CN113213769B - Etching thinning system - Google Patents
Etching thinning system Download PDFInfo
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- CN113213769B CN113213769B CN202110414307.6A CN202110414307A CN113213769B CN 113213769 B CN113213769 B CN 113213769B CN 202110414307 A CN202110414307 A CN 202110414307A CN 113213769 B CN113213769 B CN 113213769B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- Chemical Kinetics & Catalysis (AREA)
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- Surface Treatment Of Glass (AREA)
Abstract
The utility model relates to an etching attenuate system, this etching system include etching device and pipeline conveying component, etching device is including having the casing that holds the chamber, it is provided with the fixed knot who is used for standing fixed glass to hold the intracavity, the casing be provided with be used for lasting to hold the etching liquid import of chamber feed etching liquid, the top of casing is provided with the etching liquid export. The glass to be thinned is placed into the accommodating cavity of the etching device, the glass is fixed in an upright state through the fixing structure, and etching liquid filled in the accommodating cavity can be completely and uniformly contacted with the surface of the glass, so that the problem of inconsistent local etching of the surface of the glass is solved. The particles or the sediments generated in the erosion reaction are not easy to adhere to the surface of the glass in an upright state, and the etching liquid flowing continuously from the surface of the glass can wash and carry away the sediments and the particles generated in the erosion reaction.
Description
Technical Field
The disclosure relates to the technical field of thinning, in particular to an etching thinning system.
Background
With the continuous updating of electronic display technology, flat panel display products are being developed towards light and thin and high performance, and the thinning of flat panel display glass is the most critical factor for the light and thin flat panel display products. The method for thinning the flat display glass mainly comprises a physical thinning method and a chemical thinning method, wherein the physical thinning method is to grind and polish the glass by rotating a polishing disk and adding a polishing agent, but the method has low efficiency, easy defect generation and lower yield. The chemical thinning method mainly uses etching liquid mainly comprising hydrofluoric acid (HF) to chemically react with the surface of glass so as to achieve the purpose of thinning the glass. The chemical thinning method has stable etching rate, small physical loss and lower cost, and is a very important and potential thinning method.
At present, the main implementation methods of chemical thinning include a soaking method and a spraying method. The soaking method is to vertically put glass into a groove filled with etching liquid for soaking and thinning, and precipitates or particles generated by reaction in the process of etching the glass by the etching liquid are easy to adhere to the glass, so that the surface effect of the etched glass is affected and the cleaning process is affected. The spraying method is to spray etching liquid onto the surface of glass for etching and thinning by specific equipment, and the method can lead to uneven etching reaction on the surface of the glass and is easy to generate defects such as pits, scratches and the like.
Disclosure of Invention
It is an object of the present disclosure to provide an etch thinning system that at least partially solves the above-mentioned problems.
In order to achieve the above-mentioned purpose, the present disclosure provides an etching thinning system, which includes an etching device and a pipeline conveying assembly, the etching device includes a housing having a housing cavity, a fixing structure for vertically fixing glass is provided in the housing cavity, the housing is provided with an etching liquid inlet for continuously supplying etching liquid to the housing cavity, and an etching liquid outlet is provided at the top of the housing.
Optionally, the pipeline conveying assembly comprises a first pump, an inlet of the first pump is communicated with the etching liquid outlet, and an outlet of the first pump is communicated with the etching liquid inlet.
Optionally, the fixed knot constructs for the draw-in groove, the casing includes relative lateral wall that sets up and diapire and the roof that sets up relatively, set up on the roof etching solution export, the inboard of diapire with all set up on the inboard of lateral wall be used for fixing the draw-in groove of glass.
Optionally, the card slot is configured into a U-shaped structure, the top wall is provided with an insertion port, the insertion port is arranged at an opening of the U-shaped structure, and the etching device further comprises an elastic sealing element, and the elastic sealing element is arranged at the insertion port in an openable manner so as to seal the insertion port.
Optionally, the etching and thinning system further comprises a pipeline conveying assembly, the etching liquid inlets are arranged at the bottom of the accommodating cavity, the number of the etching liquid inlets is multiple, the etching liquid inlets are respectively located at two sides of the clamping groove, and the pipeline conveying assembly comprises an input pipeline, and all the etching liquid inlets are communicated with the input pipeline.
Optionally, the etching solution outlet is arranged on the top wall, the number of the etching solution outlets is multiple and respectively arranged on two sides of the clamping groove, and the pipeline conveying assembly comprises an output pipeline, and all the etching solution outlets are communicated with the output pipeline.
Optionally, the number of the etching liquid inlets is greater than the number of the etching liquid outlets, and the etching liquid inlets and the etching liquid outlets are not coaxially arranged.
Optionally, the pipeline conveying assembly further comprises a first flow regulating valve and a second flow regulating valve, wherein the first flow regulating valve is arranged on the input pipeline, and the second flow regulating valve is arranged on the output pipeline.
Optionally, the etching thinning system further comprises a filtering device, an inlet of the filtering device is communicated with the etching liquid outlet, and an outlet of the filtering device is communicated with the etching liquid inlet.
Optionally, the pipeline conveying assembly further comprises a first pump and a second pump, the filtering device and the first pump are sequentially communicated, an outlet of the first pump is communicated with the etching liquid inlet, and an inlet of the second pump is communicated with the etching liquid outlet.
Optionally, the etching thinning system further comprises a constant temperature device capable of keeping constant temperature, the constant temperature device comprises a container, and the etching device is arranged in the container.
The technical scheme at least can achieve the following technical effects:
through the technical scheme, glass to be thinned is placed into the accommodating cavity of the etching device, the glass is fixed in an upright state through the fixing structure, etching liquid is introduced into the accommodating cavity from the etching liquid inlet, so that the etching liquid fills the accommodating cavity and reacts with the surface of the glass in an etching manner, and in addition, the etching liquid enters the accommodating cavity from the etching liquid inlet and flows out from the etching liquid outlet, so that liquid flow is generated on the surface of the glass. The etching liquid outlet arranged at the top of the shell enables etching liquid to flow out from the etching liquid outlet after the etching liquid inlet enters the accommodating cavity and is fully filled with the accommodating cavity, the etching liquid filled with the accommodating cavity can be fully and uniformly contacted with the glass surface, and the problem of inconsistent local etching of the glass surface is solved. The particles or the sediments generated in the erosion reaction are not easy to adhere to the surface of the glass in an upright state, and the etching liquid flowing continuously from the surface of the glass can wash away and take away the sediments and the sediments generated in the erosion reaction, so that the defects of protruding points and the like generated by the adhesion of the sediments and the sediments on the glass are effectively avoided.
Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:
FIG. 1 is a schematic perspective view of an etch thinning system according to an embodiment of the present disclosure;
FIG. 2 is a schematic front view of an etching apparatus of an etching thinning system according to an embodiment of the present disclosure;
fig. 3 is a perspective schematic view of an etching apparatus of an etching thinning system according to an embodiment of the present disclosure.
Description of the reference numerals
100-etching and thinning system; 10-etching device; 11-a housing; 12-a receiving cavity; 13-a fixed structure; 14-etching liquid inlet; 15-an etching liquid outlet; 16-clamping grooves; 17-an insertion port; 18-an elastic seal; 21-a first pump; 22-input pipeline; 23-an output line; 24-a first flow regulating valve; 25-a second flow regulating valve; 26-a filtration device; 27-a second pump; 30-a constant temperature device; 31-a container; 32-an ultrasonic source; 33-heating wires; 40-a liquid storage tank.
Detailed Description
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the disclosure, are not intended to limit the disclosure.
In this disclosure, unless otherwise indicated, the term "upper" and "lower" are used to generally refer to "upper" and "lower" when the etching and thinning system 100 is in normal use, and reference may be made to the orientation of the drawing as shown in fig. 1-3, wherein "top" and "bottom" correspond to "upper" and "lower", "inner" and "outer" respectively refer to the inner and outer of the profile of the associated component. Furthermore, the terms "first," "second," and the like, as used in embodiments of the present disclosure, are used for distinguishing one element from another and not for order or importance. The top of the bottom is correspondingly up and down.
In order to be able to increase the yield of the etch-down of glass, as shown in fig. 1-3, an etch-down system 100 is provided in the present disclosure that includes an etching apparatus 10 and a tubing transport assembly. The etching device 10 comprises a housing 11 with a receiving chamber 12. A fixing structure 13 for vertically fixing the glass is provided in the accommodating chamber 12. The housing 11 is provided with an etching liquid inlet 14 for continuously supplying an etching liquid to the accommodating chamber 12, and the top of the housing 11 is provided with an etching liquid outlet 15. The etching liquid can be continuously supplied into the accommodating chamber 12 through the inlet of the pump and the etching liquid inlet 14, and the etching liquid outlet 15 is communicated with the outlet of the pump, so that the etching liquid can fill the accommodating chamber 12 and flow on the glass surface.
The etching and thinning system 100 in the present disclosure may be applied to etching and thinning glass, and may also be applied to products such as liquid crystal panels that need to be etched and thinned, which is not limited in this disclosure. For convenience of explanation, the etching thinning system 100 will be hereinafter described as applied to glass thinning as an example.
Through the above technical scheme, glass to be thinned is placed into the accommodating cavity 12 of the etching device 10, the glass is fixed in an upright state through the fixing structure 13, etching liquid is introduced into the accommodating cavity 12 from the etching liquid inlet 14, so that the etching liquid fills the accommodating cavity 12 and reacts with the surface of the glass, and the etching liquid enters the accommodating cavity 12 from the etching liquid inlet 14 and flows out from the etching liquid outlet 15, so that liquid flow is generated on the surface of the glass. The etching liquid outlet 15 arranged at the top of the shell 11 enables etching liquid to flow out from the etching liquid outlet 15 after the etching liquid enters the accommodating cavity 12 from the etching liquid inlet 14 and is fully filled in the accommodating cavity 12, and the etching liquid filled in the accommodating cavity 12 can be fully and uniformly contacted with the glass surface, so that the problem of inconsistent local etching of the glass surface is solved. The particles or the sediments generated in the erosion reaction are not easy to adhere to the surface of the glass in an upright state, and the etching liquid flowing continuously from the surface of the glass can wash away and take away the sediments and the sediments generated in the erosion reaction, so that the defects of protruding points and the like generated by the adhesion of the sediments and the sediments on the glass are effectively avoided.
In one embodiment of the present disclosure, as shown in fig. 3, the fixing structure 13 is a slot 16, and the housing 11 includes opposite side walls and opposite bottom and top walls. The etching liquid outlet 15 is formed in the top wall, and the clamping grooves 16 for fixing glass are formed in the inner side of the bottom wall and the inner side of the side wall, so that the glass is fixed in the accommodating cavity 12 in an upright state through the clamping grooves 16 in the side wall and the bottom wall. The etching liquid can enter the clamping groove 16, and the clamping groove 16 does not shade the surface of the glass, so that all the surfaces of the glass can be in contact and react with the etching liquid. Optionally, the width of the clamping groove 16 is greater than the thickness of the glass, so that etching liquid can enter the clamping groove 16 to perform erosion reaction with the edge of the glass, and all surfaces of the glass can be thinned.
Optionally, the bottom wall of the housing 11 is provided with the etching solution inlet 14, and the clamping groove 16 on the side wall is communicated with the clamping groove 16 on the bottom wall. Etching liquid flows through the glass surface from bottom to top and reacts with the glass surface in an erosion way.
In other embodiments, a clasp may be provided within the receiving chamber 12 into which the glass is inserted to secure the glass.
The particular shape of the card slot 16 is not limited in this disclosure, and in one embodiment, the card slot 16 is configured in a U-shaped configuration as shown in FIG. 3. The top wall of the accommodating cavity 12 is provided with an inserting port 17, the inserting port 17 is arranged at the opening of the U-shaped structure, the etching device 10 further comprises an elastic sealing element 18, and the elastic sealing element 18 is arranged at the inserting port 17 in an openable and closable manner so as to seal the inserting port 17. In the initial state, the elastic seal 18 closes and seals the insertion port 17.
The glass is inserted into the accommodating chamber 12 through the insertion opening 17 provided in the top wall and is engaged with the card slot 16, and when the glass is inserted into the insertion opening 17, the elastic seal 18 is pushed to open the insertion opening 17, so that the glass is inserted, and when the glass is completely inserted into the card slot 16, the elastic seal 18 is restored by the action of external force, so that the insertion opening 17 is sealed. By providing the elastic seal member 18, the sealability of the accommodating chamber 12 can be increased, volatilization of the etching liquid from the insertion port 17 can be prevented, insertion of glass into the accommodating chamber 12 through the insertion port 17 is facilitated, and the glass after completion of the reaction can be taken out directly from the insertion port 17.
And the elastic sealing element 18 ensures that the accommodating cavity 12 has certain tightness, so that etching liquid in the accommodating cavity 12 has certain pressure, and the etching liquid is ensured to be fully contacted with the glass surface, so that the glass surface is ensured to be uniformly subjected to corrosion reaction.
In order to continuously input the etching solution into the etching apparatus 10, in one embodiment of the present disclosure, as shown in fig. 1 and 2, the etching and thinning system 100 further includes a pipe conveying assembly, the etching solution inlets 14 are disposed at the bottom of the accommodating cavity 12, and the number of the etching solution inlets 14 is plural, the etching solution inlets 14 are respectively disposed at two sides of the clamping groove 16, the pipe conveying assembly includes an input pipe 22, and all the etching solution inlets 14 are communicated with the input pipe 22. The pumped etching liquid is input into the accommodating cavity 12 from two sides of the glass through the etching liquid inlet 14 via the input pipeline 22, so that the etching liquid can flow upwards from two sides of the glass, and the etching liquid uniformly contacts the glass at two sides of the glass to perform an erosion reaction, and the pressure at two sides of the glass can be kept to reach an equilibrium state in the reaction process, so that the glass can be effectively protected from being damaged due to pressure difference. In the related art, if the glass is etched on one side, the surface of the glass plate which is not etched is protected by an acid-resistant film.
Furthermore, by providing a plurality of inlets, it is helpful to ensure that the flow rates of the etching liquid flowing from each region of the glass surface are uniform, thereby ensuring that the etching reactions carried out by each region of the glass surface are uniform.
In the present disclosure, the number of the etching solution outlets 15 is not limited, in one embodiment, as shown in fig. 2, the etching solution outlets 15 are formed in the top wall, and the number of the etching solution outlets is plural and respectively disposed on two sides of the clamping groove 16, and the pipeline conveying assembly includes an output pipeline 23, where all the etching solution outlets 15 are communicated with the output pipeline 23. By arranging a plurality of etching liquid inlets 14 and etching liquid outlets 15, it is facilitated that the etching liquid having reacted in the accommodating chamber 12 is discharged from the accommodating chamber 12 as soon as possible, taking away particulate matter and deposits that may be generated by the etching reaction.
In order to ensure that the etching solution in the accommodating cavity 12 has a certain pressure, in one embodiment of the present disclosure, the number of etching solution inlets 14 is greater than the number of etching solution outlets 15, so that the accommodating cavity 12 can be always filled with the etching solution having a certain pressure, and the etching solution is ensured to react with the glass sufficiently. In addition, the etching liquid inlet 14 and the etching liquid outlet 15 are arranged in a non-coaxial manner, in other words, the etching liquid inlet 14 and the etching liquid outlet 15 are arranged in a staggered manner, so that the etching liquid entering from the inlet is discharged from the outlet after fully reacting with the glass, and the etching liquid entering from the etching liquid inlet 14 is prevented from being directly discharged from the etching liquid outlet 15 without reacting with the glass.
In order to be able to control the flow of etching liquid in the etching apparatus 10, in one embodiment of the present disclosure, as shown in fig. 1, the pipe transfer assembly further includes a first flow adjustment valve 24 and a second flow adjustment valve 25, the first flow adjustment valve 24 being disposed on the input pipe 22, and the second flow adjustment valve 25 being disposed on the output pipe 23. The flow rate and the pressure of the etching liquid in the etching device 10 can be controlled according to the specific requirements of etching thinning by adjusting the first flow rate adjusting valve 24 and the second flow rate adjusting valve 25, so that the etching liquid and the glass can be ensured to react fully and uniformly.
The specific valves used for the first flow rate adjusting valve 24 and the second flow rate adjusting valve 25 in the present disclosure are not limited, as long as the flow rate of the etching liquid in the corresponding pipeline can be adjusted, and may be, for example, one or more of an adjusting valve, a V-valve, an angle valve, a needle valve, a butterfly valve, and a diaphragm valve.
In order to improve the utilization of the etching solution, in one embodiment of the present disclosure, as shown in fig. 1, the etching and thinning system 100 further includes a filtering device 26, where an inlet of the filtering device 26 is in communication with the etching solution outlet 15, and an outlet of the filtering device 26 is in communication with the etching solution inlet 14. The reacted etching liquid enters the filtering device 26 through the output pipeline 23, and after sediment and glass particles generated by the reaction in the etching liquid are filtered by the filtering device 26, the etching liquid is sent back to the etching device 10 again through the input pipeline 22, so that the etching liquid can be fully utilized, and the use value of the etching liquid is ensured to be maximized.
In order to enable circulation of the etching solution within the etching and thinning system 100, in one embodiment of the present disclosure, the pipeline transportation assembly further includes a first pump 21 and a second pump 27, the filtering device 26, and the first pump 21 are sequentially communicated, an outlet of the first pump 21 is communicated with the etching solution inlet 14, and an inlet of the second pump 27 is communicated with the etching solution outlet 15.
The first pump 21 and the second pump 27 provide power for the circulating flow of the etching liquid in the entire etching and thinning system 100, and ensure that the etching liquid reaches a preset flow rate and pressure when flowing through the etching device 10, so that the etching liquid and glass are sufficiently and uniformly subjected to an etching reaction.
In order to enable the etching reaction to sufficiently proceed, in one embodiment of the present disclosure, as shown in fig. 1, the etching thinning system 100 further includes a constant temperature device 30 capable of maintaining a constant temperature, the constant temperature device 30 including a container 31, and the etching device 10 is disposed within the container 31.
In the present disclosure, there is no limitation on how the constant temperature device 30 is used to ensure the constant temperature state of the etching device 10 located in the container 31, and in one embodiment, the constant temperature device 30 is a temperature-controlled ultrasonic water bath device, water is contained in the container 31, and the ultrasonic source 32 is disposed at the bottom of the temperature-controlled ultrasonic water bath device. The bottom of the temperature-controlled ultrasonic water bath device is also provided with a heating wire 33, so that the erosion reaction process is kept at a constant temperature.
The ultrasonic wave generated by the ultrasonic source 32 arranged at the bottom can further and sufficiently peel the sediment and glass particles generated by the erosion reaction of the etching liquid and the glass from the surface of the glass.
In order to increase the etching and thinning efficiency of the etching and thinning system 100, in one embodiment, as shown in fig. 1, a plurality of etching devices 10 may be disposed in the container 31 of the same constant temperature device 30 at intervals, while the plurality of etching devices 10 are insulated.
In other embodiments, the constant temperature state of the etching apparatus 10 may be maintained by continuously supplying water of the same temperature into the container 31 of the constant temperature apparatus 30.
To ensure that there is sufficient etching solution in the etching-thinning system 100, as shown in fig. 1, in one embodiment of the present disclosure, the etching-thinning system 100 further includes a liquid reservoir 40, an outlet of the liquid reservoir 40 being in communication with an inlet of the first pump 21. The reservoir 40 and the first pump 21 may also be provided with a regulating valve to control the flow of etching liquid from the reservoir 40 to the input line 22. The prepared etching liquid is stored in a liquid storage tank and can be sent to the input pipeline 22 through a pipeline, the liquid storage tank 40 can be further provided with a temperature control system, and the etching liquid in the tank body can be conveyed to the etching device 10 after being kept at a constant temperature in advance.
In the present disclosure, polytetrafluoroethylene (PTFE) or polyvinyl chloride (PVC), preferably Polytetrafluoroethylene (PTFE), may be used as the input line 22, the output line 23, etc. of the etching apparatus 10 and the line delivery assembly, and these materials have corrosion resistance, wear resistance, aging resistance, heat resistance, and a certain mechanical strength, so as to be able to withstand the corrosiveness of the etching liquid.
The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.
In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations.
Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.
Claims (8)
1. An etching thinning system is characterized by comprising an etching device (10) and a pipeline conveying assembly, wherein the etching device (10) comprises a shell (11) with a containing cavity (12), a fixing structure (13) for vertically fixing glass is arranged in the containing cavity (12), the shell (11) is provided with an etching liquid inlet (14) for continuously supplying etching liquid to the containing cavity (12), and the top of the shell (11) is provided with an etching liquid outlet (15);
the etching liquid inlets (14) are arranged at the bottom of the accommodating cavity (12), the number of the etching liquid inlets (14) is a plurality of, the number of the etching liquid inlets (14) is greater than the number of the etching liquid outlets (15), and the etching liquid inlets (14) and the etching liquid outlets (15) are arranged in a non-coaxial mode;
the pipeline conveying assembly comprises an input pipeline (22), an output pipeline (23), a first flow regulating valve (24) and a second flow regulating valve (25), wherein all etching liquid inlets (14) are communicated with the input pipeline (22), all etching liquid outlets (15) are communicated with the output pipeline (23), the first flow regulating valve (24) is arranged on the input pipeline (22), and the second flow regulating valve (25) is arranged on the output pipeline (23).
2. The etching and thinning system according to claim 1, wherein the fixing structure (13) is a clamping groove (16), the housing (11) comprises a side wall which is oppositely arranged, a bottom wall and a top wall which are oppositely arranged, the top wall is provided with the etching liquid outlet (15), and the inner side of the bottom wall and the inner side of the side wall are provided with the clamping groove (16) for fixing the glass.
3. The etching and thinning system according to claim 2, wherein the clamping groove (16) is configured into a U-shaped structure, the top wall is provided with an insertion opening (17), the insertion opening (17) is arranged at an opening of the U-shaped structure, the etching device (10) further comprises an elastic sealing element (18), and the elastic sealing element (18) is arranged at the insertion opening (17) in an openable manner so as to seal the insertion opening (17).
4. The etching and thinning system according to claim 2, wherein the etching liquid inlets (14) are respectively located at both sides of the clamping groove (16).
5. The etching and thinning system according to claim 4, wherein the etching liquid outlets (15) are opened at the top wall, and the number of the etching liquid outlets is plural and respectively provided at both sides of the card slot (16).
6. The etching and thinning system according to claim 1, characterized in that the etching and thinning system (100) further comprises a filter device (26), an inlet of the filter device (26) being in communication with the etching liquid outlet (15), an outlet of the filter device (26) being in communication with the etching liquid inlet (14).
7. The etching and thinning system according to claim 6, wherein the pipeline conveying assembly further comprises a first pump (21) and a second pump (27), the filtering device (26) and the first pump (21) are sequentially communicated, an outlet of the first pump (21) is communicated with the etching liquid inlet (14), and an inlet of the second pump (27) is communicated with the etching liquid outlet (15).
8. The etching and thinning system according to claim 1, wherein the etching and thinning system (100) further comprises a thermostat device (30) capable of maintaining a constant temperature, the thermostat device (30) comprising a container (31), the etching device (10) being arranged within the container (31).
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| CN202110414307.6A CN113213769B (en) | 2021-04-16 | 2021-04-16 | Etching thinning system |
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| CN202110414307.6A CN113213769B (en) | 2021-04-16 | 2021-04-16 | Etching thinning system |
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| CN113213769A CN113213769A (en) | 2021-08-06 |
| CN113213769B true CN113213769B (en) | 2023-09-15 |
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| CN114394759B (en) * | 2021-12-24 | 2023-08-01 | 凯盛科技股份有限公司蚌埠华益分公司 | Glass single-sided thinning method and glass thinning equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201883035U (en) * | 2010-12-08 | 2011-06-29 | 深圳市科达超声自动化设备有限公司 | Etching machine for thinning glass |
| CN106904839A (en) * | 2017-03-31 | 2017-06-30 | 中国工程物理研究院电子工程研究所 | A kind of masking method of glass corrosion |
| CN206751657U (en) * | 2017-05-08 | 2017-12-15 | 伊犁正佳特种玻璃有限公司 | A kind of glass production stripping apparatus |
| CN110316970A (en) * | 2019-05-31 | 2019-10-11 | 中国建筑材料科学研究总院有限公司 | The preparation method of ultra-thin quartz glass piece |
| CN112358194A (en) * | 2020-11-16 | 2021-02-12 | 凯盛科技集团有限公司 | Etching and thinning device and method for extremely-thin glass |
-
2021
- 2021-04-16 CN CN202110414307.6A patent/CN113213769B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201883035U (en) * | 2010-12-08 | 2011-06-29 | 深圳市科达超声自动化设备有限公司 | Etching machine for thinning glass |
| CN106904839A (en) * | 2017-03-31 | 2017-06-30 | 中国工程物理研究院电子工程研究所 | A kind of masking method of glass corrosion |
| CN206751657U (en) * | 2017-05-08 | 2017-12-15 | 伊犁正佳特种玻璃有限公司 | A kind of glass production stripping apparatus |
| CN110316970A (en) * | 2019-05-31 | 2019-10-11 | 中国建筑材料科学研究总院有限公司 | The preparation method of ultra-thin quartz glass piece |
| CN112358194A (en) * | 2020-11-16 | 2021-02-12 | 凯盛科技集团有限公司 | Etching and thinning device and method for extremely-thin glass |
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