CN106739431A - The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements - Google Patents
The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements Download PDFInfo
- Publication number
- CN106739431A CN106739431A CN201611147022.6A CN201611147022A CN106739431A CN 106739431 A CN106739431 A CN 106739431A CN 201611147022 A CN201611147022 A CN 201611147022A CN 106739431 A CN106739431 A CN 106739431A
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- China
- Prior art keywords
- steel mesh
- pitch csp
- designing
- perforate
- pitch
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
Abstract
The invention discloses the steel mesh perforate method for designing of 0.5mm pitch CSP elements, when using 0.5 pitch CSP elements, corresponding tin paste printed steel mesh perforate is square to methods described.Present invention design has broken industry and has often used round hole mode, and there is provided the suggestion size of golden section size, improves the yield and reliability of product manufacturing.
Description
Technical field
The present invention relates to PCB design and processing technique field, and in particular to a kind of steel mesh of 0.5mm pitch CSP elements
Perforate method for designing and structure.
Background technology
With the continuous progress in epoch, the mankind are used for more and more stronger to the demand property of electronic product.The commercializations such as server
Application of the electronic product towards low-power consumption, miniaturization is developed rapidly, from initial large product miniaturization clothes till now
Business device, the increasing highly integrated, densification of server electronic product, so that electronic device becomes more miniature
Change.The miniaturization of electronic device is the key subjects of server research and development and server manufacture, while bringing bigger challenge.
As electron trade develops, electronic component tends to highly integrated, and the volume of element constantly reduces so that element is welded
Spacing between point increasingly reduces, and 0.5 pitch CSP have turned into the main flow CSP elements of server product unexpectedly.But this class component
Because the ball spacing of CSP only has 0.15mm, tin cream amount easy solder shorts bigger than normal are on the low side, occur that rosin joint is bad.
As shown in figure 1, CSP steel mesh opening approach recommended by the manufacturer：
Steel mesh thickness 0.08mm, perforate are the circle of diameter 0.25mm；
Paste solder printing area is the easy demoulding of tin cream than 0.67 more than golden section, on the contrary easy-to-draw point；.
The area ratio of this scheme is=r2 pi/2 r π h=r/2h=0.125/0.16=0.78；
The ratio is more than 0.67 therefore is easy to the paste solder printing demoulding；
But adjacent Yin Xi is away from only 4-0.25=0.15mm；
Bad up to the 50% of the solder shorts of the actual production program；
The scheme of steel mesh perforate to the circular hole of 0.22mm is gradually reduced：
Now there are two kinds of situations in welding quality：Short circuit and rosin joint；
Bad the 3% of poor short circuit 0.05%, rosin joint；
Now steel mesh perforate can not reduce again, if reducing rosin joint again, good general is not substantially increased；
The area ratio of calculated diameter 0.22mm=r2 pi/2 r π h=r/2h=0.11/0.16=0.67
Ratio is just for golden section point equally can not shrinkage cavity again.
The content of the invention
The technical problem to be solved in the present invention is：The present invention is directed to problem above, there is provided a kind of 0.5mm pitch CSP units
The steel mesh perforate method for designing and structure of part, the yield of settlement server board and the reliability of lifting server product；Ensure
To the optional property of 0.5 pitch CSP elements during product design.
The technical solution adopted in the present invention is：
The steel mesh perforate method for designing of 0.5mm pitch CSP elements, methods described using 0.5 pitch CSP elements when,
Corresponding tin paste printed steel mesh perforate is square.
The size dimension of the tin paste printed steel mesh square opening is 0.22mm.
The design has broken industry and has often used round hole mode, and there is provided the suggestion size of golden section size, improves
The yield and reliability of product manufacturing.
It is as follows that methods described implements process：
1）, choose thickness steel disc and make tin paste printed steel mesh；
2）, the 0.5 pitch CSP bits place of putting open the square hole of 0.22mm；
3）, wiring board normal SMT productions.
The steel net structure of 0.5mm pitch CSP elements, the structure of the steel mesh includes steel disc and is arranged at opening for steel disc
Hole, wherein it is square opening that corresponding 0.5 pitch CSP bits put place's perforate, 4 angles of square opening are fillet.
The size dimension of the square opening is 0.22mm.
Beneficial effects of the present invention are：
Present invention design has broken industry and has often used round hole mode, and there is provided the suggestion size of golden section size, improves
The yield and reliability of product manufacturing.
Brief description of the drawings
Fig. 1 is steel mesh square aperture schematic diagram of the present invention.
Specific embodiment
Below according to Figure of description, with reference to specific embodiment, the present invention is further described：
Embodiment 1
The steel mesh perforate method for designing of 0.5mm pitch CSP elements, methods described using 0.5 pitch CSP elements when,
Corresponding tin paste printed steel mesh perforate is square.
Embodiment 2
As shown in figure 1, on the basis of embodiment 1, the size dimension of tin paste printed steel mesh square opening is described in the present embodiment
0.22mm.
The design has broken industry and has often used round hole mode, and there is provided the suggestion size of golden section size, improves
The yield and reliability of product manufacturing.
Embodiment 3
On the basis of embodiment 2, it is as follows that the present embodiment methods described implements process：
1）, the steel disc of choosing thickness 0.08mm make tin paste printed steel mesh；
2）, the 0.5 pitch CSP bits place of putting open the square hole of 0.22mm；
3）, wiring board normal SMT productions；
4）, by X-RAY equipment detect welding effect.
Embodiment 4
The steel net structure of 0.5mm pitch CSP elements, the structure of the steel mesh includes steel disc and the perforate for being arranged at steel disc, its
It is square opening that the pitch CSP bits of middle correspondence 0.5 put place's perforate, and 4 angles of square opening are fillet.
Embodiment 5
On the basis of embodiment 4, the size dimension of square opening described in the present embodiment is 0.22mm.
0.22 circular hole is changed to 0.22 square hole：
Area ratio=d2/4dh=0.22/0.32=0.67；
Ratio is still golden section；
Actual production yield poor short circuit 0.05%, and without rosin joint；
Yield is up to 99.5% for yield high is welded.
Implementation method is merely to illustrate the present invention, and not limitation of the present invention, about the ordinary skill of technical field
Personnel, without departing from the spirit and scope of the present invention, can also make a variety of changes and modification, therefore all equivalent
Technical scheme fall within scope of the invention, scope of patent protection of the invention should be defined by the claims.
Claims (5)
1.0.5mm the steel mesh perforate method for designing of pitch CSP elements, it is characterised in that methods described is using 0.5
During pitch CSP elements, corresponding tin paste printed steel mesh perforate is square.
2. the steel mesh perforate method for designing of 0.5mm pitch CSP elements according to claim 1, it is characterised in that institute
The size dimension for stating tin paste printed steel mesh square opening is 0.22mm.
3. the steel mesh perforate method for designing of 0.5mm pitch CSP elements according to claim 2, it is characterised in that institute
It is as follows that the method for stating implements process：
1）, choose steel disc make tin paste printed steel mesh；
2）, at the 0.5 pitch CSP bits place of putting open the square hole of 0.22mm；
3）, wiring board normal SMT productions.
4.0.5mm the steel net structure of pitch CSP elements, it is characterised in that the structure of the steel mesh includes steel disc and is arranged at
The perforate of steel disc, wherein it is square opening that corresponding 0.5 pitch CSP bits put place's perforate, 4 angles of square opening are fillet.
5. the steel mesh perforate method for designing of 0.5mm pitch CSP elements according to claim 4, it is characterised in that institute
The size dimension for stating square opening is 0.22mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611147022.6A CN106739431A (en) | 2016-12-13 | 2016-12-13 | The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611147022.6A CN106739431A (en) | 2016-12-13 | 2016-12-13 | The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106739431A true CN106739431A (en) | 2017-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611147022.6A Pending CN106739431A (en) | 2016-12-13 | 2016-12-13 | The steel mesh perforate method for designing and structure of 0.5mm pitch CSP elements |
Country Status (1)
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| CN (1) | CN106739431A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933866A (en) * | 2019-11-29 | 2020-03-27 | 苏州浪潮智能科技有限公司 | PCB device welding method and device |
| CN111132472A (en) * | 2020-01-19 | 2020-05-08 | 联宝(合肥)电子科技有限公司 | Method for welding circuit board based on low-temperature solder paste and welding area |
| CN113276535A (en) * | 2021-05-13 | 2021-08-20 | 浪潮商用机器有限公司 | Steel mesh processing method and steel mesh structure of 0.4pitch BGA component |
| CN113382557A (en) * | 2021-05-08 | 2021-09-10 | 山东英信计算机技术有限公司 | DDR CONN welding layout method, screen plate device and PCBA board card |
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| JPS58108142A (en) * | 1981-12-23 | 1983-06-28 | Hitachi Ltd | Production of printing screen formed of pasty substance |
| JPS6369694A (en) * | 1986-09-11 | 1988-03-29 | Oki Electric Ind Co Ltd | Screen |
| CN201417764Y (en) * | 2009-04-17 | 2010-03-03 | 广芯电子技术(上海)有限公司 | Package structure of array type flat pin-free chip |
| CN103072367A (en) * | 2013-01-06 | 2013-05-01 | 奈电软性科技电子(珠海)有限公司 | Producing method for simple SMT (surface mount technology) otter board |
| CN103124476A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Printed circuit board and machining method thereof |
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2016
- 2016-12-13 CN CN201611147022.6A patent/CN106739431A/en active Pending
Patent Citations (5)
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| JPS58108142A (en) * | 1981-12-23 | 1983-06-28 | Hitachi Ltd | Production of printing screen formed of pasty substance |
| JPS6369694A (en) * | 1986-09-11 | 1988-03-29 | Oki Electric Ind Co Ltd | Screen |
| CN201417764Y (en) * | 2009-04-17 | 2010-03-03 | 广芯电子技术(上海)有限公司 | Package structure of array type flat pin-free chip |
| CN103124476A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Printed circuit board and machining method thereof |
| CN103072367A (en) * | 2013-01-06 | 2013-05-01 | 奈电软性科技电子(珠海)有限公司 | Producing method for simple SMT (surface mount technology) otter board |
Non-Patent Citations (2)
| Title |
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| 孙国清，李承虎: "0.5mm间距CSP/BGA器件无铅焊接工艺技术研究", 《电子工业专用设备》 * |
| 宋好强，戎孔亮: "0.5mm间距CSP焊接工艺研究", 《电子工艺技术》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933866A (en) * | 2019-11-29 | 2020-03-27 | 苏州浪潮智能科技有限公司 | PCB device welding method and device |
| CN111132472A (en) * | 2020-01-19 | 2020-05-08 | 联宝(合肥)电子科技有限公司 | Method for welding circuit board based on low-temperature solder paste and welding area |
| CN111132472B (en) * | 2020-01-19 | 2022-02-01 | 联宝(合肥)电子科技有限公司 | Method for welding circuit board based on low-temperature solder paste and welding area |
| CN113382557A (en) * | 2021-05-08 | 2021-09-10 | 山东英信计算机技术有限公司 | DDR CONN welding layout method, screen plate device and PCBA board card |
| CN113276535A (en) * | 2021-05-13 | 2021-08-20 | 浪潮商用机器有限公司 | Steel mesh processing method and steel mesh structure of 0.4pitch BGA component |
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Application publication date: 20170531 |