CN113237681A - Vacuum thermal test spacecraft levelness measuring device - Google Patents
Vacuum thermal test spacecraft levelness measuring device Download PDFInfo
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- CN113237681A CN113237681A CN202110453558.5A CN202110453558A CN113237681A CN 113237681 A CN113237681 A CN 113237681A CN 202110453558 A CN202110453558 A CN 202110453558A CN 113237681 A CN113237681 A CN 113237681A
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- heat
- cover
- spacecraft
- insulating cover
- levelness
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- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 238000009413 insulation Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005259 measurement Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000010963 304 stainless steel Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000004321 preservation Methods 0.000 description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/002—Thermal testing
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- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
本申请公开了一种真空热试验航天器水平度测量装置。包括：控温罩和设置在所述控温罩内的水平敏感器；本申请设计了控温罩结构，将水平敏感器安装在控温罩的基板上，在基板的上下表面设置隔热垫，使得装置可以直接安装在航天器上，防止本装置与航天器进行热传导；再通过在基板上设置具有双重保温形式的保温罩，并在保温罩内壁与水平敏感器的表面设置加热组件，确保水平敏感器在高低温冷热变化的环境下始终能够保持正常工作温度范围内；进一步地，通过在保温罩侧壁上开设与水平敏感器对应设置的开口，使得水平敏感器能够准确监测航天器热管的水平度，降低热试验失败率。
The present application discloses a device for measuring the levelness of a vacuum thermal test spacecraft. It includes: a temperature control cover and a level sensor arranged in the temperature control cover; the present application designs a temperature control cover structure, the level sensor is installed on the base plate of the temperature control cover, and heat insulation pads are arranged on the upper and lower surfaces of the base plate , so that the device can be directly installed on the spacecraft to prevent heat conduction between the device and the spacecraft; then, a thermal insulation cover with a double thermal insulation form is arranged on the substrate, and heating components are arranged on the inner wall of the thermal insulation cover and the surface of the level sensor to ensure that The level sensor can always maintain the normal working temperature range under the environment of high and low temperature changes; further, by opening the opening corresponding to the level sensor on the side wall of the thermal insulation cover, the level sensor can accurately monitor the spacecraft The levelness of the heat pipe reduces the failure rate of the heat test.
Description
Technical Field
The invention relates to the technical field of spacecraft ground test and test equipment, in particular to a device for measuring the levelness of a vacuum thermal test spacecraft.
Background
The spacecraft vacuum thermal test is used as a test project with the most complex state, the most expensive and the most time-consuming in the spacecraft development process. In the process of a thermal test of a spacecraft, a heat pipe arranged in the spacecraft can exert good heat conduction performance in a horizontal state, the spacecraft and a support are deformed under the influence of different environments such as vacuum, low temperature or high temperature, and the like, so that the levelness of the heat pipe is changed, if the levelness exceeds a certain range, the heat pipe is failed, the thermal test is failed, and the cost is very high. Multiple thermal test results show that the levelness of the spacecraft needs to be monitored in the thermal test process in order to maintain the inclination angle of the satellite within an acceptable range.
The level is measured by a horizontal sensor generally, but in the thermal test process, the ambient temperature undergoes high and low temperature changes from-190 ℃ to +100 ℃, and the working temperature range of the horizontal sensor is from-30 ℃ to +70 ℃, so that the horizontal sensor cannot be directly arranged on the surface of the spacecraft. Therefore, the device for measuring the levelness of the vacuum thermal test spacecraft is provided for solving the problems that the monitoring equipment cannot be installed on the surface of the spacecraft, the levelness monitoring of the spacecraft is inaccurate, and the failure rate of the thermal test is high.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a vacuum thermal test spacecraft levelness measuring device which can be directly installed on a spacecraft compression point, accurately monitor the spacecraft levelness, reduce the thermal test failure rate, has strong universality, has a simple structure and is easy to implement.
In a first aspect, the present application provides a levelness measuring device for a vacuum thermal test spacecraft, comprising: the temperature control device comprises a temperature control cover and a horizontal sensor arranged in the temperature control cover;
the temperature control cover comprises: the substrate is used for mounting the horizontal sensor, and the heat-insulating cover is mounted on the substrate; the upper surface and the lower surface of the substrate are provided with heat insulation pads; the side wall of the heat-insulating cover is provided with an opening corresponding to the horizontal sensor;
and heating components are arranged on the surface of the horizontal sensor and the inner wall of the heat-insulating cover.
According to the technical scheme that this application embodiment provided, the cover that keeps warm includes: an inner heat-insulating cover and an outer heat-insulating cover which are matched for use; the inner heat-insulation cover is positioned in the outer heat-insulation cover, and the heating components are arranged on the inner walls of the inner heat-insulation cover and the outer heat-insulation cover; a window corresponding to the horizontal sensor is formed in one side wall of the inner heat-preservation cover, and an opening is formed in the side wall of the outer heat-preservation cover corresponding to the window of the inner heat-preservation cover.
According to the technical scheme provided by the embodiment of the application, the inner heat-preservation cover and the outer heat-preservation cover are both made of 304 stainless steel materials.
According to the technical scheme provided by the embodiment of the application, the heating assembly comprises: the heating device comprises a plurality of heating sheets and a heating loop connected with the heating sheets.
According to the technical scheme provided by the embodiment of the application, a hollow fixing column is arranged between the substrate and the heat-preservation cover and is in threaded connection with the mounting hole in the substrate.
According to the technical scheme provided by the embodiment of the application, the method further comprises the following steps: a fixing bolt provided independently; the fixing bolt penetrates through the heat insulation cover, the fixing column and the mounting hole in sequence and is connected with a spacecraft pressing point.
According to the technical scheme provided by the embodiment of the application, the heat insulation pad is made of polyimide.
In conclusion, the technical scheme specifically discloses a specific structure of a levelness measuring device for a vacuum thermal test spacecraft. The temperature control cover structure is specifically designed, the horizontal sensor is installed on a substrate of the temperature control cover, and the upper surface and the lower surface of the substrate are provided with heat insulation pads, so that the device can be directly installed on a spacecraft, and the device is prevented from conducting heat with the spacecraft; the substrate is provided with the heat-insulating cover in a double heat-insulating mode, and the inner wall of the heat-insulating cover and the surface of the horizontal sensor are provided with the heating component, so that the horizontal sensor can be always kept within a normal working temperature range in the environment of high-temperature and low-temperature cold and heat changes; furthermore, the opening which is arranged corresponding to the horizontal sensor is formed in the side wall of the heat-insulating cover, so that the horizontal sensor can accurately monitor the levelness of the heat pipe of the spacecraft, and the failure rate of the heat test is reduced.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic view of the components of a vacuum thermal test spacecraft levelness measuring device.
Fig. 2 is a schematic view of the assembly state of the levelness measuring device of the vacuum thermal test spacecraft.
Reference numbers in the figures: 1. a horizontal sensor; 2. a substrate; 3. a heat insulating pad; 4. an inner heat-insulating cover; 5. an outer heat-insulating cover; 6. a heating plate; 8. fixing a column; 9. and (5) fixing the bolt.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example one
Please refer to fig. 1 and fig. 2, which are schematic structural diagrams of a first embodiment of a vacuum thermal test spacecraft levelness measurement device provided by the present application, comprising: the temperature control device comprises a temperature control cover and a horizontal sensor 1 arranged in the temperature control cover;
the temperature control cover comprises: a substrate 2 for mounting the horizontal sensor 1 and a heat-insulating cover mounted on the substrate 2; the upper surface and the lower surface of the substrate 2 are provided with heat insulation pads 3; the side wall of the heat-insulating cover is provided with an opening corresponding to the horizontal sensor 1;
and heating components are arranged on the surface of the horizontal sensor 1 and the inner wall of the heat-insulating cover.
In this embodiment, the model number of the horizontal sensor 1, optionally, for example, TSD-232; the measurement range is +/-10 degrees, and the measurement range of the levelness in the thermal test is met; the heating component is arranged on the surface of the horizontal sensor 1, and controls the temperature of the horizontal sensor 1 along with the changes of high and low temperature of a thermal test, so that the measurement precision of the horizontal sensor 1 is ensured;
as shown in fig. 1, a substrate 2, which is a basic part of a temperature-controlled cover, is used for mounting a horizontal sensor 1; the heat insulation pads 3 cover the upper surface and the lower surface of the substrate 2, and the heat insulation pad positioned on the upper surface of the substrate 2 is a first heat insulation pad and is used for preventing the device from conducting heat with the spacecraft; the heat insulation pad positioned on the lower surface of the substrate 2 is a second heat insulation pad, the size of the second heat insulation pad is relatively smaller than that of the first heat insulation pad, when the device is installed, the substrate 2 is not in direct contact with the spacecraft due to the arrangement of the second heat insulation pad, and a gap exists between the substrate 2 and the spacecraft, so that the contact area between the substrate 2 and the spacecraft can be reduced, the device is effectively prevented from conducting heat with the spacecraft due to the fact that the level sensor 1 cannot measure the levelness due to the cooperation of the first heat insulation pad, and the insulativity between the device and the spacecraft can be guaranteed;
the material of the heat insulation pad 3 is, for example, polyimide;
the heat-insulating cover is arranged on the substrate 2, and the heating component is arranged on the inner wall of the heat-insulating cover to protect the horizontal sensor 1 and ensure that the horizontal sensor 1 can normally work all the time in the environment of high-temperature and low-temperature cold and heat changes; furthermore, the side wall of the heat-insulating cover is provided with an opening which is arranged corresponding to the horizontal sensor 1, so that the horizontal sensor 1 can accurately monitor the levelness of the spacecraft heat pipe;
through the cooperation of heating element and heat preservation cover, separate horizontal sensor 1 and external environment temperature to guarantee that the temperature of horizontal sensor 1 is in normal operating temperature within range, make horizontal sensor 1 can the direct mount on the spacecraft compresses tightly the point, and can normally work in the temperature range that it can bear, thereby accurate monitoring spacecraft levelness reduces the thermal test failure rate.
In any preferred embodiment, the heat-retaining cover comprises: an inner heat-insulating cover 4 and an outer heat-insulating cover 5 which are used in a matching way; the inner heat-insulating cover 4 is positioned in the outer heat-insulating cover 5, and the heating components are arranged on the inner walls of the inner heat-insulating cover 4 and the outer heat-insulating cover 5; a window corresponding to the horizontal sensor 1 is formed in one side wall of the inner heat-preservation cover 4, and an opening corresponding to the window of the inner heat-preservation cover 4 is formed in the side wall of the outer heat-preservation cover 5.
In this embodiment, the inner heat-insulating cover 4 and the outer heat-insulating cover 5 used in cooperation form a double heat-insulating form, as shown in fig. 2, after the device is installed, the inner heat-insulating cover 4 is located in the outer heat-insulating cover 5, and the inner walls of the inner heat-insulating cover and the outer heat-insulating cover are also provided with heating components, so as to control the temperature of the space environment formed by the substrate 2 and the temperature-controlling cover along with the high-low temperature cold and heat changes of the thermal test, thereby ensuring the measurement accuracy of the horizontal sensor 1;
furthermore, as shown in fig. 1, a window is formed in one side wall of the inner heat-insulating cover 4, an opening is also formed in the side wall of the outer heat-insulating cover 5, and as shown in fig. 2, the window is communicated with the opening after the components are installed, so that the levelness of the heat pipe of the spacecraft can be accurately monitored under the condition that the ambient temperature around the horizontal sensor 1 is ensured;
wherein, the inner heat-insulating cover 4 and the outer heat-insulating cover 5 are made of 304 stainless steel materials, for example;
the base plate 2 is provided with mounting holes of different specifications, and the heat insulation pad 3, the inner heat insulation cover 4 and the outer heat insulation cover 5 are also provided with mounting holes corresponding to the mounting holes on the base plate 2, so that the device can be mounted on spacecrafts of different models.
In any preferred embodiment, the heating assembly comprises: a plurality of heating plates 6 and a heating circuit connected to the heating plates 6.
In this embodiment, the number of the heating sheets 6 is at least two, which can be set according to actual requirements; the heating loop is connected with the heating sheet 6 and used for heating the heating sheet; and the heating circuit is provided with a platinum resistor which is arranged adjacent to the heating sheet 6; when the temperature rises, the resistance value of the platinum resistor rises, when the heating loop is disconnected, the temperature is gradually reduced, at the moment, the resistance value of the platinum resistor is also gradually reduced, and the temperature value of the heating sheet 6 can be obtained through detecting the resistance value of the platinum resistor, so that the temperature of the horizontal sensor 1 can be controlled to be always within the temperature range of normal operation;
for example, the top and a side wall of the horizontal sensor 1 are respectively adhered with a heating plate, a platinum resistor is disposed adjacent to one heating plate, and the temperature of the horizontal sensor 1 is controlled by a heating circuit.
In any preferred embodiment, a hollow fixing column 8 is arranged between the base plate 2 and the heat-preservation cover and is in threaded connection with a mounting hole on the base plate 2.
In this embodiment, the fixed column 8 is arranged between the substrate 2 and the heat preservation cover, and is of a hollow structure, the outer surface of one end of the fixed column is provided with a thread, and can be in threaded connection with a threaded hole on the substrate 2, and the other end of the fixed column can be in contact with the inner top wall of the inner heat preservation cover 4 and is communicated with a mounting hole on the inner heat preservation cover 4, so that the fixed column is penetrated by the fixing bolt 9.
In any preferred embodiment, further comprising: a fixing bolt 9 provided independently; the fixing bolt 9 penetrates through the heat insulation cover, the fixing column 8 and the mounting hole in sequence and is connected with a spacecraft pressing point.
In this embodiment, fixing bolt 9, independent setting, it can run through in proper order the heat preservation cover, fixed column 8 and the mounting hole is connected with spacecraft pressure point, installs this device on spacecraft pressure point.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (7)
1. A vacuum thermal test spacecraft levelness measuring device is characterized by comprising: the temperature control device comprises a temperature control cover and a horizontal sensor (1) arranged in the temperature control cover;
the temperature control cover comprises: the substrate (2) is used for mounting the horizontal sensor (1) and the heat-insulating cover is mounted on the substrate (2); the upper surface and the lower surface of the substrate (2) are provided with heat insulation pads (3); the side wall of the heat-insulating cover is provided with an opening corresponding to the horizontal sensor (1);
and heating components are arranged on the surface of the horizontal sensor (1) and the inner wall of the heat-insulating cover.
2. The apparatus of claim 1, wherein the thermal shield comprises: an inner heat-insulating cover (4) and an outer heat-insulating cover (5) which are matched for use; the inner heat-insulation cover (4) is positioned in the outer heat-insulation cover (5), and the heating components are arranged on the inner walls of the inner heat-insulation cover (4) and the outer heat-insulation cover (5); a window corresponding to the horizontal sensor (1) is formed in one side wall of the inner heat-insulation cover (4), and an opening is formed in the side wall of the outer heat-insulation cover (5) corresponding to the window of the inner heat-insulation cover (4).
3. The device for measuring the levelness of the vacuum thermal test spacecraft as claimed in claim 2, wherein the inner heat-insulating cover (4) and the outer heat-insulating cover (5) are both made of 304 stainless steel materials.
4. A vacuum thermal test spacecraft levelness measurement apparatus according to claim 2, wherein said heating assembly comprises: a plurality of heating plates (6) and a heating loop connected with the heating plates (6).
5. A vacuum thermal test spacecraft levelness measuring device according to claim 1, characterized in that a hollow fixing column (8) is provided between the base plate (2) and the heat-insulating cover and is in threaded connection with a mounting hole on the base plate (2).
6. The apparatus of claim 5, further comprising: a fixing bolt (9) provided independently; the fixing bolt (9) penetrates through the heat-insulating cover, the fixing column (8) and the mounting hole in sequence and is connected with a spacecraft pressing point.
7. A vacuum thermal test spacecraft levelness measurement device according to claim 1, characterized in that said thermal insulation mat (3) is made of polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110453558.5A CN113237681A (en) | 2021-04-26 | 2021-04-26 | Vacuum thermal test spacecraft levelness measuring device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110453558.5A CN113237681A (en) | 2021-04-26 | 2021-04-26 | Vacuum thermal test spacecraft levelness measuring device |
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| CN113237681A true CN113237681A (en) | 2021-08-10 |
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| CN202110453558.5A Pending CN113237681A (en) | 2021-04-26 | 2021-04-26 | Vacuum thermal test spacecraft levelness measuring device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5799904A (en) * | 1996-04-25 | 1998-09-01 | Lockheed Martin Corp. | Temperature control for spacecraft inertial control unit |
| US20060272167A1 (en) * | 2005-06-07 | 2006-12-07 | Asia Optical Co., Inc. | Laser level with temperature control device and temperature control method thereof |
| CN200979528Y (en) * | 2006-12-14 | 2007-11-21 | 薛文伟 | An infrared gas detecting device with constant temperature function |
| CN104102245A (en) * | 2014-05-26 | 2014-10-15 | 航天东方红卫星有限公司 | Thermal control device used for improving satellite temperature control precision and thermal control method |
| CN106484001A (en) * | 2015-08-25 | 2017-03-08 | 北京卫星环境工程研究所 | Cable high accuracy temperature control device on spacecraft thermal vacuum test star |
| CN108490775A (en) * | 2018-03-19 | 2018-09-04 | 上海微小卫星工程中心 | Spacecraft temperature stability control device and control method |
-
2021
- 2021-04-26 CN CN202110453558.5A patent/CN113237681A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5799904A (en) * | 1996-04-25 | 1998-09-01 | Lockheed Martin Corp. | Temperature control for spacecraft inertial control unit |
| US20060272167A1 (en) * | 2005-06-07 | 2006-12-07 | Asia Optical Co., Inc. | Laser level with temperature control device and temperature control method thereof |
| CN200979528Y (en) * | 2006-12-14 | 2007-11-21 | 薛文伟 | An infrared gas detecting device with constant temperature function |
| CN104102245A (en) * | 2014-05-26 | 2014-10-15 | 航天东方红卫星有限公司 | Thermal control device used for improving satellite temperature control precision and thermal control method |
| CN106484001A (en) * | 2015-08-25 | 2017-03-08 | 北京卫星环境工程研究所 | Cable high accuracy temperature control device on spacecraft thermal vacuum test star |
| CN108490775A (en) * | 2018-03-19 | 2018-09-04 | 上海微小卫星工程中心 | Spacecraft temperature stability control device and control method |
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Application publication date: 20210810 |
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