CN113260238A - Constant temperature system for switching power supply - Google Patents
Constant temperature system for switching power supply Download PDFInfo
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- CN113260238A CN113260238A CN202110770108.9A CN202110770108A CN113260238A CN 113260238 A CN113260238 A CN 113260238A CN 202110770108 A CN202110770108 A CN 202110770108A CN 113260238 A CN113260238 A CN 113260238A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a constant temperature system for a switching power supply, wherein a circulating fan generates suction force to enable gas in a containing cavity to be discharged into a heat dissipation channel through an air outlet, a heat dissipation structure dissipates the heat of the gas entering the heat dissipation channel, the dissipated gas circularly flows back to the containing cavity through an air inlet, a lateral medium flowing component can exchange heat with the heat dissipated by the heat dissipation structure, a bottom medium flowing component and a top medium flowing component can exchange heat with the heat at the top and the bottom of the containing cavity, and the containing cavity in the external high-temperature environment or the low-temperature environment can be maintained in a relatively constant-temperature state according to different selected media so as to reach or approach a rated temperature range required by the switching power supply, thereby being capable of adapting to the all-area and all-weather constant-temperature working environment.
Description
Technical Field
The invention relates to the technical field of constant temperature control, in particular to a constant temperature system for a switching power supply.
Background
With the continuous aggravation of the environmental pollution problem, the development of new energy automobiles is an important strategy for energy conservation, emission reduction and low-carbon economic development. The new energy automobile adopts unconventional automobile fuel as a power source, common and technically mature new energy automobiles comprise a pure electric automobile, a hybrid electric automobile, a fuel cell automobile and the like, the new energy automobiles of the types all adopt a motor as a power source, the motor is controlled by a motor controller to work according to set direction, speed, angle, response time and the like, the instructions are equivalent to instructions of gears, accelerators, brakes and the like in the traditional fuel oil automobile, and a switching power supply in the motor controller works in an optimal temperature range (constant temperature mode), so that the stable operation of the whole system is played a vital role.
At present, switch power supplies are divided into two types according to different constant temperature modes, wherein one type is that the system is kept at a constant temperature through heating, and the other type is that the system is kept at a constant temperature through refrigeration, and the two constant temperature modes have single working mode and poor adaptability to different regions and seasons and cannot adapt to constant temperature working modes of all-territory and all-weather switch power supplies.
Disclosure of Invention
The invention aims to provide a constant temperature system for a switching power supply, so that the switching power supply is always in a constant temperature environment and can adapt to all-territory and all-weather working modes.
The application provides a constant temperature system for switching power supply, includes:
the device comprises a shell, a first fixing piece and a second fixing piece, wherein an accommodating cavity is formed in the shell;
circulation radiator unit includes: the circulating fan, the heat dissipation channel arranged on the periphery of the circumferential cavity wall of the accommodating cavity and the heat dissipation structure arranged in the heat dissipation channel; the circumferential cavity wall of the accommodating cavity is provided with an air outlet hole and an air inlet hole which are communicated to the heat dissipation channel, and the circulating fan is installed at the hole of the air outlet hole and used for generating suction force so that the gas in the accommodating cavity is discharged into the heat dissipation channel through the air outlet hole and circularly flows back to the accommodating cavity through the air inlet hole; the heat dissipation structure is used for dissipating heat of the gas entering the heat dissipation channel;
a side medium flowing component arranged at the circumferential periphery of the heat dissipation channel and used for the circulation flow of a cold medium or a heat medium so as to exchange heat with the heat dissipated by the heat dissipation structure;
a bottom medium flow assembly provided in a bottom casing wall of the casing for circulating a cooling medium or a heating medium to exchange heat with the heat radiated downward in the accommodating chamber;
a top medium flow assembly disposed in the top shell wall of the housing for circulating a cooling medium or a heating medium to exchange heat radiating upward in the receiving cavity.
According to the constant temperature system for the switching power supply, the circulating fan generates suction force to enable gas in the accommodating cavity to be discharged into the heat dissipation channel through the air outlet, the heat dissipation structure dissipates heat of the gas entering the heat dissipation channel, the dissipated gas flows back to the accommodating cavity through the air inlet in a circulating mode, the lateral medium flowing component, the bottom medium flowing component and the top medium flowing component can exchange heat with the gas in the accommodating cavity, and according to different selected media, the accommodating cavity in the high-temperature environment or the low-temperature environment can be maintained in a relatively constant-temperature state to reach or approach a rated temperature range required by the switching power supply, so that the constant temperature system can adapt to the all-territory and all-weather constant-temperature working environment.
Drawings
Fig. 1 is a perspective view of a thermostat system for a switching power supply provided herein;
FIG. 2 is an exploded view of a thermostat system for a switching power supply as provided herein;
FIG. 3 is a cross-sectional view of a thermostat system for a switching power supply provided herein;
FIG. 4 is a cross-sectional view of the thermostat system for a switching power supply provided herein, with the switching power supply removed;
fig. 5 is a schematic structural diagram of a bottom case and a switching power supply in the thermostatic system for the switching power supply provided by the present application;
FIG. 6 is a schematic diagram of a thermostat system for a switching power supply provided herein with the bottom case removed;
FIG. 7 is a bottom schematic view of the thermostatic system for a switching power supply with the bottom housing removed;
fig. 8 is a perspective view of a housing cover in the thermostat system for a switching power supply provided by the present application;
fig. 9 is a cross-sectional view of a housing cover in the thermostat system for a switching power supply provided by the present application;
fig. 10 is a perspective view of a heat dissipation structure in a thermostat system for a switching power supply provided by the present application;
fig. 11 is a first schematic structural diagram of a C-type dielectric flow plate in the thermostat system for the switching power supply provided by the present application;
fig. 12 is a second schematic structural diagram of a C-type dielectric flow plate in the thermostat system for a switching power supply provided by the present application.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
The application provides a constant temperature system for switching power supply for the new energy automobile field of mainly used for switching power supply among the motor controller keeps under the constant temperature environment. The cavity that holds of casing is used for placing and holds switching power supply, and the heat in holding the cavity mainly is produced by switching power supply, and switching power supply need be in rated temperature within range can reach efficient work level, and rated temperature is the constant temperature state promptly. In the following embodiments, the cold medium may be a cooling liquid or a cooling gas, and the hot medium may also be a hot liquid or a hot gas.
Referring to fig. 1 to 12, the thermostat system for a switching power supply provided in this embodiment mainly includes: a housing 10, a circulating heat dissipating assembly, a side media flow assembly 30, a bottom media flow assembly 40, and a top media flow assembly 50.
As shown in fig. 4, a housing chamber 11 is provided in the housing 10, the housing chamber 11 is used for housing the switching power supply 100, and the switching power supply 100 operates to generate a certain high temperature, so that the gas in the housing chamber 11 is formed into a high-temperature gas.
Referring to fig. 2, 3, 4, 5, and 6, the circulation heat dissipating assembly includes: the circulating fan 21, the heat dissipation channel 22 and the heat dissipation structure 23, the heat dissipation channel 22 is arranged on the periphery of the circumferential cavity wall of the accommodating cavity 11, and the heat dissipation structure 23 is arranged in the heat dissipation channel 22. Seted up venthole 111 and inlet port 112 on the circumference chamber wall that holds chamber 11, venthole 111 and inlet port 112 all communicate with heat dissipation channel 22 each other, and circulation fan 21 installs in the orifice department of venthole 111, and more specifically, circulation fan 21 is arranged in holding chamber 11, effectively practices thrift installation space. The circulation fan 21 serves to generate suction force so that the gas in the accommodating chamber 11 is discharged into the heat dissipation channel 22 through the gas outlet holes 111 and circulates back into the accommodating chamber 11 through the gas inlet holes 112. The heat dissipation structure 23 dissipates heat of the gas entering the heat dissipation channel 22.
Referring to fig. 6, an arrow with a dotted line in fig. 6 reveals that the whole process of flowing and flowing back of the gas in the accommodating cavity 11 to the heat dissipating channel 22, the circulating fan 21 works to generate suction force, so that the air pressure value of the accommodating cavity 11 is smaller than the air pressure value in the heat dissipating channel 22, a certain pressure difference is generated, the gas in the accommodating cavity 11 is discharged into the heat dissipating channel 22 through the air outlet 111 under the action of the pressure difference and moves in the heat dissipating channel 22 along the direction from the air outlet 111 to the air inlet 112, the heat dissipating structure 23 dissipates the heat of the gas entering the heat dissipating channel 22 from the accommodating cavity 11, and the gas with the heat dissipated circulates and flows back to the accommodating cavity 11 through the air inlet 112, thereby effectively reducing the temperature in the accommodating cavity.
A side medium flow assembly 30 is provided at a circumferential periphery of the heat dissipation channel 22, the side medium flow assembly 30 being for a cooling medium or a heating medium to circulate for heat exchange with the heat dissipated by the heat dissipation structure 23.
A bottom medium flow assembly 40 is provided in the bottom casing wall of the casing 10, and the bottom medium flow assembly 40 is used for a cooling medium or a heating medium to circulate for heat exchange with the heat radiated downward in the receiving chamber 11.
A top medium flow assembly 50 is provided in the top casing wall of the casing 10, and the top medium flow assembly 50 is used for circulation of a cooling medium or a heating medium to exchange heat radiated upward in the receiving chamber 11.
The thermostat system for a switching power supply provided by the embodiment has an internal circulation operation mode, an external circulation operation mode and a hybrid operation mode.
In the internal circulation operating mode, the circulation fan 21 generates suction force to discharge the gas in the accommodating cavity 11 into the heat dissipation channel 22 through the air outlet 111, the gas discharged into the heat dissipation channel 22 dissipates heat under the action of the heat dissipation structure 23, and the gas after heat dissipation flows back to the accommodating cavity 11 through the air inlet 112 in a circulation manner.
In the external circulation operation mode, when the external environment temperature is higher than the rated temperature, the accommodating chamber 11 needs to be maintained at a lower level relative to the external temperature, the bottom medium flowing unit 40 circulates the cold medium to exchange heat with the heat radiated downwards in the accommodating chamber 11, so that the temperature of the gas at the bottom of the accommodating chamber 11 is lowered, and the top medium flowing unit 50 circulates the cold medium to exchange heat with the heat radiated upwards in the accommodating chamber 11, so that the temperature of the gas at the top of the accommodating chamber 11 is lowered. When the external temperature is lower than the rated temperature, the accommodating chamber 11 needs to be maintained at a higher level relative to the external temperature, and the heat medium circulates in the bottom medium flowing unit 40 to exchange heat with the gas at the bottom of the accommodating chamber 11, so that the temperature of the gas at the bottom of the accommodating chamber 11 is increased. The heat medium is circulated in the top medium flow module 50 to exchange heat with the gas at the top of the receiving chamber 11, so that the temperature of the gas at the top of the receiving chamber 11 is increased.
Of course, in the external circulation operation mode, the external environment temperature cannot be too high relative to the rated temperature, and the approximate difference position is within 10 ℃.
In the hybrid ring operating mode, when the external environment temperature is higher than the rated temperature, the accommodating chamber 11 needs to be maintained at a lower level relative to the external temperature, at this time, the circulating fan 21 generates suction force to discharge the gas with higher temperature in the accommodating chamber 11 into the heat dissipation channel 22 through the exhaust hole 111, the heat dissipation structure 23 dissipates the heat of the gas with higher temperature, the gas with heat dissipation is circulated and returned into the accommodating chamber 11 through the air inlet hole 112, the cold medium is circulated and flowed in the lateral medium flow assembly 30 to exchange heat with the heat dissipated by the heat dissipation structure 23, the cold medium is circulated and flowed in the bottom medium flow assembly 40 to exchange heat with the heat radiated downward in the accommodating chamber 11, and the cold medium is circulated and flowed in the top medium flow assembly 50 to exchange heat with the heat radiated upward in the accommodating chamber 11.
Accordingly, in the hybrid operation mode, when the external ambient temperature is lower than the rated temperature, the accommodating chamber 11 needs to be maintained at a higher level with respect to the external temperature, and at this time, the circulation fan 21 discharges the gas in the accommodating chamber 11 into the heat dissipation channel 22, and the thermal medium circulates in the side medium flow assembly 30 to exchange heat with the gas in the heat dissipation channel 22, so that the temperature of the gas is raised, and the raised temperature gas is returned to the accommodating chamber 11. The heat medium is circulated in the bottom medium flow module 40 to exchange heat with the gas at the bottom of the receiving chamber 11, so that the temperature of the gas at the bottom of the receiving chamber 11 is increased. The heat medium is circulated in the top medium flow module 50 to exchange heat with the gas at the top of the receiving chamber 11, so that the temperature of the gas at the top of the receiving chamber 11 is increased.
It will be appreciated that in the hybrid mode of operation, the difference between the ambient temperature and the nominal temperature is relatively large, typically above 10 ℃.
On the one hand, the side medium flow assembly 30, the bottom medium flow assembly 40, and the top medium flow assembly 50 can exchange heat with the gas in the accommodating chamber 11, and according to the selected medium, the accommodating chamber 11 in the high temperature environment or the low temperature environment can be maintained in a relatively constant temperature state to reach or approach the rated temperature range required by the switching power supply 100, so as to be adapted to the all-territory and all-weather constant temperature working environment. On the other hand, the side medium flow member 30, the bottom medium flow member 40, and the top medium flow member 50 can also block the external heat from being transferred to the inside of the accommodating chamber 11.
As shown in fig. 5, the thermostat system for a switching power supply provided by the present application further includes: the temperature detection module 60, the temperature detection module 60 is disposed in the accommodating cavity 11, and the temperature detection module 60 is connected with the circulating fan 21, and the connection mode includes electrical connection or signal connection. The temperature detecting module 60 is used for detecting the temperature in the accommodating chamber 11, comparing the detected temperature with a rated temperature, and adjusting the air volume of the circulating fan 21.
On the premise that the external environment temperature is high and heat dissipation is required, the temperature in the accommodating cavity 11 is high, and the cold medium flows in the side medium flow assembly 30, the bottom medium flow assembly 40 and the top medium flow assembly 50.
When the temperature in the accommodating chamber 11 detected by the temperature detecting module 60 is higher than the rated temperature and the difference is large, the circulating fan 21 is adjusted to a high rotation speed so that the air volume of the circulating fan 21 is increased. When the temperature in the accommodating chamber 11 detected by the temperature detecting module 60 is greater than the rated temperature and the difference is small, the circulating fan 21 is adjusted to a low rotation speed so that the air volume of the circulating fan 21 is reduced.
When the temperature of the external environment is low and the temperature in the accommodating chamber needs to be raised, the heat medium flows in the side medium flow assemblies 30, the bottom medium flow assemblies 40 and the top medium flow assemblies 50. When the temperature in the accommodating chamber 11 detected by the temperature detecting module 60 is lower than the rated temperature and the difference is large, the circulating fan 21 is adjusted to a high rotation speed so that the air volume of the circulating fan 21 is increased.
In some embodiments, the thermostat system for a switching power supply provided herein further comprises: and a cold and hot medium supply mechanism for supplying a cold medium or a hot medium to the side medium flow module 30, the bottom medium flow module 40, and the top medium flow module 50. The temperature detecting module 60 is further connected to the cold and hot medium supply mechanism, and the temperature detecting module 60 is further configured to compare the detected temperature with a rated temperature to adjust the amount of the cold medium or the hot medium supplied by the cold and hot medium supply mechanism.
In this embodiment, the cold and hot medium supply mechanism may use a pump to pump the cold medium or the hot medium to the side medium flow assembly 30, the bottom medium flow assembly 40, and the top medium flow assembly 50, and then the detected temperature is compared with the rated temperature at the temperature detection module 60 to adjust the flow rate of the cold medium or the hot medium supplied by the cold and hot medium supply mechanism.
When the external environment temperature is higher than the rated temperature, the accommodating cavity 11 is in an environment higher than the rated temperature, and when the external environment temperature is lower than the rated temperature, the accommodating cavity 11 is in an environment lower than the rated temperature.
When the temperature in the accommodating chamber 11 detected by the temperature detecting module 60 is greater than the rated temperature and the difference is large, the cold and hot medium supplying mechanism is adjusted to supply the cold medium with high flow rate to the side medium flow assemblies 30, the bottom medium flow assembly 40, and the top medium flow assembly 50. When the temperature in the accommodating chamber 11 detected by the temperature detecting module 60 is higher than the equal temperature and the difference is small, the cold and hot medium supplying mechanism is adjusted to supply the cold medium with a low flow rate to the side medium flow assembly 30, the bottom medium flow assembly 40, and the top medium flow assembly 50. When the temperature in the accommodating chamber detected by the temperature detecting module 60 is less than the rated temperature and the difference is large, the cold and hot medium supplying mechanism is adjusted to supply the high flow rate of the hot medium to the side medium flow assemblies 30, the bottom medium flow assembly 40, and the top medium flow assembly 50. When the temperature in the accommodating chamber detected by the temperature detecting module 60 is less than the rated temperature and the difference is small, the cold and hot medium supplying mechanism is adjusted to supply the low flow rate of the hot medium to the side medium flow assemblies 30, the bottom medium flow assembly 40, and the top medium flow assembly 50.
As shown in fig. 3, 4, 5, 11 and 12, two accommodating chambers 11 are provided in the housing 10, and the side medium flow module 30 includes: the intermediate partition plate 31 is provided between the two housing chambers 11, and the two C-type medium flow plates 32 are provided on the outer periphery of the other circumferential side surfaces of the housing chambers 11 except the intermediate partition plate 31.
In some embodiments, as shown in fig. 3 and 11, the C-type medium flow plate 32 is further provided with a heat conduction groove 320, and the heat conduction groove 320 is disposed on a side of the C-type medium flow plate 32 facing the heat dissipation channel 22. As shown in fig. 6, at least one heat conduction communication hole 221 is further formed on the channel wall of the heat dissipation channel 22, and the heat conduction communication hole 221 is communicated with the heat conduction groove 320 and the heat dissipation channel 22.
The side surface of the C-type medium flow plate 32 facing the heat dissipation channel 22 is bonded to the outer channel wall of the heat dissipation channel 22, and an air flow channel is formed between the heat conduction groove 320 and the outer channel wall of the heat dissipation channel 22. When the circulation fan 21 discharges the gas in the accommodating cavity 11 into the heat dissipation channel 22 for heat dissipation, and the gas after heat dissipation flows back to the accommodating cavity 11, the gas in the air flow channel enters the heat dissipation channel 22 at the same time, so that the heat dissipation or temperature rise effect is further improved.
The intermediate partition 31 is provided with an intermediate medium circulation flow passage 311 inside, and the intermediate medium circulation flow passage 311 may be C-shaped or S-shaped, and is specifically set according to actual needs, for example, according to the height of the intermediate partition, when the height is relatively low, the intermediate medium circulation flow passage 311 may be C-shaped, and when the height is relatively high, the intermediate medium circulation flow passage 311 may be S-shaped. The C-type medium circulation flow path 321 is also provided inside the C-type medium flow plate 32. The aforementioned bottom medium circulation module 40 is a bottom medium flow chamber provided on the bottom casing wall of the casing 11, and the C-type medium circulation flow path 321 and the bottom medium flow chamber communicate with each other. As shown in fig. 1, a first inlet 322 and a first outlet 323 are provided on the wall of the casing 10, the first inlet 322 is located below the first outlet 323, the first inlet 322 is connected to the C-shaped medium circulation flow path 321, and the first outlet 323 is connected to the bottom medium flow chamber. A second inlet 312 and a second outlet 313 communicating with the intermediate medium circulation flow path 311 are also provided on the wall of the casing 10. The top medium flow assembly 50 is a top medium flow chamber provided in the top shell wall of the shell 10, and a third inlet 51 and a third outlet 52 are provided in the top shell wall of the shell 10, which are in communication with the top medium flow chamber. The first inlet 422, the second inlet 312 and the third inlet 51 are communicated with a cold and hot medium supply mechanism, and cold medium or hot medium enters the C-shaped medium circulation flow channel 321 and the bottom medium flow cavity from the first inlet 422 to circulate, enters the intermediate medium circulation flow channel 311 from the second inlet 312 to circulate, and enters the top medium flow cavity from the third inlet 41 to circulate.
The first outlet 323, the second outlet 313, and the third outlet 52 allow the medium to flow back. In some embodiments, the medium is stored in the medium storage mechanism, the cold and hot medium supply mechanism pumps the cold medium or the hot medium in the medium storage mechanism to the first inlet 422, the second inlet 312, and the third inlet 51, and the returned medium is returned to the medium storage mechanism, where the cold medium or the hot medium after heat exchange is cooled or heated again. Of course, it is understood that the cold medium and the hot medium are stored in two different medium storage mechanisms, respectively.
As shown in fig. 12, the dotted line in the figure represents a structure which is hidden from external view, a plurality of C-type medium flow paths 321 are provided in the C-type medium flow plate 32, the C-type medium flow paths 321 are arranged side by side, an inlet path 324 and an outlet path 325 are further provided in the C-type medium flow plate 32, the inlet path 324 communicates with the inlet ends of all the C-type medium flow paths 321 and connects with the first inlet 322, and the outlet path 325 communicates with the outlet ends of all the C-type medium flow paths 321 and communicates with the bottom medium flow chamber.
The plurality of C-shaped medium flow channels 321 are provided to allow the cold medium or the heat medium to flow slowly at a uniform speed, thereby significantly improving the heat exchange effect.
In this embodiment, referring to fig. 7, a plurality of heat dissipation pillars 41 are further disposed in the bottom medium flowing cavity, and all the heat dissipation pillars 41 are uniformly distributed in the bottom medium flowing cavity, on one hand, a flow for medium flowing is formed between two adjacent heat dissipation pillars 41, so as to slow down the flow velocity of the medium, and on the other hand, the heat dissipation pillars 41 can effectively increase the area, so as to improve the heat exchange effect.
In some embodiments, referring to fig. 10, the heat dissipation structure 23 includes: the fixing plate 231 is formed in the same shape as the heat dissipation channel 22, for example, a ring-shaped fixing plate 231, and all the heat dissipation fins 232 are uniformly distributed on the fixing plate 231, so that the heat dissipation fins 232 can effectively increase the heat dissipation area and improve the heat dissipation effect.
It can be understood that at least the heat dissipation fins 232 are made of a metal material with a certain thermal conductivity, and particularly made of an aluminum alloy material, on one hand, the aluminum alloy is easy to obtain and low in cost, and can reduce the weight, and on the other hand, the aluminum alloy has an excellent thermal conductivity, and can achieve a better thermal conductivity effect.
In some embodiments, the heat dissipation channel 22 may surround the entire periphery of the circumferential cavity wall of the accommodating cavity 11 to form a heat dissipation channel in an annular shape, or the heat dissipation channel 22 may surround a part of the periphery of the circumferential cavity wall of the accommodating cavity 11 to form a heat dissipation channel in an approximately semi-annular shape or a C-shape, in which case, the heat dissipation channel 22 just covers the air outlet hole 111 and the air inlet hole 112.
In this embodiment, the casing is usually made of a metal material, and is particularly made of an aluminum alloy, so that on one hand, the aluminum alloy is easy to obtain and low in cost, and meanwhile, the weight can be reduced, and on the other hand, the aluminum alloy has excellent thermal conductivity and can achieve a good thermal conduction effect.
Referring to fig. 9, two top medium flow chambers 53 are provided on the top wall of the housing 10, respectively at the top of the two receiving chambers 11. As described with reference to fig. 7, two bottom medium flow chambers 42 are provided in the bottom wall of the housing 10, and the two bottom medium flow chambers 42 are located at the bottom of the two accommodating chambers 11, respectively.
With continued reference to fig. 9, a flow guiding structure is further provided in the top medium flow chamber 53 for guiding the cold medium or the hot medium in the direction from the third inlet 51 to the third outlet 52.
In this embodiment, a partition plate 54 is further provided in the top medium flow chamber 53, the partition plate 54 divides the top medium flow chamber into two top medium flow chambers 53, and a chamber communication hole 541 for communicating the two top medium flow modules is further provided in the partition plate. The third inlet 51 and the third outlet 52 are respectively communicated with the two top medium flow cavities 53, the two top medium flow cavities 53 are internally provided with the flow guide structures, and each flow guide structure comprises: and the guide plates 55 are arranged in the top medium flow cavity 53 in a mutually spaced and adjacent manner, and a guide channel 551 is formed between every two adjacent guide plates 55. The flow guide passage 551 of one top medium flow chamber 53 guides the cooling medium or the heating medium in the direction from the third inlet 51 to the chamber communication hole 551, and the flow guide passage 55 of the other top medium flow chamber 53 guides the cooling medium or the heating medium in the direction from the chamber communication hole 551 to the third outlet 52.
In some embodiments, the housing 10 is formed in a split structure to facilitate installation of the switching power supply 100 into the accommodating cavity 11. Specifically, the housing 10 includes: a bottom case 12 and a cover 13, the bottom case 12 is formed with a groove 121, in other words, the bottom case 12 is a groove structure. The cover 13 is sealed and fastened at the notch of the groove 121. Referring to fig. 1, 2, 5 and 6, a plurality of threaded holes 122 are formed along the top edge of the groove wall of the groove 121, a plurality of through holes 131 are formed in the cover 13, after the cover 13 is fastened to the notch of the groove 121 of the bottom case 12, the through holes 131 and the threaded holes 122 respectively correspond to each other one by one, and bolts pass through the through holes 131 and are screwed into the corresponding threaded holes 122, so that the cover 13 is detachably mounted on the bottom case 12.
The housing cover 13 forms the top wall of the housing 10, and the bottom of the bottom housing 11 forms the bottom wall of the housing 10. The groove 121 is provided with a first annular partition plate 123 and a second annular partition plate 124, the second annular partition plate 124 is arranged around the periphery of the first annular partition plate 123, the first annular partition plate 123 encloses a first space, the second annular partition plate 124 and the first annular partition plate 123 enclose a second space, the second annular partition plate 124 and the groove wall of the groove 121 enclose a third space, the first space and the cover 13 enclose the accommodating cavity 11, the second space and the cover 13 enclose the heat dissipation channel 22, and the lateral medium flowing assembly 30 is arranged in the space enclosed by the third space and the cover 13.
In one embodiment, to facilitate machining of the top media flow chamber in the housing cover 13, the housing cover 13 is also constructed in a split configuration, for example, the housing cover 13 is composed of a housing cover body and a cover plate, the housing cover body has a groove formed therein, and the cover plate covers and is positioned at the notch of the groove to form the top media flow chamber.
Of course, to facilitate the machining of the bottom housing wall of the housing 10 to form the bottom media flow chamber, the bottom housing wall is correspondingly formed with a bottom groove and a bottom cover plate is sealingly attached to the notch of the bottom groove to form the bottom media flow chamber.
In conclusion, the circulating fan generates suction force to enable the gas in the accommodating cavity to be discharged into the heat dissipation channel through the air outlet, the heat dissipation structure dissipates the heat of the gas entering the heat dissipation channel, the dissipated gas circularly flows back to the accommodating cavity through the air inlet, the lateral medium flowing component, the bottom medium flowing component and the top medium flowing component can exchange heat with the gas in the accommodating cavity, and the accommodating cavity in the high-temperature environment or the low-temperature environment can be maintained in a relatively constant-temperature state according to different selected media so as to reach or approach a rated temperature range required by the switching power supply, so that the constant-temperature working environment in the whole area and all weather can be adapted.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (10)
1. A thermostat system for a switching power supply, comprising:
the device comprises a shell, a first fixing piece and a second fixing piece, wherein an accommodating cavity is formed in the shell;
circulation radiator unit includes: the circulating fan, the heat dissipation channel arranged on the periphery of the circumferential cavity wall of the accommodating cavity and the heat dissipation structure arranged in the heat dissipation channel; the circumferential cavity wall of the accommodating cavity is provided with an air outlet hole and an air inlet hole which are communicated to the heat dissipation channel, and the circulating fan is installed at the hole of the air outlet hole and used for generating suction force so that the gas in the accommodating cavity is discharged into the heat dissipation channel through the air outlet hole and circularly flows back to the accommodating cavity through the air inlet hole; the heat dissipation structure is used for dissipating heat of the gas entering the heat dissipation channel;
a side medium flowing component arranged at the circumferential periphery of the heat dissipation channel and used for the circulation flow of a cold medium or a heat medium so as to exchange heat with the heat dissipated by the heat dissipation structure;
a bottom medium flow assembly provided in a bottom casing wall of the casing for circulating a cooling medium or a heating medium to exchange heat with the heat radiated downward in the accommodating chamber;
a top medium flow assembly disposed in the top shell wall of the housing for circulating a cooling medium or a heating medium to exchange heat radiating upward in the receiving cavity.
2. The thermostat system for a switching power supply according to claim 1, further comprising: the temperature detection module is arranged in the accommodating cavity, is connected with the circulating fan and is used for detecting the temperature in the accommodating cavity and comparing the temperature with a rated temperature to adjust the air volume of the circulating fan.
3. The thermostat system for a switching power supply according to claim 2, further comprising: a cold and hot medium supply mechanism for supplying cold medium or hot medium to the side medium flow assembly, the bottom medium flow assembly, and the top medium flow assembly, the cold medium including: a cooling liquid or a cooling gas, the thermal medium comprising: a thermal liquid or a thermal gas; the temperature detection module is also connected with the cold and hot medium supply mechanism and is used for comparing the temperature with a rated temperature and adjusting the supply quantity of the cold medium or the hot medium supplied by the cold and hot medium supply mechanism.
4. The thermostat system for a switching power supply according to claim 3, wherein two receiving chambers are provided in the housing, the side medium flow assembly comprising: the medium flow plate assembly comprises a middle partition plate and two C-shaped medium flow plates, wherein the middle partition plate is arranged between the two accommodating cavities, and the two C-shaped medium flow plates are arranged on the peripheries of the other circumferential side surfaces of the accommodating cavities except the periphery facing the middle partition plate; the middle partition plate is internally provided with a middle medium circulating flow channel, the C-shaped medium flow plate is internally provided with a C-shaped medium circulating flow channel, the bottom medium circulation assembly is a bottom medium flow cavity arranged on the wall of the bottom shell of the shell, and the bottom medium flow cavity is internally provided with a plurality of radiating columns; the C-shaped medium circulating flow channel is communicated with the bottom medium flow cavity; a first inlet and a first outlet are arranged on the shell wall of the shell, the first inlet is communicated to the C-shaped medium circulation flow channel, and the first outlet is communicated to the bottom medium flow cavity; the shell wall of the shell is also provided with a second inlet and a second outlet which are mutually communicated with the intermediate medium circulating flow channel; the top medium flow assembly is a top medium flow chamber arranged in the top shell wall of the shell, and the top shell wall of the shell is also provided with a third inlet and a third outlet which are communicated with the top medium flow chamber; the first inlet, the second inlet and the third inlet are communicated with the cold and hot medium supply mechanism.
5. The thermostat system for a switching power supply according to claim 4, wherein the C-type dielectric flow plate is further provided with a heat conduction groove, and the heat conduction groove is provided on a side of the C-type dielectric flow plate facing the heat dissipation channel; the channel wall of the heat dissipation channel is also provided with at least one heat conduction communication hole, and the heat conduction communication hole is communicated with the heat conduction groove and the heat dissipation channel.
6. The thermostat system for a switching power supply according to claim 4, wherein two top medium flow chambers are provided on the top wall of the housing, the two top medium flow chambers being located at the tops of the two accommodation chambers, respectively; two bottom medium flow cavities are arranged on the bottom shell wall of the shell; the two bottom medium flowing cavities are respectively positioned at the bottoms of the two containing cavities.
7. The thermostat system for a switching power supply according to claim 6, wherein a flow guide structure is further provided in the top medium flow chamber, the flow guide structure being configured to guide the cold medium or the hot medium in a direction from the third inlet to the third outlet.
8. The thermostat system for a switching power supply according to claim 7, wherein a partition plate is further provided in the top medium flow chamber, the partition plate dividing the top medium flow chamber into two top medium flow chambers, the partition plate being further provided with a communication hole for communicating the two top medium flow chambers; the third import with the third export respectively with two top medium flow chamber intercommunications each other, all be provided with in two top medium flow chambers the water conservancy diversion structure, the water conservancy diversion structure includes: the guide plates are spaced from each other and adjacent to each other in pairs, and a guide channel is formed between every two adjacent guide plates; the flow guide channel in one of the top medium flow cavities is used for guiding the cold medium or the heat medium in the direction from the third inlet to the chamber communication hole, and the flow guide channel in the other top medium flow cavity is used for guiding the cold medium or the heat medium in the direction from the chamber communication hole to the third outlet.
9. The thermostat system for a switching power supply according to claim 1, wherein the housing includes: the bottom shell is provided with a groove, and the shell cover is arranged at the notch of the groove; the housing cover is formed as a top wall of the housing and the bottom of the bottom housing is formed as a bottom wall of the housing; be equipped with first annular baffle and second annular baffle in the recess, second annular baffle encloses to be established the circumference of first annular baffle is peripheral, first annular baffle encloses synthetic first space, second annular baffle with first annular baffle encloses synthetic second space, second annular baffle with enclose synthetic third space between the cell wall of recess, first space with the cap encloses synthetic the chamber of holding, the second space with the cap encloses synthetic heat dissipation channel, lateral part medium flow subassembly sets up the third space with the cap encloses synthetic space.
10. The thermostat system for a switching power supply according to claim 1,
the constant temperature system is provided with an internal circulation working mode, an external circulation working mode and a mixed working mode;
in the internal circulation working mode, the circulation fan generates suction force to enable the gas in the accommodating cavity to be discharged into the heat dissipation channel through the gas outlet hole and circularly flow back to the accommodating cavity through the gas inlet hole; the gas discharged into the heat dissipation channel is dissipated through the heat dissipation structure;
in the external circulation working mode, when the external environment temperature is higher than the rated temperature, the bottom medium flowing assembly circulates and flows cold medium to exchange heat with the heat radiated downwards in the accommodating cavity, and the top medium flowing assembly circulates and flows cold medium to exchange heat with the heat radiated upwards in the accommodating cavity; when the external environment temperature is lower than the rated temperature, the heat medium flows in the bottom medium flowing assembly in a circulating mode so as to exchange heat with the heat radiated downwards by the accommodating cavity; a heat medium is circulated in the top medium flow assembly to exchange heat with the heat radiated upward in the receiving chamber;
in the hybrid working mode, when the external environment temperature is higher than the rated temperature, the circulating fan generates suction force to enable the gas in the accommodating cavity to be discharged into the heat dissipation channel through the gas outlet hole and to circularly flow back to the accommodating cavity through the gas inlet hole, the gas discharged into the heat dissipation channel is dissipated through the heat dissipation structure, the cold medium circularly flows in the bottom medium flowing component to exchange heat with the heat radiated downwards by the accommodating cavity, and the cold medium circularly flows in the top medium flowing component to exchange heat with the heat radiated upwards in the accommodating cavity; when the external environment temperature is lower than the rated temperature, the circulating fan generates suction force to enable the gas in the accommodating cavity to be discharged into the heat dissipation channel through the gas outlet, the heat medium flows in the lateral medium flowing assembly in a circulating mode to exchange heat with the gas in the heat dissipation channel, so that the temperature of the gas is increased, the gas with the increased temperature flows back to the accommodating cavity in a circulating mode through the gas inlet, the heat medium flows in the bottom medium flowing assembly in a circulating mode to exchange heat with the heat radiated downwards by the accommodating cavity, and the heat medium flows in the top medium flowing assembly in a circulating mode to exchange heat with the heat radiated upwards in the accommodating cavity.
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| CN116519165A (en) * | 2023-07-03 | 2023-08-01 | 中建三局集团华南有限公司 | Overheat detection alarm device for switching power supply |
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| CN113260238B (en) | 2021-12-10 |
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