CN113213769A - Etching thinning system - Google Patents
Etching thinning system Download PDFInfo
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- CN113213769A CN113213769A CN202110414307.6A CN202110414307A CN113213769A CN 113213769 A CN113213769 A CN 113213769A CN 202110414307 A CN202110414307 A CN 202110414307A CN 113213769 A CN113213769 A CN 113213769A
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- etching
- etching liquid
- glass
- thinning system
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Abstract
The utility model relates to an sculpture attenuate system, this sculpture system include etching device and pipeline transport module, etching device is including having the casing that holds the chamber, it is provided with the fixed knot who is used for upright fixed glass to hold the intracavity to construct, the casing be provided with be used for lasting to hold the chamber and supply the etching liquid import of etching liquid, the top of casing is provided with the etching liquid export. Glass to be thinned is put into the containing cavity of the etching device, the glass is fixed in an upright state through the fixing structure, etching liquid filled in the containing cavity can be in complete and uniform contact with the surface of the glass, and the problem of inconsistent local etching of the surface of the glass is solved. The particles or sediments generated in the corrosion reaction are not easy to be attached to the glass surface in the vertical state, and the etching liquid which continuously flows through the glass surface can wash and carry away the sediments and the particles generated in the corrosion reaction.
Description
Technical Field
The disclosure relates to the technical field of thinning, in particular to an etching thinning system.
Background
With the continuous updating and upgrading of electronic display technologies, flat panel display products are developing towards light, thin and high performance, and the thinness of flat panel display glass is the most critical factor for the light and thin flat panel display products. The method for thinning the flat panel display glass mainly comprises a physical thinning method and a chemical thinning method, wherein the physical thinning method is to grind and polish the glass by rotating a polishing disc and adding a polishing agent to achieve the purpose of thinning, but the method has low efficiency, is easy to generate defects and has low yield. The chemical thinning method mainly utilizes the chemical reaction between etching liquid mainly containing hydrofluoric acid (HF) and the surface of glass to achieve the purpose of thinning the glass. The chemical thinning method has the advantages of stable etching rate, small physical loss and low cost, and is an important thinning method with huge potential.
At present, the main implementation methods of chemical thinning include a soaking method and a spraying method. The soaking method is to vertically put the glass into a groove filled with etching liquid for soaking and thinning, and precipitates or particles generated by reaction are easy to adhere to the glass in the process of corroding the glass by the etching liquid, so that the surface effect of corroding the glass is influenced, and the cleaning process is influenced. The spraying method is to spray etching liquid to the surface of the glass through specific equipment to perform etching thinning, and the spraying method can cause uneven corrosion reaction on the surface of the glass and easily generate defects such as pits, scratches and the like.
Disclosure of Invention
It is an object of the present disclosure to provide an etch thinning system that at least partially solves the above problems.
In order to realize the above-mentioned purpose, the present disclosure provides an sculpture attenuate system, it includes etching apparatus and pipeline transport assembly, etching apparatus is including having the casing that holds the chamber, it is provided with the fixed knot who is used for upright fixed glass to hold the intracavity to construct, the casing be provided with be used for lasting to hold the chamber and supply the etching liquid import of etching liquid, the top of casing is provided with the etching liquid export.
Optionally, the pipeline conveying assembly includes a first pump, an inlet of the first pump is communicated with the etching liquid outlet, and an outlet of the first pump is communicated with the etching liquid inlet.
Optionally, the fixing structure is a clamping groove, the housing includes a side wall, a bottom wall and a top wall, the side wall is arranged oppositely, the bottom wall and the top wall are arranged oppositely, the etching liquid outlet is formed in the top wall, and the clamping groove is used for fixing the glass and is formed in the inner side of the bottom wall and the inner side of the side wall.
Optionally, the card slot is configured as a U-shaped structure, the top wall is provided with an insertion opening, the insertion opening is disposed at an opening of the U-shaped structure, and the etching apparatus further includes an elastic sealing member, which is openably disposed at the insertion opening to seal the insertion opening.
Optionally, the etching thinning system further comprises a pipeline conveying assembly, the etching liquid inlet is formed in the bottom of the accommodating cavity, the number of the etching liquid inlets is multiple, the etching liquid inlets are respectively located on two sides of the clamping groove, the pipeline conveying assembly comprises an input pipeline, and the etching liquid inlets are communicated with the input pipeline.
Optionally, the etching liquid outlets are formed in the top wall, the etching liquid outlets are multiple and are respectively arranged on two sides of the clamping groove, the pipeline conveying assembly comprises an output pipeline, and all the etching liquid outlets are communicated with the output pipeline.
Optionally, the number of the etching liquid inlets is greater than that of the etching liquid outlets, and the etching liquid inlets and the etching liquid outlets are arranged non-coaxially.
Optionally, the pipeline conveying assembly further comprises a first flow regulating valve and a second flow regulating valve, the first flow regulating valve is disposed on the input pipeline, and the second flow regulating valve is disposed on the output pipeline.
Optionally, the etching and thinning system further comprises a filtering device, an inlet of the filtering device is communicated with the etching liquid outlet, and an outlet of the filtering device is communicated with the etching liquid inlet.
Optionally, the pipeline conveying assembly further comprises a first pump and a second pump, the filtering device and the first pump are sequentially communicated, an outlet of the first pump is communicated with the etching liquid inlet, and an inlet of the second pump is communicated with the etching liquid outlet.
Optionally, the etching and thinning system further comprises a constant temperature device capable of keeping constant temperature, the constant temperature device comprises a container, and the etching device is arranged in the container.
The technical scheme can at least achieve the following technical effects:
through foretell technical scheme, the glass that will attenuate is put into etching device's the intracavity that holds to fix glass with upright state through fixed knot structure, and let in the etching liquid to holding the intracavity from the etching liquid import, make the etching liquid be full of and hold the chamber, take place the erosion reaction with the glass surface, moreover, the etching liquid from the etching liquid import get into hold the chamber in, and flow from the etching liquid export, produced liquid flow on the glass surface. The setting makes the etching liquid follow the etching liquid import and gets into after holding the chamber at the etching liquid export at the casing top, is full of completely and holds the chamber after, just flows from the etching liquid export, and the etching liquid that is full of and holds the chamber can contact with glass surface uniformly completely, has solved the inconsistent problem of glass surface local etching. The particles or sediments generated in the corrosion reaction are not easy to adhere to the glass surface in the vertical state, and the etching liquid which continuously flows through the glass surface can wash and take away the sediments and the particles generated in the corrosion reaction, thereby effectively avoiding the defects of generating convex points and the like when the sediments and the particles are adhered on the glass.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
FIG. 1 is a schematic perspective view of an etch thinning system according to one embodiment of the present disclosure;
FIG. 2 is a schematic front view of an etching apparatus of an etching thinning system according to an embodiment of the disclosure;
fig. 3 is a perspective schematic view of a three-dimensional structure of an etching apparatus of an etching thinning system according to an embodiment of the present disclosure.
Description of the reference numerals
100-etching and thinning system; 10-an etching device; 11-a housing; 12-a containment chamber; 13-a fixed structure; 14-an etching liquid inlet; 15-etching liquid outlet; 16-a card slot; 17-an insertion opening; 18-an elastomeric seal; 21-a first pump; 22-input line; 23-an output line; 24-a first flow regulating valve; 25-a second flow regulating valve; 26-a filtration device; 27-a second pump; 30-a constant temperature device; 31-a container; 32-a source of ultrasonic waves; 33-heating wires; 40-a liquid storage tank.
Detailed Description
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
In the present disclosure, unless otherwise specified, use of directional terms such as "upper and lower" generally refers to "upper and lower" in the normal use of the etch thinning system 100, and reference is made to the orientation of the drawing as shown in fig. 1-3, wherein "top and bottom" correspond to "upper and lower," respectively, and "inner and outer" refer to the inner and outer of the associated component contours. In addition, the terms "first", "second", and the like used in the embodiments of the present disclosure are for distinguishing one element from another, and have no order or importance. The bottom and the top are correspondingly up and down.
In order to be able to improve the yield of etching thinning of glass, as shown in fig. 1-3, an etching thinning system 100 is provided in the present disclosure, which includes an etching apparatus 10 and a pipe conveying assembly. The etching apparatus 10 includes a housing 11 having a receiving chamber 12. A fixing structure 13 for vertically fixing the glass is arranged in the accommodating cavity 12. The housing 11 is provided with an etching liquid inlet 14 for continuously supplying the etching liquid to the accommodating chamber 12, and the top of the housing 11 is provided with an etching liquid outlet 15. The etching liquid can be continuously supplied into the containing cavity 12 by communicating the inlet of the pump with the etching liquid inlet 14, and the etching liquid outlet 15 is communicated with the outlet of the pump, so that the containing cavity 12 can be filled with the etching liquid and the etching liquid can flow on the surface of the glass.
The etching thinning system 100 in the present disclosure may be applied to etching thinned glass, and may also be applied to products such as liquid crystal panels that need to be etched and thinned, which is not limited in the present disclosure. For ease of illustration, the use of the etch thinning system 100 to thin glass is described below as an example.
Through the technical scheme, the glass to be thinned is placed in the containing cavity 12 of the etching device 10, the glass is fixed in an upright state through the fixing structure 13, the etching liquid is introduced into the containing cavity 12 from the etching liquid inlet 14, the containing cavity 12 is filled with the etching liquid, the etching liquid and the surface of the glass are subjected to corrosion reaction, the etching liquid enters the containing cavity 12 from the etching liquid inlet 14 and flows out from the etching liquid outlet 15, and liquid flow is generated on the surface of the glass. The etching liquid outlet 15 arranged at the top of the shell 11 enables the etching liquid to flow out from the etching liquid outlet 15 after entering the containing cavity 12 from the etching liquid inlet 14 and completely filling the containing cavity 12, and the etching liquid filled in the containing cavity 12 can be completely and uniformly contacted with the surface of the glass, so that the problem of inconsistent local etching of the surface of the glass is solved. The particles or sediments generated in the corrosion reaction are not easy to adhere to the glass surface in the vertical state, and the etching liquid which continuously flows through the glass surface can wash and take away the sediments and the particles generated in the corrosion reaction, thereby effectively avoiding the defects of generating convex points and the like when the sediments and the particles are adhered on the glass.
The fixing structure 13 is not limited in the present disclosure, and in one embodiment of the present disclosure, as shown in fig. 3, the fixing structure 13 is a slot 16, and the housing 11 includes opposite side walls and opposite bottom and top walls. The top wall is provided with the etching liquid outlet 15, the inner side of the bottom wall and the inner side of the side wall are both provided with clamping grooves 16 for fixing glass, and therefore the glass is fixed in the accommodating cavity 12 in an upright state through the clamping grooves 16 on the side wall and the bottom wall. The etching liquid can enter the clamping groove 16, and the clamping groove 16 can not shield the surface of the glass, so that all surfaces of the glass can be contacted and reacted with the etching liquid. Optionally, the width of the clamping groove 16 is larger than the thickness of the glass, so that the etching liquid can enter the clamping groove 16 to perform an erosion reaction with the edge of the glass, and all surfaces of the glass can be thinned.
Optionally, the bottom wall of the housing 11 is provided with the etching liquid inlet 14, and the clamping groove 16 on the side wall is communicated with the clamping groove 16 on the bottom wall. The etching liquid flows through the glass surface from bottom to top and generates an erosion reaction with the glass surface.
In other embodiments, a snap may be provided in the receiving cavity 12, and the glass may be fixed by inserting the glass into the snap.
The specific shape of the card slot 16 is not limiting in this disclosure, and in one embodiment, the card slot 16 is configured in a U-shaped configuration, as shown in FIG. 3. An insertion opening 17 is formed in the top wall of the accommodating cavity 12, the insertion opening 17 is arranged at the opening of the U-shaped structure, the etching device 10 further comprises an elastic sealing element 18, and the elastic sealing element 18 is arranged at the insertion opening 17 in an openable and closable manner to seal the insertion opening 17. In the initial state, the elastic seal member 18 closes and seals the insertion opening 17.
The glass is inserted into the accommodating cavity 12 through an insertion opening 17 provided on the top wall and is clamped into the clamping groove 16, when the glass is inserted into the insertion opening 17, the elastic sealing member 18 can be pressed to open the insertion opening 17, so that the glass is inserted, and when the glass is completely inserted into the clamping groove 16, the elastic sealing member 18 is recovered by the action of external force, so that the insertion opening 17 is sealed. By providing the elastic sealing member 18, the sealing property of the accommodating chamber 12 can be increased, the etching liquid is prevented from volatilizing from the insertion port 17, the glass can be conveniently inserted into the accommodating chamber 12 through the insertion port 17, and the glass after reaction can be conveniently taken out directly from the insertion port 17.
And the elastic sealing element 18 is arranged to ensure that the accommodating cavity 12 has certain tightness, so that the etching liquid in the accommodating cavity 12 has certain pressure, and the etching liquid is ensured to be in full contact with the glass surface, so as to ensure that the glass surface is subjected to erosion reaction uniformly.
In order to continuously input the etching solution into the etching apparatus 10, in an embodiment of the present disclosure, as shown in fig. 1 and fig. 2, the etching thinning system 100 further includes a pipeline conveying assembly, the etching solution inlet 14 is disposed at the bottom of the accommodating cavity 12, the number of the etching solution inlets 14 is multiple, the etching solution inlets 14 are respectively located at two sides of the clamping groove 16, the pipeline conveying assembly includes an input pipeline 22, and all the etching solution inlets 14 are communicated with the input pipeline 22. The pumped etching liquid is input into the accommodating cavity 12 from two sides of the glass through the etching liquid inlet 14 through the input pipeline 22, so that the etching liquid can flow upwards from two sides of the glass, the two sides of the glass are uniformly contacted with the glass to generate an erosion reaction, and the pressure at two sides of the glass can be kept in a balanced state in the reaction process, so that the glass can be effectively protected from being damaged due to pressure difference. In the related art, if the glass is etched on one side, the surface of the glass plate which is not etched needs to be protected by an acid-resistant film.
Moreover, the arrangement of the plurality of inlets is helpful for ensuring that the flow rate of the etching liquid flowing through each area of the glass surface is consistent, thereby ensuring that the etching reaction performed on each area of the glass surface is consistent.
In one embodiment, as shown in fig. 2, the etching liquid outlets 15 are opened on the top wall, and the number of the etching liquid outlets is multiple and respectively disposed on two sides of the clamping groove 16, the pipeline conveying assembly includes an output pipeline 23, and all the etching liquid outlets 15 are communicated with the output pipeline 23. The arrangement of the etching liquid inlets 14 and the etching liquid outlets 15 helps to discharge the etching liquid in the containing chamber 12, which has been reacted, from the containing chamber 12 as soon as possible, and carry away particles and deposits which may be generated by the erosion reaction.
In order to ensure that the etching liquid in the accommodating cavity 12 has a certain pressure, in one embodiment of the present disclosure, the number of the etching liquid inlets 14 is greater than the number of the etching liquid outlets 15, so that the accommodating cavity 12 can be always filled with the etching liquid having a certain pressure, and the etching liquid is ensured to fully react with the glass. In addition, the etching liquid inlet 14 and the etching liquid outlet 15 are arranged non-coaxially, in other words, the etching liquid inlet 14 and the etching liquid outlet 15 are arranged in a staggered manner, so that the etching liquid entering from the inlet is fully reacted with the glass and then discharged from the outlet, and the etching liquid entering from the etching liquid inlet 14 is prevented from being directly discharged from the etching liquid outlet 15 without being reacted with the glass.
In order to control the flow rate of the etching liquid in the etching apparatus 10, in one embodiment of the present disclosure, as shown in fig. 1, the pipeline transportation assembly further includes a first flow regulating valve 24 and a second flow regulating valve 25, the first flow regulating valve 24 is disposed on the input pipeline 22, and the second flow regulating valve 25 is disposed on the output pipeline 23. The flow and the pressure of the etching liquid in the etching device 10 can be controlled according to the specific requirements of etching thinning by adjusting the first flow adjusting valve 24 and the second flow adjusting valve 25, so that the etching liquid and the glass can be fully and uniformly reacted.
The specific valves used for the first flow regulating valve 24 and the second flow regulating valve 25 in the present disclosure are not limited as long as the flow of the etching liquid in the corresponding pipeline can be regulated, and may be, for example, one or more of a regulating valve, a V-shaped valve, an angle valve, a needle valve, a butterfly valve, and a diaphragm valve.
In order to improve the utilization rate of the etching solution, in an embodiment of the present disclosure, as shown in fig. 1, the etching thinning system 100 further includes a filter 26, an inlet of the filter 26 is communicated with the etching solution outlet 15, and an outlet of the filter 26 is communicated with the etching solution inlet 14. The etching liquid after the reaction enters the filtering device 26 through the output pipeline 23, and after precipitates and glass particles generated by the reaction in the etching liquid are filtered by the filtering device 26, the etching liquid is sent back to the etching device 10 again through the input pipeline 22, so that the etching liquid can be fully utilized, and the use value of the etching liquid is ensured to be maximized.
In order to enable the etching liquid in the etching and thinning system 100 to circulate, in an embodiment of the present disclosure, the pipeline conveying assembly further includes a first pump 21 and a second pump 27, the filtering device 26, and the first pump 21 are sequentially communicated, an outlet of the first pump 21 is communicated with the etching liquid inlet 14, and an inlet of the second pump 27 is communicated with the etching liquid outlet 15.
The first pump 21 and the second pump 27 provide power for the circular flow of the etching liquid in the whole etching and thinning system 100, and ensure that the etching liquid reaches a preset flow rate and pressure when flowing through the etching device 10, so that the etching liquid can fully and uniformly perform an erosion reaction with the glass.
In order to enable the etching reaction to be sufficiently performed, in one embodiment of the present disclosure, as shown in fig. 1, the etching and thinning system 100 further includes a constant temperature device 30 capable of maintaining a constant temperature, the constant temperature device 30 includes a container 31, and the etching device 10 is disposed in the container 31.
In the present disclosure, there is no limitation on how the thermostatic device 30 can ensure the constant temperature state of the etching apparatus 10 located in the container 31, and in one embodiment, the thermostatic device 30 is a temperature-controlled ultrasonic water bath device, the container 31 is filled with water, and the ultrasonic wave source 32 is disposed at the bottom of the temperature-controlled ultrasonic water bath device. The bottom of the temperature-controlled ultrasonic water bath device is also provided with a heating wire 33, so that the erosion reaction process is kept at a constant temperature.
The ultrasonic wave generated by the ultrasonic wave source 32 arranged at the bottom can further and fully peel off the sediment and glass particles generated by the etching liquid and the glass through the erosion reaction.
In order to increase the etching thinning efficiency of the etching thinning system 100, in one embodiment, as shown in fig. 1, a plurality of etching devices 10 may be disposed at intervals in the container 31 of the same constant temperature device 30, and the plurality of etching devices 10 may be insulated at the same time.
In other embodiments, the constant temperature state of the etching apparatus 10 may be maintained by continuously supplying water of the same temperature into the container 31 of the constant temperature apparatus 30.
To ensure that there is sufficient etching liquid in the etching thinning system 100, as shown in fig. 1, in one embodiment of the present disclosure, the etching thinning system 100 further includes a reservoir 40, an outlet of the reservoir 40 being in communication with an inlet of the first pump 21. The reservoir 40 and the first pump 21 may also be provided with regulating valves to control the flow of the etching liquid delivered from the reservoir 40 to the inlet line 22. The prepared etching solution is stored in a solution storage tank and can be sent to the input pipeline 22 through a pipeline, and the solution storage tank 40 can be also provided with a temperature control system, and the etching solution in the tank body can be conveyed to the etching device 10 after being kept at a constant temperature in advance.
In the present disclosure, Polytetrafluoroethylene (PTFE) or polyvinyl chloride (PVC), preferably Polytetrafluoroethylene (PTFE), may be used for the etching apparatus 10 and the input pipeline 22 and the output pipeline 23 of the pipeline conveying assembly, and these materials have corrosion resistance, wear resistance, aging resistance, heat resistance and certain mechanical strength, so as to be able to bear the corrosiveness of the etching liquid.
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (10)
1. The utility model provides an sculpture attenuate system, its characterized in that, includes etching device (10) and pipeline conveying component, etching device (10) is including having casing (11) that holds chamber (12), it is provided with fixed knot structure (13) that are used for upright fixed glass in chamber (12) to hold, casing (11) are provided with be used for lasting to hold chamber (12) and supply etching liquid's etching liquid inlet (14), the top of casing (11) is provided with etching liquid export (15).
2. The etching and thinning system according to claim 1, wherein the fixing structure (13) is a clamping groove (16), the housing (11) comprises opposite side walls, and opposite bottom and top walls, the top wall is provided with the etching liquid outlet (15), and the inner sides of the bottom wall and the side walls are provided with the clamping groove (16) for fixing the glass.
3. The etching and thinning system according to claim 2, wherein the slot (16) is configured as a U-shaped structure, an insertion opening (17) is opened on the top wall, the insertion opening (17) is disposed at the opening of the U-shaped structure, the etching apparatus (10) further comprises an elastic sealing member (18), and the elastic sealing member (18) is openably disposed at the insertion opening (17) to seal the insertion opening (17).
4. The etching and thinning system according to claim 2, wherein the etching and thinning system (100) further comprises a pipeline conveying assembly, the etching liquid inlets (14) are arranged at the bottom of the accommodating cavity (12), the number of the etching liquid inlets (14) is multiple, the etching liquid inlets (14) are respectively located at two sides of the clamping groove (16), the pipeline conveying assembly comprises an input pipeline (22), and all the etching liquid inlets (14) are communicated with the input pipeline (22).
5. The etching and thinning system according to claim 4, wherein the etching liquid outlets (15) are formed in the top wall, a plurality of etching liquid outlets are formed in the top wall and are respectively arranged on two sides of the clamping groove (16), the pipeline conveying assembly comprises an output pipeline (23), and all the etching liquid outlets (15) are communicated with the output pipeline (23).
6. Etching thinning system according to claim 5, characterized in that the number of etching liquid inlets (14) is greater than the number of etching liquid outlets (15), and in that the etching liquid inlets (14) are arranged non-coaxially with the etching liquid outlets (15).
7. The etch thinning system of claim 5, wherein the conduit transfer assembly further comprises a first flow regulating valve (24) and a second flow regulating valve (25), the first flow regulating valve (24) being disposed on the input conduit (22), the second flow regulating valve (25) being disposed on the output conduit (23).
8. Etching thinning system according to claim 1, characterized in that the etching thinning system (100) further comprises a filter device (26), an inlet of the filter device (26) being in communication with the etching liquid outlet (15), an outlet of the filter device (26) being in communication with the etching liquid inlet (14).
9. The etching and thinning system according to claim 8, wherein the pipeline conveying assembly further comprises a first pump (21) and a second pump (27), the filtering device (26) and the first pump (21) are sequentially communicated, an outlet of the first pump (21) is communicated with the etching liquid inlet (14), and an inlet of the second pump (27) is communicated with the etching liquid outlet (15).
10. Etching thinning system according to claim 1, characterized in that the etching thinning system (100) further comprises a thermostat (30) capable of maintaining a constant temperature, the thermostat (30) comprising a container (31), the etching device (10) being arranged within the container (31).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110414307.6A CN113213769B (en) | 2021-04-16 | 2021-04-16 | Etching thinning system |
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| CN202110414307.6A CN113213769B (en) | 2021-04-16 | 2021-04-16 | Etching thinning system |
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| CN113213769A true CN113213769A (en) | 2021-08-06 |
| CN113213769B CN113213769B (en) | 2023-09-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114394759A (en) * | 2021-12-24 | 2022-04-26 | 凯盛科技股份有限公司蚌埠华益分公司 | Glass single-side thinning method and glass thinning equipment |
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| CN206751657U (en) * | 2017-05-08 | 2017-12-15 | 伊犁正佳特种玻璃有限公司 | A kind of glass production stripping apparatus |
| CN110316970A (en) * | 2019-05-31 | 2019-10-11 | 中国建筑材料科学研究总院有限公司 | The preparation method of ultra-thin quartz glass piece |
| CN112358194A (en) * | 2020-11-16 | 2021-02-12 | 凯盛科技集团有限公司 | Etching and thinning device and method for extremely-thin glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201883035U (en) * | 2010-12-08 | 2011-06-29 | 深圳市科达超声自动化设备有限公司 | Etching machine for thinning glass |
| CN106904839A (en) * | 2017-03-31 | 2017-06-30 | 中国工程物理研究院电子工程研究所 | A kind of masking method of glass corrosion |
| CN206751657U (en) * | 2017-05-08 | 2017-12-15 | 伊犁正佳特种玻璃有限公司 | A kind of glass production stripping apparatus |
| CN110316970A (en) * | 2019-05-31 | 2019-10-11 | 中国建筑材料科学研究总院有限公司 | The preparation method of ultra-thin quartz glass piece |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114394759A (en) * | 2021-12-24 | 2022-04-26 | 凯盛科技股份有限公司蚌埠华益分公司 | Glass single-side thinning method and glass thinning equipment |
| CN114394759B (en) * | 2021-12-24 | 2023-08-01 | 凯盛科技股份有限公司蚌埠华益分公司 | Glass single-sided thinning method and glass thinning equipment |
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| CN113213769B (en) | 2023-09-15 |
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