CN113253396A - 光模块装置制造方法以及光模块装置 - Google Patents

光模块装置制造方法以及光模块装置 Download PDF

Info

Publication number
CN113253396A
CN113253396A CN201911406265.0A CN201911406265A CN113253396A CN 113253396 A CN113253396 A CN 113253396A CN 201911406265 A CN201911406265 A CN 201911406265A CN 113253396 A CN113253396 A CN 113253396A
Authority
CN
China
Prior art keywords
optical module
substrate
electronic component
component mounting
active device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911406265.0A
Other languages
English (en)
Inventor
郑汉标
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xunyun Electronic Technology Zhongshan Co ltd
Original Assignee
Xunyun Electronic Technology Zhongshan Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xunyun Electronic Technology Zhongshan Co ltd filed Critical Xunyun Electronic Technology Zhongshan Co ltd
Priority to CN201911406265.0A priority Critical patent/CN113253396A/zh
Priority to TW109106612A priority patent/TWI752425B/zh
Priority to US16/855,204 priority patent/US11051394B1/en
Publication of CN113253396A publication Critical patent/CN113253396A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0425—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using optical fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0204—Compact construction
    • G01J1/0209—Monolithic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02016—Circuit arrangements of general character for the devices
    • H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4446—Type of detector
    • G01J2001/446—Photodiode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J2001/4446—Type of detector
    • G01J2001/446—Photodiode
    • G01J2001/4466—Avalanche
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)

Abstract

一种光模块装置制造方法以及光模块装置。光模块装置包括基板印刷电路电子元件安装部有源器件以及透鏡。印刷电路形成于基板；电子元件安装部，设置于基板，电子元件安装部包括凹槽；有源器件包括激光器或光探测器，设置于凹槽。透鏡设置于有源器件上。本申请使用了开槽的衬垫结构，用以容置容易发热的有源器件，再利用导热胶填充有源器件与凹槽之间的间隙，有效提高导热的效能。

Description

光模块装置制造方法以及光模块装置
技术领域
本申请有关于一种光纤通信技术领域，尤指一种能够提供更好导热性能的光模块装置制造方法以及光模块装置。
背景技术
光纤通讯网路具有低传输损失、高数据保密性、优秀的抗干扰性，以及超大频宽等特性，已是现代主要的资讯通讯方式，其中，用于接受来自光纤网路的光讯号并将其转换成电讯号传输，及/或将电讯号转换成光讯号再藉由光纤网路向外传输的光收发器(OpticalTransceiver)是光纤通讯技术中最重要的基础元件之一。
光收发器中的光模块装置具有激光器以提供光源，然而，激光器在工作过程中会产生大量的热，而电路板的导热性能很弱，无法满足散热要求。
发明内容
有鉴于此，在本申请一实施例中，使用了开槽的衬垫结构來容置容易发热的有源器件以解決散热的問題。
本申请一实施例揭露一种光模块装置，包括：基板；印刷电路，形成于上述基板；电子元件安装部，设置于上述基板，其中上述电子元件安装部包括凹槽；有源器件，包括激光器或光探测器，设置于上述凹槽；以及透鏡，设置于上述有源器件上。
本申请另一实施例揭露一种光模块装置制造方法，包括：提供基板；形成印刷电路于上述基板；提供电子元件安装部，其中上述电子元件安装部包括凹槽；设置有源器件于上述凹槽，其中上述有源器件包括激光器或光探测器；设置透鏡于上述有源器件上；以及将具有上述有源器件的上述电子元件安装部与上述基板结合。
根据本申请一实施例，光模块装置更包括外壳；以及导热片，设置于上述电子元件安装部与上述外壳之间。
根据本申请一实施例，其中上述有源器件在上述凹槽中时，上述有源器件的顶部与上述凹槽的顶部齐平。
根据本申请一实施例，光模块装置更包括监控器与放大器，设置于上述基板，并透过印刷电路电性连接。
上述有源器件更包括监控器与放大器，上述有源器件之间透过印刷电路电性连接。
根据本申请一实施例，其中上述有源器件与上述凹槽之间的间隙以导热胶填充。
根据本申请一实施例，其中上述电子元件安装部为金属衬垫。
根据本申请实施例，使用了金属衬垫结构，相较于传统陶瓷衬垫，具有更好的导热效率，另外，使用了开槽的金属衬垫结构来容置容易发热的有源器件，再利用导热胶填充有源器件与凹槽之间的间隙，更能提高导热的效能。本申请实施例使用金属衬垫结构另一个优点为能够提供有源器件电磁干扰屏蔽作用，改善了电子元件操作的稳定度。另外，装配电子元件的基板与装配有源器件的电子元件安装部的封装可分开进行，形成模块化生产，有效提高组装的效率。
附图说明
图1显示根据本申请一实施例所述的光模块装置的立体图。
图2显示根据本申请一实施例所述的光模块装置的侧视图。
图3显示根据本申请另一实施例所述的光模块装置的立体图。
图4显示根据本申请一实施例所述的电子元件安装部的爆炸图。
图5显示根据本申请另一实施例所述的光模块装置的爆炸图。
图6显示根据本申请一实施例所述的光模块装置的制造方法的操作流程图。
主要元件符号说明
光模块装置 10
基板 12
印刷电路 14
有源器件 16、24A、24B
透鏡 18
电路元件 19
电子元件安装部 20
凹槽 22A、22B
外壳 30
导热片 32
步骤流程 S11-S18
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
为了便于本领域普通技术人员理解和实施本申请，下面结合附图与实施例对本申请进一步的详细描述，应当理解，本申请提供许多可供应用的发明概念，其可以多种特定型式实施。熟悉此技艺之人士可利用这些实施例或其他实施例所描述的细节及其他可以利用的结构，逻辑和电性变化，在没有离开本发明的精神与范围之下以实施发明。
本申请说明书提供不同的实施例来说明本申请不同实施方式的技术特征。其中，实施例中的各元件的配置是为说明之用，并非用以限制本发明。且实施例中图式标号的部分重复，是为了简化说明，并非意指不同实施例之间的关联性。其中，图示和说明书中使用的相同的元件编号表示相同或类似的元件。本说明书的图示为简化的形式且并未以精确比例绘制。为清楚和方便说明起见，方向性用语(例如顶、底、上、下以及对角)是针对伴随的图示说明。而以下说明所使用的方向性用语在没有明确使用在以下所附的申请专利范围时，并非用来限制本发明的范围。
再者，在说明本申请一些实施例中，说明书以特定步骤顺序说明本申请的方法以及(或)程序。然而，由于方法以及程序并未必然根据所述的特定步骤顺序实施，因此并未受限于所述的特定步骤顺序。熟习此项技艺者可知其他顺序也为可能的实施方式。因此，于说明书所述的特定步骤顺序并未用来限定申请专利范围。再者，本申请针对方法以及(或)程序的申请专利范围并未受限于其撰写的执行步骤顺序，且熟习此项技艺者可了解调整执行步骤顺序并未跳脱本发明的精神以及范围。
图1显示根据本申请一实施例所述的光模块装置的立体图。图2显示根据本申请一实施例所述的光模块装置的侧视图。根据本申请一实施例所述的光模块装置10，包括基板12，印刷电路14，电子元件安装部20(component mounting block，CMB)，有源器件16以及其他电路元件19。根据本申请一实施例，电路元件19可包括例如监控器、激光控制器与放大器等电子元件。为了方便说明，在图1与图2中并未显示透镜、导热片以及外壳。根据本申请一实施例，基板12可用不同的材料制作，如硅、高分子和陶瓷材料制作。基板12上具有预先设计的内连线结构、透过网版印刷方式形成的印刷电路14以及相关电子元件，电子元件安装部20同样设置于基板10。印刷电路14包括用来实施光信号发射或接收功能所必要的电路元件，此为本领域技术人员所熟知，在此不予赘述以精简说明。
图3显示根据本申请另一实施例所述的光模块装置的立体图。在图3中，加入了透镜18。透鏡18设置于图1中的有源器件16上。根据本申请一实施例，透鏡18为聚光透镜，激光器所发射的光束经由聚光透镜汇聚后耦合(Coupling)到光纤，然后藉由光纤传输至其他光接收器(图未显示)。根据本申请其他实施例，透鏡18还可视需要增加准直透镜，用来调整光束的方向，例如转换成平行光束。
图4显示根据本申请一实施例所述的电子元件安装部的爆炸图。根据本申请一实施例，电子元件安装部20整体为L型，可為为金属衬垫。电子元件安装部20包括凹槽22A、22B。有源器件24A、24B分别透過胶水或黏着层附着至凹槽22A、22B底部。根据本申请一实施例，胶水或黏着层可包括聚酰亚胺(Polyimide，PI)、聚乙烯对苯二甲酸酯(PolyethyleneTerephthalate，PET)、铁氟龙(Teflon)、液晶高分子(Liquid Crystal Polymer，LCP)、聚乙烯(Polyethylene，PE)、聚丙烯(Polypropylene，PP)、聚苯乙烯(Polystyrene，PS)、聚氯乙烯(Polyvinyl Chloride，PVC)、尼龙(Nylon或Polyamides)、聚甲基丙烯酸甲酯(Polymethylmethacrylate，PMMA)、ABS塑胶(Acrylonitrile-Butadiene-Styrene)、酚树脂(Phenolic Resins)、环氧树脂(Epoxy)、聚酯(Polyester)、硅胶(Silicone)、聚氨基甲酸乙酯(Polyurethane，PU)、聚酰胺-酰亚胺(polyamide-imide，PAI)或其组合，但不限于此，只要具有黏着特性的材料皆可应用于本申请。
如图4所示，以有源器件24A为例，当有源器件24A设置于凹槽22A中时，有源器件24A的顶部可与凹槽22A的顶部齐平。根据本申请实施例，有源器件24A可为激光器，有源器件24B可为光探测器。有源器件之间透过钢网以及印刷工艺所形成的印刷电路(图未显示)电性连接。激光器为光源。在光通讯系统中，通常使用发光二极体或雷射二极体作为光源。根据本申请一实施例，激光器可包括单个或多个垂直腔面发射雷射二极体(VerticalCavity Surface Emitting Laser Diode，VCSEL)，或称面射型雷射二极体，多个VCSEL构成阵列，并由驱动晶片驱动而发射光讯号。在其他实施例中，亦可使用其他可作为光源的元件，例如发光二极体、边射型雷射二极体(Edge Emitting Laser Diode，EELD)或分散式反馈雷射器(Distributed Feedback Laser，DFB)。另外，如图4所示，有源器件24A与凹槽22A之间的间隙以导热胶填充。同样的，有源器件24B与凹槽22B之间的间隙也以导热胶填充。根据本申请一实施例，导热胶可以是银胶或锡膏，光探测器可为PIN光二极体或雪崩式光电二极体(Avalance Photodiode，APD)，用以将由透鏡18所耦合的光束转换成电讯号。
当有源器件24A、24B以及透鏡18安装于电子元件安装部20后，再将电子元件安装部20组装于基板12，电子元件安装部20上的有源器件24A、24B透过打线接合(Wirebonding)程序电性连接至基板12上的印刷电路14。
图5显示根据本申请另一实施例所述的光模块装置的爆炸图。根据本申请一实施例，电子元件安装部20还可透过导热片32与光模块装置的外壳30接触，以将有源器件24A、24B所产生的热传导至光模块装置的外壳，藉以提高散热的效能。
图6显示根据本申请一实施例所述的光模块装置的制造方法的操作流程图。参阅图1-5，首先透过表面黏著技術(surface-mount technology，SMT)将相关电子元件(surface-mount devices，SMD)(例如電阻、電容、電晶體、積體電路等)安装于基板12(步骤S11)，并在基板12透过网版印刷方式形成印刷电路14以电性连接相关电子元件(步骤S12)。在其他实施例中，也可搭配通孔插裝技術(Through-hole technology)将相关电子元件安装于基板12。基板12可用不同的材料制作，如硅、高分子和陶瓷材料制作。基板12上具有透过网版印刷方式形成的印刷电路14以及相关电子元件。
接下来，将有源器件24A、24B分别透過胶水或黏着层附着至电子元件安装部20的凹槽22A、22B底部(步骤S13)，根据本申请一实施例，电子元件安装部20可為为金属衬垫，胶水或黏着层可包括聚酰亚胺(Polyimide，PI)、聚乙烯对苯二甲酸酯(PolyethyleneTerephthalate，PET)、铁氟龙(Teflon)、液晶高分子(Liquid Crystal Polymer，LCP)、聚乙烯(Polyethylene，PE)、聚丙烯(Polypropylene，PP)、聚苯乙烯(Polystyrene，PS)、聚氯乙烯(Polyvinyl Chloride，PVC)、尼龙(Nylon or Polyamides)、聚甲基丙烯酸甲酯(Polymethylmethacrylate，PMMA)、ABS塑胶(Acrylonitrile-Butadiene-Styrene)、酚树脂(Phenolic Resins)、环氧树脂(Epoxy)、聚酯(Polyester)、硅胶(Silicone)、聚氨基甲酸乙酯(Polyurethane，PU)、聚酰胺-酰亚胺(polyamide-imide，PAI)或其组合，但不限于此，只要具有黏着特性的材料皆可应用于本申请。在步骤S13中，尚包括烘烤以及在有源器件24A与凹槽22A之间，有源器件24B与凹槽22B之间的间隙以导热胶填充的步骤。
接下來，在电子元件安装部20執行钢网以及印刷工艺以形成印刷电路(步骤S14)，印刷电路可以将有源器件间的电路导通。接下来，将透鏡18置于有源器件24A、24B上方(步骤S15)，在步骤S15中，尚包括光学对准程序，首先可在基板12上设置定位部以协助有源器件24A(激光器)与透镜18的初步对准，此时可涂布UV胶于透镜18与基板12之间，为了提高定位的精确度，可透过电荷耦合元件(Charge Coupled Device，CCD)摄影机对位，待透镜18定位完成后，对UV胶照射紫外光以固化UV胶。透过光学对准程序将光学镜片耦合在有源器件24A(激光器)和有源器件24B(光探测器)上，可完成一个完整的光路。
接下来，将组装好有源器件24A、24B以及透镜18的电子元件安装部20安装于基板12(步骤S16)，并透过打线接合(Wire bonding)程序使得电子元件安装部20上的有源器件24A、24B电性连接至基板12上的印刷电路14(步骤S17)，最后，将基板12安装至外壳30，其中，导热片32设置于电子元件安装部20与外壳30之间，完成本申请一实施例所述的光模块装置。必须说明的是，步骤S11-S12以及步骤S13-S15的顺序并非固定，熟习此项技艺者可先行完成步骤S11-S12，再执行步骤S13-S15，也可以先行完成步骤S13-S15，再执行步骤S11-S12，最后再执行步骤S16-18以完成本申请一实施例所述的光模块装置。
根据本申请实施例，使用了金属衬垫结构，相较于传统陶瓷衬垫，具有更好的导热效率，另外，使用了开槽的金属衬垫结构来容置容易发热的有源器件，再利用导热胶填充有源器件与凹槽之间的间隙，更能提高导热的效能。本申请实施例使用金属衬垫结构另一个优点为能够提供有源器件电磁干扰屏蔽作用，改善了电子元件操作的稳定度。另外，装配电子元件的基板与装配有源器件的电子元件安装部的封装可分开进行，形成模块化生产，有效提高组装的效率。
对本领域的普通技术人员来说，可以根据本申请的发明方案和发明构思结合生成的实际需要做出其他相应的改变或调整，而这些改变和调整都应属于本发明权利要求的保护范围。

Claims (10)

1.一种光模块装置，其特征在于，包括：
基板；
印刷电路，形成于上述基板；
电子元件安装部，设置于上述基板，其中上述电子元件安装部包括凹槽；
有源器件，包括激光器或光探测器，设置于上述凹槽；以及
透鏡，设置于上述有源器件上。
2.如权利要求1所述的光模块装置，其特征在于，更包括:
外壳；以及
导热片，设置于上述电子元件安装部与上述外壳之间。
3.如权利要求1所述的光模块装置，其特征在于，更包括监控器与放大器，设置于上述基板，并透过上述印刷电路电性连接。
4.如权利要求1所述的光模块装置，其特征在于，上述有源器件与上述凹槽之间的间隙以导热胶填充。
5.如权利要求1所述的光模块装置，其特征在于，上述电子元件安装部为金属衬垫。
6.一种光模块装置制造方法，其特征在于，包括：
提供基板；
形成印刷电路于上述基板；
提供电子元件安装部，其中上述电子元件安装部包括凹槽；
设置有源器件于上述凹槽，其中上述有源器件包括激光器或光探测器；
设置透鏡于上述有源器件上；以及
将具有上述有源器件的上述电子元件安装部与上述基板结合。
7.如权利要求6所述的光模块装置制造方法，其特征在于，更包括:
提供外壳；以及
设置导热片于上述电子元件安装部与上述外壳之间。
8.如权利要求6所述的光模块装置制造方法，其特征在于，更包括监控器与放大器，设置于上述基板，并透过上述印刷电路电性连接。
9.如权利要求6所述的光模块装置制造方法，其特征在于，上述有源器件与上述凹槽之间的间隙以导热胶填充。
10.如权利要求6所述的光模块装置制造方法，其特征在于，上述电子元件安装部为金属衬垫。
CN201911406265.0A 2019-12-31 2019-12-31 光模块装置制造方法以及光模块装置 Pending CN113253396A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201911406265.0A CN113253396A (zh) 2019-12-31 2019-12-31 光模块装置制造方法以及光模块装置
TW109106612A TWI752425B (zh) 2019-12-31 2020-02-27 光模塊裝置以及光模塊裝置製造方法
US16/855,204 US11051394B1 (en) 2019-12-31 2020-04-22 Optical module and method of manufacturing optical module comprising an optical active device disposed in the recess of a component mounting block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911406265.0A CN113253396A (zh) 2019-12-31 2019-12-31 光模块装置制造方法以及光模块装置

Publications (1)

Publication Number Publication Date
CN113253396A true CN113253396A (zh) 2021-08-13

Family

ID=76547712

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911406265.0A Pending CN113253396A (zh) 2019-12-31 2019-12-31 光模块装置制造方法以及光模块装置

Country Status (3)

Country Link
US (1) US11051394B1 (zh)
CN (1) CN113253396A (zh)
TW (1) TWI752425B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI790151B (zh) * 2022-03-30 2023-01-11 西柏科技股份有限公司 導光部件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579376A (zh) * 2012-08-08 2014-02-12 安华高科技通用Ip(新加坡)公司 具有倒装芯片衬底安装的光电子系统
CN204331096U (zh) * 2014-12-31 2015-05-13 中航海信光电技术有限公司 一种并行光组件
CN104965267A (zh) * 2015-07-13 2015-10-07 青岛海信宽带多媒体技术有限公司 光模块
US20160109664A1 (en) * 2014-10-16 2016-04-21 Foxconn Interconnect Technology Limited Optical module assembly with improved printed circuit board
CN107907947A (zh) * 2017-12-18 2018-04-13 江苏奥雷光电有限公司 一种cxp模块结构
CN207908746U (zh) * 2018-02-23 2018-09-25 武汉亿思源光电技术有限公司 一种光模块电路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299362B1 (en) * 1998-04-22 2001-10-09 Stratos Lightwave, Inc. High speed optical interface converter module having mounting halves
CN103984066B (zh) * 2014-05-20 2016-08-24 昆山柯斯美光电有限公司 用于高速传输的多路并行光组件及其组装方法
TW201613068A (en) 2014-09-17 2016-04-01 Cheering Sun Applied Materials Co Ltd Multi-die substrate-less LED device
JP6631138B2 (ja) * 2015-10-01 2020-01-15 住友電気工業株式会社 光学装置、プリント回路基板
TWI583086B (zh) 2016-07-18 2017-05-11 華星光通科技股份有限公司 光發射器散熱結構及包含其的光發射器
JP7176842B2 (ja) * 2017-12-12 2022-11-22 日東電工株式会社 光電気混載基板
CN208937754U (zh) * 2018-10-11 2019-06-04 深圳市光为光通信科技有限公司 一种军工多路并行光模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579376A (zh) * 2012-08-08 2014-02-12 安华高科技通用Ip(新加坡)公司 具有倒装芯片衬底安装的光电子系统
US20160109664A1 (en) * 2014-10-16 2016-04-21 Foxconn Interconnect Technology Limited Optical module assembly with improved printed circuit board
CN204331096U (zh) * 2014-12-31 2015-05-13 中航海信光电技术有限公司 一种并行光组件
CN104965267A (zh) * 2015-07-13 2015-10-07 青岛海信宽带多媒体技术有限公司 光模块
CN107907947A (zh) * 2017-12-18 2018-04-13 江苏奥雷光电有限公司 一种cxp模块结构
CN207908746U (zh) * 2018-02-23 2018-09-25 武汉亿思源光电技术有限公司 一种光模块电路板

Also Published As

Publication number Publication date
US11051394B1 (en) 2021-06-29
US20210204391A1 (en) 2021-07-01
TWI752425B (zh) 2022-01-11
TW202127080A (zh) 2021-07-16

Similar Documents

Publication Publication Date Title
US9709760B2 (en) Chip on flex optical subassembly
US9647762B2 (en) Integrated parallel optical transceiver
EP3121630B1 (en) Optoelectronic module with improved heat management
EP1482339A1 (en) Optical module, method of manufacturing the same, optical communication device and electronic device using the same
US7306377B2 (en) Integrated optical sub-assembly having epoxy chip package
US7103249B2 (en) Optical module and manufacturing method of the same, optical-communication apparatus, and electronic apparatus
US9103999B2 (en) Optical data communication module having EMI cage
US11415764B2 (en) Optical module
JP2009253166A (ja) 光通信モジュール
US20170052336A1 (en) Optoelectronic module and method of producing same
KR100734906B1 (ko) 연성 광 ｐｃｂ를 이용한 광연결 장치
US10295768B2 (en) Chip on leadframe optical subassembly
TW202045968A (zh) 光發射模組、光通訊模組以及光通訊模組製造方法
CN113253396A (zh) 光模块装置制造方法以及光模块装置
KR20030063235A (ko) 섬유 광학 엔진 제조 방법
WO2007091733A2 (en) Photoelectric converting device, manufacturing method of the same, and external waveguide
KR20080049881A (ko) 평판 디스플레이용 연성 광 접속 모듈 및 그 제조 방법
CN113267852A (zh) 光模块装置制造方法以及光模块装置
CN113703103B (zh) 光发射次模块（tosa）结构及其主动对准方法
JP2008145931A (ja) 光電気複合配線
US20170354026A1 (en) Flex-less multilayer ceramic substrate
JP2005284167A (ja) 光通信モジュール
CN217587687U (zh) 光模块
JP2007035697A (ja) 光電気変換モジュール
CN115980939A (zh) 光通讯模组结构及其制作方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210813

WD01 Invention patent application deemed withdrawn after publication