CN113281932A - TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method - Google Patents
TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method Download PDFInfo
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- CN113281932A CN113281932A CN202110588681.8A CN202110588681A CN113281932A CN 113281932 A CN113281932 A CN 113281932A CN 202110588681 A CN202110588681 A CN 202110588681A CN 113281932 A CN113281932 A CN 113281932A
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- cutting
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- lcd
- screen
- liquid crystal
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- 238000005520 cutting process Methods 0.000 title claims abstract description 161
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000010409 thin film Substances 0.000 title abstract description 7
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000012805 post-processing Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 40
- 238000003698 laser cutting Methods 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 238000003908 quality control method Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract 6
- 230000007797 corrosion Effects 0.000 abstract 6
- 239000007788 liquid Substances 0.000 abstract 4
- 230000002378 acidificating effect Effects 0.000 abstract 2
- 238000011156 evaluation Methods 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
Abstract
The invention discloses a method for improving the cutting strength of a TFT-LCD (thin film transistor-liquid crystal display) comprehensive screen, which relates to the technical field of fastener detection and comprises the following steps: (1) collecting data; (2) clamping and fixing; (3) cutting the screen comprehensively; (4) performing post-processing; (5) packaging a screen; (6) and (5) quality inspection. The TFT-LCD full screen cutting strength improving method comprises the steps that corrosive liquid in a corrosive liquid preparation process is acidic corrosive liquid, corrosion resistance of a fastener sample is detected by utilizing the corrosion effect of the acidic corrosive liquid, a detection result analyzing step is arranged after detection result identification, analysis and evaluation of data of the detection result can be realized, the corrosion type of the fastener and the corrosion resistance of the fastener under different temperature conditions are known and mastered under the condition that the humidity is constant, so that the corrosion degree of the fastener under different environment conditions is deduced, and the corrosion resistance result of the fastener obtained by detection of the detection method is more comprehensive.
Description
Technical Field
The invention relates to the technical field of TFT-LCD (thin film transistor-liquid crystal display) overall screen cutting, in particular to a method for improving the TFT-LCD overall screen cutting strength.
Background
A TFT-LCD (Thin film transistor liquid crystal display) is one of the most liquid crystal displays, which is applied to televisions, flat panel displays, and projectors. The thin film transistor liquid crystal display technology is a technology of skillfully combining a microelectronic technology and a liquid crystal display technology. The TFT-LCD panel can be seen as two glass substrates with a layer of liquid crystal sandwiched therebetween, the upper glass substrate is a color filter, and the lower glass substrate has a transistor embedded thereon. When the current passes through the transistor, the electric field changes to cause the liquid crystal molecules to deflect, so as to change the polarization of the light, and then the bright and dark states of the pixel are determined by utilizing the polaroid.
The existing screen cutting method cannot be suitable for fine cutting of a modern electronic full screen, the phenomenon that fragments are easy to appear due to stress during cutting exists, and the heat effect during cutting can damage an electronic crystal part inside the full screen.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for improving the cutting strength of a TFT-LCD (thin film transistor-liquid crystal display) full screen, which solves the problems that the existing screen cutting method proposed in the background technology cannot be suitable for the fine cutting of a modern electronic full screen, the phenomenon of fragments is easy to occur in stress during cutting, and the heat effect during cutting can damage the electronic crystal part in the full screen.
In order to achieve the purpose, the invention is realized by the following technical scheme, and the method for improving the cutting strength of the TFT-LCD comprehensive screen comprises the following steps:
(1) collecting data;
(2) clamping and fixing;
(3) cutting the screen comprehensively;
(4) performing post-processing;
(5) packaging a screen;
(6) and (5) quality inspection.
Optionally, the method for improving the cutting strength of the overall screen of the TFT-LCD includes the following specific steps:
(1) data acquisition
Firstly, collecting integral data of length, width, thickness and the like of a TFT-LCD comprehensive screen to be cut, acquiring corresponding cutting data according to cutting requirements, and setting a laser cutting route;
(2) and is clamped and fixed
Horizontally laying the TFT-LCD full screen to be cut on a workbench, and uniformly positioning and clamping the middle part and the upper and lower sides of the TFT-LCD full screen by adopting a clamp;
(3) full screen cutting
The upper layer glass substrate, the inner liquid crystal unit and the lower layer glass substrate of the TFT-LCD full screen are cut separately in a three-time cutting mode, so that the cutting precision and strength are improved;
(4) post-processing
Polishing the outer edges and corners of the cut TFT-LCD comprehensive panel blocks, and removing dust and residues to ensure that no foreign matter exists in the TFT-LCD comprehensive panel blocks;
(5) screen package
Vacuumizing the interior between the upper glass substrate and the lower glass substrate, then re-filling liquid crystal into the gap position of the edge, and performing pressurization packaging at the edge after sealing, so that the liquid crystal surface in the whole screen is complete, and the phenomenon that the image display precision in the later period is influenced by the blank at the edge is avoided;
(6) quality control
And carrying out size detection and internal crystal detection on the cut comprehensive screen panel block to ensure that the cut comprehensive screen panel block meets the quality production requirement.
Optionally, the full-screen cutting in step (3) includes the following specific processes:
a. one-time cutting
Firstly cutting an upper glass substrate of the TFT-LCD full screen along a cutting track, controlling the cutting depth, reserving a certain modifiable range between the connected cutting plates during cutting, and reserving a proper edge distance to ensure the frame strength;
b. second cutting
After preliminary cutting, exposing the lower glass substrate inlaid with the liquid crystal units at the edge of the cutting position, setting parameters for the liquid crystal units in the middle of the TFT-LCD comprehensive screen, setting a cutting track again, cutting off redundant liquid crystal units along a line, and cutting off damaged liquid crystal unit parts and capacitor parts generated by cutting at the edge part;
c. triple cutting
And cutting the lower glass substrate of the TFT-LCD comprehensive screen according to the cutting requirement, wherein the lower glass substrate and the upper glass substrate are kept consistent in edge position by adopting a laser cutting mode during cutting.
Optionally, in the step (3), one cutting in the full-screen cutting is performed by using an ultrasonic blade, ultrasonic waves are converted into mechanical vibration, and the focused ultrasonic waves perform high-frequency vibration cutting on a cutting position.
Optionally, the secondary cutting in the full-screen cutting in the step (3) adopts a laser cutting mode, specifically, an Amber picosecond infrared laser, the output pulse width of which is less than 15ps, and the beam quality M2 of which is less than 1.3.
Optionally, the three times of cutting in the step (3) of full screen cutting adopt a laser cutting mode, ultrafast laser has ultrashort pulses and ultrastrong characteristics, and extremely high peak light intensity can be obtained with low pulse energy.
The invention provides a method for improving the cutting strength of a TFT-LCD comprehensive screen, which has the following beneficial effects: the method for improving the cutting strength of the TFT-LCD comprehensive screen comprises the steps of cutting an upper glass substrate, an inner liquid crystal unit and a lower glass substrate of the TFT-LCD comprehensive screen separately, adopting different cutting modes aiming at different parts, optimizing the cutting method, being beneficial to improving the cutting precision and strength, adopting an ultrasonic blade to cut when cutting the upper glass substrate, converting ultrasonic waves into mechanical vibration without generating stress damage, simultaneously resonating to facilitate the stress release without generating fragments, being beneficial to controlling the cutting depth, adopting a laser cutting mode when cutting the liquid crystal unit in the middle of the TFT-LCD comprehensive screen, having lower ultrafast laser heat effect, avoiding the influence on a transistor due to the heat effect, simultaneously cutting redundant damaged liquid crystal unit parts to avoid the short circuit of the transistor, and simultaneously refilling liquid crystal to the edge gap position in the later period, and sealed package, this mode is favorable to improving the yields for the inside liquid crystal face of full face screen is complete, avoids the edge to have the picture display precision that blank influence later stage, and the suitable margin distance is reserved to the comprehensive screen panel piece in the cutting process and is favorable to guaranteeing frame intensity.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
A method for improving the cutting strength of a TFT-LCD full screen comprises the following steps:
(1) collecting data;
(2) clamping and fixing;
(3) cutting the screen comprehensively;
(4) performing post-processing;
(5) packaging a screen;
(6) and (5) quality inspection.
The method for improving the cutting strength of the TFT-LCD comprehensive screen comprises the following specific steps:
(1) data acquisition
Firstly, collecting integral data of length, width, thickness and the like of a TFT-LCD comprehensive screen to be cut, acquiring corresponding cutting data according to cutting requirements, and setting a laser cutting route;
(2) and is clamped and fixed
Horizontally laying the TFT-LCD full screen to be cut on a workbench, and uniformly positioning and clamping the middle part and the upper and lower sides of the TFT-LCD full screen by adopting a clamp;
(3) full screen cutting
The upper layer glass substrate, the inner liquid crystal unit and the lower layer glass substrate of the TFT-LCD full screen are cut separately in a three-time cutting mode, so that the cutting precision and strength are improved;
(4) post-processing
Polishing the outer edges and corners of the cut TFT-LCD comprehensive panel blocks, and removing dust and residues to ensure that no foreign matter exists in the TFT-LCD comprehensive panel blocks;
(5) screen package
Vacuumizing the interior between the upper glass substrate and the lower glass substrate, then re-filling liquid crystal into the gap position of the edge, and performing pressurization packaging at the edge after sealing, so that the liquid crystal surface in the whole screen is complete, and the phenomenon that the image display precision in the later period is influenced by the blank at the edge is avoided;
(6) quality control
And carrying out size detection and internal crystal detection on the cut comprehensive screen panel block to ensure that the cut comprehensive screen panel block meets the quality production requirement.
The full screen cutting in the step (3) comprises the following specific processes:
a. one-time cutting
Firstly cutting an upper glass substrate of the TFT-LCD full screen along a cutting track, controlling the cutting depth, reserving a certain modifiable range between the connected cutting plates during cutting, and reserving a proper edge distance to ensure the frame strength;
b. second cutting
After preliminary cutting, exposing the lower glass substrate inlaid with the liquid crystal units at the edge of the cutting position, setting parameters for the liquid crystal units in the middle of the TFT-LCD comprehensive screen, setting a cutting track again, cutting off redundant liquid crystal units along a line, and cutting off damaged liquid crystal unit parts and capacitor parts generated by cutting at the edge part;
c. triple cutting
And (3) cutting the lower layer glass substrate of the TFT-LCD comprehensive screen according to cutting requirements, wherein laser cutting is optional during cutting, an ultrasonic blade is adopted for cutting in one cutting in the step (3), ultrasonic waves are converted into mechanical vibration, and focused ultrasonic waves are used for carrying out high-frequency vibration cutting on the cutting position.
The secondary cutting in the step (3) of the overall screen cutting adopts a laser cutting mode, in particular to an Amber picosecond infrared laser, the output pulse width of the Amber picosecond infrared laser is less than 15ps, and the beam quality M2 is less than 1.3.
The three times of cutting in the step (3) of overall screen cutting adopt a laser cutting mode, ultrafast laser has ultrashort pulses and ultrastrong characteristics, and extremely high peak light intensity can be obtained with lower pulse energy.
In summary, the method for improving the cutting strength of the TFT-LCD full screen comprises the following steps:
(1) data acquisition
Firstly, collecting integral data of length, width, thickness and the like of a TFT-LCD comprehensive screen to be cut, acquiring corresponding cutting data according to cutting requirements, and setting a laser cutting route;
(2) and is clamped and fixed
Horizontally laying the TFT-LCD full screen to be cut on a workbench, and uniformly positioning and clamping the middle part and the upper and lower sides of the TFT-LCD full screen by adopting a clamp;
(3) full screen cutting
The upper layer glass substrate, the inner liquid crystal unit and the lower layer glass substrate of the TFT-LCD full screen are cut separately in a three-time cutting mode, so that the cutting precision and strength are improved;
a. one-time cutting
Firstly cutting an upper glass substrate of the TFT-LCD full screen along a cutting track, controlling the cutting depth, reserving a certain modifiable range between the connected cutting plates during cutting, and reserving a proper edge distance to ensure the frame strength; cutting by adopting an ultrasonic blade, converting ultrasonic waves into mechanical vibration, and focusing the ultrasonic waves to perform high-frequency vibration cutting on a cutting position;
b. second cutting
After preliminary cutting, exposing the lower glass substrate inlaid with the liquid crystal units at the edge of the cutting position, setting parameters for the liquid crystal units in the middle of the TFT-LCD comprehensive screen, setting a cutting track again, cutting off redundant liquid crystal units along a line, and cutting off damaged liquid crystal unit parts and capacitor parts generated by cutting at the edge part; the laser cutting mode is adopted, in particular to an Amber picosecond infrared laser, the output pulse width of the laser is less than 15ps, and the beam quality M2 is less than 1.3;
c. triple cutting
Cutting the lower glass substrate of the TFT-LCD comprehensive screen according to cutting requirements, wherein the lower glass substrate and the upper glass substrate are kept consistent in edge position in a laser cutting mode during cutting; by adopting a laser cutting mode, the ultrafast laser has ultrashort pulses and ultrastrong characteristics, and can obtain extremely high peak light intensity with lower pulse energy;
(4) post-processing
Polishing the outer edges and corners of the cut TFT-LCD comprehensive panel blocks, and removing dust and residues to ensure that no foreign matter exists in the TFT-LCD comprehensive panel blocks;
(5) screen package
Vacuumizing the interior between the upper glass substrate and the lower glass substrate, then re-filling liquid crystal into the gap position of the edge, and performing pressurization packaging at the edge after sealing, so that the liquid crystal surface in the whole screen is complete, and the phenomenon that the image display precision in the later period is influenced by the blank at the edge is avoided;
(6) quality control
And carrying out size detection and internal crystal detection on the cut comprehensive screen panel block to ensure that the cut comprehensive screen panel block meets the quality production requirement.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A method for improving the cutting strength of a TFT-LCD full screen is characterized by comprising the following steps:
(1) collecting data;
(2) clamping and fixing;
(3) cutting the screen comprehensively;
(4) performing post-processing;
(5) packaging a screen;
(6) and (5) quality inspection.
2. The method for improving the cutting strength of the TFT-LCD full screen according to claim 1, wherein the method for improving the cutting strength of the TFT-LCD full screen comprises the following steps:
(1) data acquisition
Firstly, collecting integral data of length, width, thickness and the like of a TFT-LCD comprehensive screen to be cut, acquiring corresponding cutting data according to cutting requirements, and setting a laser cutting route;
(2) and is clamped and fixed
Horizontally laying the TFT-LCD full screen to be cut on a workbench, and uniformly positioning and clamping the middle part and the upper and lower sides of the TFT-LCD full screen by adopting a clamp;
(3) full screen cutting
The upper layer glass substrate, the inner liquid crystal unit and the lower layer glass substrate of the TFT-LCD full screen are cut separately in a three-time cutting mode, so that the cutting precision and strength are improved;
(4) post-processing
Polishing the outer edges and corners of the cut TFT-LCD comprehensive panel blocks, and removing dust and residues to ensure that no foreign matter exists in the TFT-LCD comprehensive panel blocks;
(5) screen package
Vacuumizing the interior between the upper glass substrate and the lower glass substrate, then re-filling liquid crystal into the gap position of the edge, and performing pressurization packaging at the edge after sealing, so that the liquid crystal surface in the whole screen is complete, and the phenomenon that the image display precision in the later period is influenced by the blank at the edge is avoided;
(6) quality control
And carrying out size detection and internal crystal detection on the cut comprehensive screen panel block to ensure that the cut comprehensive screen panel block meets the quality production requirement.
3. The method for improving the cutting strength of the TFT-LCD full screen according to claim 2, wherein: the full screen cutting in the step (3) comprises the following specific processes:
a. one-time cutting
Firstly cutting an upper glass substrate of the TFT-LCD full screen along a cutting track, controlling the cutting depth, reserving a certain modifiable range between the connected cutting plates during cutting, and reserving a proper edge distance to ensure the frame strength;
b. second cutting
After preliminary cutting, exposing the lower glass substrate inlaid with the liquid crystal units at the edge of the cutting position, setting parameters for the liquid crystal units in the middle of the TFT-LCD comprehensive screen, setting a cutting track again, cutting off redundant liquid crystal units along a line, and cutting off damaged liquid crystal unit parts and capacitor parts generated by cutting at the edge part;
c. triple cutting
And cutting the lower glass substrate of the TFT-LCD comprehensive screen according to the cutting requirement, wherein the lower glass substrate and the upper glass substrate are kept consistent in edge position by adopting a laser cutting mode during cutting.
4. The method for improving the cutting strength of the TFT-LCD full screen according to claim 3, wherein the method comprises the following steps: and (4) cutting in one cutting in the step (3) of comprehensive screen cutting by adopting an ultrasonic blade, converting ultrasonic waves into mechanical vibration, and focusing the ultrasonic waves to perform high-frequency vibration cutting on a cutting position.
5. The method for improving the cutting strength of the TFT-LCD full screen according to claim 3, wherein the method comprises the following steps: the secondary cutting in the step (3) of the overall screen cutting adopts a laser cutting mode, in particular to an Amber picosecond infrared laser, the output pulse width of the Amber picosecond infrared laser is less than 15ps, and the beam quality M2 is less than 1.3.
6. The method for improving the cutting strength of the TFT-LCD full screen according to claim 3, wherein the method comprises the following steps: the three times of cutting in the step (3) of overall screen cutting adopt a laser cutting mode, ultrafast laser has ultrashort pulses and ultrastrong characteristics, and extremely high peak light intensity can be obtained with lower pulse energy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110588681.8A CN113281932A (en) | 2021-05-28 | 2021-05-28 | TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110588681.8A CN113281932A (en) | 2021-05-28 | 2021-05-28 | TFT-LCD (thin film transistor-liquid crystal display) full-screen cutting strength improving method |
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| CN113281932A true CN113281932A (en) | 2021-08-20 |
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