CN113267959A - Black photosensitive resin composition, color filter comprising black matrix manufactured using same, and display device comprising color filter - Google Patents
Black photosensitive resin composition, color filter comprising black matrix manufactured using same, and display device comprising color filter Download PDFInfo
- Publication number
- CN113267959A CN113267959A CN202110180937.1A CN202110180937A CN113267959A CN 113267959 A CN113267959 A CN 113267959A CN 202110180937 A CN202110180937 A CN 202110180937A CN 113267959 A CN113267959 A CN 113267959A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- photosensitive resin
- black photosensitive
- black
- chemical formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 71
- 239000011159 matrix material Substances 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 230000008859 change Effects 0.000 claims abstract description 20
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims abstract description 16
- -1 thiol compound Chemical class 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 238000001029 thermal curing Methods 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims description 41
- 239000000126 substance Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000000654 additive Substances 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 19
- 239000003086 colorant Substances 0.000 claims description 18
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 16
- 230000000996 additive effect Effects 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 13
- 125000003700 epoxy group Chemical group 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 16
- 239000010410 layer Substances 0.000 abstract description 16
- 239000012044 organic layer Substances 0.000 abstract description 5
- 238000013035 low temperature curing Methods 0.000 abstract description 4
- 239000000049 pigment Substances 0.000 description 22
- 239000002904 solvent Substances 0.000 description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 239000002270 dispersing agent Substances 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- QOSPZWFSEFUMGD-UHFFFAOYSA-N 4-oxatetracyclo[6.2.1.02,7.03,5]undecan-10-yl prop-2-enoate Chemical compound C12C3OC3CC2C2CC(OC(=O)C=C)C1C2 QOSPZWFSEFUMGD-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- VDBSRPBXFACZJJ-UHFFFAOYSA-N 4-oxatetracyclo[6.2.1.02,7.03,5]undecan-9-yl prop-2-enoate Chemical compound C12CC3OC3C2C2CC(OC(=O)C=C)C1C2 VDBSRPBXFACZJJ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- IPTNXMGXEGQYSY-UHFFFAOYSA-N acetic acid;1-methoxybutan-1-ol Chemical compound CC(O)=O.CCCC(O)OC IPTNXMGXEGQYSY-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- NHAQFLFLZGBOBG-UHFFFAOYSA-N decan-3-yl prop-2-enoate Chemical compound CCCCCCCC(CC)OC(=O)C=C NHAQFLFLZGBOBG-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- HMLSBRLVTDLLOI-UHFFFAOYSA-N 1-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)C(C)OC(=O)C(C)=C HMLSBRLVTDLLOI-UHFFFAOYSA-N 0.000 description 1
- KZQIYOCELNGJPJ-UHFFFAOYSA-N 1-phenyldecyl prop-2-enoate Chemical compound CCCCCCCCCC(OC(=O)C=C)C1=CC=CC=C1 KZQIYOCELNGJPJ-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical compound C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- YHFGMFYKZBWPRW-UHFFFAOYSA-N 3-methylpentane-1,1-diol Chemical compound CCC(C)CC(O)O YHFGMFYKZBWPRW-UHFFFAOYSA-N 0.000 description 1
- 102100027123 55 kDa erythrocyte membrane protein Human genes 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 101001057956 Homo sapiens 55 kDa erythrocyte membrane protein Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- IHUNBGSDBOWDMA-AQFIFDHZSA-N all-trans-acitretin Chemical compound COC1=CC(C)=C(\C=C\C(\C)=C\C=C\C(\C)=C\C(O)=O)C(C)=C1C IHUNBGSDBOWDMA-AQFIFDHZSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- HECGKCOICWUUJU-UHFFFAOYSA-N bis(diphenylphosphanylmethyl)-phenylphosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 HECGKCOICWUUJU-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
Abstract
The black photosensitive resin composition is characterized by comprising a thermal curing agent, wherein the thermal curing agent comprises a thiol compound, and when the thickness of a cured film formed by using the black photosensitive resin composition is 1.5 +/-0.1 [ mu ] m, and the optical density of the cured film is OD1, the reflectance is Y1, and the color change rate is a 1, and when the optical density of the cured film after being immersed in propylene glycol monomethyl ether acetate for 10 minutes at 100 ℃ is OD2, the reflectance is Y2, and the color change rate is a 2, the OD2/OD1, the Y2/Y1, and the a 2/a 1 are all more than 0.90. This enables low-temperature curing at less than 100 ℃, and the cured product has excellent curing degree even on a flexible substrate or a substrate having an organic layer as a lower layer.
Description
Technical Field
The present invention relates to a black photosensitive resin composition, a color filter including a black matrix manufactured using the same, and a display device including the color filter.
Background
The color filter includes 3 primary color pixels of a red pixel, a green pixel, and a blue pixel, and a black matrix which is formed at a boundary of each color pixel and is substantially opaque to visible light as black.
In the case of using a black photosensitive resin composition for a color filter of a display device or a display, a light-shielding layer is formed by the black photosensitive resin composition at a boundary portion between colored layers in order to improve the contrast and color development effect of red, green and blue colors.
On the other hand, a glass substrate has been conventionally used as a substrate of a display, and when a glass substrate is used, high-temperature curing is possible, but when a flexible (flexible) substrate such as a polymer compound or a polymer is used, particularly when a substrate having an organic material layer in a lower layer is used, high-temperature curing cannot be performed, and when a conventional photosensitive resin composition is used for low-temperature curing, deep curing cannot be performed, and thus the reliability of a display including the substrate is lowered.
For this reason, in recent years, many studies have been made on flexible (flexible) displays, and korean registered patent No. 10-1464312 discloses a photosensitive resin composition capable of being cured at a low temperature. However, the above documents do not disclose low temperature curing of less than 100 ℃, and thus have the following problems: it is not useful for forming a pattern on a flexible substrate such as a polymer or a polymer, particularly on a substrate having an organic material layer as a lower layer.
Documents of the prior art
Patent document
Patent document 1: korean registered patent No. 10-1464312
Disclosure of Invention
Problems to be solved
The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a black photosensitive resin composition which can be cured at a low temperature of less than 100 ℃ so as to form a pattern on a flexible substrate, particularly a substrate having an organic material layer as a lower layer.
Another object of the present invention is to provide a color filter including a black matrix produced from the black photosensitive resin composition, and a display device including the color filter.
Means for solving the problems
In order to achieve the above object, the present invention provides a black photosensitive resin composition comprising a thermosetting agent, wherein the thermosetting agent comprises a thiol (thiol) based compound, and wherein when a cured film formed from the black photosensitive resin composition has a thickness of 1.5 ± 0.1 μm, and when the cured film has an o.d. (Optical Density) of OD1, a reflectance (SIC mode) of Y1, a color change rate (a x 1), and an OD of Propylene Glycol Monomethyl Ether Acetate (PGMEA) after immersion for 10 minutes at 100 ℃ of the cured film is OD2, a reflectance of Y2, and a color change rate of a x 2, OD2/OD1, Y2/Y1, and a x 2/a 1 are all 0.90 or more.
In addition, the present invention provides a color filter comprising a black matrix manufactured using the black photosensitive resin composition.
In addition, the present invention provides a display device including the color filter.
Effects of the invention
The black photosensitive resin composition of the present invention can be cured at a low temperature of less than 100 ℃ and has an excellent degree of curing even on a flexible substrate or a substrate having an organic material layer in the lower layer. Further, an effect of forming a pattern with improved solvent resistance (reliability) is provided.
In addition, a color filter including a black matrix manufactured using the black photosensitive resin composition and a display device including the color filter provide excellent characteristics in terms of reliability, durability, and the like.
Detailed Description
The present invention relates to a black photosensitive resin composition for manufacturing a cured film that minimizes the rate of change of o.d. before and after immersion in Propylene Glycol Monomethyl Ether Acetate (PGMEA), the reflectance (Y), and the rate of change of color (a ×) based on the difference in the degree of cure of the cured film, a color filter including a black matrix manufactured using the same, and a display device including the color filter.
Specifically, the black photosensitive resin composition of the present invention is characterized in that when the thickness of a cured film formed therefrom is 1.5 ± 0.1 μm, and the o.d. (Optical Density) of the cured film is OD1, the reflectance (SIC mode) is Y1, the color change rate (a) is a 1, the OD of the cured film after being immersed in Propylene Glycol Monomethyl Ether Acetate (PGMEA) at 100 ℃ for 10 minutes is OD2, the reflectance is Y2, and the color change rate is a 2, the OD2/OD1, Y2/Y1, and/or a 2/a 1 are all 0.90 or more, preferably 0.95 or more. When the above range is satisfied, there is an advantage that the change in the reflectance of external light is minimized without the change in the reflectance due to the post-process.
The black photosensitive resin composition of the present invention may further include one or more of (a) an epoxy group-containing binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a colorant, and the (E) thermosetting agent may include a thiol (thiol) compound.
The coating film formed from the black photosensitive resin composition of the present invention can be cured at a low temperature of less than 100 ℃, and the solvent resistance (reliability) of the cured film can be improved.
Further, the coating film formed using the black photosensitive resin composition of the present invention can be cured at a low temperature of less than 100 ℃, preferably 70 ℃ or more and less than 100 ℃, and more preferably 80 ℃ or more and less than 100 ℃, and can be effectively used for forming a pattern on a flexible (flexible) substrate such as a polymer compound or a polymer or a substrate including an organic material layer.
< Black photosensitive resin composition >
The black photosensitive resin composition of the present invention comprises (E) a thermosetting agent, and if necessary, may further comprise (a) an epoxy group-containing binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a colorant, (F) an epoxy additive, and/or (G) other additives.
(A) Epoxy group-containing adhesive resin
In the present invention, the epoxy group-containing binder resin can usually make the unexposed portion of the black photosensitive resin layer formed from the black photosensitive resin composition alkali-soluble, and can also function as a dispersion medium for the pigment.
The epoxy group-containing binder resin may be selected from a wide variety of polymers used in the art, but preferably may include a compound represented by the following chemical formula 1.
[ chemical formula 1]
In the chemical formula 1 described above,
R1and R2Each independently hydrogen, C1-C5 alkyl, preferably hydrogen or methyl, more preferably hydrogen, a and b each independently may be an integer of 3-20, preferably an integer of 5-15.
The epoxy group-containing adhesive resin may be obtained by including one or more kinds of epoxy groups as 3, 4-epoxy-containing tricyclo [5.2.1.0 ]2，6]A decane ring compound monomer and one or more monomers as unsaturated carboxylic acids or anhydrides thereof.
The above-mentioned 3, 4-epoxy-containing tricyclo [ 5.2.1.0%2，6]As the decane ring compound, 3, 4-epoxytricyclo [5.2.1.02，6]Decane-9-yl acrylate, 3, 4-epoxytricyclo [5.2.1.02，6]Decane-8-yl acrylate, acrylic acid or the like, preferably 3, 4-epoxytricyclo [5.2.1.02，6]Decane-9-yl acrylate with 3, 4-epoxytricyclo [5.2.1.02，6]A mixture of decane-8-yl acrylate, more preferably the above-mentioned 3, 4-epoxytricyclo [5.2.1.02，6]Decane-9-yl acrylate with 3, 4-epoxytricyclo [5.2.1.02，6]Decane-8-yl acrylate in a volume ratio of 50: 50.
The carboxylic acid or anhydride thereof may be an α, β -unsaturated carboxylic acid such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, or the like, and an anhydride thereof (maleic acid, itaconic acid anhydride, or the like), and methacrylic acid is preferable.
When the compound represented by the above chemical formula 1 is contained as the epoxy group-containing binder resin, the reliability (solvent resistance) after dipping of PGMEA can be improved.
The binder resin may have a weight average molecular weight of 8,000 to 20,000g/mol, preferably 10,000 to 15,000g/mol, an acid value of 50 to 130mg KOH/g, preferably 65 to 120mg KOH/g, based on the solid content, and a dispersity (Mw/Mn) of 1.8 to 2.3, preferably 1.9 to 2.2. This improves the developability in the alkali development, suppresses the generation of residue, and improves the adhesion of the pattern.
The content of the binder resin may be 5 to 20% by weight, and is more preferably 7.5 to 18% by weight, based on the total weight of the solid content in the black photosensitive resin composition. When the content of the binder resin is within the above range, the reliability (solvent resistance) after PGMEA impregnation can be excellent. In the context of the present specification, "the total weight of solid components in the black photosensitive resin composition" means the weight excluding the solvent in the black photosensitive resin composition.
(B) Photopolymerizable compound
In the present invention, the photopolymerizable compound is a compound which can be polymerized by the action of a photopolymerization initiator described later, and examples thereof include monofunctional monomers, difunctional monomers, and other polyfunctional monomers.
Specific examples of the monofunctional monomer include nonylphenylcarbinol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolidone. Specific examples of the bifunctional monomer include 1, 6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, bis (acryloyloxyethyl) ether of bisphenol a, and 3-methylpentanediol di (meth) acrylate. Specific examples of the other polyfunctional monomer include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. Among them, a polyfunctional monomer having two or more functions is preferably used.
The content of the photopolymerizable compound may be 6 to 20 wt% based on the total weight of the solid components in the black photosensitive resin composition, and is more preferably 10 to 17 wt%. When the content of the photopolymerizable compound is within the above range, the intensity and smoothness of the pixel portion tend to be improved, which is preferable.
(C) Photopolymerization initiator
In the present invention, the photopolymerization initiator is a compound for initiating polymerization of the photopolymerizable compound, and in the present invention, there are no particular limitations on the photopolymerization initiator, and compounds of acetophenone, benzophenone, triazine, thioxanthone, oxime, benzoin, anthraquinone, and bisimidazole, and the like can be used, and they can be used alone or in a mixture of two or more.
The content of the photopolymerization initiator may be 0.5 to 5% by weight, and more preferably 1 to 3% by weight, based on the total weight of the solid components in the black photosensitive resin composition. Such a content range takes into consideration the photopolymerization rate of the photopolymerizable compound and the physical properties of the finally obtained coating film, and if it is less than the above range, the polymerization rate is slow and the overall process time may be long, whereas if it is more than the above range, the crosslinking reaction may be lost due to excessive reaction and the physical properties of the coating film may be rather degraded. When the photopolymerization initiator is used in the above content range, the intensity of the pixel portion and the linearity of the pattern can be improved.
The photopolymerization initiator may be used in combination with a photopolymerization initiator aid. When a photopolymerization initiator is used in combination with the photopolymerization initiator, the black photosensitive resin composition containing the photopolymerization initiator is preferably used because the black photosensitive resin composition has higher sensitivity and improves deep curing in forming a black matrix.
The photopolymerization initiation assistant may be used for improving the photocuring efficiency, and may be one or more compounds selected from the group consisting of amine compounds, alkoxyanthracene compounds, thioxanthone compounds, carboxylic acids, and sulfonic acid compounds, preferably carboxylic acids and sulfonic acid compounds.
The photopolymerization initiator aid is preferably used in an amount of usually 10 moles or less, preferably 0.01 to 5 moles per 1 mole of the photopolymerization initiator. When the photopolymerization initiator is used in the above range, the polymerization efficiency can be improved and the deep curing effect can be expected.
(D) Coloring agent
In the present invention, the colorant is used for black color, and plays a role of preventing light leakage in a portion other than the pixel portion.
The above colorant may contain a black inorganic pigment and/or a black organic pigment. For example, the black inorganic pigment may be one or more selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black, and the black organic pigment may be one or more selected from the group consisting of lactam black, perylene black, cyanine black, and aniline black, but is not limited thereto.
The content of the colorant may be 30 to 50% by weight, and is more preferably 35 to 45% by weight, based on the total weight of the solid content in the black photosensitive resin composition. When the content of the colorant is within the above range, it is preferable in terms of being able to exhibit sufficient masking, i.e., high Optical Density (o.d.), and to achieve sufficient pattern formation.
The colorant is preferably used as a pigment dispersion liquid in which the particle size of the pigment is uniformly dispersed. Examples of a method for uniformly dispersing the particle diameter of the pigment include a method in which a pigment dispersant is added to perform dispersion treatment, and a pigment dispersion liquid in which the pigment is uniformly dispersed in a solution can be obtained by the above method.
The pigment dispersant is added for the purpose of disaggregation and maintenance of stability of the pigment, and specific examples of the pigment dispersant include surfactants such as cationic, anionic, nonionic, amphoteric, polyester, and polyamine surfactants; acrylate based dispersants comprising Butyl Methacrylate (BMA) or N, N-dimethylaminoethyl methacrylate (DMAEMA); or other known resin type pigment dispersants; and the like, and they may be used each alone or in combination of two or more.
The content of the pigment dispersant is more than 0 and 1 part by weight or less, preferably 0.01 to 0.5 part by weight, based on 1 part by weight of the colorant. It is preferable to include the pigment dispersant in an amount of more than 0 part by weight and not more than 1 part by weight because a uniformly dispersed pigment can be obtained.
(E) Thermal curing agent
In the present invention, the heat-curing agent plays a role of accelerating deep curing of the coating film and improving mechanical strength, and can accelerate low-temperature curing at less than 100 ℃. The thermosetting agent preferably contains a thiol (thio) group-containing compound, and the thiol group-containing compound more preferably contains 3 to 6 functional thiol groups.
Specifically, the thiol group-containing compound may include a compound represented by the following chemical formula 2 or the following chemical formula 3:
[ chemical formula 2]
In the above chemical formula 2, R3～R6Each independently may contain a C1-C5 alkyl or thiol group, and R3～R6At least 3 or more of them may contain a thiol group.
Preferably, R3is-CH3、
R4～R6Each independently is
[ chemical formula 3]
In the above chemical formula 3, R7～R12Each independently may contain a C1-C5 alkyl or thiol group, R7～R12At least 3 or more of them may contain a thiol group.
Preferably, R7～R12Each independently is
In one exemplary embodiment, the thiol group-containing compound may include compounds represented by the following chemical formulas 4 to 7:
[ chemical formula 4]
[ chemical formula 5]
[ chemical formula 6]
[ chemical formula 7]
The content of the thermosetting agent may be 1 to 5% by weight, and is more preferably 2 to 4.5% by weight, based on the total weight of the solid content in the black photosensitive resin composition. When the content of the thermosetting agent is within the above range, it is preferable from the viewpoint of improving reliability by increasing the degree of curing.
(F) Epoxy additive
The black photosensitive resin composition of the present invention may further contain an epoxy additive as needed by those skilled in the art within a range not impairing the object of the present invention in addition to the above components.
The epoxy additive can be used as a curing agent for improving deep-section curing and mechanical strength.
Specific examples of the epoxy additive include bisphenol a type epoxy resins, hydrogenated bisphenol a type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol F type epoxy resins, novolac type epoxy resins, other aromatic epoxy resins, alicyclic epoxy resins, glycidyl ester resins, glycidyl amine resins, brominated derivatives of these epoxy resins, aliphatic, alicyclic or aromatic epoxy compounds other than epoxy resins and brominated derivatives thereof, butadiene (co) polymer epoxides, isoprene (co) polymer epoxides, glycidyl (meth) acrylate (co) polymers, triglycidyl isocyanurate, and the like.
The epoxy additive may be used in combination with a co-curing compound capable of ring-opening polymerizing an epoxy group of the epoxy compound or an oxetane skeleton of the oxetane compound together with the epoxy additive. Examples of the curing assistant compound include polycarboxylic acids, polycarboxylic acid anhydrides, and acid generators. The polycarboxylic acid anhydride may be a commercially available epoxy resin curing agent. Specific examples of the commercially available epoxy resin curing agent include ADEKA HARDENER EH-700 (trade name, manufactured by ADEKA industries, Ltd.), RIKACID HH (trade name, manufactured by Nissian Chemicals & Co., Ltd.), MH-700 (trade name, manufactured by Nissian Chemicals & Co., Ltd.), and the like. The above-exemplified epoxy additives may be used alone or in combination of two or more.
The epoxy additive may be added as appropriate by those skilled in the art within a range not impairing the effects of the present invention. For example, the epoxy additive may be used in an amount of 0 to 10 parts by weight, preferably 0.1 to 9 parts by weight, and more preferably 0.1 to 8 parts by weight, based on 100 parts by weight of the solid content in the black photosensitive resin composition, but is not limited thereto.
(G) Other additives
The black photosensitive resin composition of the present invention may further contain other additives as needed by those skilled in the art within a range not impairing the object of the present invention in addition to the above components.
The additive may include, for example, a leveling agent.
As the leveling agent, a surfactant which is commercially available for further improving the film formability of the black photosensitive resin composition can be used, and examples thereof include silicone-based, fluorine-based, ester-based, cationic, anionic, nonionic, amphoteric and the like surfactants, and these surfactants can be used alone or in combination of two or more kinds.
The additives may be added as appropriate by those skilled in the art within a range not impairing the effects of the present invention. For example, the additive may be used in an amount of 0.05 to 10 parts by weight, preferably 0.1 to 9 parts by weight, and more preferably 0.1 to 8 parts by weight, based on 100 parts by weight of the solid content in the black photosensitive resin composition, but is not limited thereto.
Black matrix, color filter and display device
The present invention relates to a black matrix produced by using the black photosensitive resin composition.
The method for producing the black photosensitive resin composition of the present invention is not particularly limited, and the known method for producing a black photosensitive resin composition is followed.
For example, it can be obtained by adding a colorant to a solvent, adding the remaining components and other additives, and stirring. In this case, the colorant may be added in the form of a paste prepared by dissolving or dispersing a pigment or the like in a solvent or an alkali-soluble resin in advance. When the additive is in the form of a solution, it may be previously added to the solvent together with the colorant.
The black photosensitive resin composition thus produced can be preferably used for producing a black matrix of a display device.
The present invention also relates to a black matrix manufactured by using the black photosensitive resin composition, and a color filter including the black matrix, wherein the color filter includes a black matrix formed on a substrate. In the case of using the black photosensitive resin composition of the present invention, since a black matrix can be produced at a low temperature, a flexible substrate having flexibility or a substrate including an organic layer, particularly a substrate having an organic layer in a lower layer is preferably used as the substrate, and the black matrix may have flexibility.
A typical patterning process for forming a black matrix using a photolithography method includes the steps of:
a) a step of coating a black photosensitive resin composition on a substrate;
b) a pre-baking step of drying the solvent;
c) irradiating the obtained coating film with active light through a photomask to cure the exposed portion;
d) a step of performing a developing step of dissolving the unexposed portion with an alkali aqueous solution; and
e) the steps of drying and postbaking are carried out.
The substrate is a glass substrate or a polymer plate, and a flexible substrate is preferably used. The flexible substrate is a substrate having flexibility. As the glass substrate, soda lime glass, barium-or strontium-containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass, quartz, or the like can be used particularly preferably. Examples of the polymer sheet include polycarbonate, acryl, polyethylene terephthalate, polyether sulfide, polysulfone, and the like. The substrate may include an organic layer on one surface, and the organic layer may be used without limitation as long as it is an organic substance generally used in an OLED.
In this case, coating can be performed by a wet coating method using a coating apparatus such as a roll coater, a spin coater, a slit coater (also referred to as a die coater), or a spray printer in order to obtain a desired thickness.
In the prebaking, heating is performed by an oven, a hot plate, or the like. In this case, the heating temperature and the heating time in the prebaking are appropriately selected depending on the solvent used, and are carried out, for example, at a temperature of 80 to less than 100 ℃ for 1 to 30 minutes.
The exposure after the prebaking is performed by an exposure machine, and exposure is performed through a photomask, so that only a portion corresponding to the pattern is exposed to light. In this case, the light to be irradiated may be, for example, visible light, ultraviolet light, X-rays, electron beams, or the like.
The alkali development after the exposure is performed for the purpose of removing the photosensitive resin composition in the portion not removed in the non-exposed portion, and a desired pattern is formed by the development. The treatment is carried out by using 0.02 to 0.06 wt% KOH aqueous alkali at a temperature of 10 to 50 ℃, preferably 20 to 40 ℃ by using a developing machine, an ultrasonic cleaning machine or the like.
The post-baking is performed to improve the adhesion between the patterned film and the substrate, and is preferably performed by performing a heat treatment at a temperature of 80 to less than 100 ℃ for 10 to 120 minutes. Specifically, when a flexible substrate having poor heat resistance or a lower layer having no organic material layer is used, the heat treatment is preferably performed at a low temperature of 80 to 100 ℃. The post-baking is performed by an oven, a hot plate, or the like as in the pre-baking.
In this case, the thickness of the black matrix is preferably 1.0 to 5.0. mu.m, more preferably 1.0 to 3.0. mu.m, and particularly preferably 1.0 to 2.0. mu.m.
The black matrix produced from the black photosensitive resin composition of the present invention has an effect of improving the adhesion force to the base material of the black matrix, and thus can have excellent characteristics in terms of reliability, durability, and the like of a display device.
Furthermore, the present invention provides a display device and/or a display comprising the above color filter.
The present invention will be described in more detail below with reference to examples. However, the following examples are intended to more specifically illustrate the present invention, and the scope of the present invention is not limited to the following examples. The following embodiments may be modified and changed as appropriate by those skilled in the art within the scope of the present invention.
Synthesis example 1: synthesis of epoxy group-containing adhesive resin (A-1)
A1L separable flask having an internal volume and equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen gas inlet was charged with 277g of methoxybutyl acetate, and after the temperature was raised to 80 ℃ it was added dropwise over 5 hours to add 3, 4-epoxytricyclo [5.2.1.0 ]2，6]Decane-9-yl acrylate with 3, 4-epoxytricyclo [5.2.1.02，6]Mixture of decane-8-yl acrylate [ 50: 50 (molar ratio)]301g of a mixed solution of Azobisdimethylvaleronitrile (AIV), 49g of methacrylic acid and 23g of Azobisdimethylvaleronitrile (AIV) dissolved in 350g of methoxybutyl acetate was cured for 3 hours to obtain a binder resin (A) [ solid content (NV)35.0 wt% ]]. The acid value (dry) of the binder resin (A) was 69.8KOH mg/g, the weight average molecular weight (Mw) was 12300, and the molecular weight (Mw/Mn) was 2.1.
Production example 1: production of Black pigment Dispersion (D-1)
A black pigment dispersion (D-1) was produced by mixing and charging a composition comprising the following components in a weight ratio of 50: 50 with a rigid grinding medium (zirconia beads) having an average particle size of 0.1mm, and then dispersing the pigment for 4 to 6 hours by a bead mill: 15.0 parts by weight of carbon black (P.Bk.7) as a colorant, 3 parts by weight (in terms of solid content) [ 35.0% by weight of solid content (NV) ] of the binder resin (A-1) as a dispersion resin, 5 parts by weight (in terms of solid content) of an acrylic polymer dispersant (DISPERBYK-2000) as a dispersant [ 40.0% by weight of solid content (NV) ], and 77 parts by weight of propylene glycol monomethyl ether acetate as a solvent.
Production example 2: production of Black pigment Dispersion (D-2)
A black pigment dispersion (D-2) was produced by mixing and charging a composition comprising the following components in a weight ratio of 50: 50 with a rigid grinding medium (zirconia beads) having an average particle size of 0.1mm, and then dispersing the pigment for 4 to 6 hours by a bead mill: 15.0 parts by weight of an organic black pigment (IrgaphorS 100CF, Basff Co.), 3 parts by weight (in terms of solid content) of the binder resin (A-1) as a dispersion resin [ 35.0% by weight of solid content (NV) ], 5 parts by weight (in terms of solid content) of an acrylic polymer dispersant (DISPERBYK-2000) as a dispersant [ 40.0% by weight of solid content (NV) ], and 77 parts by weight of propylene glycol monomethyl ether acetate as a solvent.
Production of Black photosensitive resin compositions of examples and comparative examples
The black photosensitive resin compositions of examples and comparative examples were manufactured with reference to table 1 below.
[ Table 1]
(A-1) binder resin: resin produced according to Synthesis example 1
(A-2) binder resin: S-77A (love for chemical, non-epoxy resin)
(B) Photopolymerizable compound: dipentaerythritol hexaacrylate
(C) Photopolymerization initiator: irgacure OXE-01 (manufactured by BASF corporation)
(D) Colorant dispersion liquid: 13.7% by mass and 86.3% by mass of a mixture of production example 1(D-1) and production example 2(D-2) based on the total mass of the colorant dispersion
(E-1) thermal curing agent: compound represented by chemical formula 4 (TMMP, SC organic Chemicals Co., Ltd.)
[ chemical formula 4]
(E-2) thermal curing agent: compound represented by chemical formula 5 (PEMP, SC organic Chemicals Co., Ltd.)
[ chemical formula 5]
(E-3) thermal curing agent: a compound represented by chemical formula 6 (PE1, Showa Denko Co., Ltd.)
[ chemical formula 6]
(E-4) thermal curing agent: compound represented by chemical formula 7 (DPMP, SC organic Chemicals Co., Ltd.)
[ chemical formula 7]
(E-5) thermal curing agent: azobisisobutyronitrile (AIBN reagent (Aldrich) Co., Ltd.), a thermal curing agent containing no thiol group)
(F) Epoxy additive: celloxide2021P (Daicel corporation)
(G) Additive (leveling agent): f-554(DIC corporation)
Test example: evaluation of physical Properties of Black photosensitive resin composition
(1) Fabrication of cured films
The glass substrate (corning corporation) of 5cmX5cm was washed with a neutral detergent and water and then dried. A coating film was formed on the glass substrate by using the black photosensitive resin compositions of examples and comparative examples so that the final film thickness became 1.5. + -. 0.1. mu.m (measured by Dektak apparatus), and the exposure amount of the coating film was 100mJ/cm2The film was exposed to light and baked at 80 ℃ for 60 minutes to form a cured film.
(2) Optical Density (O.D.) determination
The optical density (OD1) of the cured film produced in (1) was measured by X-rite, and the optical density (OD2) was measured again after the cured film was immersed in propylene glycol monomethyl ether acetate at 100 ℃ for 10 minutes, and the OD2/OD1 were calculated (Δ o.d.), and the results are shown in table 2 below.
(2) Reflectance measurement
The reflectance (Y1) of the cured film produced in (1) above was measured in the SIC mode by an integrating sphere reflectance measuring instrument (CM-3700D), the cured film was immersed in propylene glycol monomethyl ether acetate at 100 ℃ for 10 minutes, and then the reflectance (Y2) was measured again, and the Y2/Y1 was calculated (Δ reflectance), and the results thereof are shown in table 2 below.
(3) Determination of color Change Rate
The color change rate of the cured film produced in (1) was measured by an integrating sphere reflectometer (CM-3700D), and the cured film was immersed in propylene glycol monomethyl ether acetate at 100 ℃ for 10 minutes, and then the color change rate (a × 2) was measured again, and a × 2/a × 1 was calculated (Δ color change rate), and the results thereof are shown in table 2 below.
[ Table 2]
Referring to table 2 above, the optical density change rate, the reflectance change rate, and the color change rate before and after the immersion in propylene glycol monomethyl ether acetate were 0.80 or less in comparative examples 1 to 4, and 0.90 or more in examples 1 to 8 of the present invention. This indicates that the change in optical density, reflectance, and color of the cured film of the present invention cured at a low temperature is significantly suppressed, and it can be confirmed that, in the case of using the black photosensitive resin composition of the present invention, excellent curability and solvent resistance are exhibited even when curing is performed at a low temperature of 80 ℃.
Claims (13)
1. A black photosensitive resin composition comprising a thermosetting agent,
the thermal curing agent contains a thiol compound,
the cured film formed from the black photosensitive resin composition had a thickness of 1.5 ± 0.1 μm, and had an optical density of OD1, a reflectance of Y1, and a color change rate of a 1, and had an optical density of OD2, a reflectance of Y2, and a color change rate of a 2 after immersion of the cured film in propylene glycol monomethyl ether acetate at 100 ℃ for 10 minutes, all of OD2/OD1, Y2/Y1, and a 2/a 1 were 0.90 or more.
2. The black photosensitive resin composition according to claim 1, further comprising at least one of an epoxy group-containing binder resin, a photopolymerizable compound, a photopolymerization initiator and a colorant.
3. The black photosensitive resin composition according to claim 1, wherein the black photosensitive resin composition is used for forming a pattern on a flexible substrate or a substrate containing an organic material layer.
4. The black photosensitive resin composition according to claim 1, wherein a coating film formed from the black photosensitive resin composition is cured at a low temperature of less than 100 ℃.
5. The black photosensitive resin composition according to claim 2, wherein the epoxy group-containing binder resin comprises a compound represented by the following chemical formula 1:
chemical formula 1
In the chemical formula 1, the metal oxide is represented by,
R1and R2Each independently is hydrogen or CH3，
a and b are each independently an integer of 3 to 20.
6. The black photosensitive resin composition according to claim 1, wherein the thiol compound comprises a compound containing a thiol group.
7. The black photosensitive resin composition according to claim 6, wherein the thiol group-containing compound comprises 3 to 6 functional thiol groups.
8. The black photosensitive resin composition according to claim 6, wherein the thiol group-containing compound comprises a compound represented by the following chemical formula 2 or the following chemical formula 3:
chemical formula 2
In the chemical formula 2, the first and second organic solvents,
R3is-CH3、
R4～R6Each independently is
Chemical formula 3
In the chemical formula 3, the first and second organic solvents,
R7～R12each independently is
9. The black photosensitive resin composition according to claim 1, wherein said black photosensitive resin composition further comprises (F) an epoxy additive.
10. The black photosensitive resin composition according to claim 1, wherein the black photosensitive resin composition further comprises (G) a leveling agent.
11. The black photosensitive resin composition according to claim 2,
the black photosensitive resin composition comprises, based on the total solid content in the black photosensitive resin composition:
5-20 wt% of the epoxy group-containing binder resin;
6 to 20 wt% of the photopolymerizable compound;
0.5 to 5 wt% of a photopolymerization initiator;
30 to 50 wt% of the colorant; and
1 to 5 wt% of the thermal curing agent.
12. A color filter comprising a black matrix produced using the black photosensitive resin composition according to any one of claims 1 to 11.
13. A display device comprising the color filter of claim 12.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2020-0019239 | 2020-02-17 | ||
| KR1020200019239A KR20210104956A (en) | 2020-02-17 | 2020-02-17 | A black photo sensitive resin composition, a color filter comprising a black metrics by using the composition, and a display comprising the color filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113267959A true CN113267959A (en) | 2021-08-17 |
Family
ID=77228110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110180937.1A Pending CN113267959A (en) | 2020-02-17 | 2021-02-07 | Black photosensitive resin composition, color filter comprising black matrix manufactured using same, and display device comprising color filter |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20210104956A (en) |
| CN (1) | CN113267959A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140086493A (en) * | 2012-12-28 | 2014-07-08 | 동우 화인켐 주식회사 | Black-colored photosensitive resin composition, black matrix prepared by using thereof and color filter comprising the black matrix |
| CN105319850A (en) * | 2014-07-01 | 2016-02-10 | 东友精细化工有限公司 | Photonasty resin composition |
| CN105938294A (en) * | 2015-03-05 | 2016-09-14 | 东友精细化工有限公司 | Negative photosensitive resin composition |
| CN107092165A (en) * | 2016-02-17 | 2017-08-25 | 住友化学株式会社 | Colored curable resin composition, colour filter and the display device comprising the colour filter |
| CN109696801A (en) * | 2017-10-20 | 2019-04-30 | 东友精细化工有限公司 | Color dispersion liquid, photosensitive composition, pattern layer, colour filter and display device |
| CN109765756A (en) * | 2017-11-09 | 2019-05-17 | 东友精细化工有限公司 | Photosensitive composition, colour filter and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101464312B1 (en) | 2008-03-03 | 2014-11-21 | 주식회사 동진쎄미켐 | Photosensitive resin composition which is capable of being cured at a low temperature |
-
2020
- 2020-02-17 KR KR1020200019239A patent/KR20210104956A/en not_active Application Discontinuation
-
2021
- 2021-02-07 CN CN202110180937.1A patent/CN113267959A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140086493A (en) * | 2012-12-28 | 2014-07-08 | 동우 화인켐 주식회사 | Black-colored photosensitive resin composition, black matrix prepared by using thereof and color filter comprising the black matrix |
| CN105319850A (en) * | 2014-07-01 | 2016-02-10 | 东友精细化工有限公司 | Photonasty resin composition |
| CN105938294A (en) * | 2015-03-05 | 2016-09-14 | 东友精细化工有限公司 | Negative photosensitive resin composition |
| CN107092165A (en) * | 2016-02-17 | 2017-08-25 | 住友化学株式会社 | Colored curable resin composition, colour filter and the display device comprising the colour filter |
| CN109696801A (en) * | 2017-10-20 | 2019-04-30 | 东友精细化工有限公司 | Color dispersion liquid, photosensitive composition, pattern layer, colour filter and display device |
| CN109765756A (en) * | 2017-11-09 | 2019-05-17 | 东友精细化工有限公司 | Photosensitive composition, colour filter and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210104956A (en) | 2021-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111796484B (en) | Colored photosensitive resin composition, color filter and image display device provided with same | |
| JP5431225B2 (en) | Alkali-developable photosensitive resin composition, partition wall for display element formed using the same, and display element | |
| KR101051398B1 (en) | Photosensitive resin composition for black resist and light shielding film formed using this | |
| TWI490644B (en) | Blue photosensitive resin composition for color filter and uses thereof | |
| CN104950577A (en) | Photosensitive resin composition for light shielding film, light shielding film formed through hardening of same, and color filter | |
| CN104898372A (en) | Black resin combination for light shielding film, substrate with shielding film, colorful light filtering sheet and touch control screen | |
| CN106959577A (en) | Photosensitive polymer combination, photomask, liquid crystal display and these manufacture method | |
| TWI709818B (en) | Photosensitive resin composition for light-sielding film with the role of spacer, light-sielding film, liquid crystal display device, method for producing photosensitive resin composition for light-sielding film with the role of spacer, method for producing light-sielding film and method for producing liquid crystal display device | |
| JP5180765B2 (en) | Alkali-developable photosensitive resin composition, display element partition and display element formed using the same | |
| US20030175615A1 (en) | Photocurable resin composition | |
| KR20170113390A (en) | Photosensitive resin composition for light-shielding film, display substrate having the light-shielding film obtained by curing the same, and manufacturing method of display substrate | |
| TWI478950B (en) | Non-aqueous dispersant, color material dispersion liquid and method for producing the same, color resin composition and method for producing the same, color filter, liquid crystal display device and organic light-emitting display device | |
| CN104684994A (en) | Ink-repellent composition, negative photosensitive resin composition, hardened film, partition wall, and optical element | |
| CN102652285B (en) | Photosensitive composition, partition wall, color filter and organic el element | |
| KR20150011496A (en) | A colored photosensitive resin composition, color filter and display device comprising the same | |
| KR20200112626A (en) | A photo sensitive resin composition, a display partition wall structure prepared using the composition, and a display devide comprising the same | |
| CN113267959A (en) | Black photosensitive resin composition, color filter comprising black matrix manufactured using same, and display device comprising color filter | |
| JP2008181016A (en) | Composition for forming protrusion for liquid crystal alignment control | |
| KR102622853B1 (en) | A black photo sensitive resin composition, a color filter comprising a black metrics by using the composition, and a display comprising the color filter | |
| JP2003255120A (en) | Resin composition for color filter | |
| TWI535742B (en) | Photosensitive resin composition for color filter and its application | |
| KR102664597B1 (en) | Black photosensitive resin composition, cured film and black matrix produced using the same | |
| TW574619B (en) | Photosensitive resin, photoresist for color filters, and process for producing color filter | |
| KR20080100720A (en) | A colored photosensitive resin composition, color filter, liquid crystal display device having the same | |
| KR20210106127A (en) | Radiation-sensitive resin composition, method for forming cured film for display device, and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |