CN113238456A - 一种采用具厚度变化的可挠式模仁的压印方法 - Google Patents

一种采用具厚度变化的可挠式模仁的压印方法 Download PDF

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CN113238456A
CN113238456A CN202110555887.0A CN202110555887A CN113238456A CN 113238456 A CN113238456 A CN 113238456A CN 202110555887 A CN202110555887 A CN 202110555887A CN 113238456 A CN113238456 A CN 113238456A
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mold core
imprinting
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substrate
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李永春
蔡宜君
吴俊颖
苏暐翔
黄少宣
卢科全
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Abstract

本发明公开了一种采用具厚度变化的可挠式模仁的压印方法，采用一底部具奈米压印的微结构的模仁本体，且该模仁本体的厚度是自其周缘向中间逐渐增厚，本压印方法使得具厚度变化的可挠式模仁受一力量或位移时，会产生较大的压缩量，造成该模仁本体底部的微结构与受压印的物件产生较大的接触压力，并透过模仁本体的厚度差异，而于脱模时控制模仁本体的变形量，以改善过去因拔模角度过大或急遽的压力释放造成的缺陷问题。

Description

一种采用具厚度变化的可挠式模仁的压印方法
本发明是分案申请，原申请的申请日为“2017年08月11日”，申请号为“201710684792.2”，发明创造名称为“具厚度变化的可挠式模仁”。
技术领域
本发明属于纳米压印技术领域，尤指一种可以精确控制压力分布的压印机制与机构，以掌控压印过程中高分子阻剂胶层的流动方式，进而确保大面积下高分子残留层的厚度与均匀性的采用具厚度变化的可挠式模仁的压印方法。
背景技术
奈米压印(Nano-Imprinting)技术的发展已有20年的历史，在国、内外的学术界与产业界都产生一定的冲击与影响，许多新的方法、技术、材料、机台、甚至专业厂商都陆续出现，并积极寻求可能的产业应用。平心而论，奈米压印技术仍然存在许多重大的技术瓶颈，有待学术界与产业界共同突破；举其大者而言，包括：(1).压印模仁的制作方式、成本、与使用寿命；(2).大面积下压印残留层厚度与均匀性的控制；(3).重复或多层对位的精度控制；(4).整体制程良率与成本的竞争力…等等。
奈米压印技术的核心概念，是以简单的机械与力学原理，取代复杂的光学微影技术，复制出大面积与小特征尺度的微/奈米结构。它的核心技术是：接触、施压、成型、脱模，其中可能伴随着高分子材料对温度与光的物理与化学变化。奈米压印的挑战在于必须以机械的方式同时兼顾两个极端的尺度：大尺度(4”、6”、8”)的成型面积、与小线宽(μm,sub-μm,and nm)的结构特征。虽然目前已经有许多种类的奈米压印技术，但是大部分技术的共同基本特征是要将一高分子材料均匀地成型于一片模仁(mold)与一片基板(substrate)之间；成型后的高分子层须能忠实复制模仁表面的微/奈米结构，且其压印面积内的残留层(residual layer)厚度必须小于一定要求，例如10～100nm。
检视学术界与产业界现有的奈米压印机台设计与压印技术，令人惊讶的是在施压过程中均缺乏精准的力学控制，例如施压过程中是平均施压于模仁上，使得模仁与基板间的接触压力平均；另外在脱模过程中，常常会因急遽的压力释放造成的缺陷问题，造成微结构断裂的状况。
因此现有的奈米压印机台设计与压印技术对高分子阻剂胶层的成型过程，与对最终残留层的控制能力都非常有限与薄弱；这可能是奈米压印技术与其产业应用上最关键的技术瓶颈之一。
发明内容
为解决上述现有技术的问题，本发明的一目的是在于提供一种可在奈米压印过程中提供高精准的力学控制，以精准地传递与分布到受压的高分子层状材料的采用具厚度变化的可挠式模仁的压印方法。
为解决上述现有技术的问题，本发明的另一目的是在于提供一种可以吸收基板的不平整性、均匀地分布压力、并可控制地驱动高分子层流动的采用具厚度变化的可挠式模仁的压印方法。
为达成上述的目的，本发明采用如下技术方案:
一种采用具厚度变化的可挠式模仁的压印方法，该可扰式模仁包括一模仁本体，该模仁本体的厚度是自该模仁本体的周缘向该模仁本体中间逐渐变化，且该模仁本体的底面具有奈米压印的微结构；
该压印方法为于该模仁本体上表面以一硬质背板施加一力量或位移，使得该模仁本体的压印面变形凸出，压印面中心区域与基板上的阻剂胶接触，通过进一步缩短硬质背板与基板间的相对距离，基于该模仁本体中心有较厚的厚度，受到硬质背板与基板挤压时会产生较大的压缩量，造成该模仁本体的压印面与基板间有较大的接触压力，迫使阻剂胶充填微结构模穴，并将多余的阻剂胶挤压向外围流动至基板边缘。
其中，该模仁本体是以热固性硅胶材料、光固化性硅胶材料、橡胶材料、塑料材料浇铸成型。
为达成上述的目的，本发明还提供另一技术方案：
一种采用具厚度变化的可挠式模仁的压印方法，其特征在于，该可挠式模仁包括：一模仁本体，该模仁本体包含：
一压印模仁，该压印模仁下表面具有奈米压印的微结构；
一软性模仁，该软性模仁是为一自周缘向中间逐渐变化的弹性体，该软性模仁是用以自该压印模仁上表面向该压印模仁施压；
该压印方法为将软性模仁与硬质背板结合，并施加位移或力量于压印模仁，使得该压印模仁的压印面变形凸出，压印面中心区域与基板上的阻剂胶接触，进一步缩短硬质背板与基板间的相对距离，基于该软性模仁中心有较厚的厚度，使压印模仁受压时会产生较大的压缩量，造成压印模仁的压印面与基板间有较大的接触压力，迫使阻剂胶充填微结构模穴，并将多余的阻剂胶5挤压向外围流动至基板边缘。
其中，该软性模仁及该压印模仁是以热固性硅胶材料、光固化性硅胶材料、橡胶材料、塑料材料浇铸成型。
其中，该软性模仁的厚度是自该软性模仁的周缘向该软性模仁中间下方逐渐增厚。
采用上述技术方案，本发明具有以下的特点与功效：
1.本发明通过模仁本体的厚度差异，在压印过程中变形时产生不同的应力与应变，于模仁本体与基板间形成中央强、周围弱的接触压力分布，迫使阻剂胶自基板中央往外流动，达到均匀涂布的目的，解决传统旋转涂布浪费胶材的缺点。
2.本发明透过模仁本体的厚度差异，可在压印过程中透过施加位移或力量于模仁本体时，控制模仁本体的变形量，进而达成在压印过程中的接触压力控制，达到压印结果的微结构高度均匀，底层残余厚度最小的目的。
3.本发明透过模仁本体的厚度差异，而于脱模时控制模仁本体的变形量，以改善过去因拔模角度过大或急遽的压力释放造成的缺陷问题。
附图说明
图1为本发明具厚度变化的可挠式模仁的侧面示意图；
图2为本发明具厚度变化的可挠式模仁的使用状态示意图(一)；
图3为本发明具厚度变化的可挠式模仁的使用状态示意图(二)；
图4为本发明具厚度变化的可挠式模仁的使用状态示意图(三)；
图5为本发明具厚度变化的可挠式模仁另一实施例的侧面示意图；
图6为本发明具厚度变化的可挠式模仁另一实施例的使用状态示意图(一)；
图7为本发明具厚度变化的可挠式模仁另一实施例的使用状态示意图(二)。
符号说明
1模仁本体
11压印面
12压印模仁
13软性模仁
2金属环
3硬质背板
4基板
5阻剂胶
具体实施方式
以下将描述具体的实施例以说明本创作的实施态样，惟其并非用以限制本发明所欲保护的范畴。
请参阅图1～4，是为本发明具厚度变化的可挠性模仁的第一实施例，本实施例中，本发明具厚度变化的可挠性模仁的模仁本体1是将一具微结构的硅晶圆模具(图中未示)以及一具曲面的不锈钢模具(图中未示)结合，以热固性硅胶材料浇铸成型方式所制作而成，该模仁本体1的底面为具有奈米压印的微结构的压印面11，该模仁本体1的厚度是自该模仁本体1的周缘向该模仁本体中间上方逐渐增厚。
本发明具厚度变化的可挠性模的模仁本体1周缘主要是以一金属环2夹持固定，接着于模仁本体1上表面以一硬质背板3施加一力量或位移，使得该模仁本体1的压印面11变形凸出，压印面11中心区域与基板4上的阻剂胶5接触。接着进一步缩短硬质背板与基板间的相对距离，由于该模仁本体1中心有较厚的厚度，受到硬质背板3与基板4挤压时会产生较大的压缩量，造成该模仁本体1的压印面11与基板4间有较大的接触压力，迫使阻剂胶5充填微结构模穴，并将多余的阻剂胶5挤压向外围流动至基板4边缘。
在压印过程中，通过硬质背板3与基板4接近的速度与位移量，达到控制接触压力分布的效果。接着以紫外光照射或加热方式使阻剂胶5固化，完成微结构奈米压印成型流程。最后，通过脱模过程中控制硬质背板3与基板4远离的速度与位移量，达到控制拔模角度与分离速度，可有效避免习知技术脱模时，因力量急遽释放造成微结构断裂产生的缺陷。
请参阅图5～7，是为本发明具厚度变化的可挠性模仁的第二实施例，本实施例中，本发明具厚度变化的可挠性模仁的模仁本体1包含一压印模仁12及一软性模仁13，该压印模仁12下表面为具有奈米压印的微结构的压印面11，该软性模仁13是为一自周缘向中间逐渐增厚的弹性体，该软性模仁13的厚度是自该软性模仁13的周缘向该软性模仁13中间下方逐渐增厚。
本实施例主要是以金属环2夹持固定该压印模仁12的周缘，接着将软性模仁13与硬质背板3结合，并施加位移或力量于压印模仁12，使得该压印模仁12的压印面11变形凸出，压印面11中心区域与基板4上的阻剂胶5接触。接着进一步缩短硬质背板3与基板4间的相对距离，由于该软性模仁13中心有较厚的厚度，因此压印模仁12受压时会产生较大的压缩量，造成压印模仁13的压印面11与基板4间有较大的接触压力，迫使阻剂胶5充填微结构模穴，并将多余的阻剂胶5挤压向外围流动至基板4边缘。
由上所述，本发明具厚度变化的可挠性模仁相较习知技术，更具有以下的特点与功效：
1.本发明通过模仁本体的厚度差异，在压印过程中变形时产生不同的应力与应变，于模仁本体与基板间形成中央强、周围弱的接触压力分布，迫使阻剂胶自基板中央往外流动，达到均匀涂布的目的，解决传统旋转涂布浪费胶材的缺点。
2.本发明透过模仁本体的厚度差异，可在压印过程中透过施加位移或力量于模仁本体时，控制模仁本体的变形量，进而达成在压印过程中的接触压力控制，达到压印结果的微结构高度均匀，底层残余厚度最小的目的。
3.本发明透过模仁本体的厚度差异，而于脱模时控制模仁本体的变形量，以改善过去因拔模角度过大或急遽的压力释放造成的缺陷问题。
上列详细说明是针对本发明的一可行实施例的具体说明，惟该实施例并非用以限制本发明的专利范围，凡未脱离本发明技艺精神所为的等效实施或变更，均应包含于本案的专利范围中。

Claims (9)

1.一种采用具厚度变化的可挠式模仁的压印方法，其特征在于，该可扰式模仁包括一模仁本体，该模仁本体的厚度是自该模仁本体的周缘向该模仁本体中间逐渐变化，且该模仁本体的底面具有奈米压印的微结构；
该压印方法为于该模仁本体上表面以一硬质背板施加一力量或位移，使得该模仁本体的压印面变形凸出，压印面中心区域与基板上的阻剂胶接触，通过进一步缩短硬质背板与基板间的相对距离，基于该模仁本体中心有较厚的厚度，受到硬质背板与基板挤压时会产生较大的压缩量，造成该模仁本体的压印面与基板间有较大的接触压力，迫使阻剂胶充填微结构模穴，并将多余的阻剂胶挤压向外围流动至基板边缘。
2.如权利要求1所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：接着以紫外光照射或加热方式使阻剂胶固化，完成微结构奈米压印成型流程。
3.如权利要求1所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该模仁本体是以热固性硅胶材料、光固化性硅胶材料、橡胶材料、塑料材料浇铸成型。
4.如权利要求1所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该模仁本体的厚度是自该模仁本体的周缘向该模仁本体中间上方逐渐增厚。
5.如权利要求1所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该模仁本体的周缘用金属环夹持固定。
6.一种采用具厚度变化的可挠式模仁的压印方法，其特征在于，该可挠式模仁包括：一模仁本体，该模仁本体包含：
一压印模仁，该压印模仁下表面具有奈米压印的微结构；
一软性模仁，该软性模仁是为一自周缘向中间逐渐变化的弹性体，该软性模仁是用以自该压印模仁上表面向该压印模仁施压；
该压印方法为将软性模仁与硬质背板结合，并施加位移或力量于压印模仁，使得该压印模仁的压印面变形凸出，压印面中心区域与基板上的阻剂胶接触，进一步缩短硬质背板与基板间的相对距离，基于该软性模仁中心有较厚的厚度，使压印模仁受压时会产生较大的压缩量，造成压印模仁的压印面与基板间有较大的接触压力，迫使阻剂胶充填微结构模穴，并将多余的阻剂胶挤压向外围流动至基板边缘。
7.如权利要求6所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该软性模仁及该压印模仁是以热固性硅胶材料、光固化性硅胶材料、橡胶材料、塑料材料浇铸成型。
8.如权利要求6所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该软性模仁的厚度是自该软性模仁的周缘向该软性模仁中间下方逐渐增厚。
9.如权利要求6所述的采用具厚度变化的可挠式模仁的压印方法，其特征在于：该压印模仁的周缘用金属环夹持固定。
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