CN113276535A - Steel mesh processing method and steel mesh structure of 0.4pitch BGA component - Google Patents
Steel mesh processing method and steel mesh structure of 0.4pitch BGA component Download PDFInfo
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- CN113276535A CN113276535A CN202110523610.XA CN202110523610A CN113276535A CN 113276535 A CN113276535 A CN 113276535A CN 202110523610 A CN202110523610 A CN 202110523610A CN 113276535 A CN113276535 A CN 113276535A
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- Prior art keywords
- steel mesh
- bga
- processing method
- bga component
- opening
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 75
- 239000010959 steel Substances 0.000 title claims abstract description 75
- 238000003672 processing method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000012545 processing Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 230000006855 networking Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 4
- 238000012795 verification Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2200/00—Printing processes
- B41P2200/40—Screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/12—Screens
Abstract
The application discloses a steel mesh processing method of a 0.4pitch BGA component, which comprises the following steps: selecting a steel sheet with a set thickness to manufacture a solder paste printing steel mesh; an opening with the size of 0.22mm is arranged at the position of 0.4pitch BGA on the manufactured steel mesh. Such trompil design size is golden section size, can effectively reduce the short circuit risk and the rosin joint risk of 0.4pitch BGA component, improves the welding quality of 0.4pitch BGA component, and then promotes the yield and the reliability of product manufacturing. In addition, the invention also provides a corresponding steel mesh structure aiming at the steel mesh processing method of the 0.4pitch BGA component, so that the method has higher practicability and the steel mesh structure has corresponding advantages.
Description
Technical Field
The invention relates to the field of circuit board processing and production, in particular to a steel mesh processing method and a steel mesh structure of a 0.4pitch BGA component.
Background
With the development of the electronic industry, electronic components tend to be highly integrated and become more miniaturized, and the volume of the components is continuously reduced, so that the distance between the welding points of the components is gradually reduced.
Currently, 0.4pitch BGA (Ball Grid Array Package) has become the mainstream BGA component of consumer electronics. However, in such a device, the ball pitch of the BGA is only 0.15mm, so that the solder paste amount is large, which easily causes a short circuit during soldering, and when the solder paste amount is small, the solder tip is easy to pull, which causes poor cold soldering, that is, the soldering quality is easy to have two conditions: short circuit and cold solder joint.
Therefore, how to improve the soldering quality of the 0.4pitch BGA element is an urgent technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention is directed to a method for processing a steel mesh of a 0.4pitch BGA device and a steel mesh structure, which can improve the soldering quality of the 0.4pitch BGA device and improve the yield and reliability of product manufacturing. The specific scheme is as follows:
a steel mesh processing method of 0.4pitch BGA component, comprising:
selecting a steel sheet with a set thickness to manufacture a solder paste printing steel mesh;
and opening a hole with the size of 0.22mm at the position of 0.4pitch BGA on the manufactured steel mesh.
Preferably, in the steel mesh processing method for the 0.4pitch BGA component according to the embodiment of the present invention, when the shape of the opening is a circle, the diameter of the opening is 0.22 mm.
Preferably, in the steel mesh processing method for the 0.4pitch BGA component according to the embodiment of the present invention, when the opening is square, the side length is 0.22 mm.
Preferably, in the steel mesh processing method for the 0.4pitch BGA component according to the embodiment of the present invention, four corners of the square are rounded.
Preferably, in the steel mesh processing method of the 0.4pitch BGA component according to the embodiment of the present invention, the set thickness is 0.08 mm.
Preferably, in the steel mesh processing method of the 0.4pitch BGA component according to the embodiment of the present invention, the method further includes:
and carrying out SMT production on the circuit board, and detecting the welding effect through X-RAY equipment.
The embodiment of the invention also provides a steel mesh structure, the steel mesh structure is processed by adopting the steel mesh processing method of the 0.4pitch BGA element provided by the embodiment of the invention, and the position of the 0.4pitch BGA is provided with a hole with the size of 0.22 mm.
Preferably, in the steel mesh structure provided by the embodiment of the present invention, the shape of the opening is circular or square.
According to the technical scheme, the steel mesh processing method of the 0.4pitch BGA component, provided by the invention, comprises the following steps: selecting a steel sheet with a set thickness to manufacture a solder paste printing steel mesh; an opening with the size of 0.22mm is arranged at the position of 0.4pitch BGA on the manufactured steel mesh. Such trompil design size is golden section size, can effectively reduce the short circuit risk and the rosin joint risk of 0.4pitch BGA component, improves the welding quality of 0.4pitch BGA component, and then promotes the yield and the reliability of product manufacturing. In addition, the invention also provides a corresponding steel mesh structure aiming at the steel mesh processing method of the 0.4pitch BGA component, so that the method has higher practicability and the steel mesh structure has corresponding advantages.
Drawings
In order to more clearly illustrate the embodiments of the present invention or technical solutions in related arts, the drawings used in the description of the embodiments or related arts will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of a method for processing a steel mesh of a 0.4pitch BGA device according to an embodiment of the present invention;
fig. 2 and fig. 3 are schematic structural diagrams of the opening provided in the embodiment of the present invention, respectively.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a steel mesh processing method of a 0.4pitch BGA element, which comprises the following steps as shown in figure 1:
s101, selecting a steel sheet with a set thickness to manufacture a solder paste printing steel mesh; the set thickness h can be selected to be 0.08mm, namely a steel sheet with the thickness of 0.08mm is selected to manufacture a solder paste printing steel mesh;
s102, forming a hole with the size of 0.22mm at the position of 0.4pitch BGA on the manufactured steel mesh.
In the steel mesh processing method of the 0.4pitch BGA component provided by the embodiment of the invention, firstly, a steel sheet with a set thickness is selected to manufacture a solder paste printing steel mesh; then, an opening with the size of 0.22mm is formed at the position of 0.4pitch BGA on the manufactured steel mesh. Such trompil design size is golden section size, can effectively reduce the short circuit risk and the rosin joint risk of 0.4pitch BGA component, improves the welding quality of 0.4pitch BGA component, and then promotes the yield and the reliability of product manufacturing.
Further, in a specific implementation, in the steel mesh processing method of the 0.4pitch BGA component provided in the embodiment of the present invention, after the step S102 is executed, the method may further include: SMT (Surface Mount Technology) production is performed on the circuit board, and inspection of the soldering effect is performed by an X-RAY apparatus. After multiple production tests and verifications, the invention can ensure that the welding yield of 0.4pitch BGA can reach more than 99.5%.
Further, in practical implementation, in the steel mesh processing method of the 0.4pitch BGA component provided by the embodiment of the present invention, the shape of the opening may be circular or square.
Specifically, as shown in FIG. 2, when the opening is circular, the diameter d is 0.22 mm. Calculate the area ratio of 0.22mm diameter ═ pi (d/2)2And d/4h 0.22/0.32 0.67, the ratio is exactly that no keyhole can be re-locked at the golden section point. After multiple production tests verify that the design of the circular opening can ensure that the actual production yield is poor in short circuit by 0.05% and the insufficient solder joint by 3%.
Specifically, as shown in fig. 3, when the opening is square, the side length L is 0.22 mm; preferably, four corners of the square shape may be set as rounded corners. Calculating the area ratio of L2The ratio of L/4h to 0.22/0.32 to 0.67 remains the golden section. After multiple production tests verify that the design of the square opening can ensure that the actual production yield is poor in short circuit by 0.05 percent and no cold solder exists. Comparing the production test verification results, it can be seen that the design of the square opening is superior to that of the circular opening.
Based on the same inventive concept, the embodiment of the present invention further provides a steel mesh structure, and as the principle of solving the problem of the steel mesh structure is similar to the steel mesh processing method of the 0.4pitch BGA component, the implementation of the steel mesh structure can refer to the implementation of the steel mesh processing method of the 0.4pitch BGA component, and repeated details are omitted.
In specific implementation, the steel mesh structure provided by the embodiment of the invention is processed by using the steel mesh processing method of the 0.4pitch BGA element provided by the embodiment of the invention, and the 0.22 mm-sized opening is formed at the position of the 0.4pitch BGA. Preferably, the shape of the opening can be provided as a circle or a square.
In the steel mesh structure provided by the embodiment of the invention, the short circuit risk and the insufficient soldering risk of the 0.4pitch BGA element can be effectively reduced, the soldering quality of the 0.4pitch BGA element is improved, and the yield and the reliability of product manufacturing are further improved.
To sum up, the steel mesh processing method for a 0.4pitch BGA component according to the embodiment of the present invention includes: firstly, selecting a steel sheet with a set thickness to manufacture a tin paste printing steel mesh; then, an opening with the size of 0.22mm is formed at the position of 0.4pitch BGA on the manufactured steel mesh. Such trompil design size is golden section size, can effectively reduce the short circuit risk and the rosin joint risk of 0.4pitch BGA component, improves the welding quality of 0.4pitch BGA component, and then promotes the yield and the reliability of product manufacturing. In addition, the invention also provides a corresponding steel mesh structure aiming at the steel mesh processing method of the 0.4pitch BGA component, so that the method has higher practicability and the steel mesh structure has corresponding advantages.
Finally, it should also be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The steel mesh processing method and the steel mesh structure of the 0.4pitch BGA component provided by the present invention are described in detail above, and a specific example is applied in the present disclosure to explain the principle and the implementation of the present invention, and the description of the above embodiment is only used to help understanding the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. A steel mesh processing method of 0.4pitch BGA component is characterized by comprising the following steps:
selecting a steel sheet with a set thickness to manufacture a solder paste printing steel mesh;
and opening a hole with the size of 0.22mm at the position of 0.4pitch BGA on the manufactured steel mesh.
2. The method of claim 1, wherein the opening has a diameter of 0.22mm when the shape is circular.
3. The method of claim 1, wherein the opening has a square shape with a side length of 0.22 mm.
4. The method of claim 3, wherein four corners of the square are rounded.
5. The method of steel net working of 0.4pitch BGA component of claim 1, wherein the set thickness is 0.08 mm.
6. The method of steel net processing of 0.4pitch BGA component of claim 1, further comprising:
and carrying out SMT production on the circuit board, and detecting the welding effect through X-RAY equipment.
7. A steel mesh structure, characterized in that, the steel mesh structure is processed by the steel mesh processing method of the 0.4pitch BGA element according to any one of claims 1 to 6, and the 0.4pitch BGA position is opened with a hole with a size of 0.22 mm.
8. The steel mesh structure according to claim 7, wherein the shape of the opening is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110523610.XA CN113276535A (en) | 2021-05-13 | 2021-05-13 | Steel mesh processing method and steel mesh structure of 0.4pitch BGA component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110523610.XA CN113276535A (en) | 2021-05-13 | 2021-05-13 | Steel mesh processing method and steel mesh structure of 0.4pitch BGA component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113276535A true CN113276535A (en) | 2021-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110523610.XA Pending CN113276535A (en) | 2021-05-13 | 2021-05-13 | Steel mesh processing method and steel mesh structure of 0.4pitch BGA component |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039549A (en) * | 2006-03-17 | 2007-09-19 | 日本特殊陶业株式会社 | Manufacturing method of wiring substrate and mask used for printing |
| CN102026497A (en) * | 2009-09-16 | 2011-04-20 | 沈阳晨讯希姆通科技有限公司 | Power amplifier screens and methods for disposing holes thereon |
| CN103203977A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Production method for an electroformed stencil with mark points |
| GR1008100B (en) * | 2012-12-06 | 2014-02-04 | Παναγιωτης Ανδρεα Καρυδοπουλος | Permanent bga (ball grid array) stencil made from elastomeric materials and method of application to bga component rework |
| CN106739431A (en) * | 2016-12-13 | 2017-05-31 | 郑州云海信息技术有限公司 | The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements |
-
2021
- 2021-05-13 CN CN202110523610.XA patent/CN113276535A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039549A (en) * | 2006-03-17 | 2007-09-19 | 日本特殊陶业株式会社 | Manufacturing method of wiring substrate and mask used for printing |
| CN102026497A (en) * | 2009-09-16 | 2011-04-20 | 沈阳晨讯希姆通科技有限公司 | Power amplifier screens and methods for disposing holes thereon |
| CN103203977A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Production method for an electroformed stencil with mark points |
| GR1008100B (en) * | 2012-12-06 | 2014-02-04 | Παναγιωτης Ανδρεα Καρυδοπουλος | Permanent bga (ball grid array) stencil made from elastomeric materials and method of application to bga component rework |
| CN106739431A (en) * | 2016-12-13 | 2017-05-31 | 郑州云海信息技术有限公司 | The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements |
Non-Patent Citations (1)
| Title |
|---|
| 刘桂松: "《计算机维修基础》", 30 June 2005 * |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210820 |
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| RJ01 | Rejection of invention patent application after publication |