CN113261107A - Manufacturing method of flexible electronic device and flexible electronic device - Google Patents
Manufacturing method of flexible electronic device and flexible electronic device Download PDFInfo
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- CN113261107A CN113261107A CN201980073114.XA CN201980073114A CN113261107A CN 113261107 A CN113261107 A CN 113261107A CN 201980073114 A CN201980073114 A CN 201980073114A CN 113261107 A CN113261107 A CN 113261107A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The application provides a manufacturing method of a flexible electronic device and the flexible electronic device, wherein the manufacturing method of the flexible electronic device comprises the following steps: providing a first stretched base film; hardening the first stretch base film to form a stretchable or bendable first flexible film having a first elastic portion and a second elastic portion, the first elastic portion having a hardness or elongation different from a hardness or elongation of the second elastic portion; an electronic device layer is formed on the first flexible film. The first stretching base film is subjected to hardening treatment to form a stretchable or bendable first flexible film, the first flexible film is provided with a first elastic part and a second elastic film, and an electronic device layer is formed on the first flexible film, so that the flexible electronic device at least has two elastic parts with different stretching rates or hardness, and the flexible electronic device can be stretched and deformed in a uniform amplitude when being stressed and deformed.
Description
The application relates to the field of flexible equipment, in particular to a flexible electronic device manufacturing method and a flexible electronic device.
There is currently consistency in the elongation or hardness of flexible electronic devices. When the flexible electronic device is stretched or bent to deform, the deformation degree of the flexible electronic device in the area with smaller stress is inconsistent with the deformation degree of the flexible electronic device in the area with larger stress, so that the flexible electronic device is difficult to stretch and deform in uniform amplitude.
Disclosure of Invention
The application provides a manufacturing method of a flexible electronic device and the flexible electronic device.
The application provides a method for manufacturing a flexible electronic device, wherein the method for manufacturing the flexible electronic device is characterized by comprising the following steps:
providing a first stretched base film;
hardening the first stretch base film to form a stretchable or bendable first flexible film having a first elastic portion and a second elastic portion, the first elastic portion having a hardness or elongation different from a hardness or elongation of the second elastic portion;
an electronic device layer is formed on the first flexible film.
The application provides a flexible electronic device, wherein the flexible electronic device is manufactured by the manufacturing method of the flexible electronic device.
The application provides a flexible electronic device, wherein, flexible electronic device includes flexible film and forms in the electron device layer of flexible film, flexible film is equipped with first elastic component and second elastic component.
According to the manufacturing method of the flexible electronic device and the flexible electronic device, the first stretching base film is hardened to form the first flexible film capable of stretching or bending, the first flexible film is provided with the first elastic part and the second elastic film, and the electronic device layer is formed on the first flexible film, so that the flexible electronic device is at least provided with the two elastic parts with different stretching rates or hardness, and the flexible electronic device can stretch and deform in an even range when stressed and deformed.
Fig. 1 is a schematic flow chart of a method for manufacturing a flexible electronic device according to an embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional view of a flexible electronic device provided in an embodiment of the present application.
Fig. 3 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 4 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 5 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 6 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 7 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 8 is a process diagram of a method for manufacturing a flexible electronic device according to another embodiment of the present application.
Fig. 9 is a process schematic diagram of a manufacturing method of a flexible electronic device provided in an embodiment of the present application.
Fig. 10 is a schematic cross-sectional structure diagram of a flexible electronic device provided in an embodiment of the present application.
Fig. 11 is a process schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
Fig. 12 is a process schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
Fig. 13 is an exploded view of a flexible electronic device according to another embodiment of the present application.
Fig. 14 is a process schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
Fig. 15 is a process schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
Fig. 16 is a process diagram of a method for manufacturing a flexible electronic device according to another embodiment of the present application.
Fig. 17 is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present application.
Fig. 18 is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present application.
The technical solutions in the embodiments of the present invention will be described clearly below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 and fig. 2, the present application provides a method for manufacturing a flexible electronic device, which is used for manufacturing a flexible electronic device 1000. The flexible electronic device 1000 includes a first flexible film 100 and an electronic device layer 200 formed on the first flexible film 100. The first flexible film 100 carries the electronic device layer 200 and may protect the electronic device layer 200. The first flexible film 100 has elastic, bendable, and stretchable deformation properties, so that the flexible electronic device 1000 can be bent, stretched and deformed. The first flexible film 100 has a first elastic portion 110 and a second elastic portion 120, so that the flexible electronic device 1000 has at least two elastic portions with different stretching ratios or hardness, so that the flexible electronic device 1000 can be stretched and deformed in a uniform amplitude when being subjected to a force deformation. It is understood that the flexible electronic device 1000 may be a flexible or stretchable device such as a flexible sensor, or a flexible display screen, or a flexible electronic wristband, or a smart electronic watch, or a flexible cell phone. The flexible electronic device 1000 may also be used to detect bendable or stretchable electronic devices in the fields of monitoring, or entertainment interaction, or smart wear.
Referring to fig. 1, fig. 2 and fig. 3, a method for manufacturing a flexible electronic device includes the steps of:
101: a first stretched base film 10 is provided.
In this embodiment, the first stretched base film 10 is in a semi-solid and semi-liquid state, so that the first flexible film 100 can be formed by a subsequent hardening process. The main material of the first stretched base film 10 may be silicone rubber. The first stretch base film 10 may be formed by forming a liquid silicone rubber on a base layer or a carrier layer that can perform a carrier function similar to the base layer. After the first flexible film 100 is formed by stretching the base film 10, the first flexible film 100 may be separated from the base layer or the carrier layer that may perform a carrier function.
Specifically, the forming process for providing the first stretched base film 10 is: firstly, providing a base layer 11; forming a release layer 12 on the base layer 11; a first stretched base film 10 is formed on the release layer 12.
In this embodiment, the base layer 11 is made of a material having flexibility and bendability. For example, the material of the base layer 11 may be PET (Polyethylene terephthalate) plastic, or may be PBT (polybutylene terephthalate) plastic, or may be TPU (Thermoplastic polyurethane elastomer) material, and the like. The base layer 11 may be a film with a larger area formed by a hot pressing, rolling, stretching, curtain coating, or extruding process, and then cut, blanked, or cut to form a film with a predetermined area. In order to facilitate the base layer 11 to effectively support the first stretched base film 10 and to prevent the first stretched base film 10 from being thermally deformed during the curing process, the base layer 11 may have a thickness greater than that of the first stretched base film 10 to effectively reinforce the first gel layer 10. Of course, in other embodiments, in order to reduce the manufacturing cost of the flexible electronic device 1000, the thickness of the base layer 11 may be less than the thickness of the first stretched base film 10, or equal to the thickness of the first stretched base film 10.
In this embodiment, the material of the release layer 12 is a peelable glue or a surfactant. The release layer 12 may be formed on one side of the base layer 11 by spraying, coating, curtain coating, or printing. The release layer 12 completely covers the base layer 11. The thickness of the release layer 12 is smaller than that of the base layer 11, so as to reduce the manufacturing cost of the flexible electronic device 1000. Of course, in other embodiments, the first gel layer 10 may also be formed on the base layer 11 by vacuum negative pressure, or formed on the base layer 11 by electrostatic adsorption, so as to facilitate the subsequent separation of the first flexible film 100 from the base layer 11, simplify the formation step of the first flexible film 100, and reduce the manufacturing cost.
More specifically, the step of forming the first stretched base film 10 on the release layer 12 includes: a mixed liquid is provided.
In this embodiment, the mixing of the liquid may be mixing the hardenable liquid material and the non-reactive diluent. The viscosity of the mixed liquid is changed by using the non-reactive diluent, so that the mixed liquid is conveniently and uniformly dispersed and formed on the release layer 12. Of course, in other embodiments, the mixed liquid may also contain other viscosity-changing materials.
Specifically, the forming process of the mixed liquid is as follows:
first, a curable liquid is provided, and the curable liquid may be a silicone rubber liquid that is curable under specific conditions, has high curing efficiency, and can be cured multiple times. As a preferred embodiment, the hardenable fluid is a light-curable silicone rubber fluid. Of course, in other embodiments, other plastic or rubber liquids may be used for the hardenable liquid, and the hardenable liquid may be a heat-curable liquid, as well as a curable liquid.
Then, a hardening initiator is added to the hardenable liquid, and the hardening initiator undergoes a polymerization reaction or a crosslinking reaction with the high molecules in the hardenable liquid under specific conditions, so that the hardenable liquid forms the first stretch base film 10 that is stretchable or bent with a certain hardness and a certain strength. As a preferred embodiment, the hardening initiator added to the hardenable liquid may be a photo-curing agent. In order to make the first stretched base film 10 amenable to multiple curing treatments, multiple curing initiators may be added to the curable liquid. In this embodiment, a conventional photo-curing agent, a first photo-curing agent that can absorb light of a first predetermined wavelength, and a second photo-curing agent that can absorb light of a second predetermined wavelength are added to the hardenable liquid. The first light curing agent may absorb ultraviolet light having a curing range of 300nm or less, and the second light curing agent may absorb ultraviolet light having a curing range of 350nm or more. Of course, in other embodiments, a heated curing agent, or a vulcanizing agent, or a mixture of a heated curing agent and a vulcanizing agent, is also added to the liquid in the hardenable liquid.
Then, an inactive diluent is provided. The non-reactive diluent may be a low boiling point organic solvent or a low boiling point silane, among other materials.
And finally, mixing the hardenable liquid, the hardening initiator and the non-reactive diluent, and defoaming the mixed liquid to form a mixed liquid which has proper viscosity, no bubbles, hardenable and high fluidity. Of course, in other embodiments, the hardening initiator and the non-reactive diluent may be mixed first and then mixed with the hardenable liquid.
The step of forming the first stretchable base film 10 on the release layer 12 includes: the mixed liquid is formed on the release layer 12.
In this embodiment, the mixed liquid is formed on the release layer 12 by a process such as spraying, coating, curtain coating, printing, casting, or injection. The mixed liquid is uniformly dispersed on the release layer 12. The thickness of the mixed liquid is uniformly distributed on the release layer 12. The thickness of the mixed liquid may be greater than that of the release layer 12 to meet the molding requirement of the first stretched base film 10, so that the first stretched base film 10 has certain strength to facilitate further hardening treatment of the first stretched base film 10.
The step of forming the first stretched base film 10 on the release layer 12 includes: the mixed liquid body is formed into the first stretched base film 10.
In the present embodiment, the process of forming the first stretched base film 10 from the liquid mixture is: firstly, baking the release layer 12 and the base layer 11 coated with the mixed liquid at a first preset temperature to volatilize the non-reactive diluent in the mixed liquid; and performing light curing treatment on the mixed liquid at a second preset temperature for a preset time to form a silicone rubber film capable of being light cured again, namely forming the first stretched base film 10 on the release layer 12. The first preset temperature, the second preset temperature and the preset time can be preset according to needs. The first stretched base film 10 has certain strength and hardness. The first stretched base film 10 contains a first photo-curing agent and a second photo-curing agent, and the first stretched base film 10 may be subjected to photo-curing treatment twice. Of course, if the first stretched base film 10 contains a plurality of curing initiators, the first stretched base film 10 may be subjected to a plurality of curing treatments. Of course, in another embodiment, if the mixed liquid contains a heat curing agent or a vulcanizing agent, the mixed liquid may be heated to cure or vulcanize the mixed liquid after the non-reactive diluent of the mixed liquid is volatilized, thereby forming the first stretched base film 10.
Referring to fig. 1, 4, 5 and 6, a method for manufacturing a flexible electronic device includes the steps of:
102: the first stretch base film 10 is hardened to form a stretchable or bendable first flexible film 100, the first flexible film 100 having a first elastic part 110 and a second elastic part 120, and a stretch rate, hardness, and elongation at break of the first elastic part 110 are different from those of the second elastic part 120.
In this embodiment, the first stretched base film 10 may be subjected to the photo-curing process twice to form the first flexible film 100. Of course, in other embodiments, the first stretch base film 10 may be formed into the first flexible film 100 through one photo-curing process by performing different light irradiation on different regions.
Specifically, step 102 includes:
the first stretched base film 10 is subjected to a first hardening treatment to obtain a first elastic film 30, the first elastic film 30 having a first elastic portion 110.
In the present embodiment, the first stretched base film 10 is irradiated with ultraviolet light having a wavelength of 300nm or less, and a first photocuring agent is selected to be subjected to photocuring treatment, thereby obtaining the first elastic film 30. Ultraviolet light having a wavelength of 300nm or less irradiates the entire region of the first stretched base film 10, so that the entire region of the first stretched base film 10 is further hardened to form the first elastic film 30, and the first elastic part 110 is formed in a partial region of the first elastic film 30. Of course, in another embodiment, if the first stretched base film 10 further contains a heat curing agent or a vulcanizing agent, the first stretched base film 10 may be heat cured or vulcanized so that the entire region of the first stretched base film 10 is further hardened to form the first elastic film 30.
Step 102 further comprises:
the first elastic part 110 of the first elastic film 30 is subjected to a protection process, and the first elastic film 30 is subjected to a second hardening process to obtain a second elastic film 40, the second elastic film 40 having a second elastic part 120.
In the present embodiment, the first flexible film 100 is formed by cleaning the second elastic film 40. The first elastic part 110 of the first elastic film 30 is masked with a first mask 50, and the first elastic film 30 is subjected to a second hardening process. Specifically, the first mask 50 includes a plurality of first shielding portions 51 arranged at intervals and a first hollow portion 52 formed between two adjacent first shielding portions 51. The arrangement region of the first shielding portion 51 and the arrangement region of the first hollow portion 51 may be precisely set as required, so that the region of the first shielding portion 51 shielding the first elastic film 30 is prevented from being damaged by the second hardening process, so as to precisely form the first elastic portion 110, and the region of the first hollow portion 52 facing the first elastic film 30 is hardened to further harden to form the second elastic portion 120. Of course, in other embodiments, the first elastic portion 110 may be heat-insulated by a heat-insulating pad, or the first elastic portion 110 may be vulcanization-protected by applying an anti-vulcanization film layer, and a partial region of the first elastic film 30 may be exposed, and the first elastic film 30 may be heat-cured or vulcanized by applying heat curing or vulcanization to retain the first elastic portion 110, while the exposed region of the first elastic film 30 is heat-cured or vulcanized under a heat condition to form the second elastic portion 120.
More specifically, as shown in fig. 6 and 7, the first mask 50 covers the first elastic film 30, the first shielding portion 51 shields ultraviolet light with a wavelength of 350nm or more from the first elastic portion 110, so as to prevent the first elastic portion 110 from further hardening, and the region of the first elastic film 30 facing the first hollow portion 52 is irradiated with ultraviolet light with a wavelength of 350nm or more to further harden to form the second elastic portion 120. Since the first shielding portions 51 and the first hollow portions 52 are staggered, the first elastic portions 110 and the second elastic portions 120 are staggered. The first elastic part 110 and the second elastic part 120 may be staggered in a length direction of the first flexible film 100. Since the second elastic part 120 is further hardened and formed on the basis of the first elastic film 30, the elongation of the second elastic part 120 may be smaller than that of the first elastic part 110. When the first flexible film 100 is subjected to stretching deformation, the stretching deformation of the first flexible film 100 can be uniformly dispersed by using the difference between the stretching rates of the first elastic part 110 and the second elastic part 120.
In another embodiment, as shown in fig. 8, the plurality of first elastic parts 110 and the plurality of second elastic parts 120 may be alternately arranged in the width direction of the first flexible film 100.
Referring to fig. 1, 9 and 10 together, the method for manufacturing the flexible electronic device includes the steps of:
103: an electronic device layer 200 is formed on the first flexible film 100.
In this embodiment, the electronic device layer 200 includes a plurality of electronic devices 210 and stretchable wires 220 connecting the electronic devices 210. The electronic device 210 may be any electronic device such as a sensing device, a touch device, a display device, or a light emitting device. The stretchable conductive wire 220 may transmit electrical signals with the electronic device 210. The stretchable conductive wire 220 is deformable by being bent and stretched along with the first flexible film 100. The electronic device layer 200 may be formed on the first flexible film 100 in a patch manner, or may be formed in advance as a film layer and then attached to the first flexible film 100. The electronic device layer 200 is formed on the side of the first flexible film 100 facing away from the base layer 11. First flexible film 100 can bear and protect electronic device layer 200, and the tensile deformation of homodisperse can be realized to first flexible film 100 for flexible electron device 1000 structure is firm, can the tensile deformation of homodisperse.
The manufacturing method of the flexible electronic device comprises the following steps:
104: the base layer 11 is removed.
In this embodiment, the base layer 11 is removed by peeling the base layer 11 and the release layer 12 together with the first flexible film 100 so that the release layer 12 is separated from the first flexible film 100. Specifically, in the step of forming the release layer 12, the molecular adhesive force on the side where the release layer 12 is adhered to the base layer 11 is set to be greater than the molecular adhesive force on the side where the release layer 12 deviates from the base layer 11, so that the release layer 12 and the base layer 11 are separated from the first flexible film 100 together. Certainly, in other embodiments, the molecular adhesion force of the release layer 12 adhering to the base layer 11 may also be set to be smaller than the molecular adhesion force of the release layer 12 deviating from the base layer 11, so as to further separate the release layer 13 from the encapsulation layer 200 after the base layer 11 is separated from the release layer 13.
In this embodiment, the base layer 11 and the release layer 12 are separated from the first flexible film 100 by a tearing force, that is, the base layer 11 is separated from the first flexible film 100 by a physical force. Of course, in other embodiments, the base layer 11 and the release layer 12 may also be separated from the first flexible film 100 by a chemical etching process, i.e., the electronic device layer 200, the first flexible film 100 and the base layer 11 are placed in a chemical etchant; the release layer 12 is decomposed and corroded by the chemical corrosive agent, and the base layer 11, the first flexible film 100 and the electronic device layer 200 are not corroded by the chemical corrosive agent; the base layer 11 is separated from the first flexible film 100 after the release layer 12 is corroded and decomposed, so that the base layer 11 is removed. Of course, in other embodiments, the release layer 12 may also be subjected to light treatment or heat treatment, and the release layer 12 generates a decomposition reaction or a molecular adhesion failure to achieve separation from the first flexible film 100.
In another embodiment, substantially the same as the embodiment shown in fig. 10, except that the first stretched base film 10 may be formed through a vulcanization process, the hardness of the first elastic portion 110 is different from the hardness of the second elastic portion 120.
Specifically, in the step of providing the first stretching base 10, the mixing liquid contains a hardenable liquid, a vulcanizing agent, a first photo-curing agent, a second photo-curing agent, and an inactive diluent. In the process of forming the first stretched base film 10 from the mixed liquid, the mixed liquid is subjected to a vulcanization treatment at a preset vulcanization heating temperature for a preset vulcanization time to form a photocurable silicone rubber film from the mixed liquid, i.e., the first stretched base film 10 is vulcanized on the release layer 12. In the step of hardening the first stretched base film 10 to form the stretchable or bendable first flexible film 100, the hardness of the first elastic part 110 is different from the hardness of the second elastic part 120.
In another embodiment, please refer to fig. 11, 12 and 13, which is substantially the same as the embodiment shown in fig. 10, except that the first flexible film 100 is provided with a plurality of first elastic parts 110 arranged in an array and a second elastic part 120 bridging two adjacent first elastic parts 110.
Specifically, in step 102, the first mask 50 is provided with a plurality of first shielding portions 51 arranged in an array and a first hollow portion 52 bridging between two adjacent first shielding portions 51. The arrangement region of the first shielding portion 51 may correspond to the arrangement region of the electronic device 210 of the electronic device layer 200, so that the arrangement region of the first elastic portion 110 after the first flexible film 100 is attached to the electronic device layer 200 may correspond to the arrangement region of the electronic device 210. The arrangement region of the first hollow portion 52 may correspond to the arrangement region of the tensile conductive line 220 of the electronic device layer 200, so that the arrangement region of the second elastic portion 120 may correspond to the arrangement region of the tensile conductive line 220 after the first flexible film 100 is attached to the electronic device layer 200. It is understood that the stretch ratio of the first elastic part 110 may be less than the stretch ratio of the second elastic part 120, i.e. the elasticity of the first elastic part 110 is lower than the elasticity of the second elastic part 120. After the first flexible film 100 is attached to the electronic device layer 200, the first elastic portion 110 can effectively support the electronic device 210, so as to prevent the electronic device 210 from being under tensile stress, and the second elastic portion 120 supports the tensile wires 220
In another embodiment, please refer to fig. 14, 15, 16 and 17, which are substantially the same as the embodiment shown in fig. 10, except that the first flexible film 100 further has a third elastic portion 130.
Specifically, in step 101, the mixed liquid contains a silicone rubber liquid capable of being cured for multiple times, an inactive diluent, a vulcanizing agent, a first photo-curing agent capable of absorbing light of a first predetermined wavelength, and a second photo-curing agent capable of absorbing light of a second predetermined wavelength. The first light curing agent may absorb ultraviolet light having a curing range of 300nm or less, and the second light curing agent may absorb ultraviolet light having a curing range of 350nm or more. After the liquid mixture forms the first stretched base film 10, the first stretched base film 10 contains a vulcanizer, a first light curing agent, and a second light curing agent.
In step 102, first, the first stretched base film 10 is subjected to a vulcanization treatment to react the silicone rubber inside the first stretched base film 10 with a vulcanizer so that the entire region of the first stretched base film 10 is hardened to form the first elastic film 30, the first elastic film 30 having the first elastic portion 110 of the first hardness.
Then, the first mask 50 is used to cover the first elastic film 30, the first shielding portion 51 of the first mask 50 shields the first elastic portion 110, and the first hollow portion 52 corresponds to a partial region of the first elastic film 30. Ultraviolet light with the wavelength of less than 300nm is adopted to irradiate the first elastic film 30 through the first mask 50, and the area, opposite to the first hollow-out part 52, of the first elastic film 30 is photocured under the irradiation of the ultraviolet light with the wavelength of less than 300nm to form a second elastic part 120 with second hardness, so that the first elastic film 30 forms a second elastic film 40.
Then, the first elastic part 110 and the second elastic part 120 are subjected to a protection treatment, and the second elastic film 40 is subjected to a hardening treatment to obtain a third elastic film 60, the third elastic film 60 having a third elastic part 130. Specifically, the second elastic membrane 40 is pressed by using a second mask 70. The second mask 70 is provided with a plurality of second shielding portions 71 and a plurality of second hollow portions 72. The plurality of second shielding portions 71 and the plurality of second hollow portions 72 are arranged in a staggered manner. The second shielding portion 71 shields the first elastic portion 110 and the second elastic portion 120. The second hollow portion 72 is opposite to a partial region of the second elastic film 40. Ultraviolet light with a wavelength of 350nm or more is adopted to irradiate the second elastic film 40 through the second mask 70, so that a third elastic part 130 with a third hardness is formed in an area where the second elastic film 40 is opposite to the second hollow-out part 72. The first flexible film 100 is formed by subjecting the third elastic film 60 to a cleaning process. It is understood that the formation conditions of the first elastic part 110, the second elastic part 120, and the third elastic part 130 may be set as needed such that the first hardness is less than the second hardness and less than the third hardness. By providing the second elastic part 120 between the first elastic part 110 and the third elastic part 130, it is possible to alleviate the fracture of the interface between the first elastic part 110 and the third elastic part 130 when the first flexible film 100 is stretched due to the large difference in hardness between the first elastic part 110 and the third elastic part 130. After the first flexible film 100 is attached to the electronic device layer 200, the first elastic portion 110 may be used to support the stretchable conductive wire 220, the third elastic portion 130 may be used to support the electronic device 210, the second elastic portion 120 may be used to support a connection portion between the stretchable conductive wire 220 and the electronic device 210, and the second elastic portion 120 may buffer a connection stress between the stretchable conductive wire 220 and the electronic device 210. Of course, in other embodiments, the second elastic film 40 may be subjected to a heat curing process or a vulcanization process to form the third elastic film 60.
It is to be understood that the formation process of the first flexible film 100 of the present application is not limited to the above-described case. That is, the number of hardening times of the first stretched base film 10 to form the first flexible film 100 is not limited; the number of elastic portions of the first flexible film 100 having different hardness, different elongation, and different extensibility is not limited; the arrangement form of the plurality of elastic portions of the first flexible film 100 is also not limited; the manner of shielding the different regions during the formation of the first flexible film 100 is also not limited.
Further, in another embodiment, referring to fig. 18, in order to increase the structural stability of the flexible electronic device 1000, the method for manufacturing the flexible electronic device further includes the steps of:
a second flexible film 300 is formed on the electronic device layer 200.
In the present embodiment, the second flexible film 300 is manufactured by substantially the same process as the first flexible film 100. Specifically, the forming process of the second flexible film 300 is as follows: providing a second stretched base film; the second stretch base film is hardened to form a stretchable or bendable second flexible film 300, the second flexible film 300 having a fourth elastic part 310 and a fifth elastic part 320. The second flexible film 300 is attached to the electronic device layer 200.
It is understood that the process of providing the second stretched base film 310 may be the same as the process of providing the first stretched base film 10, and will not be described in detail herein. The forming process of the fourth elastic part 310 and the fifth elastic part 320 of the second flexible film 300 is the same as the forming process of the first elastic part 110 and the second elastic part 120, and thus, a detailed description thereof is omitted. After the second flexible film 300 is attached to the electronic device layer 200, the fourth elastic portion 310 faces the first elastic portion 110, and the hardness of the fourth elastic portion 310 may be the same as the hardness of the first elastic portion 110. The fifth elastic part 320 is opposite to the second elastic part 120, and the hardness of the fifth elastic part 320 may be identical to that of the second elastic part 120. The electronic device layer 200 is sandwiched by the second flexible film 300 and the first flexible film 100, so that both sides of the electronic device layer 200 are protected, and the first flexible film 100 and the second flexible film 300 encapsulate the electronic device layer 200. Of course, in other embodiments, the flexible electronic device 1000 may also be formed by disposing an encapsulation film with another structure on the side of the electronic device layer 200 away from the first flexible film 100, that is, after the electronic device layer 200 is attached to the first flexible film 100, the encapsulation film with another structure may be formed on the electronic device layer 200 by other manners such as hot pressing, injection molding, and casting, so as to simplify the manufacturing process and the manufacturing cost of the manufacturing method of the flexible electronic device.
As shown in fig. 10, the present application also provides a flexible electronic device 1000, the flexible electronic device 1000 comprising a first flexible film 100 and an electronic device layer 200. The first flexible film 100 includes a plurality of first elastic parts 110 and a plurality of second elastic parts 120. The plurality of first elastic parts 110 and the plurality of second elastic parts 120 are staggered with each other. The electronic device layer 200 includes a plurality of electronic devices 210 and a plurality of stretchable conductive wires 220. The stretchable conductive wire is connected to two adjacent electronic devices 210. The first and second elastic parts 110 and 120 may be arranged in a length direction of the first flexible film 100.
In another embodiment, as shown in FIG. 13, much the same as the embodiment shown in FIG. 10, except that the plurality of electronic devices 210 of the electronic device layer 200 are arranged in an array. Each first elastic portion 110 of the first flexible film 100 is disposed corresponding to each electronic device 210. The second elastic part 120 corresponds to the stretchable wire 220.
In another embodiment, as shown in fig. 17, substantially the same as the embodiment shown in fig. 10, except that the first flexible film 100 is further provided with a plurality of third elastic parts 130. The first elastic part 110, the second elastic part 120, and the third elastic part 130 are sequentially arranged.
In another embodiment, as shown in fig. 18, the flexible electronic device 1000 is substantially the same as the embodiment shown in fig. 10, except that the flexible electronic device further includes a second flexible film 300, the second flexible film 300 is attached to the side of the electronic device layer 200 facing away from the first flexible film 100, and the second flexible film 300 includes a fourth elastic portion 310 directly opposite to the first elastic portion 110 and a fifth elastic portion 320 directly opposite to the second elastic portion 120.
The above detailed description is made on the method for manufacturing the flexible electronic device and the flexible electronic device provided in the embodiments of the present application, and specific embodiments are applied in the detailed description to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understanding the method and the core ideas of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (20)
- A method for manufacturing a flexible electronic device, the method comprising:providing a first stretched base film;hardening the first stretch base film to form a stretchable or bendable first flexible film having a first elastic portion and a second elastic portion, the first elastic portion having a hardness or elongation different from a hardness or elongation of the second elastic portion;an electronic device layer is formed on the first flexible film.
- The method of manufacturing a flexible electronic device according to claim 1, wherein the step of providing a first stretched base film comprises:providing a base layer;forming a release layer on the base layer;forming a first stretch base film on the release layer.
- The method of manufacturing a flexible electronic device according to claim 2, wherein the base layer is removed after the first flexible film is formed and before the electronic device layer is formed, or the base layer is removed after the electronic device layer is formed.
- The method of manufacturing a flexible electronic device according to claim 2, wherein the step of forming a first stretch base film on the release layer comprises:providing a mixed liquid;forming a mixed liquid on the base layer;the mixed liquid is hardened to form a first stretched base film.
- The method of manufacturing a flexible electronic device according to claim 4, wherein the mixed liquid is subjected to a photo-curing treatment, a thermal curing treatment, or a vulcanization treatment to form the first stretched base film.
- The method of manufacturing a flexible electronic device according to claim 1, wherein the step of hardening the first stretched base film to form a stretchable or bendable first flexible film comprises:subjecting the first stretched base film to a first hardening treatment to obtain a first elastic film having a first elastic portion;and carrying out protection treatment on the first elastic part of the first elastic film, and carrying out secondary hardening treatment on the first elastic film to obtain a second elastic film, wherein the second elastic film is provided with a second elastic part.
- The method of claim 6, wherein a first mask is used to mask the first elastic portion of the first elastic film and a second curing process is performed on the first elastic film.
- The method of claim 6, wherein the first curing process is one of a photo curing process, a thermal curing process, and a curing process, and the second curing process is one of a photo curing process, a thermal curing process, and a curing process.
- The method of manufacturing a flexible electronic device according to claim 6, wherein the step of hardening the first stretched base film to form a stretchable or bendable first flexible film further comprises:and performing protection treatment on the first elastic part and the second elastic part, and performing third hardening treatment on the second elastic film to obtain a third elastic film, wherein the third elastic film is provided with a third elastic part.
- The method of claim 9, wherein the third curing process is any one of a photo curing process, a thermal curing process, and a vulcanizing process.
- The method of claim 9, wherein the step of protecting the first and second elastic portions includes masking the first and second elastic portions with a second mask and hardening the second elastic film for a third time.
- The method of manufacturing a flexible electronic device according to claim 1, further comprising the steps of:a second flexible film is formed on the electronic device layer.
- The method of manufacturing a flexible electronic device according to claim 11, wherein the step of forming a second flexible film comprises:providing a second stretched base film;hardening the second stretched base film to form a stretchable or bendable second flexible film having a fourth elastic portion and a fifth elastic portion;and attaching the second flexible film to the electronic device layer.
- The method of claim 12, wherein the fourth spring is disposed opposite the first spring, and wherein the fifth spring is disposed opposite the second spring.
- A flexible electronic device, wherein the flexible electronic device is manufactured by the method of any one of claims 1 to 14.
- A flexible electronic device is characterized by comprising a flexible film and an electronic device layer formed on the flexible film, wherein the flexible film is provided with a first elastic part and a second elastic part.
- The flexible electronic device of claim 16, wherein the flexible film has a plurality of the first elastic portions and a plurality of the second elastic portions, and wherein the plurality of the first elastic portions and the plurality of the second elastic portions are staggered along a length of the first flexible film.
- The flexible electronic device according to claim 16, wherein the first flexible film is provided with a plurality of the first elastic portions arranged in an array, and the second elastic portion is provided on a peripheral side of the first elastic portion.
- The flexible electronic device of claim 18, wherein the electronics layer comprises electronics and stretchable leads connecting the electronics.
- The flexible electronic device according to claim 19, wherein the flexible film is further provided with a third elastic portion, the third elastic portion being connected to the first elastic portion or/and the second elastic portion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/080572 WO2020198994A1 (en) | 2019-03-29 | 2019-03-29 | Manufacturing method for flexible electronic apparatus and flexible electronic apparatus |
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| CN113261107A true CN113261107A (en) | 2021-08-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114296310A (en) * | 2022-03-08 | 2022-04-08 | 深圳市光科全息技术有限公司 | Flexible curtain and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106384736A (en) * | 2016-11-29 | 2017-02-08 | 合肥鑫晟光电科技有限公司 | Flexible substrate, flexible display substrate and manufacture method for the same, and display device |
| CN108305892A (en) * | 2018-04-03 | 2018-07-20 | 京东方科技集团股份有限公司 | A kind of flexible substrate substrate and preparation method thereof, display device |
| CN108417485A (en) * | 2018-01-18 | 2018-08-17 | 云谷（固安）科技有限公司 | flexible substrate processing method and flexible display screen |
| CN108898954A (en) * | 2018-07-18 | 2018-11-27 | 昆山国显光电有限公司 | Display panel and display panel production method |
| CN109454973A (en) * | 2018-11-15 | 2019-03-12 | 安徽原上草节能环保科技有限公司 | The processing method of flexible printing plate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5708542B2 (en) * | 2012-03-28 | 2015-04-30 | コニカミノルタ株式会社 | Nozzle plate manufacturing method |
| CN103698846B (en) * | 2013-11-28 | 2015-10-28 | 北京工业大学 | A kind of preparation method of flexible metal photonic crystal |
| CN105098088B (en) * | 2014-05-05 | 2017-06-06 | Tcl集团股份有限公司 | A kind of flexible display and its film encapsulation method |
| CN103985321B (en) * | 2014-05-29 | 2018-03-27 | 上海天马微电子有限公司 | A kind of flexible display panels and preparation method thereof and flexible display apparatus |
| CN107230686A (en) * | 2016-03-24 | 2017-10-03 | 上海和辉光电有限公司 | A kind of display device and its method for packing |
| CN109285968B (en) * | 2017-07-21 | 2020-08-14 | Tcl科技集团股份有限公司 | Display device and packaging method thereof |
-
2019
- 2019-03-29 WO PCT/CN2019/080572 patent/WO2020198994A1/en active Application Filing
- 2019-03-29 CN CN201980073114.XA patent/CN113261107A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106384736A (en) * | 2016-11-29 | 2017-02-08 | 合肥鑫晟光电科技有限公司 | Flexible substrate, flexible display substrate and manufacture method for the same, and display device |
| CN108417485A (en) * | 2018-01-18 | 2018-08-17 | 云谷（固安）科技有限公司 | flexible substrate processing method and flexible display screen |
| CN108305892A (en) * | 2018-04-03 | 2018-07-20 | 京东方科技集团股份有限公司 | A kind of flexible substrate substrate and preparation method thereof, display device |
| CN108898954A (en) * | 2018-07-18 | 2018-11-27 | 昆山国显光电有限公司 | Display panel and display panel production method |
| CN109454973A (en) * | 2018-11-15 | 2019-03-12 | 安徽原上草节能环保科技有限公司 | The processing method of flexible printing plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114296310A (en) * | 2022-03-08 | 2022-04-08 | 深圳市光科全息技术有限公司 | Flexible curtain and preparation method thereof |
| CN114296310B (en) * | 2022-03-08 | 2022-06-24 | 深圳市光科全息技术有限公司 | Flexible curtain and preparation method thereof |
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| WO2020198994A1 (en) | 2020-10-08 |
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