CN113211302A - Diamond structure grinding disc for grinding semiconductor substrate - Google Patents
Diamond structure grinding disc for grinding semiconductor substrate Download PDFInfo
- Publication number
- CN113211302A CN113211302A CN202110539930.4A CN202110539930A CN113211302A CN 113211302 A CN113211302 A CN 113211302A CN 202110539930 A CN202110539930 A CN 202110539930A CN 113211302 A CN113211302 A CN 113211302A
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- CN
- China
- Prior art keywords
- grinding
- peripheral wall
- diamond
- semiconductor substrate
- boss
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/16—Bushings; Mountings
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a diamond structure grinding disc for grinding a semiconductor substrate, which comprises a base disc; the base disc is provided with a plurality of bosses, a gap is reserved between every two adjacent bosses and forms a flow channel, the end surfaces of the bosses are provided with convex parts, the end surfaces of the convex parts are concavely provided with grooves which horizontally penetrate through, and the grooves are communicated with the flow channel; the boss is sleeved with an abrasive block, the abrasive block is prepared from diamond abrasive particles and a metal bonding agent and comprises a peripheral wall and a honeycomb structure formed in the peripheral wall, and a plurality of holes arranged in a penetrating mode are formed in the honeycomb structure; the peripheral wall of the grinding block is sleeved outside the convex part, the honeycomb structure is positioned on the convex part, and the hole is communicated with the groove up and down. It has the following advantages: the holes, the grooves and the flow channels are communicated, so that grinding fluid can flow, the flowing uniformity is improved, the cooling and chip removal effects can be realized, and the cooling and chip removal performance is improved; the holes are arranged to improve the self-sharpening performance of the grinding block and improve the grinding efficiency.
Description
Technical Field
The invention relates to a grinding tool, in particular to a diamond structure grinding disc for grinding a semiconductor substrate.
Background
Semiconductor substrate materials such as sapphire, single crystal silicon carbide and single crystal diamond have the characteristics of high hardness, high brittleness, good abrasion resistance and corrosion resistance and the like, and are widely used as substrate materials of chips for aerospace, consumer electronics, LED illumination, display and the like. As a chip substrate, the surface thereof needs to be processed ultra-precisely, so as to realize an ultra-smooth surface without damage. The high hardness and brittleness of these semiconductor substrate materials make their processing challenging. Grinding is an important process for processing a semiconductor substrate, and has an important influence on realizing efficient precision processing of the semiconductor substrate.
Currently, free abrasive grinding, semi-fixed abrasive grinding and fixed abrasive grinding are mainly used as grinding processing modes for semiconductor substrates. Free abrasive grinding has the problems of low processing efficiency, uneven processing surface, low utilization rate of the abrasive, great environmental pollution and the like. Compared with free abrasive grinding, semi-fixed abrasive grinding can improve the processing efficiency and the surface type precision of the substrate to a certain extent, but the improvement range is limited, and the grinding tool is difficult to trim and recycle. The grinding efficiency of the fixed abrasive is high, the surface shape precision of the substrate is good, the requirement of rapid thinning of the substrate can be met, but the grinding of the fixed abrasive has serious surface and sub-surface damage. In order to control the grinding damage of the fixed abrasive, a fine-grained diamond grinding disc needs to be selected, however, the fine-grained diamond grinding disc is easy to wear and easy to block.
Disclosure of Invention
The present invention provides a diamond-structured abrasive disk for semiconductor substrate grinding which overcomes the disadvantages of the background art.
The technical scheme adopted by the invention for solving the technical problem is as follows: a diamond structure abrasive disc for semiconductor substrate grinding comprises a base disc; the base disc is provided with a plurality of bosses, a gap is reserved between every two adjacent bosses and forms a flow channel, the end surfaces of the bosses are provided with convex parts, the end surfaces of the convex parts are concavely provided with grooves which horizontally penetrate through, and the grooves are communicated with the flow channel; the boss is sleeved with an abrasive block, the abrasive block is prepared from diamond abrasive particles and a metal bonding agent and comprises a peripheral wall and a honeycomb structure formed in the peripheral wall, and a plurality of holes arranged in a penetrating mode are formed in the honeycomb structure; the peripheral wall of the grinding block is sleeved outside the convex part, the honeycomb structure is positioned on the convex part, and the hole is communicated with the groove up and down.
In one embodiment: the cross section of the boss is of a regular polygon or circular structure, the outer contour of the cross section of the peripheral wall of the grinding block is equal to that of the cross section of the boss, and the inner contour of the cross section of the peripheral wall of the grinding block is similar to that of the cross section of the boss.
In one embodiment: the cross section outline of the hole is similar to that of the lug boss.
In one embodiment: the regular polygon is a regular quadrangle, a regular hexagon or a regular octagon.
In one embodiment: the end face of the convex part is concavely provided with a plurality of grooves which are arranged in parallel at intervals and are in a strip shape.
In one embodiment: the end face of the convex part is concavely provided with a plurality of grooves which are arranged into a # -shaped structure.
In one embodiment: the outer end face of the peripheral wall is flush with the outer end face of the honeycomb structure.
In one embodiment: the metal bond is at least one of resin bond or ceramic bond, and the diamond abrasive particles are at least one of cubic desalinization, silicon carbide or silicon oxide.
In one embodiment: the base plate also comprises a base body, wherein the base body comprises an inner peripheral wall and an outer peripheral wall, the outer peripheral wall is sleeved outside the inner peripheral wall, an installation cavity is formed between the inner peripheral wall and the outer peripheral wall, and the boss is fixedly arranged in the installation cavity.
In one embodiment: the two end faces of the boss are convexly provided with protruding parts, and the protruding parts above and below the boss are provided with grinding blocks and grinding discs to form a double-sided grinding disc.
Compared with the background technology, the technical scheme has the following advantages:
the abrasive disc includes the basal disc, the basal disc is equipped with the boss, form to the runner between every two adjacent bosss, the bellying is established to the boss terminal surface, the concave slot that runs through of bellying terminal surface is equipped with the level, slot and runner are linked together, the cover is equipped with the abrasive brick on the boss, the abrasive brick includes perisporium and honeycomb, form the hole on the honeycomb, the perisporium cover of abrasive brick is established outside the bellying and honeycomb is located the bellying, hole and slot are linked together from top to bottom, honeycomb, boss and runner cooperate in order to produce following technological effect: 1. the holes, the grooves and the flow channel are communicated, so that grinding fluid can flow, the flow uniformity is improved, the cooling and chip removal effects can be realized, the cooling and chip removal performances are improved, on one hand, chips are discharged out of the grinding disc to avoid blockage, and on the other hand, the abrasive particle cutting edge is timely updated, so that the damage to the surface and the sub-surface of a workpiece can be reduced, and the better substrate surface quality can be obtained; 2. the holes are arranged to improve the self-sharpening performance of the grinding block and improve the grinding efficiency.
The cross section of the boss is of a regular polygon or circular structure, the cross section outer contour of the peripheral wall of the grinding block is equal to that of the boss, the cross section inner contour of the peripheral wall of the grinding block is similar to that of the boss, the cross section contour of the hole is similar to that of the boss, the assembly is convenient, and the cooling and chip removal performance is further improved.
The regular polygon is a regular quadrangle, a regular hexagon or a regular octagon, and the self-sharpening performance of the grinding block is further improved.
The protruding part terminal surface is equipped with many above-mentioned grooves of concave, and many grooves parallel interval arrangement just are the strip, further promote the chip removal performance.
The metal bond is at least one of resin bond or ceramic bond, and the diamond abrasive particles are at least one of cubic desalinization, silicon carbide or silicon oxide, and have high self-sharpening performance.
Drawings
The invention is further described with reference to the following figures and detailed description.
Fig. 1 is a perspective view of an embodiment of an abrasive disk.
FIG. 2 is a schematic top view of an embodiment of an abrasive disk.
FIG. 3 is a perspective view of an embodiment boss.
FIG. 4 is a schematic top view of an embodiment boss.
FIG. 5 is a left side schematic view of an embodiment boss.
Fig. 6 is a perspective view of an embodiment abrasive block.
Fig. 7 is a schematic top view of an embodiment abrasive block.
Figure 8 is one of the perspective views of an embodiment of the boss and block mating.
Figure 9 is a second perspective view of the embodiment of the boss and block mating.
Figure 10 is a third perspective view of an embodiment of a boss and block engagement.
Detailed Description
Referring to fig. 1 to 10, a diamond-structured polishing pad for polishing a semiconductor substrate includes a base pad 1; the base disc 1 is provided with a plurality of bosses 2, a gap is reserved between every two adjacent bosses 2 and forms a flow channel 21, the end face of each boss 2 is provided with a convex part 22, the end face of each convex part 22 is concavely provided with a groove 23 which horizontally penetrates through, and the groove 23 is communicated with the flow channel 21; the boss 2 is sleeved with a grinding block 3, the grinding block 3 is prepared from diamond abrasive particles and a metal bonding agent and comprises a peripheral wall 31 and a honeycomb structure 32 formed in the peripheral wall 31, the outer end face of the peripheral wall 31 is flush with the outer end face of the honeycomb structure 32, the lower end of the honeycomb structure 32 is higher than the bottom end of the peripheral wall, so that a groove body located below the honeycomb structure is formed in the peripheral wall, and a plurality of holes 33 arranged in a penetrating mode are formed in the honeycomb structure 32; the peripheral wall 31 of the block 3 is fitted over the raised portion 22 and the honeycomb structure 32 is supported on the raised portion 22, i.e. the groove body is fitted over the raised portion, and the holes 33 and the grooves 23 are in up-and-down communication. The metal bond is at least one of resin bond or ceramic bond, the diamond abrasive particles are at least one of cubic desalinization (CBN), silicon carbide or silicon oxide, and the particle size of the abrasive particles can be selected according to needs. The base plate 1 further comprises a base body, the base body comprises an inner peripheral wall and an outer peripheral wall, the outer peripheral wall is sleeved outside the inner peripheral wall, an installation cavity is formed between the inner peripheral wall and the outer peripheral wall, the boss 2 is fixedly installed in the installation cavity, and other structures are also exploited as required. The abrasive brick 3 is used for grinding, has the hole because of honeycomb 32, can improve the abrasive brick on the one hand from sharp nature, and on the other hand hole, slot 23 and runner 21 intercommunication can supply the lapping liquid to flow, can play cooling and chip removal effect again, improve chip removal, cooling performance, in order to avoid blockking up outside the bits discharge grinding disk.
The cross section of the boss 2 is of a regular polygon or circular structure, the cross section outer contour of the peripheral wall of the grinding block 3 is equal to that of the boss 2, and the cross section inner contour of the peripheral wall of the grinding block 3 is similar to that of the boss 2 so that the peripheral wall of the grinding block can be sleeved outside the boss 2 in a matching manner. The cross section outline of the hole 33 is similar to that of the boss 2, the regular polygon is a regular hexagon, other regular polygons such as a regular quadrangle or a regular octagon can be adopted according to the requirement, and other structures such as a circle can be adopted without adopting the regular polygon according to the requirement.
The end face of the protrusion 22 is concavely provided with a plurality of grooves 232, and a plurality of grooves 23 are arranged in parallel at intervals and are in a strip shape. The plurality of grooves may also be arranged in a cross-hatched configuration, as desired.
According to the requirement, the two end surfaces of the lug boss are convexly provided with the convex parts, the upper convex part and the lower convex part of the lug boss are provided with the grinding blocks, and the grinding disc forms a double-sided grinding disc, or only one end surface is convexly provided with the convex part, and the single-sided grinding disc is formed.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (10)
1. A diamond structure abrasive disc for semiconductor substrate grinding which characterized in that: comprises a basal disc; the base disc is provided with a plurality of bosses, a gap is reserved between every two adjacent bosses and forms a flow channel, the end surfaces of the bosses are provided with convex parts, the end surfaces of the convex parts are concavely provided with grooves which horizontally penetrate through, and the grooves are communicated with the flow channel; the boss is sleeved with an abrasive block, the abrasive block is prepared from diamond abrasive particles and a metal bonding agent and comprises a peripheral wall and a honeycomb structure formed in the peripheral wall, and a plurality of holes arranged in a penetrating mode are formed in the honeycomb structure; the peripheral wall of the grinding block is sleeved outside the convex part, the honeycomb structure is positioned on the convex part, and the hole is communicated with the groove up and down.
2. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the cross section of the boss is of a regular polygon or circular structure, the outer contour of the cross section of the peripheral wall of the grinding block is equal to that of the cross section of the boss, and the inner contour of the cross section of the peripheral wall of the grinding block is similar to that of the cross section of the boss.
3. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 2, wherein: the cross section outline of the hole is similar to that of the lug boss.
4. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 2, wherein: the regular polygon is a regular quadrangle, a regular hexagon or a regular octagon.
5. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the end face of the convex part is concavely provided with a plurality of grooves which are arranged in parallel at intervals and are in a strip shape.
6. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the end face of the convex part is concavely provided with a plurality of grooves which are arranged into a # -shaped structure.
7. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the outer end face of the peripheral wall is flush with the outer end face of the honeycomb structure.
8. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the metal bond is at least one of resin bond or ceramic bond, and the diamond abrasive particles are at least one of cubic desalinization, silicon carbide or silicon oxide.
9. A diamond-structured grinding disk for grinding a semiconductor substrate according to claim 1, wherein: the base plate also comprises a base body, wherein the base body comprises an inner peripheral wall and an outer peripheral wall, the outer peripheral wall is sleeved outside the inner peripheral wall, an installation cavity is formed between the inner peripheral wall and the outer peripheral wall, and the boss is fixedly arranged in the installation cavity.
10. The diamond-structured grinding disk for grinding a semiconductor substrate according to claim 9, wherein: the two end faces of the boss are convexly provided with protruding parts, and the protruding parts above and below the boss are provided with grinding blocks and grinding discs to form a double-sided grinding disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110539930.4A CN113211302A (en) | 2021-05-18 | 2021-05-18 | Diamond structure grinding disc for grinding semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110539930.4A CN113211302A (en) | 2021-05-18 | 2021-05-18 | Diamond structure grinding disc for grinding semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113211302A true CN113211302A (en) | 2021-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110539930.4A Pending CN113211302A (en) | 2021-05-18 | 2021-05-18 | Diamond structure grinding disc for grinding semiconductor substrate |
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| Country | Link |
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| CN (1) | CN113211302A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113967856A (en) * | 2021-08-23 | 2022-01-25 | 卢秀梅 | Accelerometer sapphire pendulous reed processing method and pendulous reed light reflection amplification method precision pendulum angle measurement |
| CN114274060A (en) * | 2021-11-23 | 2022-04-05 | 北京安泰钢研超硬材料制品有限责任公司 | Metal-based diamond tool bit for thinning high-end SiC chip, grinding wheel and manufacturing method of metal-based diamond tool bit |
-
2021
- 2021-05-18 CN CN202110539930.4A patent/CN113211302A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113967856A (en) * | 2021-08-23 | 2022-01-25 | 卢秀梅 | Accelerometer sapphire pendulous reed processing method and pendulous reed light reflection amplification method precision pendulum angle measurement |
| CN114274060A (en) * | 2021-11-23 | 2022-04-05 | 北京安泰钢研超硬材料制品有限责任公司 | Metal-based diamond tool bit for thinning high-end SiC chip, grinding wheel and manufacturing method of metal-based diamond tool bit |
| CN114274060B (en) * | 2021-11-23 | 2023-12-01 | 北京安泰钢研超硬材料制品有限责任公司 | Metal-based diamond tool bit for thinning SiC chip, grinding wheel and manufacturing method of metal-based diamond tool bit |
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