CN113169189A

CN113169189A - Flexible panel and manufacturing method thereof

Info

Publication number: CN113169189A
Application number: CN201880097602.XA
Authority: CN
Inventors: 雷晓华; 袁泽; 朱林; 陈鑫; 胡康军; 李贺
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-12-19
Filing date: 2018-12-19
Publication date: 2021-07-23
Also published as: WO2020124416A1

Abstract

The application provides a flexible panel and flexible panel manufacturing method, flexible panel (100) includes substrate (10) and electron device (20), substrate (10) are equipped with binds district (11), substrate (10) are connecting it forms stereoplasm portion (12) to bind district (11) department sclerosis treatment, electron device (20) are fixed in substrate (10), electron device (20) with extend to it is connected to bind wire (30) in district (11). The hard part (12) provides stress reinforcement for the binding region (11), so that the binding region (11) is not easy to deform, a lead (30) connected with an electronic device (20) is prevented from being connected with a functional element in the binding region (11) to fail, and the functional stability of the flexible panel (100) is improved.

Description

Flexible panel and manufacturing method thereof

Technical Field

The application relates to the field of flexible equipment, in particular to a flexible panel and a manufacturing method of the flexible panel.

Background

At present, base materials of flexible sensors, flexible display screens and flexible wearable devices are easy to deform under the action of heating and pressing. For example, the substrate is easily deformed during the hot pressing process, so that the electronic device on the substrate cannot be effectively connected to the functional element at the bonding region, thereby affecting the functional stability of the flexible panel.

Disclosure of Invention

The application provides a flexible panel manufacturing method and a flexible panel.

The application provides a flexible panel manufacturing method, wherein a base material is provided, and the base material is provided with a part to be processed and a flexible part connected with the part to be processed;

hardening the part to be processed to form a hard part with a binding area;

forming an electronic device on the flexible portion, and forming a wire connecting the electronic device, the wire extending to the bonding region.

The present application provides a flexible panel prepared by the above method;

the flexible panel comprises a base material and an electronic device, wherein the base material is provided with a binding region, the base material is hardened at the binding region to form a hard part, the electronic device is fixed on the base material, and the electronic device is connected with a lead extending to the binding region.

According to the manufacturing method of the flexible panel and the flexible panel, the hard portion is formed in the binding area through the base material through hardening treatment, the hard portion provides stress reinforcement for the binding area, the binding area is not prone to deformation, the electronic device is prevented from being connected with the functional element to be invalid, and the functional stability of the flexible panel is improved.

Drawings

Fig. 1 is a schematic view of a flexible panel provided in an embodiment of the present application.

Fig. 2 is a schematic view of a flexible panel provided in another embodiment of the present application.

Fig. 3 is a schematic view of a flexible panel provided in another embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 5 is a schematic perspective view of a flexible panel provided in an embodiment of the present application.

Fig. 6 is a schematic view of a flexible panel provided in another embodiment of the present application.

Fig. 7 is a schematic view of a flexible panel provided in another embodiment of the present application.

Fig. 8 is a schematic perspective view of a flexible panel according to another embodiment of the present application.

Fig. 9 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 10 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.

Fig. 11 is a schematic processing diagram of manufacturing a flexible panel according to an embodiment of the present application.

Fig. 12 is a schematic flow chart of manufacturing a flexible panel according to an embodiment of the present application.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The technical solutions in the embodiments of the present invention will be described clearly below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, a flexible panel 100 includes a substrate 10 and an electronic device 20. The substrate 10 is provided with a bonded region 11, and the substrate 10 is hardened at the bonded region 11 to form a hard portion 12. The electronic device 20 is fixed to the substrate 10 and located in a region of the substrate 10 outside the bonding region 11, and the electronic device 20 is connected to the wire 30 extending to the bonding region 11. It is understood that the flexible panel 100 may be a flexible panel such as a flexible sensor, or a flexible display panel, or a flexible touch panel. The flexible panel 100 may be applied in a bendable or stretchable electronic device, which may be a wearable device such as a cell phone, a watch, a wrist guard, etc. The flexible panel 100 may also be used in bendable or stretchable electronic devices in the fields of detection monitoring, entertainment interaction, and smart wear.

The hard part 12 is formed at the bonding area 11 of the substrate 10 through hardening treatment, so that the hard part 12 provides stress reinforcement for the bonding area 11, the bonding area 11 is not easy to deform, a lead electrically connected with the electronic device 20 is prevented from being connected with a functional element in the bonding area 11 to fail, and the functional stability of the flexible panel 100 is improved.

In the present embodiment, the substrate 10 is a flexible substrate having flexible properties or a stretchable substrate having elastic properties. The substrate 10 comprises a first short side 13 and a second short side 14 arranged opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14. The substrate 10 is further provided with a flexible portion 16 connected to the hard portion 12. The flexible portion 16 occupies a larger area of the substrate 10 and the rigid portion 12 is connected substantially to the first short side 13. The hard portion 12 may be substantially elongated. The hard portion 12 may extend substantially parallel to the first short side 13. The length of the hard portion 12 is substantially equal to the length of the first short side 13. The hard portion 12 has a hardness greater than the flexible portion 16. The thickness of the flexible portion 16 corresponds to the thickness of the rigid portion 12. The thickness of the substrate 10 is approximately 5 μm to 80 μm. The flexible portion 16 can be bent and stretched as required to meet the bending and deformation requirements of the substrate 10. The hard portion 12 has strong internal stress, and the hard portion 12 is not easily deformed under the action of heat and pressure. The hard portion 12 may provide a relatively stable connection structure for the bonding region 11, so as to facilitate connection between the substrate 10 and an external device in the bonding region 11, prevent connection failure between the substrate 10 and the external device in the bonding region 11, and improve safety of the flexible panel 100. The substrate 10 may be a mixture of a polymer material such as rubber, plastic, or organic resin, and a material capable of generating a crosslinking reaction, such as a crosslinking agent, a photoinitiator, or a curing agent. The hard portion 12 having a high hardness is formed by partially subjecting the base material 10 to a chemical crosslinking treatment or a treatment such as oxidative decomposition, aging, or hardening. That is, the hard portion 12 and the flexible portion 16 are structurally stable and not easily separated, and the hard portion 12 can effectively provide stress support for the binding region 11, prevent the binding region 11 from deforming under the condition of being heated and pressed, and prevent the flexible panel 100 from failing. Of course, in other embodiments, the hard portion 12 may extend substantially in a direction parallel to the long side 15. The substrate 10 may be provided with a plurality of hard portions 12 separated from each other. The shape of the hard portion 12 may be other shapes such as a circle, a square, or a triangle.

In the present embodiment, the electronic device 20 is a touch electrode, that is, the flexible panel 100 is a flexible touch panel. The flexible panel 100 may be applied to electronic devices such as a folding mobile phone, a flexible wearable device, and a flexible detection device, which may sense an external signal. As an embodiment, the electronic device 20 may be formed by a plurality of capacitive sensing cells 21. A plurality of capacitive sensing cells 21 are arrayed on the flexible portion 16. The plurality of capacitive sensing cells 21 may be printed on the substrate 10 by a screen printing process. The plurality of capacitive sensing elements 21 may move toward or away from each other as the flexible portion 16 bends or stretches. The conductor 30 includes a plurality of signal lines 31. The signal line 31 is connected to the capacitance sensing units 21, and one end of the signal line 31 extends to the binding region 11 to facilitate the conduction of the functional element with the signal line 31 and the switch connecting line 32 in the binding region 11, and to achieve the purpose of obtaining the sensing signals of the plurality of capacitance sensing units 21. The signal line 31 can be bent and stretched along with the flexible portion 16, so that the flexible panel 100 can sense signals in a bent and stretched deformation state. One end of the signal line 31 at the bonding region 11 constitutes a leading end of the electronic device 20. The hard portion 12 reinforces one end of the signal line 31 located in the bonding region 11, prevents the bonding region 11 from being deformed by heat to cause poor contact with a functional element, and increases the functional stability of the flexible panel 100.

In this embodiment, the flexible panel 100 is a flexible touch panel, and as shown in fig. 2, a flexible touch display screen 1000 is provided, where the flexible touch display screen 1000 includes a light-transmitting cover plate 1001, the flexible panel 100, and a display panel 1002. The flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002. The flexible portion 16 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002 such that the flexible panel 100 may form virtual keys in conjunction with the display area of the display panel 1002. The binding region 11 of the flexible panel 100 may protrude relative to the display panel 1002, so as to be conveniently bound with the flexible circuit board 60, so that the flexible touch display screen 1000 has a touch function. Of course, in other embodiments, the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmissive cover 1001, or integrated with the light-transmissive cover 1001. Of course, the flexible panel 100 may also be applied to a wearable device having a touch function, such as a wrist band, a watch, or a strap.

In another embodiment, referring to fig. 3, different from the embodiment shown in fig. 2, the flexible panel 100 is a flexible display panel. A flexible display 2000 is provided, the flexible display 2000 comprising a light transmissive cover 2001 and a flexible panel 100. The flexible panel 100 is attached to the light-transmitting cover plate 2001, and the flexible panel 100 further includes a display layer 110, where the display layer 110 is attached to one side of the substrate 10 where the electronic devices 20 are arranged. The display layer 110 has a plurality of light emitting cells arrayed. The electronic device 20 is a drive electrode. The electronic device 20 may drive the plurality of light emitting cells of the display layer 110 to emit light. The electronic device 20 may be constituted by an array of a plurality of drive units 22. Each driving unit 22 is opposite to each light emitting unit of the display layer 110. Each driving unit 22 may be formed of a thin film transistor diode switch. The flexible portion 16 is substantially aligned with the display area of the display layer 110 to facilitate driving of the display area of the display layer 110 by the electronic device 20 to emit light to display an image. The binding region 11 protrudes relative to the display layer 110, and is conveniently bound with the flexible circuit board 60, so that the flexible display screen 2000 can acquire display signals through the flexible circuit board 60. Of course, in other embodiments, the flexible panel 100 may also be applied to an electronic device with a flexible display function, such as a foldable tablet computer, a foldable display, and the like.

Further, referring to fig. 4 and 5, the binding region 11 is disposed on the hard portion 12.

In this embodiment, the substrate 10 has a first surface 111 and a second surface 112 opposite to the first surface 111. The binding region 11 may be located at the first surface 111. The hard portion 12 may extend through the first surface 111 toward the second surface 112. The hard portion 12 may extend from the first surface 111 to the second surface 112, or may extend to a position spaced apart from the second surface 112. The hard portion 12 may also extend from the second surface 112 to a position spaced from the first surface 111. The substrate 10 is hardened in a region covering the bonded region 11 to form a hard portion 12. The hard portion 12 has an upper surface 121 that is substantially flush with the first surface 111. The upper surface 121 may have attached thereto a wire 30 extending to the bonding area 11, and the hard portion 12 provides a stable connection platform for the wire 30. The hard portion 12 is formed by chemical reaction and may be integrally formed with the flexible portion 16 of the substrate 10 to increase the stability of the flexible panel 100.

In one embodiment, the bonding region 11 occupies a portion of the hard portion 12, i.e., the orthographic projection of the hard portion 12 on the substrate 10 is larger than the orthographic projection of the bonding region 11 on the substrate 10, and the hard portion 12 provides a support structure with higher hardness in the bonding region 11 to facilitate the conduction of the wires 30 in the bonding region 11 with an external device. The hard portion 12 may still provide a stiffer support structure for the wires 30 in the area beyond the bonded region 11, further enhancing the functional stability of the flexible panel 100.

In another embodiment, please refer to fig. 6, which is different from the embodiment of fig. 5 in that the hard portion 12 extends from the second surface 112 to the first surface 111 and is spaced apart from the first surface 111. I.e., the bonded region 11, is spaced apart from the hard portion 12. Binding region 11 an orthographic projection of the binding region 11 on the hard portion 12 is located on the hard portion 12.

In another embodiment, please refer to fig. 7, which is different from the embodiment of fig. 1 in that a plurality of sub-hard portions 122 are formed at intervals around the bonding region 11. The plurality of inner edges 123 are generally aligned with the peripheral side edges of the bonded regions 11 and have a plurality of outer edges 124, the plurality of outer edges 124 being parallel with the peripheral side edges of the bonded regions 11. The plurality of inner edges 123 and the plurality of outer edges 124 are staggered in the circumferential direction of the bonded region 11. That is, the plurality of sub hard portions 122 form a saw-toothed structure on the peripheral side of the bonded region 11. The plurality of sub-hard portions 122 are arranged on the periphery of the binding region 11 to reduce the hardening area of the base material 10, reduce the cost of hardening and aging of the base material 10 through chemical treatment, and ensure the hardness of the hard portions 12, so that the functional stability of the flexible panel 100 is improved.

In another embodiment, referring to fig. 8, unlike the embodiment shown in fig. 4, a portion of the bonded region 11 coincides with the hard portion 12. The substrate 10 is provided with a plurality of hard portions 12 arranged at intervals, and the bonded regions 11 cover the hard portions 12 and cover portions between two adjacent hard portions 12. The hard portion 12 extends substantially in a straight line. The plurality of hard portions 12 are arranged parallel to each other at equal intervals. A spacer 125 is provided between two adjacent hard portions 12. A mask is provided on the substrate 10, and a specific region of the substrate 10 is chemically treated with the mask, thereby forming a plurality of hard portions 12. By reducing the hardened area of the substrate 10, the service life of the substrate 10 is ensured, and the substrate 10 has a certain hardness in the binding region 11 by using the plurality of hard portions 12, so that the hardness of the substrate 10 in the binding region 11 can be adjusted as required, and the functional stability of the flexible panel 100 is improved.

Further, referring to fig. 9, the flexible panel 100 further includes a coating 40, and the coating 40 covers the hard portion 12. The coating 40 may be applied to the first surface 111, the second surface 112, or both the first surface 111 and the second surface 112. The coating 40 may increase the hardness of the hard segment 12. To ensure that the reliability of the substrate 10 at the hard portion 12 is satisfactory, a coating 40 covers the hard portion 12 and covers the interface of the hard portion 12 and the flexible portion 16 to ensure functional stability of the flexible panel 100. The wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10. I.e. the wires 30 are covered on the coating 40. The thickness of the coating 40 is relatively thin, the thickness of the coating 40 is smaller than that of the hard portion 12, and the thickness difference between the flexible portion 11 and the hard portion 12 of the coating 40 is negligible, so as to ensure the surface flatness of the flexible panel 100.

Further, referring to fig. 10, the flexible panel 100 further includes a flexible circuit board 60, and a portion of the flexible circuit board 60 is fixed to the bonding area 11 and connected to the wires 30.

In this embodiment, the flexible circuit board 60 includes a first end 61 fixedly connected to the substrate 10 and a second end 62 disposed opposite the first end 61. The first end 61 is fixed to the binding region 11. The first end 61 covers the binding area 11. The first end 61 is provided with a plurality of bare copper. The plurality of exposed copper wires are connected to the plurality of wires 30 at the bonding region 11, so that the electronic device 20 can be electrically connected to the flexible circuit board 60 through the wires 30. The second end 62 is offset from the substrate 10. The second end 62 may be provided with a connector 621. The connector 621 is electrically connected to a plurality of exposed copper via copper foil cables, so that the connector 621 can be electrically connected to the electronic device 20 via the conductive wire 30. When the connector 621 is connected to an external device, the electronic device 20 may transmit the sensing signal to the external device through the flexible circuit board 60, so that the flexible panel 100 may transmit the sensing signal to the outside. The bonding region 11 can be reinforced by the hard portion 12 to ensure that the wires 30 of the bonding region 11 can be firmly contacted with the first end 61 of the flexible circuit board 60 to increase the conduction performance.

The flexible circuit board 60 is fixed to the bonding area 11 through the conductive adhesive 70, and is electrically connected to the conductive wires 30 through the conductive adhesive 70. The conductive adhesive 70 is adhered between the coating 40 and the first end 61 of the flexible circuit board 60, so that the flexible circuit board 60 is firmly adhered to the substrate 10, and the exposed copper of the flexible circuit board 60 can be effectively conducted with the conductive wire 30. In the process of stably connecting the flexible circuit board 60 and the substrate 10 through the conductive adhesive 70, the flexible circuit board 60, the conductive adhesive 70 and the substrate 10 need to be heated, and the flexible circuit board 60 and the substrate 10 are enabled to extrude the conductive adhesive 70 under the action of large pressure, so that conductive particles in the conductive adhesive 70 are conducted up and down, and the conductive adhesive 70 can exhibit stable bonding and conducting performance. Utilize stereoplasm portion 12 to bind district 11 reinforcement to and coating 40 covers stereoplasm portion 12 for substrate 10 increases at the district 11 hardness that binds, and substrate 10 is difficult for the deformation in the district 11 department that binds, reduces flexible circuit board 60 and substrate 10 and is connected the inefficacy, improves flexible circuit board 100's functional stability.

Referring to fig. 11 and 12, the present application further provides a method for manufacturing a flexible panel, including the steps of:

101: a substrate 10 is provided, the substrate 10 having a portion to be processed 120 and a flexible portion 16 connected to the portion to be processed 120.

In the present embodiment, the substrate 10 may be obtained by a cutting process. The substrate 10 may have a rectangular shape. The portion to be processed 120 may be located at one end in the longitudinal direction of the substrate 10. By providing the to-be-processed region in advance on the to-be-processed portion 120, the to-be-processed portion 120 can be processed more conveniently. The thickness of the substrate 10 may be 5 μm to 80 μm. The portion to be processed 120 is provided integrally with the flexible portion 16. By processing the portion to be processed 120, the base material 10 having a certain hardness is obtained, and the functional stability of the flexible panel 100 is further improved.

In one embodiment, the substrate 10 is a substrate having flexible and elastic properties. The base material 10 mainly includes a flexible material such as natural rubber or synthetic rubber. The preparation raw material of the substrate 10 is a mixture of a high molecular material containing unsaturated double bond functional groups and a cross-linking agent. That is, the raw material for preparing the substrate 10 may include natural rubber or synthetic rubber materials including styrene-based elastomers, polyisoprene rubber, polybutadiene rubber, ethylene-propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, acrylate rubber, and the like. The raw material for preparing the base material 10 is further mixed with a cross-linking agent, which may be a sulfide, a metal oxide, a peroxide, an aliphatic or aromatic amine, a sulfonate, an aromatic diol, a quaternary phosphonium (ammonium) salt, or the like. The base material 10 includes a mixture containing the above-mentioned natural rubber, synthetic rubber and a crosslinking agent, so that the portion 120 to be processed of the base material 10 can be processed by a chemical crosslinking reaction.

102: the portion to be processed 120 is hardened so that the portion to be processed 120 forms a hard portion 12 having a bonded region 11.

In one embodiment, the portion to be processed 120 is heated or soaked in a vulcanization soaking solution to form the hard portion 12, so that the hardness of the hard portion 12 can be adjusted as required, and the flexible panel 100 meets the use requirement, and can meet both certain hardness and bending deformation performance. After the hard portion 12 is formed by chemical treatment, the binding region 11 may be disposed on the hard portion 12, so that the hard portion 12 can enhance the hardness of the binding region 11, and the binding region 11 is prevented from deforming under the action of heat and pressure.

103: an electronic device 20 is formed at the flexible portion 16, and a lead 30 connected to the electronic device 20 is formed, the lead 30 extending to the bonding region 11.

In the present embodiment, the electronic device 20 and the conductive line 30 may be disposed on the substrate 10 by a screen printing process or the like. The electronic device 20 may be composed of a plurality of capacitive sensing cells 21 arranged in an array. The electronic device 20 is formed at a position where the substrate 10 is bendable or stretchable, so that the electronic device 20 can be bent and stretched with the substrate 10. The wire 30 is partially formed on the same side of the substrate 10 as the electronic device 20 to electrically connect the electronic device 20 with the bonding region 11.

104: a flexible circuit board 60 is provided, and the flexible circuit board 60 is bonded to the base material 10 at the bonding region 11.

In this embodiment, the base material 10 is coated with the conductive adhesive 70 at the bonding area 11, and one end of the flexible circuit board 60 is attached to the conductive adhesive 70. A certain squeezing force is applied to the flexible circuit board 60 and the substrate 10, and the conductive adhesive 70 is heated, so that the conductive adhesive 70 can stably connect the flexible circuit board 60 and the substrate 10, and the flexible circuit board 60 is conducted with the wires 30. Since the hardness of the binding region 11 is enhanced by the hard portion 12, deformation of the substrate 10 is prevented, and functional stability of the flexible panel 100 is ensured.

In another embodiment, unlike the embodiment shown in fig. 11, in step 101, the substrate 10 is a substrate having flexible properties. The base material 10 mainly includes natural rubber or synthetic rubber. The base material 10 is prepared from a mixture of a high molecular material containing unsaturated double bond functional groups and a photoinitiator. That is, the raw material for preparing the substrate 10 may include natural rubber or synthetic rubber materials including styrene-based elastomers, polyisoprene rubber, polybutadiene rubber, ethylene-propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, acrylate rubber, and the like. The base material 10 is prepared by mixing a photoinitiator, which may be benzoin and derivatives, benzil, acylphosphorus oxide, benzophenone, thioxanthone, and the like. The base material 10 includes a mixture containing the above-described natural rubber, synthetic rubber and photoinitiator so that the portion 120 to be processed of the base material 10 can be processed by a chemical crosslinking reaction.

In step 102, the portion to be processed 120 is irradiated with light radiation such as ultraviolet light and electron beam, so that the portion to be processed 120 is chemically cross-linked, that is, a chemical cross-linking reaction is generated in a part of the portion to be processed 120, so as to form the hard portion 12 through a hardening process. The hardness of the hard portion 12 can be adjusted as required, so that the flexible panel 100 meets the use requirements, a certain hardness can be ensured, and the bending deformation performance can be met.

In another embodiment, different from the embodiment shown in fig. 11, in step 101, the main material of the substrate 10 is a flexible polymer material containing active hydrogen. The substrate 10 mainly includes a flexible polymer material containing active hydrogen functional groups such as amino groups, hydroxyl groups, carboxyl groups, and the like. The preparation raw material of the substrate 10 is a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent. That is, the raw material for producing the substrate 10 may include a thermoplastic elastomer or a synthetic resin rubber material containing a polyurethane elastomer, a silicone rubber, a urethane rubber, a chlorohydrin rubber, an acrylate rubber, or the like. The raw material for producing the substrate 10 may be mixed with a high-temperature curing agent such as blocked isocyanates including phenol-blocked polyisocyanates, caprolactam-blocked polyisocyanates, and butanone-blocked polyisocyanates, or a resin compound having an active functional group such as a hydroxyl resin, a carboxyl-terminated resin, an acrylic resin, and an epoxy resin. The base material 10 comprises a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent, so that the portion 120 to be processed of the base material 10 can be processed by a chemical crosslinking reaction.

In step 102, the portion to be processed 120 is subjected to a chemical hardening process by heating, infrared radiation, or the like, so that the portion to be processed 120 is chemically cross-linked, i.e., a chemical cross-linking reaction occurs in a molecule of the portion to be processed 120, so as to harden and form the hard portion 12. The hardness of the hard portion 12 can be adjusted as required, so that the flexible panel 100 meets the use requirements, a certain hardness can be ensured, and the bending deformation performance can be met.

In another embodiment, different from the embodiment shown in fig. 11, in step 101, the substrate 10 is a substrate having flexibility and elasticity. The main material of the substrate 10 is a polymer such as synthetic rubber, thermoplastic, or elastic plastic. The base material 10 may be made of polyurethane, silicone, natural rubber, ethylene propylene rubber, styrene butadiene rubber, butyl rubber, silicone rubber, or other polymer materials. The substrate 10 includes a polymer material such as synthetic rubber, thermoplastic, or elastic plastic, etc. so that the portion 120 of the substrate 10 to be processed can be easily decomposed by molecules to generate radicals, and then the main chain is broken and cross-linked to generate an oxidative decomposition reaction of side chain organic groups, thereby implementing a chemical reaction hardening treatment.

Before step 102, the method comprises the steps of: the portion to be processed 120 is subjected to aging and hardening treatment. By placing the to-be-processed part 120 of the base material 10 in the chemical environments of light, heat, ultraviolet high-energy radiation, ozone, acid and alkali, etc., the molecular chain of the to-be-processed part 120 is broken, so that the subsequent chemical treatment of the to-be-processed part 120 is facilitated, the chemical treatment time of the to-be-processed part 120 is shortened, and the manufacturing cost is reduced.

In step 102, the portion to be processed 120 is chemically processed by heating, UV irradiation, chemical immersion, or the like, so that the polymer in the portion to be processed 10 undergoes an oxidative decomposition reaction or carbonization, and the portion to be processed 120 is hardened to form the hard portion 12. The hardness of the hard portion 12 can be adjusted as required, so that the flexible panel 100 meets the use requirements, a certain hardness can be ensured, and the bending deformation performance can be met.

After step 102, further comprising the steps of: the hard portion 12 of the substrate 10 is coated with a coating layer 40. The coating 40 may be formed on one side or opposite sides of the substrate 10 using a printing process. The coating 40 may increase the stiffness of the flexible panel 100. Since the substrate 10 is chemically treated to form the hard portion 12, in order to ensure that the reliability of the substrate 10 at the hard portion 12 meets requirements, the coating 40 covers the hard portion 12 and the interface between the hard portion 12 and the flexible portion 16 to ensure the functional stability of the flexible panel 100. The wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10.

The hard part is formed at the binding area through hardening treatment of the base material, and the hard part provides stress reinforcement for the binding area, so that the binding area is not easy to deform, the electronic device is prevented from being connected with the functional element in the binding area to fail, and the functional stability of the performance of the flexible panel is improved.

The above detailed description is made on a method for manufacturing a flexible panel and a flexible panel provided in the embodiments of the present application, and specific examples are applied in the present application to explain the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the method and the core ideas of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

A method for manufacturing a flexible panel is characterized by comprising the following steps:

providing a base material, wherein the base material is provided with a part to be processed and a flexible part connected with the part to be processed;

hardening the part to be processed to form a hard part with a binding area; forming an electronic device on the flexible portion, and forming a wire connecting the electronic device, the wire extending to the bonding region.
The method of claim 1, wherein the step of providing a substrate comprises a mixture of a polymer material having an unsaturated double bond functional group and a crosslinking agent;

in the step of hardening the portion to be worked, the portion to be worked is heated or dipped in a vulcanization dipping solution to form the hard portion.
The method of claim 2, wherein the substrate comprises a natural rubber or synthetic rubber material containing one or more of styrene-based elastomer, polyisoprene rubber, polybutadiene rubber, ethylene-propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, and acrylate rubber, and the crosslinking agent is a compound containing one or more of sulfide, metal oxide, peroxide, aliphatic or aromatic amine, sulfonate, aromatic diol, and ammonium salt.
The method of claim 1, wherein the step of providing a substrate comprises a mixture of a polymeric material having an unsaturated double bond functional group and a photoinitiator;

and in the step of hardening the part to be processed, ultraviolet radiation and electron beam radiation processing are carried out on the part to be processed to form a hard part.
The method of claim 4, wherein the substrate comprises a natural rubber or synthetic rubber material comprising one or more of styrene-based elastomers, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, and acrylate rubber, and the photoinitiator is one or more of benzoin and derivatives, benzil, acylphosphine oxides, benzophenones, and thioxanthones.
The method for manufacturing a flexible panel according to claim 1, wherein in the step of providing a substrate, the substrate comprises a mixture of a polymer material containing active hydrogen and a high-temperature curing agent;

and in the step of hardening the portion to be processed, heating the portion to be processed and performing infrared radiation processing to form a hard portion.
The method of claim 6, wherein the substrate comprises a thermoplastic elastomer or a synthetic resin rubber material containing one or more of polyurethane elastomer, silicon rubber, urethane rubber, chlorohydrin rubber and acrylate rubber, and the high-temperature curing agent is a reactive functional group resin compound of one or more of blocked isocyanate such as phenol blocked polyisocyanate, caprolactam blocked polyisocyanate and methyl ethyl ketone blocked polyisocyanate, hydroxyl resin, carboxyl-terminated resin, acrylic resin and epoxy resin.
The method of claim 1, wherein in the step of providing a substrate, the substrate is made of a polymer material;

in the step of hardening the portion to be worked, the portion to be worked is subjected to an oxidative decomposition reaction or carbonization to form a hard portion.
The method for manufacturing a flexible panel according to claim 8, wherein the step of hardening the portion to be processed is preceded by the step of:

and (3) performing fracture processing on the molecular chain of the part to be processed.
The method of making a flexible panel according to claim 9, further comprising, after forming the hard portion on the flexible portion, the steps of:

and applying a coating layer to the hard portion of the base material.
A flexible panel, characterized in that it is made by the method of manufacturing a flexible panel according to any one of claims 1 to 10.
The flexible panel of claim 11, wherein the flexible panel comprises a substrate and an electronic device, the substrate is provided with a bonding region, the substrate is hardened at the bonding region to form a hard portion, the electronic device is fixed to the substrate, and the electronic device is connected to a wire extending to the bonding region.
The flexible panel of claim 11, wherein the substrate includes a flexible portion connected to the hard portion, the hard portion having a hardness greater than a hardness of the flexible portion.
The flexible panel according to claim 11, wherein the substrate is provided with a plurality of hard portions arranged at intervals in the binding region, and the binding region covers the hard portions and a portion between two adjacent hard portions.
A flexible panel according to any one of claims 12 to 14, further comprising a coating covering the hard portion.
The flexible panel of claim 15, wherein the coating thickness is less than the hard segment thickness.
The flexible panel according to any one of claims 11 to 16, further comprising a flexible circuit board, a portion of which is fixed to the bonding area and electrically connected to the conductive line.
The flexible panel of claim 17, wherein the flexible circuit board is fixed to the bonding area via a conductive adhesive and is electrically connected to the conductive line via the conductive adhesive.