CN113207311A - 一种半导体元件巨量转移方法和系统 - Google Patents

一种半导体元件巨量转移方法和系统 Download PDF

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CN113207311A
CN113207311A CN201980004149.8A CN201980004149A CN113207311A CN 113207311 A CN113207311 A CN 113207311A CN 201980004149 A CN201980004149 A CN 201980004149A CN 113207311 A CN113207311 A CN 113207311A
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outlet
semiconductor element
inlet
electric field
target
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CN113207311B (zh
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张朋月
黄嘉桦
陈淑枝
陈柏辅
郑士嵩
林子平
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Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
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Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明提供了一种半导体元件的巨量转移系统，用于将设置于临时基板的半导体元件转移至目标基板。所述转移系统包括加速设备，所述加速设备设有沿第一方向的加速电场、以及沿所述第一方向设置且与所述加速电场连通的第一入口和第一出口；旋转设备，所述旋转设备设有沿第二方向的磁场、以及与所述磁场连通的第二入口和第二出口，所述第二入口与所述第一出口对准。此外，本发明还提供一种半导体元件的巨量转移方法。所述方法包括放置所述临时基板于所述第一入口处，并将所述第一入口对准需要转移至所述目标基板的目标半导体元件；利用所述加速电场对所述目标半导体元件进行加速；利用所述磁场改变所述目标半导体元件的运动方向；安装所述目标半导体元件于所述目标基板。

Description

PCT国内申请，说明书已公开。

Claims (23)

  1. PCT国内申请，权利要求书已公开。
CN201980004149.8A 2019-12-03 2019-12-03 一种半导体元件巨量转移方法和系统 Active CN113207311B (zh)

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Citations (12)

* Cited by examiner, † Cited by third party
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US20110127856A1 (en) * 2008-07-23 2011-06-02 Georges Lochak Magnetic monopole accelerator
CN102446693A (zh) * 2011-11-29 2012-05-09 邱永红 一种带电粒子的加速方法及其应用
CN105883420A (zh) * 2016-04-22 2016-08-24 京东方科技集团股份有限公司 一种基板传送装置
WO2016160322A1 (en) * 2015-04-01 2016-10-06 Sxaymiq Technologies Llc Electrostatic cleaning device
US20170154919A1 (en) * 2015-11-27 2017-06-01 Innolux Corporation Manufacturing method of display with lighting devices
CN106816451A (zh) * 2015-11-27 2017-06-09 群创光电股份有限公司 微型发光显示装置及其制造方法
CN107685539A (zh) * 2017-09-22 2018-02-13 京东方科技集团股份有限公司 喷墨打印喷头、喷墨量测量系统和方法及喷墨量控制方法
CN108526468A (zh) * 2018-04-25 2018-09-14 西北工业大学 模拟微重力环境中金属液滴3d打印的物理系统及打印方法
CN108807213A (zh) * 2017-04-27 2018-11-13 宏碁股份有限公司 微小元件的转移方法及微小元件转移装置
US20190067510A1 (en) * 2017-08-16 2019-02-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Transferring device and transferring method of micro light emitting diode
CN109548396A (zh) * 2018-11-29 2019-03-29 上海九山电子科技有限公司 微型发光二极管芯片的巨量转移系统以及方法
CN110335844A (zh) * 2019-06-17 2019-10-15 华中科技大学 一种基于选择性加热去磁的MicroLED巨量转移装置及方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110127856A1 (en) * 2008-07-23 2011-06-02 Georges Lochak Magnetic monopole accelerator
CN102446693A (zh) * 2011-11-29 2012-05-09 邱永红 一种带电粒子的加速方法及其应用
WO2016160322A1 (en) * 2015-04-01 2016-10-06 Sxaymiq Technologies Llc Electrostatic cleaning device
US20170154919A1 (en) * 2015-11-27 2017-06-01 Innolux Corporation Manufacturing method of display with lighting devices
CN106816451A (zh) * 2015-11-27 2017-06-09 群创光电股份有限公司 微型发光显示装置及其制造方法
CN105883420A (zh) * 2016-04-22 2016-08-24 京东方科技集团股份有限公司 一种基板传送装置
CN108807213A (zh) * 2017-04-27 2018-11-13 宏碁股份有限公司 微小元件的转移方法及微小元件转移装置
US20190067510A1 (en) * 2017-08-16 2019-02-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Transferring device and transferring method of micro light emitting diode
CN107685539A (zh) * 2017-09-22 2018-02-13 京东方科技集团股份有限公司 喷墨打印喷头、喷墨量测量系统和方法及喷墨量控制方法
CN108526468A (zh) * 2018-04-25 2018-09-14 西北工业大学 模拟微重力环境中金属液滴3d打印的物理系统及打印方法
CN109548396A (zh) * 2018-11-29 2019-03-29 上海九山电子科技有限公司 微型发光二极管芯片的巨量转移系统以及方法
CN110335844A (zh) * 2019-06-17 2019-10-15 华中科技大学 一种基于选择性加热去磁的MicroLED巨量转移装置及方法

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