CN113275567B - Laser sintering forming method - Google Patents
Laser sintering forming method Download PDFInfo
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- CN113275567B CN113275567B CN202110486352.2A CN202110486352A CN113275567B CN 113275567 B CN113275567 B CN 113275567B CN 202110486352 A CN202110486352 A CN 202110486352A CN 113275567 B CN113275567 B CN 113275567B
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000000149 argon plasma sintering Methods 0.000 title claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 93
- 239000002923 metal particle Substances 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 238000005245 sintering Methods 0.000 claims abstract description 23
- 150000002739 metals Chemical class 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 11
- 230000002457 bidirectional effect Effects 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
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- 230000000149 penetrating effect Effects 0.000 abstract description 3
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- 238000012545 processing Methods 0.000 abstract description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
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- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- 239000002086 nanomaterial Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model relates to the technical field of laser processing circuit boards, in particular to a laser sintering forming method, which comprises the following steps: a. smearing paste containing nano metal particles on a position to be sintered on the surface of one side of the glass carrier plate; b. respectively carrying out laser irradiation on the same positions of two sides of the glass carrier plate and the paste body combination; c. completing the single-sided sintering of the glass carrier plate; d. repeating the steps a to c to finish the sintering of the other side surface of the glass carrier plate; e. penetrating the metal and glass carrier plates sintered on the upper and lower surfaces by laser; f. filling a paste containing nano metal particles in the penetrated area; g. and (3) performing laser irradiation on the paste body to combine the nano metal particles in the paste body with the upper and lower surface metals and communicate the upper and lower surface circuits. The utility model aims to overcome the defects of the prior art and provide a laser sintering forming method, which can improve the connection reliability of glass and metal, so that the glass and metal are better in connection effect, are not easy to fall off and are more stable in connection.
Description
Technical Field
The utility model relates to the technical field of laser processing circuit boards, in particular to a laser sintering forming method.
Background
The circuit board is a support for electronic components and a carrier for electrical connection, and with the development of material science, the number of materials that can be used as the circuit board is continuously increasing, and in recent years, the liquid crystal display that is developed at a high speed is to use glass as the material of the circuit board. The glass used as the circuit board not only meets the requirement of light transmission, but also plays the original role of the circuit board, but the traditional welding method has poor bonding property between the glass and the metal circuit and is easy to fall off.
Chinese patent CN107378231B discloses a method for preparing a metal structure on the surface of a transparent material by using metal nano ink, wherein a transparent substrate is placed in the metal nano ink, the substrate is irradiated by laser, and the metal material in the metal nano ink is selectively separated out from the laser focus on the surface of the substrate by controlling the parameters of the laser and the material and concentration of the ink, so that the metal micro-nano structure is prepared on the surface of the transparent substrate. Because the connection is realized by the laser penetration action at the joint of the ink and the transparent substrate only by performing laser irradiation on the ink surface, gaps still exist, and the reliability of the connection cannot be ensured.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide a laser sintering forming method, which can improve the connection reliability of glass and metal, so that the glass and metal are better in connection effect, are not easy to fall off and are more stable in connection.
In order to solve the technical problems, the utility model adopts the technical scheme that:
the laser sintering forming method comprises the following steps:
a. smearing paste containing nano metal particles on a position to be sintered on the surface of one side of the glass carrier plate;
b. simultaneously performing bidirectional laser irradiation on the same position on two sides of the glass carrier plate and paste body combination;
c. detecting whether the single-sided sintering of the glass carrier plate is finished or not, if so, entering the next step, and if not, returning to the step a;
d. detecting whether double-sided sintering of the glass carrier plate is finished or not, entering the next step if the double-sided sintering of the glass carrier plate is finished, and returning to the step a to execute operation aiming at the other side of the glass carrier plate if the double-sided sintering of the glass carrier plate is not finished;
e. penetrating the metal and glass carrier plates sintered on the upper and lower surfaces by laser;
f. filling a paste containing nano metal particles in the penetrated area;
g. and (3) performing laser irradiation on the paste body to combine the nano metal particles in the paste body with the upper and lower surface metals and communicate the upper and lower surface circuits.
According to the utility model, metal is sintered on the glass carrier plate by utilizing bidirectional laser irradiation, so that the firmness of the combination of the metal and the glass is improved, the metals on the two sides of the glass carrier plate are communicated to complete the manufacture of the circuit board, and the combination of the metal and the glass can be improved by adopting a bidirectional laser irradiation mode; and the glass carrier plate can still have the light transmission performance of the glass material at the place which is not covered by metal, so that the circuit board not only meets the light transmission requirement, but also plays the original connection role of the circuit board.
And further, the laser heads on the two sides move at a constant speed according to a preset track in the step b, so that the irradiated nano metal particles and the irradiated glass carrier plate are combined.
Further, in the step b, when laser bidirectional irradiation is adopted, the laser positioned on one side of the glass carrier plate is short-pulse-width and low-power laser, and is focused on the joint of the glass plate and the paste body; the laser positioned on one side of the paste body is a long pulse width and high-power laser which is focused on the paste body; in the step f, the laser is a long pulse width and high-power laser and is focused on the paste.
Further, after the step c and/or the step d and/or the step g, a step h is further included: and cleaning the surface of the glass carrier plate to remove the paste of the unsintered nano metal particles.
Further, in the step h, the surface of the glass carrier is cleaned by using an organic solvent, and then the glass carrier is properly annealed according to the sintering degree of the nano metal particles, so that the bonding among the nano metal particles is enhanced.
Further, before the step a, roughening the glass carrier plate by physical engraving or chemical etching is also included.
Further, the upper and lower surfaces of the penetrated region in step f have sintered metal.
Furthermore, the metal particles in the paste of the nano metal particles have the same particle size.
Furthermore, when the paste containing the nano metal particles is prepared, the nano metal particles are added into an organic alcohol reagent, and then rosin and soldering flux are added to form the paste.
Further, when the paste of the nano metal particles is coated in the step a, the paste is coated on the glass carrier smoothly and uniformly.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the glass is used as the carrier plate, the nano metal particles are attached to the glass during single-side sintering, and bidirectional sintering is carried out through laser, so that the connection reliability between the glass and the metal can be improved, the connection effect between the glass and the metal is better, the glass and the metal are not easy to fall off, and the connection is more stable. And the two sides of the glass carrier plate are both subjected to bidirectional laser sintering, so that the two sides of the glass carrier plate can be reliably connected with metal, holes are formed in the metal on the two sides through laser, the metal on the two sides of the glass carrier plate is communicated through laser sintering, and the whole circuit board is manufactured.
Drawings
FIG. 1 is a process flow diagram of a laser sintering molding method of the present invention;
the graphic symbols are illustrated as follows:
1. a glass carrier plate; 2. a laser head; 3. paste; 4. a drip nozzle.
Detailed Description
The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.
Example 1
Fig. 1 shows a first embodiment of a laser sintering molding method according to the present invention, which includes the following steps:
firstly, roughening the glass carrier plate 1, preferably, roughening the glass carrier plate 1 by adopting a physical carving or chemical corrosion method so as to facilitate the subsequent metal to be coated on the glass carrier plate 1, increase the friction force between the metal and the glass carrier plate 1 and enable the metal to be more easily adhered on the glass carrier plate 1.
a. Smearing paste 3 containing nano metal particles on a position to be sintered on the surface of one side of the glass carrier plate 1; when the paste 3 containing the nano metal particles is manufactured, the nano metal particles are added into an organic alcohol reagent, and then rosin and soldering flux are added to form the paste 3. When the paste 3 is manufactured, the paste 3 is manufactured by adopting the metal with the same particle size, so that the metal and the glass carrier plate 1 are more uniformly fused, the laser sintering time is kept consistent, and the connection effect is improved. Specifically, the nano-metal particles with the particle size of 50nm are added into the ethanol solution to prepare paste 3 with the solid content of 75%.
The paste 3 is uniformly coated on the surface of one side of the glass carrier plate 1 through the dripping nozzle 4, and a flat surface is formed to avoid holes, and the coating thickness of the paste 3 is 2 mu m.
b. Simultaneously performing bidirectional laser irradiation on the same position on two sides of the combination body of the glass carrier plate 1 and the paste body 3;
the glass carrier plate and the laser heads 2 at the two sides of the paste 3 move at a constant speed according to a preset track, so that the irradiated nano metal particles are combined with the irradiated glass carrier plate 1. When the laser is adopted for bidirectional irradiation, the laser positioned on one side of the glass carrier plate 1 is short-pulse-width and low-power laser, and is focused on the joint of the glass plate and the paste body 3; the laser positioned at one side of the paste body 3 is long-pulse-width and high-power laser and is focused on the paste body 3.
c. Detecting whether the single-sided sintering of the glass carrier plate 1 is finished or not, if so, entering the next step, and if not, returning to the step a;
performing a cleaning operation after completing the sintering of the glass carrier plate 1;
h1, cleaning the surface of the glass carrier plate 1, and removing the paste 3 of the unsintered part of the nano metal particles
The surface of the glass carrier plate 1 is cleaned by using an organic solvent, and then the glass carrier plate 1 is properly annealed according to the sintering degree of the nano metal particles, so that the bonding among the nano metal particles is enhanced.
d. Detecting whether double-sided sintering of the glass carrier plate 1 is finished or not, if so, entering the next step, and if not, returning to the step a to execute operation aiming at the other side of the glass carrier plate 1;
performing a cleaning operation after completing the sintering of the glass carrier plate 1;
h2, cleaning the surface of the glass carrier plate 1, and removing the paste 3 of the unsintered part of the nano metal particles
The surface of the glass carrier plate 1 is cleaned by using an organic solvent, and then the glass carrier plate 1 is properly annealed according to the sintering degree of the nano metal particles, so that the bonding among the nano metal particles is enhanced.
e. Penetrating the metal and glass carrier plates 1 sintered on the upper and lower surfaces by laser;
wherein, the upper and lower surfaces of the penetrated area are all provided with sintered metal; the penetration of the glass carrier plate 1 by laser means that a circular hole with a diameter of 2 μm is made by high-power laser.
f. Filling a paste 3 containing nano metal particles in the penetrated area;
g. performing laser irradiation on the paste 3 to combine the nano metal particles in the paste 3 with the upper and lower surface metals, and communicating the upper and lower surface circuits;
wherein, the paste 3 is sintered by focusing laser with long pulse width and high power, so that the metal on the upper surface and the metal on the lower surface of the glass carrier plate 1 are communicated.
h3, cleaning the surface of the glass carrier plate 1, and removing the paste 3 of the unsintered nano metal particles.
The surface of the glass carrier plate 1 is cleaned by using an organic solvent, and then the glass carrier plate 1 is properly annealed according to the sintering degree of the nano metal particles, so that the bonding among the nano metal particles is enhanced.
Example 2
The following is a second embodiment of the laser sintering molding method of the present invention, which is similar to embodiment 1, except that the adopted nano metal particles have a particle size of 80nm, and the nano metal particles with the particle size of 80nm are added into an ethylene glycol solution to prepare a paste 3 with a solid content of 85%; the paste is uniformly coated on the roughened glass carrier plate 1 through a dripping nozzle 4, and the thickness of the coated paste 3 is 4 mu m. As in example 1, laser irradiation was performed on both sides of the glass carrier 1 and the paste 3, respectively; then, washing with glycol solution to finish the single-sided sintering of the surface of the glass carrier plate 1. Repeating the steps until the sintering of the other side surface of the glass carrier plate 1 is completed; after the paste 3 is sintered and cleaned, a round hole with the diameter of 4 mu m is formed by using a high-power laser, the paste 3 is added, the nano metal particles with the particle size of 80nm are sintered by using a long-pulse width and high-power laser to complete the communication of the metal on the two sides of the glass carrier plate 1, and then the glass carrier plate is cleaned by using an ethylene glycol solution to complete the manufacture of the whole circuit board.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A laser sintering forming method is characterized by comprising the following steps:
a. smearing paste (3) containing nano metal particles on a position to be sintered on the surface of one side of the glass carrier plate (1);
b. simultaneously performing bidirectional laser irradiation on the same position on two sides of the combination of the glass carrier plate (1) and the paste body (3);
c. detecting whether the single-sided sintering of the glass carrier plate (1) is finished or not, if so, entering the next step, and if not, returning to the step a;
d. detecting whether double-sided sintering of the glass carrier plate (1) is finished or not, entering the next step if the double-sided sintering is finished, and returning to the step a to execute operation aiming at the other side of the glass carrier plate (1) if the double-sided sintering is not finished;
e. the upper surface and the lower surface of a sintered metal and glass carrier plate (1) are penetrated by laser;
f. filling a paste (3) containing nano metal particles in the penetrated area;
g. and (3) performing laser irradiation on the paste body (3) to combine the nano metal particles in the paste body (3) with the upper and lower surface metals and communicate the upper and lower surface circuits.
2. The laser sintering molding method according to claim 1, characterized in that in the step b, the laser heads (2) on both sides move at a constant speed according to a preset track, so that the irradiated nano metal particles and the irradiated glass carrier plate (1) are combined.
3. The laser sintering molding method according to claim 2, wherein in the step b, when the laser is used for bidirectional irradiation, the laser on one side of the glass carrier plate (1) is a short-pulse-width, low-power laser, and is focused on the joint of the glass plate and the paste body (3); the laser positioned on one side of the paste body (3) is a long pulse width and high-power laser which is focused on the paste body (3); in the step f, the laser is a long pulse width and high-power laser and is focused on the paste body (3).
4. The laser sintering molding method according to any one of claims 1 to 3, further comprising step h after step c and/or step d and/or step g: and cleaning the surface of the glass carrier plate (1) to remove the paste (3) of the unsintered nano metal particles.
5. The laser sintering molding method according to claim 4, characterized in that in the step h, the surface of the glass carrier (1) is cleaned by using an organic solvent, and then the glass carrier (1) is properly annealed according to the sintering degree of the nano-metal particles, so as to enhance the bonding between the nano-metal particles.
6. The laser sintering method according to claim 5, characterized in that step a is preceded by roughening the glass carrier plate (1) by physical engraving or chemical etching.
7. The laser sintering molding method of claim 6 wherein in step f the upper and lower surfaces of the penetrated region are provided with sintered metal.
8. The laser sintering molding method according to claim 7, characterized in that the metal particles in the paste (3) of nano-metal particles all have the same particle size.
9. The laser sintering molding method according to claim 8, characterized in that, in the preparation of the paste (3) containing the nano-metal particles, the nano-metal particles are added into an organic alcohol reagent, and then rosin and a flux are added to form the paste (3).
10. The laser sintering molding method according to claim 9, characterized in that the paste (3) is evenly and uniformly applied on the glass carrier (1) when the paste (3) of nano-metal particles is applied in step a.
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| CN202110486352.2A CN113275567B (en) | 2021-04-30 | 2021-04-30 | Laser sintering forming method |
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| CN202110486352.2A CN113275567B (en) | 2021-04-30 | 2021-04-30 | Laser sintering forming method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11346059A (en) * | 1998-06-02 | 1999-12-14 | Mitsubishi Gas Chem Co Inc | Printed circuit board with reliable via hole |
| JP6358535B2 (en) * | 2013-04-26 | 2018-07-18 | パナソニックＩｐマネジメント株式会社 | Wiring board connection structure and wiring board connecting method |
| JP2016160528A (en) * | 2015-03-05 | 2016-09-05 | 国立大学法人大阪大学 | Method for manufacturing circuit board, circuit board and plasma device |
| JP2018129409A (en) * | 2017-02-09 | 2018-08-16 | 国立研究開発法人産業技術総合研究所 | Method for forming pattern wiring circuit on the basis of metal powder low temperature melting by irradiation with substrate back surface laser light and formed structure of the same |
| JP7075785B2 (en) * | 2018-03-08 | 2022-05-26 | スタンレー電気株式会社 | Circuit boards, electronic circuit devices, and methods for manufacturing circuit boards |
| CN109719405A (en) * | 2019-03-12 | 2019-05-07 | 武汉华工激光工程有限责任公司 | Laser processing |
| CN110972406B (en) * | 2019-12-04 | 2020-07-28 | 广东工业大学 | Repair method for fine line |
| CN110753454B (en) * | 2019-12-04 | 2020-08-18 | 广东工业大学 | Forming and repairing method for fine line |
| CN112466857B (en) * | 2021-01-28 | 2021-06-25 | 广东佛智芯微电子技术研究有限公司 | Chip packaging method based on light-transmitting plate and packaging structure thereof |
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