CN113267552B - Nitrogen oxygen sensor ceramic chip - Google Patents
Nitrogen oxygen sensor ceramic chip Download PDFInfo
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- CN113267552B CN113267552B CN202110529535.8A CN202110529535A CN113267552B CN 113267552 B CN113267552 B CN 113267552B CN 202110529535 A CN202110529535 A CN 202110529535A CN 113267552 B CN113267552 B CN 113267552B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 119
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 238000009792 diffusion process Methods 0.000 claims abstract description 157
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 134
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 61
- 239000007789 gas Substances 0.000 claims description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/4075—Composition or fabrication of the electrodes and coatings thereon, e.g. catalysts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
The invention provides a nitrogen-oxygen sensor ceramic chip, and relates to the technical field of sensors. The nitrogen-oxygen sensor ceramic chip comprises a first zirconia ceramic layer, a second zirconia ceramic layer, a main pump chamber, an auxiliary pump chamber and a measuring pump chamber, wherein the first zirconia ceramic layer is sequentially laminated from top to bottom, the main pump chamber, the auxiliary pump chamber and the measuring pump chamber are arranged in the second zirconia ceramic layer, the main pump chamber and the nitrogen-oxygen sensor ceramic chip are communicated through a first diffusion channel, the main pump chamber and the auxiliary pump chamber are communicated through a second diffusion channel, the auxiliary pump chamber and the measuring pump chamber are communicated through a third diffusion channel, and the first diffusion channel, the second diffusion channel and the third diffusion channel are of a hole type air inlet diffusion channel structure. Through adopting hole formula air inlet diffusion channel structure, effectively prevent knudsen diffusion, carbon deposit jam and air inlet channel micro-crack caused sensor failure problem, reduced the risk that nitrogen oxygen sensor ceramic chip degraded, promoted nitrogen oxygen sensor ceramic chip producer's product percent of pass greatly.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a nitrogen-oxygen sensor ceramic chip.
Background
In a vehicle exhaust system, the concentration of nitrogen and oxygen in exhaust gas is detected by a ceramic chip of a nitrogen and oxygen sensor sensing probe. The ceramic chip is the most core part of the whole sensor, and tail gas enters the cavity in the ceramic chip through the diffusion channel in the ceramic chip.
The design and preparation of the diffusion channel is a technical difficulty of the ceramic chip. In conventional technology, one way is: the diffusion channel can be formed by a microporous structure with certain porosity, but the pore diameter of the micropores is too small to be easy to accumulate carbon, and gas molecules are diffused with the defects of unstable Knudsen diffusion to cause inaccurate gas inlet concentration; another way is: the diffusion channel is formed by vertically non-bonding two adjacent layers of matrix materials of the ceramic chip, the process is difficult to realize, cracks are easily caused by gaps after sintering or under the condition that the nitrogen-oxygen sensor is 800 ℃ high temperature, in addition, the sectional area of the gaps is difficult to control, so that the air inflow is difficult to control, and the product rejection rate is high. The diffusion channels of both of the above approaches are prone to degradation in the performance of the ceramic chip.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a nitrogen-oxygen sensor ceramic chip so as to solve the problem that a diffusion channel in the prior art is easy to cause the performance degradation of the ceramic chip.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the invention provides a nitrogen-oxygen sensor ceramic chip, which comprises a first zirconia ceramic layer, a second zirconia ceramic layer, a third zirconia ceramic layer, a fourth zirconia ceramic layer, a fifth zirconia ceramic layer and a sixth zirconia ceramic layer which are sequentially laminated from top to bottom,
the method comprises the steps that a common electrode is arranged on a first zirconia ceramic layer, a main pump chamber, an auxiliary pump chamber and a measuring pump chamber are sequentially arranged in a second zirconia ceramic layer from left to right, the upper side of the main pump chamber is provided with a main pump electrode, the lower side of the main pump chamber is provided with a main pump reference electrode, the upper side of the auxiliary pump chamber is provided with an auxiliary pump electrode, the lower side of the auxiliary pump chamber is provided with a measuring pump reference electrode, the upper side of the measuring pump chamber is provided with a measuring pump electrode, the lower side of the measuring pump chamber is provided with a measuring pump reference electrode, the main pump chamber is communicated with the outside of a nitrogen-oxygen sensor ceramic chip through a first diffusion channel, the main pump chamber is communicated with the auxiliary pump chamber through a second diffusion channel, the auxiliary pump chamber is communicated with the measuring pump chamber through a third diffusion channel, and the first diffusion channel, the second diffusion channel and the third diffusion channel are all of an orifice type air inlet diffusion channel structure which is a cylindrical hollow airflow channel with a preset aperture;
the right side of the fourth zirconia ceramic layer is provided with a reference chamber communicated with the atmosphere, and the lower side of the reference chamber is provided with a reference electrode;
a platinum electrode heating wire is arranged between the fifth zirconia ceramic layer and the sixth zirconia ceramic layer.
Optionally, an alumina protective layer is provided in a part of the region between the common electrode and the first zirconia ceramic layer.
Alternatively, the hole-type intake diffusion channel structure is fabricated by: and (3) clamping the cylindrical carbon rod with the preset pore diameter between zirconia raw ceramic chips for isostatic lamination, and then sintering at a preset sintering temperature to ensure that carbon rod combustion becomes carbon dioxide gas to be discharged, so that a cylindrical hollow channel structure with the same shape as the carbon rod is formed in the sintered zirconia ceramic layer.
Optionally, the carbon rod is made by: the carbon powder is molded into a cylindrical shape having a preset pore diameter to form a preformed carbon rod, and then the preformed carbon rod is sintered at a preset curing temperature to cure the structure of the preformed carbon rod, thereby forming the carbon rod.
Optionally, the first diffusion channel includes a plurality of first sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of first sub-diffusion channels being a1, and the aperture of each first sub-diffusion channel being b1, the total through-hole area c1 of the first diffusion channels; the second diffusion channel includes a plurality of second sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of second sub-diffusion channels being a2, and the aperture of each second sub-diffusion channel being b2, the total through-hole area of the second diffusion channels being c2; the third diffusion channel includes a plurality of third sub-diffusion channels disposed in parallel with each other and having the same size, the number of the plurality of third sub-diffusion channels being a3, and the aperture of each third sub-diffusion channel being b3, the total through-hole area of the third diffusion channel being c3; the total through hole area is equal to the product of the through hole area of each corresponding sub-diffusion channel and the number of sub-diffusion channels; wherein a1, a2 and a3 are positive integers, b1, b2 and b3 are all 50-150 μm, b1 is less than or equal to b2 and less than or equal to b3, and c1 is more than or equal to c2 and more than or equal to c3.
Optionally, b1< b2< b3, and c1> c2> c3.
Optionally, b2=d1×b1, b3=d2×b2, c2=e1×c1, c3=e2×c2, wherein d1 is used to represent a proportionality coefficient of the aperture of the second sub-diffusion channel with respect to the aperture of the first sub-diffusion channel, d2 is used to represent a proportionality coefficient of the aperture of the third sub-diffusion channel with respect to the aperture of the second sub-diffusion channel, e1 is used to represent a proportionality coefficient of the total through-hole area of the second diffusion channel with respect to the total through-hole area of the first diffusion channel, e2 is used to represent a proportionality coefficient of the total through-hole area of the third diffusion channel with respect to the total through-hole area of the second diffusion channel, and 1.1< d1, d2<1.5;0.5< e1, e2<0.9.
Alternatively, d1=d2, and e1=e2.
Optionally, the first, second and third pluralities of sub-diffusion channels all extend in the same plane parallel to the upper surface of the second zirconia ceramic layer.
Optionally, the same plane is located at a middle position in the second zirconia ceramic layer in a direction perpendicular to the upper surface of the second zirconia ceramic layer.
The beneficial effects of the invention include:
the invention provides a nitrogen-oxygen sensor ceramic chip which comprises a first zirconia ceramic layer, a second zirconia ceramic layer, a third zirconia ceramic layer, a fourth zirconia ceramic layer, a fifth zirconia ceramic layer and a sixth zirconia ceramic layer which are sequentially laminated from top to bottom, wherein a common electrode is arranged on the first zirconia ceramic layer, a main pump chamber, an auxiliary pump chamber and a measuring pump chamber are sequentially arranged in the second zirconia ceramic layer from left to right, a main pump electrode is arranged on the upper side of the main pump chamber, a main pump reference electrode is arranged on the lower side of the main pump chamber, an auxiliary pump electrode is arranged on the upper side of the auxiliary pump chamber, an auxiliary pump reference electrode is arranged on the lower side of the auxiliary pump chamber, a measuring pump electrode is arranged on the upper side of the measuring pump chamber, a measuring pump reference electrode is arranged on the lower side of the measuring pump chamber, the main pump chamber is communicated with the outside of the nitrogen-oxygen sensor ceramic chip through a first diffusion channel, the main pump chamber is communicated with the auxiliary pump chamber through a second diffusion channel, the auxiliary pump chamber is communicated with the measuring pump chamber through a third diffusion channel, and the first diffusion channel, the second diffusion channel and the third diffusion channel are provided with a preset hole-type air inlet channel, and the air inlet channel has a cylindrical air inlet structure; the right side of the fourth zirconia ceramic layer is provided with a reference chamber communicated with the atmosphere, and the lower side of the reference chamber is provided with a reference electrode; a platinum electrode heating wire is arranged between the fifth zirconia ceramic layer and the sixth zirconia ceramic layer. Through adopting hole formula air inlet diffusion channel structure, effectively prevent knudsen diffusion, carbon deposit jam and air inlet channel micro-crack caused sensor failure problem, reduced the risk that nitrogen oxygen sensor ceramic chip degraded, promoted nitrogen oxygen sensor ceramic chip producer's product percent of pass greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic structural diagram of a ceramic chip of a nitrogen-oxygen sensor according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a first diffusion channel of a nitrogen-oxygen sensor ceramic chip according to another embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In a vehicle exhaust system, the concentration of nitrogen and oxygen in exhaust gas is detected by a ceramic chip of a nitrogen and oxygen sensor sensing probe. The ceramic chip is the most core part of the whole sensor, and tail gas enters the cavity in the ceramic chip through the diffusion channel in the ceramic chip. The design and preparation of the diffusion channel is a technical difficulty of the ceramic chip. In conventional technology, one way is: the diffusion channel can be formed by a microporous structure with certain porosity, but the pore diameter of the micropores is too small to be easy to accumulate carbon, and gas molecules are diffused with the defects of unstable Knudsen diffusion to cause inaccurate gas inlet concentration; another way is: the diffusion channel is formed by vertically non-bonding two adjacent layers of matrix materials of the ceramic chip, the process is difficult to realize, cracks are easily caused by gaps after sintering or under the condition that the nitrogen-oxygen sensor is 800 ℃ high temperature, in addition, the sectional area of the gaps is difficult to control, so that the air inflow is difficult to control, and the product rejection rate is high. The diffusion channels of both of the above approaches are prone to degradation in the performance of the ceramic chip. For this purpose, the invention provides a nitrogen-oxygen sensor ceramic chip.
Fig. 1 shows a schematic structural diagram of a nitrogen-oxygen sensor ceramic chip provided by an embodiment of the invention. As shown in fig. 1, the nitrogen-oxygen sensor ceramic chip comprises a first zirconia ceramic layer 101, a second zirconia ceramic layer 102, a third zirconia ceramic layer 103, a fourth zirconia ceramic layer 104, a fifth zirconia ceramic layer 105 and a sixth zirconia ceramic layer 106 which are sequentially stacked from top to bottom, wherein a common electrode 107 is arranged on the first zirconia ceramic layer 101, a main pump chamber 108, a secondary pump chamber 109 and a measuring pump chamber 110 are sequentially arranged in the second zirconia ceramic layer 102 from left to right, a main pump electrode 181 is arranged on the upper side of the main pump chamber 108, a main pump reference electrode 182 is arranged on the lower side of the main pump chamber 108, a secondary pump electrode 191 is arranged on the upper side of the secondary pump chamber 109, a secondary pump reference electrode 192 is arranged on the lower side of the secondary pump chamber 109, a measuring pump electrode 111 is arranged on the upper side of the measuring pump chamber 110, a measuring pump reference electrode 112 is arranged on the lower side of the measuring pump chamber 110, the main pump chamber 108 is communicated with the outside of the nitrogen-oxygen sensor ceramic chip through a first diffusion channel 113, the main pump chamber 108 and the secondary pump chamber 108 are communicated with the measuring pump chamber 108 through a second diffusion channel 108, a third diffusion channel 114 and a cylindrical diffusion channel 114 are communicated with the measuring pump chamber 110 through a second diffusion channel 114, and a third diffusion channel 114 is provided with a hollow-shaped diffusion channel structure; the right side of the fourth zirconia ceramic layer 104 is provided with a reference chamber 116 communicated with the atmosphere, and the lower side of the reference chamber 116 is provided with a reference electrode 117; a platinum electrode heating wire 118 is provided between the fifth zirconia ceramic layer 105 and the sixth zirconia ceramic layer 106.
When the sensor works, tail gas sequentially enters the main pump chamber 108, the auxiliary pump chamber 109 and the measuring pump chamber 110 from the first diffusion channel 113, the second diffusion channel 114 and the third diffusion channel 115, oxygen in the chamber is continuously pumped out by a pump oxygen electrode in the ceramic chip, and the concentration value of the tail gas is fed back to the controller electronic control unit in a current mode (Ip 0 represents oxygen current; ip2 represents nitrogen-oxygen current; ip1 is regulating current and is not output); the electronic control unit simultaneously controls the heating temperature of the sensor probe (heating by the platinum electrode heater wire 118) and through a series of signal conditioning, the Nox concentration and the oxygen concentration in the measurement pump chamber 110 are finally calculated and determined. When the intelligent control system is used in a vehicle, the electronic control unit is communicated with the whole vehicle control center through the CAN bus, the concentration of NOx and O2 is sent to the automobile CAN bus in real time, and nitrogen oxide in the state six is used for providing basis for SCR injection quantity so as to reduce emission of NOx. In addition, the signals of nitrogen and oxygen after the sixth country are read and written by the OBD system and then whether the emission is qualified or not is judged; the post-nitroxide forms a closed loop control with the pre-nitroxide.
Through adopting hole formula air inlet diffusion channel structure, effectively prevent knudsen diffusion, carbon deposit jam and air inlet channel micro-crack caused sensor failure problem, reduced the risk that nitrogen oxygen sensor ceramic chip degraded, promoted nitrogen oxygen sensor ceramic chip producer's product percent of pass greatly.
Alternatively, an alumina protective layer 119 is provided in a part of the region between the common electrode 107 and the first zirconia ceramic layer 101.
Alternatively, the hole-type intake diffusion channel structure is fabricated by: and (3) clamping the cylindrical carbon rod with the preset pore diameter between zirconia raw ceramic chips for isostatic lamination, and then sintering at a preset sintering temperature to ensure that carbon rod combustion becomes carbon dioxide gas to be discharged, so that a cylindrical hollow channel structure with the same shape as the carbon rod is formed in the sintered zirconia ceramic layer. Optionally, the carbon rod is made by: the carbon powder is molded into a cylindrical shape having a preset pore diameter to form a preformed carbon rod, and then the preformed carbon rod is sintered at a preset curing temperature to cure the structure of the preformed carbon rod, thereby forming the carbon rod.
Optionally, the first diffusion channel includes a plurality of first sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of first sub-diffusion channels being a1, and the aperture of each first sub-diffusion channel being b1, the total through-hole area c1 of the first diffusion channels; the second diffusion channel includes a plurality of second sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of second sub-diffusion channels being a2, and the aperture of each second sub-diffusion channel being b2, the total through-hole area of the second diffusion channels being c2; the third diffusion channel includes a plurality of third sub-diffusion channels disposed in parallel with each other and having the same size, the number of the plurality of third sub-diffusion channels being a3, and the aperture of each third sub-diffusion channel being b3, the total through-hole area of the third diffusion channel being c3; the total through hole area is equal to the product of the through hole area of each corresponding sub-diffusion channel and the number of sub-diffusion channels; wherein a1, a2 and a3 are positive integers, b1, b2 and b3 are all 50-150 μm, b1 is less than or equal to b2 and less than or equal to b3, and c1 is more than or equal to c2 and more than or equal to c3.
Fig. 2 illustrates a schematic cross-sectional view of a first diffusion channel of a ceramic chip of a nitrogen-oxygen sensor provided in another embodiment of the present invention, and as illustrated in fig. 2, the first diffusion channel 113 may include a plurality of first sub-diffusion channels 131 disposed parallel to each other and having the same size, although four first sub-diffusion channels 131 are illustrated in fig. 2, it should be understood that the number of first sub-diffusion channels 131 is not limited thereto. The sub-diffusion channels corresponding to the second diffusion channel 114 and the third diffusion channel 115 may also be arranged in a similar manner to fig. 2.
Optionally, b1< b2< b3, and c1> c2> c3. Optionally, b2=d1×b1, b3=d2×b2, c2=e1×c1, c3=e2×c2, wherein d1 is used to represent a proportionality coefficient of the aperture of the second sub-diffusion channel with respect to the aperture of the first sub-diffusion channel, d2 is used to represent a proportionality coefficient of the aperture of the third sub-diffusion channel with respect to the aperture of the second sub-diffusion channel, e1 is used to represent a proportionality coefficient of the total through-hole area of the second diffusion channel with respect to the total through-hole area of the first diffusion channel, e2 is used to represent a proportionality coefficient of the total through-hole area of the third diffusion channel with respect to the total through-hole area of the second diffusion channel, and 1.1< d1, d2<1.5;0.5< e1, e2<0.9. Alternatively, d1=d2, and e1=e2. From first diffusion channel to third diffusion channel, through the aperture size that enlarges in proper order, avoid getting into the interior carbon particle of cavity and be blockked up and pile up, through reducing total through-hole area in proper order, can increase the velocity of flow of air current in first diffusion channel to the third diffusion channel in proper order, further reduced the risk of carbon deposition.
Optionally, the first, second and third pluralities of sub-diffusion channels all extend in the same plane parallel to the upper surface of the second zirconia ceramic layer. Optionally, the same plane is located at a middle position in the second zirconia ceramic layer in a direction perpendicular to the upper surface of the second zirconia ceramic layer.
In summary, the embodiment of the invention uses the small hole structure to stabilize the intake flow, and the diffusion channel is not easy to deform, so that the single hole diffusion area is enlarged, the knudsen diffusion is avoided, and the accurate measurement of the nitrogen and oxygen gas components is facilitated. However, the process of the small hole is a technical difficulty, and the embodiment of the invention is solved by the following scheme: the ZrO2 green ceramic chips are subjected to isostatic lamination by being clamped by a fine carbon rod, so that residual heat stress is not easy to cause; in order to ensure that the carbon rod is not easy to be crushed or broken, the carbon rod is die-cast and molded in a die press and presintered at a certain temperature to form a certain mechanical strength (like the shape of a pencil lead), the whole carbon rod enters a sintering process after being isostatic, and the carbon rod can be burnt at a high temperature of 1500 ℃ to become CO2 gas to be discharged, so that a round hole-shaped structure of the carbon rod is formed. By utilizing the hole type air inlet diffusion channel structure, the problems that the traditional product is easy to fail and the rejection rate of the ceramic chip of a manufacturer is high are solved, the production cost is saved, and the product quality is improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, but not limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. A nitrogen-oxygen sensor ceramic chip is characterized by comprising a first zirconia ceramic layer, a second zirconia ceramic layer, a third zirconia ceramic layer, a fourth zirconia ceramic layer, a fifth zirconia ceramic layer and a sixth zirconia ceramic layer which are sequentially laminated from top to bottom,
the method comprises the steps that a common electrode is arranged on a first zirconia ceramic layer, a main pump chamber, an auxiliary pump chamber and a measuring pump chamber are sequentially arranged in a second zirconia ceramic layer from left to right, a main pump electrode is arranged on the upper side of the main pump chamber, a main pump reference electrode is arranged on the lower side of the main pump chamber, an auxiliary pump electrode is arranged on the upper side of the auxiliary pump chamber, an auxiliary pump reference electrode is arranged on the lower side of the auxiliary pump chamber, a measuring pump electrode is arranged on the upper side of the measuring pump chamber, a measuring pump reference electrode is arranged on the lower side of the measuring pump chamber, the main pump chamber is communicated with the outside of a nitrogen-oxygen sensor ceramic chip through a first diffusion channel, the main pump chamber is communicated with the auxiliary pump chamber through a second diffusion channel, the auxiliary pump chamber is communicated with the measuring pump chamber through a third diffusion channel, and the first diffusion channel, the second diffusion channel and the third diffusion channel are all of a hole type air inlet diffusion channel structure, and the hole type air inlet diffusion channel structure is a cylindrical air flow channel with a preset aperture;
a reference chamber communicated with the atmosphere is arranged on the right side of the fourth zirconia ceramic layer, and a reference electrode is arranged on the lower side of the reference chamber;
a platinum electrode heating wire is arranged between the fifth zirconia ceramic layer and the sixth zirconia ceramic layer.
2. The oxynitride sensor ceramic chip according to claim 1, wherein an alumina protective layer is provided in a part of an area between said common electrode and said first zirconia ceramic layer.
3. The nitrogen-oxygen sensor ceramic chip of claim 1, wherein the hole-type gas inlet diffusion channel structure is fabricated by: and (3) clamping the cylindrical carbon rod with the preset pore diameter between zirconia raw ceramic chips for isostatic lamination, and sintering at a preset sintering temperature to ensure that the carbon rod burns to become carbon dioxide gas to be discharged, so that a cylindrical hollow channel structure with the same shape as the carbon rod is formed in the sintered zirconia ceramic layer.
4. A nitrogen-oxygen sensor ceramic chip according to claim 3, wherein the carbon rod is made by: and molding carbon powder into a cylindrical shape with the preset aperture to form a preformed carbon rod, and sintering the preformed carbon rod at a preset curing temperature to cure the structure of the preformed carbon rod so as to form the carbon rod.
5. The nitrogen-oxygen sensor ceramic chip of claim 4, wherein the first diffusion channel comprises a plurality of first sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of first sub-diffusion channels being a1, and the aperture of each first sub-diffusion channel being b1, the total through-hole area c1 of the first diffusion channels; the second diffusion channel includes a plurality of second sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of second sub-diffusion channels being a2, and the aperture of each second sub-diffusion channel being b2, the total through-hole area of the second diffusion channels being c2; the third diffusion channel includes a plurality of third sub-diffusion channels disposed parallel to each other and having the same size, the number of the plurality of third sub-diffusion channels being a3, and the aperture of each third sub-diffusion channel being b3, the total through-hole area of the third diffusion channels being c3; the total through hole area is equal to the product of the through hole area of each corresponding sub-diffusion channel and the number of sub-diffusion channels; wherein a1, a2 and a3 are positive integers, b1, b2 and b3 are all 50-150 μm, b1 is less than or equal to b2 and less than or equal to b3, and c1 is more than or equal to c2 and more than or equal to c3.
6. The nitrogen-oxygen sensor ceramic chip of claim 5, wherein b1< b2< b3, and c1> c2> c3.
7. The nitrogen-oxygen sensor ceramic chip of claim 6, wherein b2=d1×b1, b3=d2×b2, c2=e1×c1, c3=e2×c2, wherein d1 is used to represent a proportionality coefficient of the aperture of the second sub-diffusion channel relative to the aperture of the first sub-diffusion channel, d2 is used to represent a proportionality coefficient of the aperture of the third sub-diffusion channel relative to the aperture of the second sub-diffusion channel, e1 is used to represent a proportionality coefficient of the total through-hole area of the second diffusion channel relative to the total through-hole area of the first diffusion channel, e2 is used to represent a proportionality coefficient of the total through-hole area of the third diffusion channel relative to the total through-hole area of the second diffusion channel, and 1.1< d1, d2<1.5;0.5< e1, e2<0.9.
8. The nitrogen oxide sensor ceramic chip of claim 7, wherein d1=d2 and e1=e2.
9. The nitrogen-oxygen sensor ceramic chip of claim 5, wherein the plurality of first sub-diffusion channels, the plurality of second sub-diffusion channels, and the plurality of third sub-diffusion channels all extend in a same plane parallel to an upper surface of the second zirconia ceramic layer.
10. The oxynitride sensor ceramic chip according to claim 9, wherein said same plane is located at a middle position in said second zirconia ceramic layer in a direction perpendicular to an upper surface of said second zirconia ceramic layer.
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