CN113215454B - Aluminum alloy for manufacturing mobile phone plate - Google Patents
Aluminum alloy for manufacturing mobile phone plate Download PDFInfo
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- CN113215454B CN113215454B CN202110408958.4A CN202110408958A CN113215454B CN 113215454 B CN113215454 B CN 113215454B CN 202110408958 A CN202110408958 A CN 202110408958A CN 113215454 B CN113215454 B CN 113215454B
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 65
- 239000000956 alloy Substances 0.000 claims abstract description 65
- 239000011777 magnesium Substances 0.000 claims abstract description 37
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 36
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 30
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000010936 titanium Substances 0.000 claims abstract description 26
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 26
- 239000010703 silicon Substances 0.000 claims abstract description 25
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 25
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052796 boron Inorganic materials 0.000 claims abstract description 24
- -1 aluminum-titanium-boron Chemical compound 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 14
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000003723 Smelting Methods 0.000 claims abstract description 11
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims abstract description 10
- YNDGDLJDSBUSEI-UHFFFAOYSA-N aluminum strontium Chemical compound [Al].[Sr] YNDGDLJDSBUSEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 238000002360 preparation method Methods 0.000 claims abstract description 3
- 238000007670 refining Methods 0.000 claims description 20
- 238000005266 casting Methods 0.000 claims description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000000265 homogenisation Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 22
- 230000000694 effects Effects 0.000 description 10
- 238000005728 strengthening Methods 0.000 description 8
- 229910000861 Mg alloy Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000007792 addition Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910000676 Si alloy Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910010038 TiAl Inorganic materials 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910018565 CuAl Inorganic materials 0.000 description 1
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- GANNOFFDYMSBSZ-UHFFFAOYSA-N [AlH3].[Mg] Chemical compound [AlH3].[Mg] GANNOFFDYMSBSZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
- C22C21/04—Modified aluminium-silicon alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses an aluminum alloy with excellent performance for manufacturing a mobile phone plate, which relates to the field of aluminum alloys and comprises 1.13-1.20 mass percent of magnesium, 1.95-2.08 mass percent of silicon, 0.85-0.95 mass percent of copper, 0.23-0.28 mass percent of titanium, 0.04-0.05 mass percent of boron, 0.015-0.03 mass percent of strontium and the balance of aluminum and a small amount of impurity iron. When in preparation, double-zero aluminum, aluminum-magnesium intermediate alloy, aluminum-silicon intermediate alloy, aluminum-copper intermediate alloy, aluminum-titanium-boron intermediate alloy and aluminum-strontium intermediate alloy are added into a smelting furnace and are sintered into ingots; post-treating the alloy as a fired ingot. The invention can solve the problem that the existing aluminum alloy for manufacturing the mobile phone plate is low in hardness, tensile strength and yield strength.
Description
Technical Field
The invention relates to the field of aluminum alloy, in particular to aluminum alloy for manufacturing a mobile phone plate.
Background
The existing aluminum alloy for manufacturing the mobile phone plate is generally 6XXX series aluminum alloy. The main alloy elements of the series of aluminum alloys are magnesium and silicon, and a small amount of copper is added to improve the alloy strength. The main alloying elements in the aluminum alloy have the following effects on the alloy properties:
silicon element: at eutectic temperature 577 o C, the maximum solubility of silicon in solid solution is 1.65%, although solubility decreases with decreasing temperature, such alloys are generally not heat treatment strengthened, and have good castability and corrosion resistance. Silicon and magnesium are simultaneously added into aluminum to form aluminum-silicon-magnesium alloy, and the strengthening phase is Mg 2 And (3) Si. The mass ratio of magnesium to silicon was 1.73: 1. When designing the magnesium-aluminum-silicon alloy composition, the contents of magnesium and silicon are basically configured according to the proportion.
Magnesium element: the solubility of magnesium in aluminum decreases rapidly with decreasing temperature, and in most industrial wrought aluminum alloys, the magnesium content is less than 6%, which are not heat treatment strengthened, but have good weldability, good corrosion resistance, and moderate strength. The strengthening of magnesium to aluminum is obvious, and the tensile strength is improved by about 34MPa for every 1 percent of magnesium. However, when the magnesium content exceeds 1.2% by mass, excess magnesium promotes the strengthening phase Mg 2 Si is precipitated from the matrix and grows and coarsens, and the hardness, the tensile strength and the yield strength of the aluminum alloy are reduced.
Copper element: aluminum copper alloy 548 o C, the maximum solubility of copper in aluminum is 5.65%, and the temperature is reduced to 302% o The solubility of copper in C was 0.45%. Copper is an important alloy element, has a certain solid solution strengthening effect, and is CuAl precipitated by aging 2, Has obvious aging strengthening effect. The copper content of the aluminum alloy is usually controlled to be 2.5-5%, and the strengthening effect is best when the copper content is 4-6.8%, so that the copper content of most hard aluminum alloys is in the range.
The existing 6XXX series aluminum alloy used for manufacturing the mobile phone plate has lower hardness, lower tensile strength and lower yield strength, which results in poorer performance of the mobile phone aluminum plate.
Disclosure of Invention
The invention aims to solve the technical problem of providing an aluminum alloy for manufacturing a mobile phone plate, and solves the problem that the existing aluminum alloy for manufacturing the mobile phone plate is low in hardness, tensile strength and yield strength.
The technical scheme adopted by the invention for solving the technical problems is as follows: an aluminum alloy for manufacturing a mobile phone plate comprises aluminum, magnesium, silicon, copper, titanium, boron and strontium, wherein the mass percent of magnesium is 1.13-1.20%, the mass percent of silicon is 1.95-2.08%, the mass percent of copper is 0.85-0.95%, the mass percent of titanium is 0.23-0.28%, the mass percent of boron is 0.04-0.05%, the mass percent of strontium is 0.015-0.03%, and the balance is aluminum and a small amount of impurity iron.
The invention also provides a preparation method of the aluminum alloy for manufacturing the mobile phone plate, which comprises the following steps:
(1) adding double-zero aluminum, aluminum-magnesium intermediate alloy, aluminum-silicon intermediate alloy, aluminum-copper intermediate alloy, aluminum-titanium-boron intermediate alloy and aluminum-strontium intermediate alloy into a smelting furnace, and sintering and casting into ingots;
(2) post-treating the alloy as a fired ingot.
Further, the mass percent of magnesium in the aluminum-magnesium intermediate alloy is 50.23%, the mass percent of silicon in the aluminum-silicon intermediate alloy is 10.12%, the mass percent of copper in the aluminum-copper intermediate alloy is 50.34%, the mass percent of titanium in the aluminum-titanium-boron intermediate alloy is 4.75%, the mass percent of boron in the aluminum-titanium-boron intermediate alloy is 0.87%, and the mass percent of strontium in the aluminum-strontium intermediate alloy is 0.65%.
Further, the loss of magnesium during the process of firing into an ingot in said step (1) is complemented by an aluminum-magnesium master alloy.
Further, the melting temperature at the time of the ingot casting in the step (1) is 750 o C。
Further, in the step (1), argon gas rotary blowing refining and powder injection refining are used for refining in coordination when the ingot is sintered and smelted.
Further, 560 is adopted in the step (2) o And C, 10h of homogenization treatment.
The invention has the following beneficial effects:
the aluminum alloy for manufacturing the mobile phone plate is added with titanium in the aluminum-silicon-magnesium alloy, and the titanium and the aluminum form a strengthening phase TiAl 2 Becomes a non-spontaneous core during crystallization, and can play a role in refining a casting structure and a welding seam structure, thereby improving the hardness of the material. The aluminum alloy for manufacturing the mobile phone plate has the effect of reducing the using amount of titanium by adding boron into the aluminum-silicon-magnesium alloy. Because the price of titanium is far higher than that of boron, the addition of boron can achieve the effect of reducing the cost of the mobile phone plate.
The aluminum alloy for manufacturing the mobile phone plate is added with strontium in the aluminum-silicon-magnesium alloy, wherein the strontium is a surface active element and can change the behavior of an intermetallic compound phase in crystallography. Therefore, the modification treatment with strontium improves the plastic workability of the alloy and the quality of the final product. Because of the advantages of long effective time of strontium modification, good effect and reproducibility and the like, in recent years, strontium in aluminum-silicon alloy gradually replaces sodium, and 0.015-0.03 percent of strontium is added in aluminum alloy casting, so that beta-AlFeSi in cast ingots is transformed into a Chinese-character-shaped alpha-AlFeSi phase, coarse second phases can be effectively reduced, the homogenization time of the cast ingots is reduced by 60-70 percent, the mechanical property and the plastic processability of materials are improved, and the tensile strength and the yield strength of the materials are improved.
Detailed Description
Example 1:
the aluminum alloy for manufacturing the mobile phone plate comprises 1.20 mass percent of magnesium, 2.08 mass percent of silicon, 0.9 mass percent of copper, 0.23 mass percent of titanium, 0.04 mass percent of boron, 0.015 mass percent of strontium and the balance of aluminum and a small amount of impurity iron.
Is prepared by the following steps:
(1) adding an aluminum-magnesium intermediate alloy with the mass percent of double-zero aluminum and magnesium being 50.23%, an aluminum-silicon intermediate alloy with the mass percent of silicon being 10.12%, an aluminum-copper intermediate alloy with the mass percent of copper being 50.34%, an aluminum-titanium-boron intermediate alloy with the mass percent of titanium being 4.75%, an aluminum-titanium-boron intermediate alloy with the mass percent of boron being 0.87% and an aluminum-strontium intermediate alloy with the mass percent of strontium being 0.65% into a smelting furnace, and sintering and casting into ingots. In the process of casting, the smelting temperature is 750 DEG o And C, refining by using the cooperation of argon rotary blowing refining and powder spraying refining, and supplementing the lost magnesium by using an aluminum-magnesium intermediate alloy.
(2) By the use of 560 o And C, 10h of homogenization treatment. The aluminum alloy with the mass percent of magnesium of 1.20%, silicon of 2.08%, copper of 0.9%, titanium of 0.23%, boron of 0.04% and strontium of 0.015% is obtained. The aluminum alloy was subjected to hardness test, tensile strength and yield strength test.
Comparative example 1:
the aluminum alloy comprises 1.20 mass percent of magnesium, 2.08 mass percent of silicon, 0.9 mass percent of copper and the balance of aluminum and a small amount of impurity iron.
Is prepared by the following steps:
(1) adding double-zero aluminum, an aluminum-magnesium intermediate alloy with the mass percent of magnesium being 50.23%, an aluminum-silicon intermediate alloy with the mass percent of silicon being 10.12%, an aluminum-copper intermediate alloy with the mass percent of copper being 50.34% into a smelting furnace, and sintering and casting into ingots. In the process of casting, the smelting temperature is 750 DEG o C, refining by using argon gas rotary blowing refining and powder injection refining in coordination with lossThe magnesium is complemented by an aluminium-magnesium master alloy.
(2) By the use of 560 o And C, 10h of homogenization treatment. The aluminum alloy containing 1.20 mass% of magnesium, 2.08 mass% of silicon and 0.9 mass% of copper was obtained. The aluminum alloy was subjected to hardness test, tensile strength and yield strength test.
The test data for example 1 and comparative example 1 are shown in the following table:
| hardness (HV) | Tensile strength (MPa) | Yield strength (MPa) | |
| Example 1 | 152 | 336 | 289 |
| Comparative example 1 | 145 | 312 | 277 |
By comparing example 1 with comparative example 1, it can be seen that the addition of titanium, boron and strontium to the aluminum-magnesium-silicon series aluminum alloy for microalloying can effectively improve the hardness, tensile strength and yield strength of the aluminum alloy.
Example 2:
the aluminum alloy for manufacturing the mobile phone plate comprises aluminum, magnesium, silicon, copper, titanium, boron and strontium, wherein the mass percent of magnesium is 1.20%, the mass percent of silicon is 2.08%, the mass percent of copper is 0.9%, the mass percent of titanium is 0.255%, the mass percent of boron is 0.045%, the mass percent of strontium is 0.0225%, and the balance is aluminum and a small amount of impurity iron.
Is prepared by the following steps:
(1) adding an aluminum-magnesium intermediate alloy with the mass percent of double-zero aluminum and magnesium being 50.23%, an aluminum-silicon intermediate alloy with the mass percent of silicon being 10.12%, an aluminum-copper intermediate alloy with the mass percent of copper being 50.34%, an aluminum-titanium-boron intermediate alloy with the mass percent of titanium being 4.75%, an aluminum-titanium-boron intermediate alloy with the mass percent of boron being 0.87% and an aluminum-strontium intermediate alloy with the mass percent of strontium being 0.65% into a smelting furnace, and sintering and casting into ingots. In the process of casting, the melting temperature is 750 DEG C o And C, refining by using the cooperation of argon rotary blowing refining and powder spraying refining, and supplementing the lost magnesium by using an aluminum-magnesium intermediate alloy.
(2) Using 560 o And C, 10h of homogenization treatment. The aluminum alloy with 1.20 mass percent of magnesium, 2.08 mass percent of silicon, 0.9 mass percent of copper, 0.255 mass percent of titanium, 0.045 mass percent of boron and 0.0225 mass percent of strontium is obtained. The aluminum alloy was subjected to hardness test, tensile strength and yield strength test.
Example 2 test data is shown in the following table:
| hardness (HV) | Tensile strength (MPa) | Yield strength (MPa) | |
| Example 2 | 155 | 338 | 292 |
Example 3:
the aluminum alloy for manufacturing the mobile phone plate comprises 1.20 mass percent of magnesium, 2.08 mass percent of silicon, 0.9 mass percent of copper, 0.28 mass percent of titanium, 0.05 mass percent of boron, 0.03 mass percent of strontium and the balance of aluminum and a small amount of impurity iron.
Is prepared by the following steps:
(1) adding an aluminum-magnesium intermediate alloy with the mass percent of double-zero aluminum and magnesium being 50.23%, an aluminum-silicon intermediate alloy with the mass percent of silicon being 10.12%, an aluminum-copper intermediate alloy with the mass percent of copper being 50.34%, an aluminum-titanium-boron intermediate alloy with the mass percent of titanium being 4.75%, an aluminum-titanium-boron intermediate alloy with the mass percent of boron being 0.87% and an aluminum-strontium intermediate alloy with the mass percent of strontium being 0.65% into a smelting furnace, and sintering and casting into ingots. In the process of casting, the smelting temperature is 750 DEG o And C, refining by using the cooperation of argon rotary blowing refining and powder spraying refining, and supplementing the lost magnesium by using an aluminum-magnesium intermediate alloy.
(2) By the use of 560 o And C, 10h of homogenization treatment. The aluminum alloy with the mass percent of magnesium of 1.20%, silicon of 2.08%, copper of 0.9%, titanium of 0.28%, boron of 0.05% and strontium of 0.03% is obtained. The aluminum alloy was subjected to hardness test, tensile strength and yield strength test.
Example 3 test data are shown in the following table:
| hardness (HV) | Tensile strength (MPa) | Yield strength (MPa) | |
| Example 3 | 156 | 339 | 296 |
It can be seen from the comparison of example 1, example 2 and example 3 that increasing the proportion of titanium, boron and strontium elements in the range of the respective alloying element additions is effective in increasing the hardness, tensile strength and yield strength of the alloy.
The aluminum alloy for manufacturing the mobile phone plate is added with titanium in the aluminum-silicon-magnesium alloy, and the titanium and the aluminum form a strengthening phase TiAl 2 Becomes a non-spontaneous core during crystallization, and can play a role in refining a casting structure and a welding seam structure, thereby improving the hardness of the material. The aluminum alloy for manufacturing the mobile phone plate has the effect of reducing the using amount of titanium by adding boron into the aluminum-silicon-magnesium alloy. Because the price of titanium is far higher than that of boron, the addition of boron can achieve the effect of reducing the cost of the mobile phone plate.
The aluminum alloy for manufacturing the mobile phone plate is added with strontium in the aluminum-silicon-magnesium alloy, wherein the strontium is a surface active element and can change the behavior of an intermetallic compound phase in crystallography. Therefore, the modification treatment with strontium improves the plastic workability of the alloy and the quality of the final product. Because of the advantages of long effective time of strontium modification, good effect and reproducibility and the like, in recent years, strontium in aluminum-silicon alloy gradually replaces sodium, and 0.015-0.03 percent of strontium is added in aluminum alloy casting, so that beta-AlFeSi in cast ingots is transformed into a Chinese-character-shaped alpha-AlFeSi phase, coarse second phases can be effectively reduced, the homogenization time of the cast ingots is reduced by 60-70 percent, the mechanical property and the plastic processability of materials are improved, and the tensile strength and the yield strength of the materials are improved.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in any way, and those skilled in the art can make various changes and modifications to the equivalent embodiments without departing from the scope of the present invention, and all such changes, modifications, equivalents and improvements that can be made to the above embodiments without departing from the technical spirit of the present invention are within the spirit and principle of the present invention.
Claims (7)
1. The aluminum alloy for manufacturing the mobile phone plate is characterized by comprising 1.13-1.20 mass percent of magnesium, 1.95-2.08 mass percent of silicon, 0.85-0.95 mass percent of copper, 0.23-0.28 mass percent of titanium, 0.04-0.05 mass percent of boron, 0.015-0.03 mass percent of strontium and the balance of aluminum and a small amount of impurity iron.
2. The preparation method of the aluminum alloy for manufacturing the mobile phone plate as claimed in claim 1, characterized by comprising the following steps:
(1) adding double-zero aluminum, aluminum-magnesium intermediate alloy, aluminum-silicon intermediate alloy, aluminum-copper intermediate alloy, aluminum-titanium-boron intermediate alloy and aluminum-strontium intermediate alloy into a smelting furnace, and sintering and casting into ingots;
(2) post-treating the alloy as a fired ingot.
3. The method for preparing an aluminum alloy for manufacturing a mobile phone plate as defined in claim 2, wherein the mass percentage of magnesium in the aluminum-magnesium intermediate alloy is 50.23%, the mass percentage of silicon in the aluminum-silicon intermediate alloy is 10.12%, the mass percentage of copper in the aluminum-copper intermediate alloy is 50.34%, the mass percentage of titanium in the aluminum-titanium-boron intermediate alloy is 4.75%, the mass percentage of boron in the aluminum-titanium-boron intermediate alloy is 0.87%, and the mass percentage of strontium in the aluminum-strontium intermediate alloy is 0.65%.
4. The method of claim 2, wherein the loss of magnesium during the step (1) of sintering into ingots is compensated by an aluminum-magnesium intermediate alloy.
5. The method for preparing the aluminum alloy for manufacturing the mobile phone plate as claimed in claim 2, wherein the melting temperature of the ingot sintered in the step (1) is 750% o C。
6. The method for preparing an aluminum alloy for manufacturing a mobile phone plate according to claim 2, wherein in the step (1), the co-refining of argon rotary blowing refining and powder injection refining is used for smelting the sintered ingot.
7. The method for preparing the aluminum alloy for manufacturing the mobile phone plate as claimed in claim 2, wherein 560 is adopted in the step (2) o And C, 10h of homogenization treatment.
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| JP4719731B2 (en) * | 2007-11-22 | 2011-07-06 | 住友電気工業株式会社 | Aluminum alloy rolled material with excellent machinability and method for producing the same |
| CN104451278B (en) * | 2013-09-23 | 2017-06-06 | 比亚迪股份有限公司 | A kind of pack alloy and preparation method thereof |
| CN107641741A (en) * | 2017-08-30 | 2018-01-30 | 上海帅翼驰铝合金新材料有限公司 | A kind of high heat conduction aluminium alloy |
| CN109628804B (en) * | 2018-12-06 | 2020-12-22 | 佛山市三水凤铝铝业有限公司 | High-strength aluminum alloy with excellent oxidation effect and preparation method thereof |
| CN111733351A (en) * | 2020-04-07 | 2020-10-02 | 浙江顺虎铝业有限公司 | Aluminum alloy material with high heat conductivity and high strength and preparation method thereof |
| CN112251655B (en) * | 2020-09-09 | 2022-07-01 | 科曼车辆部件系统(苏州)有限公司 | High-toughness liquid die forging cast aluminum alloy and preparation method thereof |
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