CN113210879A - Screen chamfering method - Google Patents
Screen chamfering method Download PDFInfo
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- CN113210879A CN113210879A CN202010053736.0A CN202010053736A CN113210879A CN 113210879 A CN113210879 A CN 113210879A CN 202010053736 A CN202010053736 A CN 202010053736A CN 113210879 A CN113210879 A CN 113210879A
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- Prior art keywords
- screen
- cutting
- sub
- pulse
- chamfering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention relates to the field of screen processing, and discloses a screen chamfering processing method, which comprises the following steps: adjusting the relative position of the screen and the laser according to the identification points arranged on the screen to determine the accurate relative position of the screen; adjusting the setting parameters of the laser to generate a cutting beam having specified pulse envelope characteristics; and acquiring a preset optimized cutting path matched with the accurate relative position of the screen, and cutting the corners of the screen according to the preset optimized cutting path by using the cutting light beam with the specified pulse envelope characteristic. The screen chamfering processing method provided by the invention can improve the processing efficiency of the screen chamfering, improve the processing quality of the screen chamfering, and simultaneously reduce the processing cost of the screen chamfering.
Description
Technical Field
The invention belongs to the field of screen processing, and particularly relates to a screen chamfering processing method.
Background
With the rapid development of the mobile phone industry, more and more mobile phones use the bang screen or the water drop screen as the mobile phone screen for the purpose of improving the screen occupation ratio. When the bang screen or the water drop screen is produced, the chamfer angle of the mobile phone screen needs to be processed. The existing screen chamfering processing method mainly adopts a CNC engraving and milling machine to grind an angle of a mobile phone screen. Concretely, CNC CNC engraving and milling machine utilizes the grinding rod to carry out the secondary grinding to the chamfer that needs to process.
However, the following disadvantages exist in the screen corner grinding by adopting the CNC engraving and milling machine: the processing speed is low; the grinding rod needs to be replaced periodically; the precision is not high, and if the grinding is excessive, the liquid crystal flows out; a large amount of glass cullet is produced. These disadvantages reduce the efficiency and quality of the chamfering process of the mobile phone screen.
Disclosure of Invention
The invention aims to provide a screen chamfering processing method to solve the problems of low efficiency and low quality of mobile phone screen chamfering processing in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: provided is a screen chamfering processing method, including:
adjusting the relative position of the screen and the laser according to the identification points arranged on the screen to determine the accurate relative position of the screen;
adjusting the setting parameters of the laser to generate a cutting beam having specified pulse envelope characteristics;
and acquiring a preset optimized cutting path matched with the accurate relative position of the screen, and cutting the corners of the screen according to the preset optimized cutting path by using the cutting light beam with the specified pulse envelope characteristic.
Optionally, the screen includes a first glass layer and a second glass layer laminated to each other, and a liquid crystal layer between the first glass layer and the second glass layer.
Optionally, the cutting beam with the specified pulse envelope characteristic includes a specified number of sub-pulses, the duration of the sub-pulses is less than 100ps, and the time interval between two adjacent sub-pulses is greater than 100 ns.
Optionally, the cutting beam with the specified pulse envelope characteristic includes any two adjacent sub-pulses, where the intensity of the sub-pulse in the first time sequence is greater than the intensity of the sub-pulse in the second time sequence.
Optionally, the cutting beam with the specified pulse envelope characteristic includes any two adjacent sub-pulses, and the intensity of the sub-pulse in the later time sequence is 0.4-0.9 times that of the sub-pulse in the earlier time sequence.
Optionally, the cutting beam with the specified pulse envelope characteristic includes any two adjacent sub-pulses, and the intensity of the sub-pulse in the later time sequence is 0.7 times that of the sub-pulse in the earlier time sequence.
Optionally, the energy of one of the cutting beams with the specified pulse envelope characteristic is in the range of 30-80 μ J.
Optionally, the setting parameters of the laser include:
the distance between cutting points is 1-2 μm;
the fundamental frequency of the light source is 100 kHz;
the cutting speed is 50-80 mm/s;
the power of the light source is 4W;
the focus position is positive focus.
Optionally, the corners of the screen include an R corner, a C corner, and a U corner;
the cutting processing mode of the connecting part of the corner and the edge of the screen is external cutting.
Optionally, the C-angle is a 45-degree edge chamfer or fillet;
the R angle is a 45-degree edge chamfer or fillet.
The screen chamfering processing method provided by the invention has the beneficial effects that: compared with the prior art, the screen chamfering processing method greatly improves the processing speed of the screen chamfering; compared with a CNC engraving and milling machine, the screen chamfering time is reduced to 10s from the original 30 s; the screen is processed and obtained by using a laser processing method, the surface is clean and tidy, and the original complex cleaning procedure (the original cleaning procedure needs to soak the processed screen with distilled water to remove glass scraps) is not needed; in addition, the laser processing does not need to consume consumables such as grinding rods, and the cost of screen chamfering processing is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic plan view of a screen to be processed in a screen chamfering method according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating energy changes of sub-pulses in a cutting beam in the screen chamfering method according to the embodiment of the present invention;
fig. 3 is a schematic structural diagram of performing special processing on an edge in the screen chamfering method according to the embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, a screen chamfering method according to the present invention will now be described. The screen chamfering processing method comprises the following steps:
adjusting the relative position of the screen and the laser according to the identification point 04 arranged on the screen to determine the accurate relative position of the screen;
adjusting the setting parameters of the laser to generate a cutting beam having specified pulse envelope characteristics;
and acquiring a preset optimized cutting path matched with the accurate relative position of the screen, and cutting the corners of the screen according to the preset optimized cutting path by using the cutting light beam with the specified pulse envelope characteristic.
The screen chamfering method provided by the embodiment can be applied to laser cutting equipment. Specifically, the light source of the laser cutting equipment can be an ultrafast laser. The laser generated by the ultrafast laser has the advantages of short pulse width, high peak power and small cutting heat affected zone.
As shown in fig. 1, an identification point 04 is provided on the screen for determining the exact relative position of the screen. In one embodiment, the laser cutting device is provided with an alignment mechanism, and whether the screen to be processed is put in place can be determined by referring to the identification points 04 on the screen. At this time, the accurate relative position refers to a position where the screen needs to be accurately placed. At least two identification points 04 are arranged on the screen, and the relative positions of the screen and the laser in the horizontal plane and the vertical direction are respectively adjusted through the alignment mechanism according to the positions of the identification points. The relative position of the screen and the laser in the vertical direction is adjusted to ensure that the focal point of the laser generated by the light source acts on the screen. And adjusting the relative positions of the screen and the laser on the horizontal plane to ensure that the focal point of the laser generated by the light source acts on the corner dividing part to be cut of the screen. At this time, the preset optimized cutting path matched with the exact relative position of the screen may be fixed. The preset optimized cutting path can be a movement path of the laser or a movement path of the screen. That is, when the precise relative position of the screen is determined, the laser may cut the screen according to the preset optimized cutting path without re-planning the preset optimized cutting path.
In another embodiment, the laser cutting device is provided with image recognition means. The image recognition apparatus may determine the precise three-dimensional coordinates of the screen based on the identification points 04 provided on the screen (at this time, the number of the identification points 04 is at least two). The relative position of the screen and the laser in the vertical direction can be adjusted according to the vertical coordinate in the precise three-dimensional coordinate (namely the z-axis coordinate in the three-dimensional coordinate system) so as to ensure that the focus of the laser generated by the light source acts on the screen. The optimized cutting path can be planned and preset according to the plane coordinate in the accurate three-dimensional coordinate. The preset optimized cutting path can be a movement path of the laser or a movement path of the screen. The replanned preset optimized cutting path may be a path of the initial optimized cutting path after coordinate translation. And if the coordinate translation amount is zero, the preset optimized cutting path is the initial optimized cutting path.
The setting parameters of the laser can be adjusted according to the physical characteristics of the screen to be cut. The laser setup parameters include, but are not limited to, cutting speed, spot separation, fundamental frequency, power, focal position. The laser may generate a cutting beam having specified pulse envelope characteristics. A cutting beam having a specified pulse envelope characteristic refers to a laser beam comprising several sub-pulses. The energy, duration, and time interval between sub-pulses of each sub-pulse may be set on the laser. The corners of the screen have good cutting effect only when the cutting beam has a specified pulse envelope characteristic. The specified pulse envelope characteristics of the corresponding cutting beams of screens of different sizes and materials are also different.
A preset optimized cutting path matching the exact relative position of the screen can be obtained. The preset optimized cutting path may be an initial optimized cutting path determined according to the corner position to be cut on the screen, or may be a cutting path obtained by adjusting the initial optimized cutting path based on the precise relative position of the screen. After generating the cutting light beam with the designated pulse envelope characteristic, the laser or the screen moves along a preset optimized cutting path, a cut is generated on the screen, and the processing of the corners of the screen is realized.
Optionally, the screen includes a first glass layer and a second glass layer laminated to each other, and a liquid crystal layer between the first glass layer and the second glass layer.
In this embodiment, the screen to be processed includes a first glass layer, a second glass layer, and a liquid crystal layer. The liquid crystal layer is between the first glass layer and the second glass layer. The screen may be a TFT (Thin Film Transistor) liquid crystal screen.
Optionally, the cutting beam with the specified pulse envelope characteristic includes a specified number of sub-pulses, the duration of the sub-pulses is less than 100ps, and the time interval between two adjacent sub-pulses is greater than 100 ns.
In one example, a cutting beam having a specified pulse envelope characteristic includes a specified number of sub-pulses. As shown in fig. 2, the specified number may be 5. The duration of each sub-pulse is less than 100ps (i.e. 10)-10s) and the time interval between two adjacent sub-pulses is greater than 100ns (i.e. 10)-7s)。
Optionally, the cutting beam with the specified pulse envelope characteristic includes any two adjacent sub-pulses, where the intensity of the sub-pulse in the first time sequence is greater than the intensity of the sub-pulse in the second time sequence. In particular, the cutting beam having the specified pulse envelope characteristic comprises any two adjacent sub-pulses, the intensity of the subsequent sub-pulse being 0.4-0.9 times the intensity of the preceding sub-pulse.
In the present embodiment, in the cutting beam with the specified pulse envelope characteristic, the intensity of the sub-pulse in the time sequence before is greater than the intensity of the sub-pulse in the time sequence after. And cutting the screen by utilizing the faded-down sub-pulses so as to realize a good corner cutting effect. Through a plurality of experiments of the inventor, in any two adjacent sub-pulses included in the cutting light beam with the specified pulse envelope characteristic, the intensity of the sub-pulse with the later time sequence is controlled to be 0.4-0.9 times of the intensity of the sub-pulse with the earlier time sequence, and the cutting effect of the screen corner is better than that of the other sub-pulse in the intensity range. In particular, the intensity of the subsequent sub-pulse is 0.7 times the intensity of the previous sub-pulse.
Optionally, the energy of one of the cutting beams with the specified pulse envelope characteristic is in the range of 30-80 μ J.
In this embodiment, the overall energy of the cutting beam needs to be controlled. In the process of corner cutting, one cutting point corresponds to one cutting light beam. The energy of the cutting beam is too high, which causes the phenomena of screen edge breakage or liquid crystal leakage. And if the energy of the cutting beam is too low, a hanging angle (which means that the corner to be cut is not completely separated from the screen) is generated, and the processing quality of the screen is affected. Through a plurality of tests of the inventor, the energy range of the cutting light beam is 30-80 muJ, and the cutting light beam has a better cutting effect. In particular, the energy of the cutting beam may be set to 40 μ J.
Optionally, the setting parameters of the laser include:
the distance between cutting points is 1-2 μm;
the fundamental frequency of the light source is 100 kHz;
the cutting speed is 50-80 mm/s;
the power of the light source is 4W;
the focus position is positive focus.
In this embodiment, when the cutting beam generated by the laser is used to cut the corner of the screen, appropriate setting parameters need to be used. These setting parameters include: the distance between cutting points is 1-2 μm; the fundamental frequency of the light source is 100 kHz; the cutting speed is 50-80 mm/s; the power of the light source is 4W; the focus position is positive focus. Wherein, need set up suitable point interval, the point interval is too big, and the corner that the cutting produced and the separation effect of screen are not good, and the point interval undersize can influence cutting speed. Tests show that the screen corners cut by the point spacing of 1 mu m have fine and smooth effect and good stress strength. The laser may be a light source with a fundamental frequency of 100 kHz. The cutting speed of the laser can reach 50-80mm/s, which is greater than the angle grinding speed of the CNC engraving and milling machine. The power of the laser may be 4W. The power of the laser is affected by the energy of the cutting beam, the spot spacing, and the cutting speed. The focal position of the laser can be selected as positive focus, and the cutting effect of the positive focus is better compared with other focal positions.
Optionally, the corners of the screen include an R corner 01, a C corner 02, and a U corner 03;
the cutting processing mode of the connecting part of the corner and the edge of the screen is external cutting.
In this embodiment, the corners to be processed on the screen include an R corner 01, a C corner 02, and a U corner 03. The R corners 01 refer to two corners at the top of the screen (in fig. 1, the top of the screen is on the left side). The R-corner 01 may be a 45 degree edge chamfer or fillet. The C-corners 02 refer to the two corners at the bottom of the screen (in fig. 1, the top of the screen is on the right side). Likewise, the C-corner 02 may be a 45 degree edge chamfer or fillet. The U-angle 03 refers to a machining position for arranging the camera position when machining the full screen. The U-corner 03 can have different shapes, such as the U-corner 03 of the liu screen in fig. 1, and the U-corner 03 of the drip screen in fig. 3.
When the corners of the screen are cut, a special processing mode can be used for optimizing the cutting effect. As shown in fig. 3, the parts in each elliptical circle are optimized by a special processing mode. Here, the special processing optimization refers to cutting the corners of the screen in an external cutting mode. The external cutting refers to that the cutting line is subjected to certain angle treatment, so that the hanging angle and the cutting residue are reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A screen chamfering processing method is characterized by comprising the following steps:
adjusting the relative position of the screen and the laser according to the identification points arranged on the screen to determine the accurate relative position of the screen;
adjusting the setting parameters of the laser to generate a cutting beam having specified pulse envelope characteristics;
and acquiring a preset optimized cutting path matched with the accurate relative position of the screen, and cutting the corners of the screen according to the preset optimized cutting path by using the cutting light beam with the specified pulse envelope characteristic.
2. The screen chamfering method according to claim 1, wherein the screen includes a first glass layer and a second glass layer laminated to each other, and a liquid crystal layer interposed between the first glass layer and the second glass layer.
3. The screen chamfering method according to claim 1, wherein the cutting beam having the designated pulse envelope characteristic includes a designated number of sub-pulses, the duration of the sub-pulses is less than 100ps, and the time interval between adjacent two sub-pulses is greater than 100 ns.
4. The screen chamfering method according to claim 3, wherein the cutting beam having the designated pulse envelope characteristic includes any two adjacent sub-pulses, an intensity of a sub-pulse preceding in time series is greater than an intensity of a sub-pulse succeeding in time series.
5. The screen chamfering method according to claim 4, wherein the cutting beam having the designated pulse envelope characteristic includes any two adjacent sub-pulses, the intensity of a sub-pulse subsequent to the time series being 0.4 to 0.9 times the intensity of a sub-pulse prior to the time series.
6. The screen chamfering method according to claim 5, wherein the cutting beam having the designated pulse envelope characteristic includes any two adjacent sub-pulses, the intensity of a sub-pulse subsequent in time series is 0.7 times the intensity of a sub-pulse prior in time series.
7. The screen chamfering method as claimed in claim 1, wherein an energy of one of the cutting beams having the designated pulse envelope characteristic is in a range of 30 to 80 μ J.
8. The screen chamfering processing method of claim 1, wherein the setting parameters of the laser include:
the distance between cutting points is 1-2 μm;
the fundamental frequency of the light source is 100 kHz;
the cutting speed is 50-80 mm/s;
the power of the light source is 4W;
the focus position is positive focus.
9. The screen chamfering processing method of claim 1, wherein the corners of the screen include an R corner, a C corner, and a U corner;
the cutting processing mode of the connecting part of the corner and the edge of the screen is external cutting.
10. The screen chamfering processing method of claim 9, wherein the C-angle is a 45 degree edge chamfer or a fillet;
the R angle is a 45-degree edge chamfer or fillet.
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| CN202010053736.0A CN113210879A (en) | 2020-01-17 | 2020-01-17 | Screen chamfering method |
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| CN202010053736.0A CN113210879A (en) | 2020-01-17 | 2020-01-17 | Screen chamfering method |
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