the transmission gear 4.
The beneficial effect of adopting the further scheme is that: the shaft wheel for mounting the transmission rod 3 is arranged at the groove to reduce energy loss caused by mechanical friction when the transmission rod rotates.
Further, the bottom of the electroplating tank body 1 is provided with at least one water outlet.
The beneficial effect of adopting the further scheme is that: the cleaning of the tank body and the discharge of the plating solution are convenient.
Further, the width of the electroplating tank body 1 is 800-1200 mm.
The beneficial effect of adopting the further scheme is that: the width of the plating bath is as narrow as possible to reduce the flow rate attenuation of the liquid in the direction of vertical flow to the printed circuit board to promote the circulation of the plating solution in the plating bath, and to reduce the volume of the plating bath to reduce the amount of the plating solution used.
Furthermore, the side length of the electroplating tank body 1 is 1000 multiplied by 5000 mm.
Further, the anode 2 is a metal mesh cuboid groove, a plurality of spacing baffle plate groove bodies are arranged in the metal mesh cuboid groove, the spacing baffle plate groove bodies are arranged at intervals along the long edge direction of the metal mesh cuboid groove, and a metal frame filled with copper balls is placed in the spacing baffle plate groove bodies and used for supplementing copper ions for electroplating liquid.
The beneficial effect of adopting the further scheme is that: for providing sufficient cations to the plating solution.
Furthermore, the bottom of the electroplating tank body 1 is provided with a fixed clamping groove for placing the anode 2.
Further, the length and the height of the anode 2 are equal to the length of the long edge of the electroplating tank body, the width of the anode 2 is 50-100mm, and the distance between the electroplating tank body 1 and the anode 2 is 50-100 mm.
Furthermore, the distance between the plurality of the partition baffle plate groove bodies is 100-200 mm.
Further, the main parameters of the propeller blade 5 are: the diameter of the impeller hub is 40-60 mm; the pitch angle of the impeller blade is 30-45 degrees; the number of the impeller blades is 3-4; the width of the impeller blade is 60-80 mm; the diameter of the impeller is 400 mm and 800 mm.
Further, the distance between the propeller blades 5 is 300-.
Further, the clamp 6 is a metal conductive clamp, the outer layer of the metal conductive clamp is wrapped by insulating rubber, and the clamp 6 clamps the contact surface of the printed circuit board, so that metal leaks out to conduct the cathode.
Further, the distance between the clamps 6 is 50-100 mm.
Furthermore, a sliding roller is arranged on the side surface of the short side of the electroplating tank body 1 and used for driving the beam 7 to drive the clamp 6 to move.
The beneficial effect of adopting the further scheme is that: a crossbeam frame for sectional fixture installs the slip gyro wheel in plating bath both sides, can make the crossbeam drive anchor clamps at lateral shifting for printed circuit board can be in the transverse shifting of coating bath, can increase the relative speed that plating bath flows to printed circuit board perpendicularly.
Further, the diameter of a transmission rod connected with the propeller blade is determined by the impeller hub, the diameter of the transmission rod connected with the transmission gear is determined by the diameter of the transmission gear, and the transmission rod is fixed by the wheel shaft.
Further, the power component is a motor, an air pump or a liquid pump.
Further, the distance between the anode and the long edge of the electroplating tank body 1 is 50-100 mm.
Drawings
FIG. 1 is a schematic structural diagram of a PCB electroplating apparatus according to an embodiment of the present invention;
FIG. 2 is a top view of a PCB plating apparatus according to an embodiment of the present invention;
FIG. 3 is a front view of a PCB plating apparatus according to an embodiment of the present invention;
FIG. 4 is a side view of a PCB plating apparatus according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a spoiler assembly propeller of a PCB electroplating apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a portion of a spoiler assembly of an electroplating apparatus for a printed circuit board according to an embodiment of the present invention;
FIG. 7 is a schematic view of the liquid circulation under the operation of the electroplating apparatus for PCB according to the embodiment of the present invention;
FIG. 8 is a slice view of a conventional through-hole plated by air blowing;
FIG. 9 is a slice view of a via hole opening after via plating using conventional air blowing;
FIG. 10 is a slice view of a printed circuit board electroplating apparatus according to an embodiment of the present invention after through hole electroplating;
fig. 11 is a slice view of a via opening after via plating using a printed circuit board plating apparatus of an embodiment of the invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. electroplating cell body, 2, positive pole, 3, transfer line, 4, drive gear, 5, propeller blade, 6, anchor clamps, 7, crossbeam, 8, printed circuit board, 9, shaft.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 to 4, a printed circuit board electroplating apparatus according to a first embodiment of the present invention includes a rectangular electroplating tank 1, an anode 2, a transmission rod 3, a transmission gear 4, a propeller blade 5, a clamp 6, a beam 7 and a power component;
the electroplating tank body 1 is used for containing electroplating solution, the long side surface of the electroplating tank body 1, the anode 2, the propeller blades 5 and the cross beam 7 are sequentially arranged at intervals, and the anode 2 is fixedly arranged at the bottom of the electroplating tank body 1; the beam 7 is erected on the short side surface of the electroplating tank body 1, a plurality of clamps 6 are arranged on the beam 7, and the clamps 6 are used for clamping a printed circuit board 8 to ensure that the printed circuit board 8 is immersed in the plating solution;
connect drive gear 4 the one end fixed mounting of transfer line 3 electroplates the short side of cell body 1, the other end of transfer line 3 extends to in electroplating cell body 1, drive gear 4 is used for realizing the transmission between the equidirectional transfer line 3, and is a plurality of 5 cross arrangement of propeller blade are in the printed circuit board both sides on the transfer line 3, it is a plurality of 5 be on a parallel with propeller blade 8 directions are placed, power part is a plurality of 5 rotations of propeller blade provide power, transfer line 3 and drive gear 4 give power part energy transfer for a plurality of propeller blade 5, 5 rotations of propeller blade make plating solution force convection current perpendicular flow to printed circuit board 8.
In the above embodiment, the anode is used to place copper balls to provide sufficient cations for electroplating.
As shown in fig. 5-6, the propeller blade mounted parallel to the printed circuit board can make the plating solution flow vertically to the board when the propeller rotates, so that the plating solution inside and outside the through hole on the board generates a pressure difference to promote the liquid in the hole to flow, thereby achieving the purpose of plating solution exchange in the hole. The two sides of the printed circuit board are provided with the propeller blades, and under the flowing state of the plating solution, the plating solution on the two sides of the printed circuit board forms pressure difference to force the plating solution to flow towards the drilled hole, and in addition, as shown in figure 7, the power efficiency of the plating solution can be improved by the circulation formed by the plating solution, so that the energy utilization rate of the rotation of the propeller blades is improved. And calculating the relation between the blade rotation speed and the plating solution flow rate by a finite element method to finally obtain the flow rate of the plating solution reaching the printed circuit board. Fluid pressure at two sides of the drill hole is obtained by Bernoulli equation, the flow speed of the plating liquid in the drill hole can be calculated, and the improvement degree of the deep plating capability in the drill hole can be obtained.
The printed circuit boards are placed in the long side direction to increase the number of printed circuit boards plated at the same time.
The distance between the propeller blade and the printed circuit board, the rotating speed of the propeller blade and the main parameters of the propeller structure can be designed by a person skilled in the art according to the dynamic viscosity of the plating solution and the size of a plating bath. The distance between the propeller blade and the printed circuit board is required to be as small as possible, and the purpose is to reduce the flow velocity attenuation caused by the dynamic viscosity of the plating solution. The rotating speed of the propeller blade is as high as possible, and the specific rotating speed is considered from the influence factors of the type of the electroplating plate, the viscosity of the electroplating solution, the power of the selected motor and the like. The specific matching of the power parts needs to be selected according to the capacity of a production line, the size of an electroplating tank body, the viscosity of plating solution, the number of propellers, the size and the shape of propeller blades and the like.
Optionally, a groove is formed in the side face of the short side of the electroplating tank body 1, an arbor 10 is installed in the groove, and the arbor 10 is used for installing and connecting one end of the transmission rod 3 of the transmission gear 4.
The above embodiment provides the shaft wheel for mounting the driving rod 3 at the groove to reduce the energy loss caused by mechanical friction when the driving rod rotates. The size of the inner diameter of the axle is determined by the size of the transmission rod, and in the example, a 40mm inner diameter axle can be selected.
Optionally, at least one water outlet is arranged at the bottom of the electroplating tank body 1.
The embodiment is convenient for cleaning the tank body and discharging the plating solution.
Optionally, the width of the electroplating tank body 1 is 800-1200 mm.
In the above embodiments, the width of the plating tank is as narrow as possible to reduce the flow rate attenuation of the plating solution in the direction of vertical flow to the printed circuit board, to promote the circulation of the plating solution in the plating tank, and to reduce the volume of the plating tank to reduce the amount of the plating solution used.
Optionally, the side length of the electroplating tank body 1 is 1000 × 5000 mm.
Optionally, the anode 2 is a metal mesh cuboid groove, a plurality of partition baffle plate groove bodies are arranged in the metal mesh cuboid groove, the partition baffle plate groove bodies are arranged at intervals along the long side direction of the metal mesh cuboid groove, and a metal frame filled with copper balls is placed in the partition baffle plate groove bodies and used for supplementing copper ions for the electroplating solution.
The above embodiments are used to provide sufficient cations for the plating solution.
Optionally, the bottom of the electroplating tank body 1 is provided with a fixed clamping groove for placing the anode 2.
Optionally, the length and height of the anode 2 are equal to the length of the long side of the electroplating tank body, the width of the anode 2 is 50-100mm, and the distance between the electroplating tank body 1 and the anode 2 is 50-100 mm.
Optionally, the spacing between the plurality of spaced baffle slots is 100 and 200 mm.
Optionally, the main parameters of the propeller blade 5 are: the diameter of the impeller hub is 40-60 mm; the pitch angle of the impeller blade is 30-45 degrees; the number of the impeller blades is 3-4; the width of the impeller blade is 60-80 mm; the diameter of the impeller is 400 mm and 800 mm.
Optionally, the main parameters of the propeller blade 5 are: the diameter of the impeller hub is 40 mm; the pitch angle of the impeller blades is 45 degrees; the number of the impeller blades is 4; the width of the impeller blade is 60 mm; the impeller diameter is 500 mm.
Optionally, the distance between the propeller blades 5 is 300-500mm, and the distance between the propeller blades 5 and the printed circuit board 8 is 100-200 mm.
In the above embodiment, the distance between the propeller blades is set according to the attenuation of the flow velocity of the plating solution flowing vertically to the printed circuit board, the propeller blades are arranged on both sides of the printed circuit board, and the propeller blades on both sides rotate in the same direction, so that the propeller blades ensure that the plating solution has a stable velocity in a vertical flow direction on the board surface by forced convection.
Optionally, the propeller blade 5 is spaced from the printed circuit board 8 by 150 mm.
Optionally, the clamp 6 is a metal conductive clamp, the outer layer of the metal conductive clamp is wrapped by insulating rubber, and the clamp 6 clamps the contact surface of the printed circuit board, and metal leaks out to conduct the cathode.
Optionally, the distance between the clamps 6 is 50-100 mm.
Optionally, a sliding roller is arranged on the side of the short side of the electroplating tank body 1, and is used for driving the clamp 6 to move by the beam 7.
In the above embodiment, the beam for mounting the clamp is arranged on two sides of the electroplating bath, and the sliding rollers are arranged on two sides of the beam, so that the beam drives the clamp to move transversely, the printed circuit board can move transversely in the electroplating bath, and the relative speed of the plating solution flowing to the printed circuit board vertically can be increased.
Alternatively, the diameter of the drive rod connected to the propeller blades is determined by the impeller hub, the diameter of the drive rod connected to the drive gear is determined by the diameter of the drive gear, and the mounting of the drive rod is fixed by the wheel axle.
In the above embodiment, in order to reduce the mechanical energy loss in the transmission process, the arrangement of the transmission rod and the gear is as small as possible, the transmission rod is fixed by the shaft wheel to reduce the energy loss, and in this embodiment, the diameter of the transmission rod is selected and matched to be 40 mm.
Optionally, the power component is an electric motor, an air pump or a liquid pump.
In the above embodiment, when the power unit is a motor, one motor may be used to drive a plurality of propellers to rotate. The number of the motors can be quantified according to the number of the propellers, in general, one motor is connected with 2-3 propellers, in the embodiment, two motors are selected and connected with transmission rods on two sides of the plating bath, and the transmission rods connected with the motors are provided with wheel shafts on the upper parts of two sides of the plating bath so as to reduce mechanical friction.
The power part can also be a pneumatic motor which can be directly connected with the propeller blade, so that the transmission device does not need to be arranged again, and the original pipeline connection can be directly used for providing power.
Optionally, the distance between the anode and the long side of the electroplating tank body 1 is 50-100 mm.
Compared with the depth capability of the through hole after electroplating by adopting the electroplating method of the embodiment of the invention and the traditional electroplating method, the depth capability is tested by a test board with the thickness of 1.3mm, and the electroplating time of the electroplating current density is the same. The electroplating effect by the conventional air blowing method is shown in fig. 8-9, and the electroplating effect by the present invention is shown in fig. 10-11. It can be clearly observed in the figure that the copper plating on the two sides of the plate is not uniform in growth and the deposition speed of the copper at the orifice is higher than that in the hole in the traditional electroplating mode, so that the deposition thickness of the copper at the orifice is higher than that in the hole, and the deep plating capacity of the center of the hole is about 50 percent. The invention can obviously show that the copper deposition speed at each position in the hole is the same, the copper deposition at the orifice is uniform, and the electroplating deep plating capacity of the through hole reaches 81 percent.
In the electroplating device for the printed circuit board, anodes are arranged at two ends of the long edge of an electroplating tank body, the printed circuit board is vertically immersed in electroplating solution through a clamp, a plurality of propellers are arranged between the anodes and the printed circuit board in parallel, and the propellers are arranged at intervals at two sides of the printed circuit board and immersed in the electroplating solution. According to the invention, the power part drives the transmission rod and the gear to rotate, the transmission assembly pushes the propeller to rotate, the propeller pushes electroplating liquid to flow to the circuit board, and the pressure difference generated on the two surfaces of the board pushes the plating liquid to pass through the drilled holes on the printed circuit board, so that the plating liquid in the holes is fully exchanged, and the electroplating efficiency of the drilled holes with high thickness-diameter ratio is improved. The electroplating device of the printed circuit board can be used as an accessory to be arranged in an electroplating bath of a gantry line and a vertical continuous electroplating line, so that the electroplating solution can be efficiently disturbed.
Compared with the traditional jet flow or bubbling forced convection, the turbulent flow component of the electroplating device can make the plating solution flow to the printed circuit board vertically, and the flowing condition of the plating solution in the electroplating bath is calculated by a finite element method.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A printed circuit board electroplating device is characterized by comprising a rectangular electroplating tank body (1), an anode (2), a transmission rod (3), a transmission gear (4), a propeller blade (5), a clamp (6), a cross beam (7) and a power component;
the electroplating tank body (1) is used for containing electroplating solution, the long side surface of the electroplating tank body (1), the anode (2), the propeller blade (5) and the cross beam (7) are sequentially arranged at intervals, and the anode (2) is fixedly arranged at the bottom of the electroplating tank body (1); the cross beam (7) is erected on the short side surface of the electroplating tank body (1), a plurality of clamps (6) are arranged on the cross beam (7), and the clamps (6) are used for clamping a printed circuit board (8) to enable the printed circuit board (8) to be immersed in plating solution;
connect drive gear (4) the one end fixed mounting of transfer line (3) electroplate the minor face side of cell body (1), the other end of transfer line (3) extends to in electroplating cell body (1), drive gear (4) are used for realizing the transmission between different direction transfer line (3), and are a plurality of propeller blade (5) cross arrangement is in printed circuit board both sides on transfer line (3), and is a plurality of propeller blade (5) are on a parallel with printed circuit board (8) direction is placed, power part is a plurality of propeller blade (5) rotate and provide power, transfer line (3) and drive gear (4) transmit power part energy for a plurality of propeller blade (5), propeller blade (5) rotate and make plating bath compulsory convection current perpendicular flow direction printed circuit board (8).
2. The electroplating device for the printed circuit board according to claim 1, wherein a groove is formed in the side face of the short side of the electroplating tank body (1), the shaft wheel (10) is installed in the groove, and the shaft wheel (10) is used for installing and connecting one end of the transmission rod (3) of the transmission gear (4).
3. A printed circuit board electroplating device according to claim 1, characterized in that the bottom of the electroplating tank body (1) is provided with at least one water outlet.
4. The electroplating device for the printed circuit board as claimed in claim 1, wherein the anode (2) is a metal mesh cuboid groove, a plurality of partition baffle plate groove bodies are arranged in the metal mesh cuboid groove at intervals along the long side direction of the metal mesh cuboid groove, and a metal frame filled with copper balls is placed in the partition baffle plate groove bodies for supplementing copper ions for the electroplating solution.
5. A printed circuit board electroplating device according to any one of claims 1 to 4, characterized in that the bottom of the electroplating tank body (1) is provided with a fixing clamping groove for placing the anode (2).
6. The electroplating device for printed circuit board according to any one of claims 1 to 4, wherein the distance between the plurality of propeller blades (5) is 300-500mm, and the distance between the propeller blades (5) and the printed circuit board (8) is 100-200 mm.
7. A PCB electroplating device according to any one of claims 1-4, characterized in that the clamp (6) is a metal conducting clamp, the outer layer of the metal conducting clamp is wrapped by insulating rubber, and the clamp (6) clamps the contact surface of the PCB to leak metal for conducting the cathode.
8. A PCB electroplating device according to any one of claims 1 to 4, wherein the short side of the electroplating tank body (1) is provided with a sliding roller for enabling the beam (7) to drive the clamp (6) to move.
9. A printed circuit board electroplating apparatus according to any one of claims 1 to 4, wherein the diameter of the drive rod connected to the propeller blade is determined by the impeller hub, the diameter of the drive rod connected to the drive gear is determined by the diameter of the drive gear, and the drive rod is fixed by the wheel shaft.
10. A PCB plating device according to any one of claims 1 to 4, wherein the power component is a motor, an air pump or a liquid pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110631417.8A CN113293420A (en) | 2021-06-07 | 2021-06-07 | Electroplating device for printed circuit board |
Applications Claiming Priority (1)
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| JP2003247099A (en) * | 2002-02-21 | 2003-09-05 | Hitachi Ltd | Circuit plating method |
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