CN113204933A

CN113204933A - Method and device for determining jointed PCB (printed circuit board), electronic equipment and storage medium

Info

Publication number: CN113204933A
Application number: CN202110471598.2A
Authority: CN
Inventors: 刘新亮; 郑雷
Original assignee: Quectel Wireless Solutions Co Ltd
Current assignee: Quectel Wireless Solutions Co Ltd
Priority date: 2021-04-29
Filing date: 2021-04-29
Publication date: 2021-08-03
Anticipated expiration: 2041-04-29
Also published as: CN113204933B

Abstract

The application relates to a method and a device for determining a PCB jointed board, electronic equipment and a storage medium, and belongs to the technical field of electronics. The method is applied to electronic equipment and comprises the following steps: acquiring basic information and design requirement parameters of a single board; processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard; and outputting the parameters of the jointed board corresponding to the jointed board with the maximum utilization rate. The design rule which gives consideration to the quality and the utilization rate of the jointed boards is obtained by processing jointed board parameters of a plurality of PCB jointed boards which meet the industrial standard, so that the optimal jointed board scheme can be quickly obtained only by inputting basic information and design requirement parameters of a single board when jointed board design is carried out subsequently.

Description

Method and device for determining jointed PCB (printed circuit board), electronic equipment and storage medium

Technical Field

The application belongs to the technical field of electronics, and particularly relates to a method and a device for determining a PCB jointed board, electronic equipment and a storage medium.

Background

In order to meet the production requirements in the electronic industry, the used PCB (Printed Circuit Board) single boards need to be combined into a jointed Board (a large Board formed by combining a plurality of single boards according to a certain rule). The difference in design of the jointed board affects the warpage, the patch precision, the utilization rate of the single board, the speed of board splitting (the single board split by the jointed board is cut by a Computer Numerical Control (CNC) or the like), the wear of the accessories of the board splitting machine, and the like. When the design of the jointed boards is made, the balance between the quality and the utilization rate of the jointed boards cannot be achieved, the design is usually carried out through empirical values, the quality of the jointed boards is improved unilaterally (for example, the quantity of the jointed boards is reduced, the strength of the jointed boards is improved, or the quantity of connecting ribs is increased, the flatness of the jointed boards is improved), the utilization rate and the production efficiency are reduced, or the quality is sacrificed only by considering the utilization rate.

Disclosure of Invention

In view of the above, an object of the present application is to provide a method and an apparatus for determining a jointed board of a PCB, an electronic device and a storage medium, so as to solve the problems of the existing jointed board design that the design cost is high and the quality and the utilization rate of the jointed board cannot be considered.

The embodiment of the application is realized as follows:

in a first aspect, an embodiment of the present application provides a method for determining a jointed PCB board, which is applied to an electronic device, and the method includes: acquiring basic information and design requirement parameters of a single board; processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard; and outputting the parameters of the jointed board corresponding to the jointed board with the maximum utilization rate.

In the embodiment of the application, the design rule which gives consideration to the quality and the utilization rate of the jointed boards is obtained by processing the jointed board parameters of the plurality of PCB jointed boards meeting the industrial standard, so that the optimal jointed board scheme can be quickly obtained only by inputting the basic information and the design requirement parameters of the single boards when the jointed board scheme is subsequently designed. Through the makeup scheme designed by the application, the quality requirement can be met, the maximization of the utilization rate of the makeup and the maximization of the production efficiency can be realized, the cost is effectively reduced, and the problem of design errors is avoided.

With reference to a possible implementation manner of the embodiment of the first aspect, the basic information of the board includes: length of single board, width of single board, thickness of single board, packaging mode; the design requirement parameters include a minimum pad pitch; processing the acquired basic information of the single plates and the design requirement parameters according to preset design rules, and determining multiple parameters of jointed boards formed by the single plates, wherein the parameters comprise: determining the maximum size allowed by the jointed board according to the preset design rule and the minimum pad step pitch; determining the maximum splicing mode allowed by the splicing plate according to the preset design rule, the length of the single plate and the thickness of the single plate; determining the minimum width of the required connecting rib according to the preset design rule and the maximum plate splicing mode; determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single plate and the packaging mode; and determining a plurality of panel parameters of the panel formed by the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum panel mode, the minimum width of the connecting ribs and the minimum width of the process edges.

In the embodiment of the application, the jointed board is designed by obtaining the length of the single board, the width of the single board, the maximum size of the jointed board, the maximum jointed board mode of the jointed board, the minimum width of the connecting rib and the minimum width of the process edge, and based on the comprehensive consideration of the basic elements of the jointed board, the determined jointed board parameters of the jointed board consisting of the single boards can meet the design requirements as much as possible.

With reference to a possible implementation manner of the embodiment of the first aspect, determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single board, and the encapsulation manner includes: determining the minimum number of connecting ribs required by each edge or each corner of the single plate according to the preset design rule, the length of the single plate and the packaging mode; determining the distribution positions of mark points according to the preset design rule and the minimum number of connecting ribs required by each edge or each corner of the single plate, wherein the mark points comprise optical points and bad plate points; and determining the minimum width of the process edge in the X direction according to the preset design rule, the minimum width of the connecting rib and the distribution position of the mark points.

In the embodiment of the application, the minimum number of the connecting ribs required by each edge or each corner of the single plate can be determined according to the preset design rule, the length of the single plate and the packaging mode, then the distribution position of the marking points can be determined according to the preset design rule, the minimum number of the connecting ribs required by each edge or each corner of the single plate, and finally the minimum width of the process edge in the X direction can be determined according to the preset design rule, the minimum width of the connecting ribs and the distribution position of the marking points.

With reference to one possible implementation manner of the embodiment of the first aspect, the method further includes: determining whether a process edge in the Y direction needs to be designed or not according to the preset design rule, the thickness of the single plate and the minimum pad step pitch; and if the Y-direction process edge needs to be designed, determining the minimum width of the Y-direction process edge according to the preset design rule. According to the embodiment of the application, whether Y-direction process edges need to be designed can be determined according to preset design rules, the thickness of a single plate and the minimum pad step pitch, if Y-direction processes need to be designed, then the minimum width of the Y-direction process edges is determined, because the Y-direction process edges are also taken into consideration, through the analysis of the thickness of the single plate and the minimum pad step pitch, whether Y-direction process edges need to be designed can be directly output, if Y-direction process edges need to be designed, the minimum width of the Y-direction process edges can be synchronously output, the requirements of quality and production efficiency can be met simultaneously, and the loss of accessories is reduced.

With reference to one possible implementation manner of the embodiment of the first aspect, the method further includes: determining whether reinforcing ribs are needed or not according to the preset design rule, the length of the single plate and the packaging mode; if the reinforcing ribs are needed, determining the minimum width of the needed reinforcing ribs; correspondingly, according to the length of the single plate, the width of the single plate, the maximum size, the maximum plate splicing mode, the minimum width of the connecting rib and the minimum width of the process edge, determining multiple plate splicing parameters of the plate splicing composed of the single plates, including: and determining a plurality of board splicing parameters of the board splicing composed of the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum board splicing mode, the minimum width of the connecting ribs, the minimum width of the process edges and the minimum width of the required reinforcing ribs.

In the embodiment of the application, through when designing the makeup, whether will need the strengthening rib also to take into account in, because the existence of strengthening rib, can reduce veneer warpage risk, but can reduce the veneer utilization ratio equally, make the cost uncontrolled, whether need the strengthening rib all be engineer according to experience or feel definition during the design makeup in the past, this application is through to veneer length, the analysis of encapsulation mode, whether can the direct output need the strengthening rib, if need the strengthening rib, can the minimum width of synchronous output strengthening rib, can satisfy quality and production efficiency's demand simultaneously, reduce the loss of accessory.

With reference to one possible implementation manner of the embodiment of the first aspect, outputting the tile parameters corresponding to the most-utilized tile includes: determining a first ratio of the sum of the areas of all single plates on the jointed board to the area of the jointed board according to each jointed board scheme; arranging and combining the jointed boards on a preset working plate area, determining a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area, and obtaining the utilization rate of the jointed boards according to the first ratio and the second ratio; and outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate based on the utilization rate of each jointed board. In the embodiment of the application, aiming at each jigsaw scheme, the final comprehensive utilization rate (the product of the first ratio and the second ratio) is obtained by calculating the jigsaw utilization rate (the first ratio of the sum of the areas of all single plates on the jigsaw and the area of the jigsaw) and the working plate utilization rate (the second ratio of the sum of the areas of all the jigsaw on the preset working plate area and the area of the preset working plate area) of the jigsaw scheme, the jigsaw scheme with the maximum comprehensive utilization rate is selected as the optimal jigsaw scheme, the jigsaw utilization rate inside the jigsaw is not only considered, the working plate utilization rate is added at the same time, the comprehensive utilization rate is used as a key parameter for judging the jigsaw cost, the cost can be reduced from a single jigsaw, the production source is expanded, and the effect of cost optimization is ensured to be optimal.

With reference to one possible implementation manner of the embodiment of the first aspect, the preset working plate area includes multiple preset working plate areas; the jointed boards are arranged and combined on a preset working plate area, a second ratio of the sum of the areas of all jointed boards on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jointed boards is obtained according to the first ratio and the second ratio, and the method comprises the following steps: aiming at each preset working plate area, the jointed boards are arranged and combined on the preset working plate area, a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jointed boards on the preset working plate area is obtained according to the first ratio and the second ratio. In the embodiment of the application, through designing various preset working plate areas and calculating the utilization rate of each jointed board in each preset working plate area, the finally determined jointed board scheme is ensured to be the optimal scheme.

In a second aspect, an embodiment of the present application further provides a device for determining a jointed PCB board, which is applied to an electronic device, and the device includes: the device comprises an acquisition module, a processing module and an output module; the acquisition module is used for acquiring the basic information and the design requirement parameters of the single board; the processing module is used for processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard; and the output module is used for outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate.

In a third aspect, an embodiment of the present application further provides an electronic device, including: a memory and a processor, the processor coupled to the memory; the memory is used for storing programs; the processor is configured to invoke a program stored in the memory to perform the method according to the first aspect embodiment and/or any possible implementation manner of the first aspect embodiment.

In a fourth aspect, embodiments of the present application further provide a storage medium, on which a computer program is stored, where the computer program is executed by a processor to perform the method provided in the foregoing first aspect and/or any one of the possible implementation manners of the first aspect.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. The foregoing and other objects, features and advantages of the application will be apparent from the accompanying drawings. Like reference numerals refer to like parts throughout the drawings. The drawings are not intended to be to scale as practical, emphasis instead being placed upon illustrating the subject matter of the present application.

Fig. 1 shows a schematic flow chart of a method for determining a PCB jigsaw provided in an embodiment of the present application.

Fig. 2 shows a schematic flowchart of step S102 in fig. 1 provided in an embodiment of the present application.

Fig. 3 shows a schematic diagram of a jigsaw mode formed by 6 single boards according to an embodiment of the present application.

Fig. 4 shows a schematic structural diagram of a jigsaw provided by the embodiment of the present application.

Fig. 5 is a schematic diagram illustrating the parameters of a puzzle that is most useful for obtaining the corresponding puzzle according to an embodiment of the present application.

Fig. 6 is a schematic diagram illustrating a relationship between a single board, a jointed board and a working board according to an embodiment of the present application.

Fig. 7 is a schematic block diagram illustrating a PCB jigsaw determining apparatus according to an embodiment of the present disclosure.

Fig. 8 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, relational terms such as "first," "second," and the like may be used solely in the description herein to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Further, the term "and/or" in the present application is only one kind of association relationship describing the associated object, and means that three kinds of relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.

In view of the current design of jointed boards, the design is usually performed through empirical values, so that balance between the quality and the utilization rate of the jointed boards cannot be achieved, or the quality of the jointed boards is improved unilaterally (for example, the quantity of the jointed boards is reduced, the strength of the jointed boards is improved, or the quantity of connecting ribs is increased, and the flatness of the jointed boards is improved), so that the utilization rate and the production efficiency are reduced, or the quality is sacrificed only by considering the utilization rate. The embodiment of the application provides a method for determining a PCB jointed board, which is based on the standardization of basic elements of the jointed board, obtains jointed board parameters of various jointed boards formed by single boards through systematic processing after inputting basic information and design requirement parameters of the single boards, and finally outputs the jointed board parameter corresponding to the jointed board with the maximum utilization rate from the parameters of various jointed boards. Through the makeup scheme designed by the application, the quality requirement can be met, the maximization of the utilization rate of the makeup and the maximization of the production efficiency can be realized, the cost is effectively reduced, and the problem of design errors is avoided.

The method for determining the PCB jigsaw provided by the embodiment of the present application will be described with reference to FIG. 1. The method is applied to an electronic device and comprises the following steps:

step S101: obtaining the basic information and design requirement parameters of the single board.

When designing a jigsaw scheme, namely designing parameters of a jigsaw, basic information and design requirement parameters of a single board need to be input, and the electronic equipment can perform subsequent processing by acquiring the basic information and the design requirement parameters of the single board input by a user.

The basic information of the single board comprises: length of single board, width of single board, thickness of single board, and packaging mode. The packaging method includes LCC (lead Chip Carriers, Leadless Chip packages) and LGA (Land Grid Array, Grid Array packages). The design requirement parameters include a minimum pad pitch.

Wherein, the veneer means: the individual, unassembled PCB boards are referred to as veneers. The jigsaw is as follows: the single boards are combined into a large board by a certain rule, and are used for SMT (Surface Mounted technology) production.

Step S102: and processing the acquired basic information of the single plates and the design requirement parameters according to preset design rules to determine multiple parameters of the jointed boards formed by the single plates.

After the electronic equipment acquires the basic information and the design requirement parameters of the single plates input by the user, the acquired basic information and the design requirement parameters of the single plates are processed according to a preset design rule, and therefore the parameters of the jointed boards formed by the multiple single plates can be determined.

The preset design rule is obtained by processing the parameters of the jointed boards of the PCB jointed boards meeting the industrial standard. The jointed board parameters of a plurality of PCB jointed boards meeting the industrial standard are analyzed and processed, and the common attributes and design rules of the jointed boards are learned, so that the design rule compatible with the quality and the utilization rate of the jointed boards is obtained. The PCB jointed board meeting the industrial standard can be a PCB jointed board generally accepted by design personnel in the PCB jointed board design industry, namely the PCB jointed board meeting the industrial standard.

In one embodiment, the processing procedure of step S102 may be as shown in fig. 2. The method comprises the following steps:

step S201: and determining the maximum size allowed by the jointed board according to the preset design rule and the minimum pad step pitch.

For example, preset design rules specify: the minimum pad step distance is less than or equal to 0.20mm, and the maximum allowable size of the jointed board is 100 x 100 mm; 0.2mm < minimum bonding pad step distance is less than or equal to 0.35mm, and the maximum allowable size of the jointed board is 150 x 150 mm; in other cases, i.e., minimum pad pitch >0.35mm, the maximum allowable size of the panel is 200 x 200 mm. Assuming that the minimum pad pitch is 0.35mm, the maximum size allowed by the jigsaw puzzle can be determined to be 150 × 150mm according to the preset design rule and the minimum pad pitch.

Step S202: and determining the maximum splicing mode allowed by the spliced plates according to the preset design rule, the length of the single plate and the thickness of the single plate.

For example, preset design rules specify: if the plate thickness is less than 0.8, the maximum allowable plate splicing mode is 8 splicing 6 (inclusive), wherein 8 splicing 6 means that the number of single plates in the horizontal direction is 8, and the number of single plates in the vertical direction is 6, namely 8 rows and 6 lines; the thickness of the plate is more than or equal to 0.8mm, the size of the single plate is less than or equal to 25 x 25mm, and the maximum allowable plate splicing mode is 8 splicing 6 (inclusive); the thickness of the plate is more than or equal to 0.8mm, the size of the single plate is more than or equal to 25 x 25mm and less than or equal to 35 x 35mm, the maximum allowable plate splicing mode is 6 splicing 4 (inclusive), the 6 splicing 4 means that the number of the single plates in the horizontal direction is 6, and the number of the single plates in the vertical direction is 4, namely 6 rows and 4 lines; the thickness of the plate is more than or equal to 0.8mm, the size of the single plate is more than 35 x 35mm, the maximum allowable plate splicing mode is 3 splicing 2 (inclusive), the 3 splicing 2 means that the number of the single plates in the horizontal direction is 3, and the number of the single plates in the vertical direction is 2, namely 3 rows and 2 lines.

Assuming that the length of the single plate is 46mm and the thickness is 1.2mm, and the maximum size of the single plate is 46 x 46mm, the maximum splicing plate mode 3 and 2 (inclusive) allowed by the splicing plate can be determined according to the preset design rule, the length of the single plate and the thickness of the single plate.

Wherein, the plate splicing mode: the mode refers to a mode of array combination of single boards on a plane, for example, 3 rows are arranged in the X direction, 2 rows are arranged in the Y direction, and 6 single boards are counted; similarly, there are 2 columns in the X direction and 3 rows in the Y direction, and there are 6 veneers in total. Subdividing, wherein the single plates in the X direction can be placed in width or length; in brief, there are 4 kinds of combination modes for a panel combination mode composed of 6 single boards. For ease of understanding, the schematic diagram shown in fig. 3 is taken as an example for explanation. In fig. 3, a and b are 3-column 2-block modes, i.e., 3 columns and 2 rows, and b and c are 2-column 3-block modes, i.e., 2 columns and 3 rows; wherein, a is the length of the veneer in the X direction, and b is the width of the veneer in the X direction; c is the length of the veneer in the X direction, and d is the width of the veneer in the X direction.

Step S203: and determining the minimum width of the required connecting rib according to the preset design rule and the maximum splicing mode.

For example, preset design rules specify: the number of the rows of the jointed boards is less than or equal to 2, and the width of the connecting rib is more than or equal to 1.7 mm; the number of the lines of the jointed boards is more than or equal to 3, and the width of the connecting rib is more than or equal to 2 mm. Assuming that the maximum plate splicing mode is 3 to 2, that is, 3 rows and 2 columns, the minimum width of the required connecting rib can be determined to be 1.7mm according to the preset design rule and the maximum plate splicing mode.

Step S204: and determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single plate and the packaging mode.

In an embodiment, if the Y process edge is not needed, the process of determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single board, and the encapsulation mode may be: determining the minimum number of connecting ribs required by each edge or each corner of the single plate according to preset design rules, the length of the single plate and the packaging mode; determining the distribution positions of mark points according to a preset design rule and the minimum number of connecting ribs required by each edge or each corner of the single plate, wherein the mark points comprise optical points and bad plate points; and determining the minimum width of the process edge in the X direction according to a preset design rule, the minimum width of the connecting rib and the distribution position of the mark points.

For example, preset design rules specify: if the LCC package is adopted, 1 connecting rib is needed for each corner of the single board, and 4 connecting ribs are needed in total; if the single board is in LGA packaging and the size of the single board is less than or equal to 40 x 40mm, each side of the single board needs 2 connecting ribs, 8 connecting ribs are needed in total, and the connecting ribs need to be designed to avoid 4 corners; if the package is an LGA package and the size of the single board is greater than 40 × 40mm, at least 3 connecting ribs are required on each side of the single board, at least 12 connecting ribs are required in total, and the connecting ribs need to avoid the 4-corner design. Assuming that the length of the single board is 46mm and the packaging method is LGA packaging, the minimum number of the connecting ribs required by each edge of the single board can be determined to be 3 according to the preset design rule, the length of the single board and the packaging method.

As another example, the preset design rules specify: the number of the connecting ribs required by each edge of the single plate is more than or equal to 3, and the optical points and the defective plate points can be placed on the connecting ribs; in other cases, the number of the connecting ribs required by the edges of the single plate is less than or equal to 2, or 1 connecting rib is required at each corner of the single plate, and the optical points and the defective plate points cannot be placed on the connecting ribs. Assuming that the minimum number of the connecting ribs required by each edge of the single plate is 3, the distribution position of the mark points can be determined to be capable of being placed on the connecting ribs according to a preset design rule and the minimum number of the connecting ribs required by each edge or each corner of the single plate.

As another example, the preset design rules specify: the marking points are positioned in the X direction and can be placed on the connecting ribs, and the width of the connecting ribs added on the technical side in the X direction is more than or equal to 6.3 mm; the marking point is positioned in the X direction but can not be placed on the connecting rib, and the width of the technical edge in the X direction is more than or equal to 6 mm. Assuming that the distribution positions of the marking points can be placed on the connecting ribs, and the minimum width of the connecting ribs is 1.7mm, the minimum width of the process edge in the X direction can be determined to be 4.6mm according to the preset design rule, the minimum width of the connecting ribs and the distribution positions of the marking points.

In an optional embodiment, if the process edge in the Y direction needs to be designed, the process of determining the minimum width of the process edge according to a preset design rule, the minimum width of the connecting rib, the length of the single board, and the encapsulation mode may be: determining the minimum number of connecting ribs required by each edge or each corner of the single plate according to preset design rules, the length of the single plate and the packaging mode; determining the distribution positions of mark points according to a preset design rule and the minimum number of connecting ribs required by each edge or each corner of the single plate, wherein the mark points comprise optical points and bad plate points; and determining the minimum width of the process edge in the X direction according to a preset design rule, the minimum width of the connecting rib and the distribution position of the mark points, and determining the minimum width of the process edge in the Y direction according to the preset design rule. In this embodiment, the method further comprises: determining whether a process edge in the Y direction needs to be designed or not according to a preset design rule, the thickness of the single plate and the minimum pad step pitch; if the Y-direction process edge needs to be designed, the minimum width of the Y-direction process edge can be determined according to a preset design rule.

When determining whether the process edge in the Y direction needs to be designed according to a preset design rule, the thickness of the single plate, and the minimum pad pitch, for example, the preset design rule specifies: the thickness of the single board is more than or equal to 1.6mm, and the minimum pad step distance is more than 0.35mm, so that a process edge in the Y direction is not needed; other cases default to requiring a Y-direction process edge. Assuming that the thickness of the single board is 1.2mm and the minimum pad pitch is 0.35mm, the process edge in the Y direction to be designed can be determined according to the preset design rule, the thickness of the single board and the minimum pad pitch.

When the minimum width of the process edge in the Y direction is determined according to a preset design rule, for example, the preset design rule specifies: if the process edge in the Y direction needs to be designed, the size of the process edge in the Y direction is more than or equal to 4 mm. Assuming that a Y-direction process edge is required, the minimum width of the Y-direction process edge can be determined to be 4mm according to preset design rules.

Step S205: and determining a plurality of panel parameters of the panel formed by the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum panel mode, the minimum width of the connecting ribs and the minimum width of the process edges.

After the length of the single plate, the width of the single plate, the maximum size, the maximum plate splicing mode, the minimum width of the connecting rib and the minimum width of the process edge are obtained, a plurality of plate splicing parameters of the plate splicing composed of the single plates can be determined according to the length of the single plate, the width of the single plate, the maximum size, the maximum plate splicing mode, the minimum width of the connecting rib and the minimum width of the process edge. If the Y process edge is not needed, the minimum width of the process edge refers to the minimum width of the process edge in the X direction; if a Y-process edge is required, the minimum width of the process edge refers to the minimum width of the X-direction process edge and the minimum width of the Y-process edge.

For example, if the length of a single plate is 46mm, the width of the single plate is 42mm, the maximum size of the jointed plate is 150 × 150mm, the maximum jointed plate mode is 3 jointed 2, the minimum width of the connecting rib is 1.7mm, the minimum width of the process side in the X direction is 4.6mm, and the minimum width of the process side in the Y direction is 4mm, then the following jointed plate schemes can be obtained by combination according to the above outputs:

< a >3 pin 2 scheme, 46mm in X direction, when the length in X and Y direction is as follows:

X＝46*3+1.7*(3+1)+4*2＝152.8mm；

Y＝42*2+1.7*(2+1)+4.6*2＝98.3mm；

because the length in the X direction is more than 150mm, the maximum size is not met, and the scheme is not adopted;

< b > 3-pin 2 scheme, 46mm in Y direction, when the lengths in X and Y direction are as follows:

X＝42*3+1.7*(3+1)+4*2＝140.8mm；

Y＝46*2+1.7*(2+1)+4.6*2＝106.3mm；

< c >2 pin 1 protocol, 46mm in X direction, when the length in X and Y direction is as follows:

X＝46*2+1.7*(2+1)+4*2＝105.1mm；

Y＝42*1+1.7*(1+1)+4.6*2＝54.6mm；

< d >2 pin 1 protocol, 46mm in Y direction, when the lengths in X and Y direction are as follows:

X＝42*2+1.7*(2+1)+4*2＝97.1mm；

Y＝46*1+1.7*(1+1)+4.6*2＝58.6mm。

finally, the parameters of the three jointed boards formed by the veneers are respectively the three schemes of the 3-joint 2 scheme, the 46mm scheme of the 2-joint 1 scheme in the Y direction, the 46mm scheme of the 2-joint 1 scheme in the X direction and the 46mm scheme in the Y direction.

In one embodiment, the processing procedure of step S102 may include the steps shown in fig. 2, and further includes: determining whether reinforcing ribs are needed or not according to preset design rules, the length of the single plate and a packaging mode; if a rib is required, the minimum width of the required rib is determined. Accordingly, step S205 includes: and determining the parameters of the jointed boards formed by the veneers according to the length, the width, the maximum size, the maximum jointed board mode, the minimum width of the connecting ribs, the minimum width of the process edges and the minimum width of the required reinforcing ribs.

When determining whether the reinforcing rib is needed according to the preset design rule, the length of the veneer and the packaging mode, for example, the preset design rule specifies: the size of the single plates is more than 35 x 35mm, and when LCC is packaged, reinforcing ribs need to be added among the single plates, and the width of each reinforcing rib is more than or equal to 2 mm; and no reinforcing ribs are arranged between the default single plates in other cases. Assuming that the length of the single plate is 46mm and the packaging mode is LCC, the required reinforcing rib can be determined according to the preset design rule, the length of the single plate and the packaging mode, and the width of the reinforcing rib is more than or equal to 2 mm.

When the reinforcing ribs are needed, the reinforcing ribs also need to be taken into account when determining the parameters of the jointed boards formed by the veneers. For example, if the length of a single plate is 46mm, the width of the single plate is 42mm, the maximum size of the jointed plate is 150 × 150mm, the maximum jointed plate mode is 3-2, the minimum width of a connecting rib is 1.7mm, the minimum width of an X-direction process edge is 6mm, the minimum width of a Y-direction process edge is 4mm, and the width of a reinforcing rib is 4mm, the following jointed plate schemes can be obtained by combining the above outputs:

X＝46*3++1.7*(3+1)+4*2+(2+1.7)*(3-1)＝160.2mm；

Y＝42*2+1.7*(2+1)+6*2+(2+1.7)*(2-1)＝104.8mm；

the length in the X direction is larger than 150mm, so that the maximum size is not met, and the scheme is not adopted;

X＝42*3+1.7*(3+1)+4*2+(2+1.7)*(3-1)＝148.2mm；

Y＝46*2+1.7*(2+1)+6*2+(2+1.7)*(2-1)＝106.1mm；

X＝46*2+1.7*(2+1)+4*2+(2+1.7)*(2-1)＝108.8mm；

Y＝42*1+1.7*(1+1)+6*2+(2+1.7)*(1-1)＝57.4mm；

X＝42*2+1.7*(2+1)+4*2+(2+1.7)*(2-1)＝100.8mm；

Y＝46*1+1.7*(1+1)++6*2+(2+1.7)*(1-1)＝61.4mm。

For ease of understanding, the following describes step S102 by taking example 1 and example 2 as examples.

Example 1:

the input information is: the length of the single board is 46mm, the width of the single board is 42mm, the thickness of the single board is 1.2mm, and the packaging mode is LGA packaging; the minimum pad pitch is 0.35 mm. Then according to the preset design rule, the following are:

(1) according to the minimum pad step pitch of 0.35mm, the maximum allowable size of the jointed board can be obtained to be 150 x 150 mm;

(2) according to the plate thickness of 1.2mm and the length of the single plate of 46mm, the maximum allowable splicing mode 3 can be obtained to splice 2;

(3) according to the length of 46mm of the LGA package and the single board, the spliced board can be obtained without reinforcing ribs;

(4) according to the plate thickness of 1.2mm and the minimum pad step pitch of 0.35mm, the required Y process edge can be obtained;

(5) splicing 2 according to a splicing mode 3, namely the number of rows of the spliced plates is 2, and obtaining the width of the connecting rib is more than or equal to 1.7 mm;

(6) according to the LGA package and the length of the single board being 46mm, 3 connecting ribs are needed on each edge of the single board;

(7) 3 connecting ribs are needed according to each edge of the single board, and the obtained mark points can be placed on the connecting ribs;

(8) the X process edge and the connecting rib are not less than 6.3mm in width according to the mark points which can be placed on the connecting rib, and the X process minimum edge is not less than 4.6m according to the connecting rib with the width not less than 1.7 mm; and designing a Y process edge according to requirements, wherein the minimum width of the obtained Y process edge is 4 mm.

Based on the above parameters, i.e. based on (1) to (8), the following makeup solutions can be combined:

< a >3 Pin 2 solution, 46mm in X direction, in which case the lengths in X and Y directions are as follows

X＝46*3+1.7*(3+1)+4*2＝152.8mm；

Y＝42*2+1.7*(2+1)+4.6*2＝98.3mm；

X＝42*3+1.7*(3+1)+4*2＝140.8mm；

Y＝46*2+1.7*(2+1)+4.6*2＝106.3mm；

X＝46*2+1.7*(2+1)+4*2＝105.1mm；

Y＝42*1+1.7*(1+1)+4.6*2＝54.6mm；

X＝42*2+1.7*(2+1)+4*2＝97.1mm；

Y＝46*1+1.7*(1+1)+4.6*2＝58.6mm。

Example 2:

the input information is: the length of the single board is 46mm, the width of the single board is 42mm, the thickness of the single board is 1.2mm, and the packaging mode is LCC packaging; the minimum pad pitch is 0.35 mm. Then according to the preset design rule, the following are:

(1) according to the minimum pad step pitch of 0.35mm, the maximum allowable size of the jointed board is 150 x 150 mm;

(2) according to the thickness of the board being 1.2mm and the length of the single board being 46mm, the maximum allowable splicing mode is 3 splicing 2;

(3) according to the length of the LCC package and the veneer being 46mm, reinforcing ribs needed by the jointed board can be obtained;

(5) splicing 2 according to a splicing mode 3, namely the number of rows of the splicing plates is 2, so that the width of the connecting rib is more than or equal to 1.7 mm;

(6) according to LCC packaging, 1 connecting rib is needed at each corner of the single plate, and 4 connecting ribs are needed in total;

(7) according to the method, 1 connecting rib is needed at each corner of a single plate, namely the number of the connecting ribs needed at the edges of the single plate is less than or equal to 2, and the obtained optical points and the bad plate points can not be placed on the connecting ribs;

(8) the minimum edge width of the X technological edge is not less than 6mm according to the fact that the optical points and the damaged points cannot be placed on the connecting ribs, the Y technological edge is designed according to needs, and the minimum edge width of the Y technological edge is 4 mm.

X＝46*3++1.7*(3+1)+4*2+(2+1.7)*(3-1)＝160.2mm；

Y＝42*2+1.7*(2+1)+6*2+(2+1.7)*(2-1)＝104.8mm；

X＝42*3+1.7*(3+1)+4*2+(2+1.7)*(3-1)＝148.2mm；

Y＝46*2+1.7*(2+1)+6*2+(2+1.7)*(2-1)＝106.1mm；

X＝46*2+1.7*(2+1)+4*2+(2+1.7)*(2-1)＝108.8mm；

Y＝42*1+1.7*(1+1)+6*2+(2+1.7)*(1-1)＝57.4mm；

X＝42*2+1.7*(2+1)+4*2+(2+1.7)*(2-1)＝100.8mm；

Y＝46*1+1.7*(1+1)++6*2+(2+1.7)*(1-1)＝61.4mm。

Wherein, the splice bar: the local connecting ribs are used between the single plates, or between the single plates and the technical edge, or between the single plates and the reinforcing ribs, and are used for connecting and bearing all parts into a whole.

Reinforcing ribs: the long edge is added between every two veneers in the jigsaw, the long edge is connected with all the veneers through connecting ribs and is directly connected with the technical edge for shaping the jigsaw, so that the connecting strength between every two veneers is increased, and the warping risk of the veneers is reduced.

The process comprises the following steps: the rim charge on the periphery of the jointed board is used for an SMT production line or a jig to bear the jointed board, so that the jointed board can move on a jointed board production line conveniently; on the other hand, the fixing device is used for fixing the internal single board to avoid the internal single board from being damaged and warped; and finally, the device is also used for bearing contents such as optical points, bad board points, board feeding direction arrows, two-dimensional codes, spliced board type character information and the like.

Optical point: the mark points are distributed on the process edge or the connecting ribs of the jointed board and used for positioning SMT equipment, and the paster precision can be controlled.

And (4) bad plate point: the single boards are distributed on the process edges or the connecting ribs of the jointed boards and correspond to the single boards one by one, whether the single boards are damaged or not is identified, and if the single boards are damaged, the points of the damaged boards are marked, so that the single boards are not produced in the subsequent production, and the waste of devices and working hours is avoided.

One embodiment of a puzzle scheme is shown in fig. 4. The splicing scheme comprises a Y-direction process edge and reinforcing ribs, and optical points and bad plate points are positioned on the connecting ribs.

Step S103: and outputting the parameters of the jointed board corresponding to the jointed board with the maximum utilization rate.

And processing the acquired basic information and design requirement parameters of the single plates according to a preset design rule, and outputting the jointed plate parameters corresponding to the jointed plate with the maximum utilization rate after determining the jointed plate parameters of the jointed plates consisting of the multiple single plates, thereby obtaining an optimal jointed plate scheme.

Among them, an optional implementation is as follows: outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate, wherein the process comprises the following steps: determining a first ratio of the sum of the areas of all single plates on the jointed board to the area of the jointed board according to each jointed board scheme; arranging and combining the jointed boards on a preset working plate area, determining a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area, and obtaining the utilization rate of the jointed boards according to the first ratio and the second ratio; and outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate based on the utilization rate of each jointed board.

For the sake of understanding, taking the scheme < b > in example 1 above as an example, the panel is composed of 6 single plates, and the sum of the areas of all the single plates on the panel is 6 × 46 × 42; the area of the jointed board is X Y140.8X 106.3, so that a first ratio of the sum of the areas of all the single plates on the jointed board to the area of the jointed board can be obtained, that is, the utilization rate of the jointed board under the scheme < b > can be obtained. Wherein, the utilization ratio of the jointed boards is defined as: and dividing the sum of the areas of all the single plates on one jointed plate by the area of the jointed plate to obtain the percentage, namely the utilization rate of the jointed plate.

The jointed boards are arranged and combined on the preset working plate area, and then the second ratio of the sum of the areas of all jointed boards on the preset working plate area to the area of the preset working plate area is determined, so that the utilization rate of the working plate can be obtained. When the jointed boards are arranged and combined in the preset working board area, two kinds of arrangement and combination are provided, wherein one is that the length of the jointed boards is in the X direction, and the other is that the width of the jointed boards is in the X direction, so that the working board utilization rate in each combination mode needs to be calculated when the working board utilization rate is calculated, and 2 second ratios can be obtained. Wherein, the working plate utilization ratio is defined as: and dividing the sum of the areas of all jointed boards on one working plate by the area of the working plate to obtain the percentage, namely the utilization rate of the working plate. The size of the preset working plate area is the same as that of the working plate.

And obtaining the utilization rate of the jointed board according to the first ratio and the second ratio, for example, multiplying the utilization rate of the jointed board by the utilization rate of the working plate, wherein the obtained product is the utilization rate of the jointed board, which is also called the comprehensive utilization rate of the jointed board. Since there are 2 second ratios, 2 overall utilizations can be obtained. Wherein, the definition of the comprehensive utilization rate is as follows: the product of the utilization rate of the jointed boards and the utilization rate of the working boards can be understood as the percentage, namely the comprehensive utilization rate, or the percentage can be understood as the sum of the areas of all the single boards on one working board divided by the area of the working board, namely the comprehensive utilization rate.

And after the utilization rate of each jointed board is obtained, outputting the jointed board parameter corresponding to the jointed board with the maximum utilization rate, thereby obtaining the jointed board parameter corresponding to the optimal jointed board.

The preset working plate area can only comprise one preset working plate area, and also can be preset with two or more working plate areas, the sizes of the preset working plate areas are different, and the utilization rate of each jointed board in each preset working plate area needs to be calculated; aiming at each jigsaw scheme and each preset working plate area, the jigsaws are arranged and combined on the preset working plate area, a second ratio of the sum of the areas of all jigsaws on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jigsaws on the preset working plate area is obtained according to the first ratio and the second ratio, so that the utilization rate of the jigsaws on the preset working plate area can be obtained.

For ease of understanding, 3 preset work plate areas are included, and the 3 preset work plate areas are respectively: for each jigsaw scheme, the utilization rates of the jigsaw in the preset working plate area 1, the preset working plate area 2, and the preset working plate area 3 need to be calculated, and the process can be seen in fig. 5.

The working plate is a plate for production and processing of a PCB factory and has a fixed size. For ease of understanding, the relationship between the veneers, tiles and work boards is described with reference to the example shown in fig. 6. In fig. 6, reference numeral 1 denotes a single plate, reference numeral 2 denotes a jointed plate, reference numeral 3 denotes a working plate, a plurality of single plates are jointed together to obtain a jointed plate, and a plurality of jointed plates can be arranged and combined on the working plate.

It should be noted that, in addition to selecting the parameters of the jointed board corresponding to the optimal jointed board according to the comprehensive utilization rate, the parameters of the jointed board corresponding to the optimal jointed board may also be selected according to the utilization rate of the jointed board (i.e., the first ratio). In this embodiment, the process of outputting the tile parameter corresponding to the tile with the highest utilization rate may be: determining a first ratio of the sum of the areas of all single plates on the jointed board to the area of the jointed board according to each jointed board scheme to obtain the utilization rate of the jointed board; and outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate based on the utilization rate of each jointed board.

Based on the same inventive concept, the embodiment of the present application further provides a PCB jigsaw determination apparatus 100 applied to an electronic device, as shown in fig. 7. The PCB panel alignment determining apparatus 100 includes: an acquisition module 110, a processing module 120, and an output module 130.

The obtaining module 110 is configured to obtain basic information and design requirement parameters of a board.

The processing module 120 is configured to process the acquired basic information of the single board and the design requirement parameters according to a preset design rule, and determine multiple board splicing parameters of a board splicing composed of the single board, where the preset design rule is obtained by processing board splicing parameters of multiple PCB board splicing meeting an industry standard.

Wherein, the basic information of the single board includes: length of single board, width of single board, thickness of single board, packaging mode; the design requirement parameters include a minimum pad pitch; the processing module 120 is specifically configured to: determining the maximum size allowed by the jointed board according to the preset design rule and the minimum pad step pitch; determining the maximum splicing mode allowed by the splicing plate according to the preset design rule, the length of the single plate and the thickness of the single plate; determining the minimum width of the required connecting rib according to the preset design rule and the maximum plate splicing mode; determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single plate and the packaging mode; and determining a plurality of panel parameters of the panel formed by the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum panel mode, the minimum width of the connecting ribs and the minimum width of the process edges.

Optionally, the processing module 120 is further specifically configured to: determining the minimum number of connecting ribs required by each edge or each corner of the single plate according to the preset design rule, the length of the single plate and the packaging mode; determining the distribution positions of mark points according to the preset design rule and the minimum number of connecting ribs required by each edge or each corner of the single plate, wherein the mark points comprise optical points and bad plate points; and determining the minimum width of the process edge in the X direction according to the preset design rule, the minimum width of the connecting rib and the distribution position of the mark points.

Optionally, the processing module 120 is further specifically configured to: determining whether a process edge in the Y direction needs to be designed or not according to the preset design rule, the thickness of the single plate and the minimum pad step pitch; and if the Y-direction process edge needs to be designed, determining the minimum width of the Y-direction process edge according to the preset design rule.

Optionally, the processing module 120 is further specifically configured to: determining whether reinforcing ribs are needed or not according to the preset design rule, the length of the single plate and the packaging mode; if a rib is required, the minimum width of the required rib is determined. Correspondingly, the processing module 120 is further specifically configured to: and determining a plurality of board splicing parameters of the board splicing composed of the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum board splicing mode, the minimum width of the connecting ribs, the minimum width of the process edges and the minimum width of the required reinforcing ribs.

Optionally, the processing module 120 is further configured to: determining a first ratio of the sum of the areas of all single plates on the jointed board to the area of the jointed board according to each jointed board scheme; and arranging and combining the jointed boards on a preset working plate area, determining a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area, and obtaining the utilization rate of the jointed boards according to the first ratio and the second ratio.

The preset work board area includes a plurality of preset work board areas, and optionally, the processing module 120 is further configured to: aiming at each preset working plate area, the jointed boards are arranged and combined on the preset working plate area, a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jointed boards on the preset working plate area is obtained according to the first ratio and the second ratio.

The output module 130 is configured to output the tile parameter corresponding to the tile with the highest utilization rate, that is, the tile parameter corresponding to the tile with the highest utilization rate based on the utilization rate of each tile.

The implementation principle and the resulting technical effects of the PCB panel determination apparatus 100 provided in the embodiment of the present application are the same as those of the foregoing method embodiments, and for the sake of brief description, reference may be made to the corresponding contents in the foregoing method embodiments for the part of the apparatus embodiments that is not mentioned.

As shown in fig. 8, fig. 8 is a block diagram illustrating a structure of an electronic device 200 according to an embodiment of the present disclosure. The electronic device 200 includes: a transceiver 210, a memory 220, a communication bus 230, and a processor 240.

The elements of the transceiver 210, the memory 220, and the processor 240 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, the components may be electrically coupled to each other via one or more communication buses 230 or signal lines. The transceiver 210 is used for transceiving data. Memory 220 is used to store a computer program, such as the software functional module shown in fig. 7, namely PCB panel determination device 100. The PCB panel determining apparatus 100 includes at least one software function module, which may be stored in the memory 220 in the form of software or firmware (firmware) or solidified in an Operating System (OS) of the electronic device 200. The processor 240 is configured to execute an executable module stored in the memory 220, such as a software function module or a computer program included in the PCB panel determination apparatus 100. For example, the processor 240 is configured to obtain basic information and design requirement parameters of the board; processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard; and outputting the parameters of the jointed board corresponding to the jointed board with the maximum utilization rate.

The Memory 220 may be, but is not limited to, a Random Access Memory (RAM), a Read Only Memory (ROM), a Programmable Read-Only Memory (PROM), an Erasable Read-Only Memory (EPROM), an electrically Erasable Read-Only Memory (EEPROM), and the like.

The processor 240 may be an integrated circuit chip having signal processing capabilities. The Processor may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components. The various methods, steps, and logic blocks disclosed in the embodiments of the present application may be implemented or performed. A general purpose processor may be a microprocessor or the processor 240 may be any conventional processor or the like.

The electronic device 200 includes, but is not limited to, a computer, a server, and the like.

The embodiment of the present application further provides a non-volatile computer-readable storage medium (hereinafter, referred to as a storage medium), where the storage medium stores a computer program, and when the computer program is run by the electronic device 200 as described above, the method for determining a PCB panel as described above is performed.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a notebook computer, a server, or an electronic device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A PCB jointed board determining method is applied to electronic equipment, and the method comprises the following steps:

acquiring basic information and design requirement parameters of a single board;

processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard;

and outputting the parameters of the jointed board corresponding to the jointed board with the maximum utilization rate.

2. The method according to claim 1, wherein the basic information of the board comprises: length of single board, width of single board, thickness of single board, packaging mode; the design requirement parameters include a minimum pad pitch; processing the acquired basic information of the single plates and the design requirement parameters according to preset design rules, and determining multiple parameters of jointed boards formed by the single plates, wherein the parameters comprise:

determining the maximum size allowed by the jointed board according to the preset design rule and the minimum pad step pitch;

determining the maximum splicing mode allowed by the splicing plate according to the preset design rule, the length of the single plate and the thickness of the single plate;

determining the minimum width of the required connecting rib according to the preset design rule and the maximum plate splicing mode;

determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single plate and the packaging mode;

and determining a plurality of panel parameters of the panel formed by the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum panel mode, the minimum width of the connecting ribs and the minimum width of the process edges.

3. The method according to claim 2, wherein determining the minimum width of the process edge according to the preset design rule, the minimum width of the connecting rib, the length of the single board, and the encapsulation mode comprises:

determining the minimum number of connecting ribs required by each edge or each corner of the single plate according to the preset design rule, the length of the single plate and the packaging mode;

determining the distribution positions of mark points according to the preset design rule and the minimum number of connecting ribs required by each edge or each corner of the single plate, wherein the mark points comprise optical points and bad plate points;

and determining the minimum width of the process edge in the X direction according to the preset design rule, the minimum width of the connecting rib and the distribution position of the mark points.

4. The method of claim 3, further comprising:

determining whether a process edge in the Y direction needs to be designed or not according to the preset design rule, the thickness of the single plate and the minimum pad step pitch;

and if the Y-direction process edge needs to be designed, determining the minimum width of the Y-direction process edge according to the preset design rule.

5. The method according to any one of claims 2-4, further comprising:

determining whether reinforcing ribs are needed or not according to the preset design rule, the length of the single plate and the packaging mode;

if the reinforcing ribs are needed, determining the minimum width of the needed reinforcing ribs; accordingly, the number of the first and second electrodes,

determining a plurality of jointed board parameters of jointed boards formed by the veneers according to the length of the veneers, the width of the veneers, the maximum size, the maximum jointed board mode, the minimum width of the connecting ribs and the minimum width of the process edges, and the method comprises the following steps:

and determining a plurality of board splicing parameters of the board splicing composed of the single plates according to the length of the single plates, the width of the single plates, the maximum size, the maximum board splicing mode, the minimum width of the connecting ribs, the minimum width of the process edges and the minimum width of the required reinforcing ribs.

6. The method as claimed in claim 1, wherein outputting the panel parameters corresponding to the most available panel comprises:

determining a first ratio of the sum of the areas of all single plates on the jointed board to the area of the jointed board according to each jointed board scheme;

arranging and combining the jointed boards on a preset working plate area, determining a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area, and obtaining the utilization rate of the jointed boards according to the first ratio and the second ratio;

and outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate based on the utilization rate of each jointed board.

7. The method of claim 6, wherein the preset work plate area comprises a plurality of preset work plate areas; the jointed boards are arranged and combined on a preset working plate area, a second ratio of the sum of the areas of all jointed boards on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jointed boards is obtained according to the first ratio and the second ratio, and the method comprises the following steps:

aiming at each preset working plate area, the jointed boards are arranged and combined on the preset working plate area, a second ratio of the sum of the areas of all the jointed boards on the preset working plate area to the area of the preset working plate area is determined, and the utilization rate of the jointed boards on the preset working plate area is obtained according to the first ratio and the second ratio.

8. A PCB makeup determination device, applied to an electronic device, comprising:

the acquisition module is used for acquiring the basic information and the design requirement parameters of the single board;

the processing module is used for processing the acquired basic information of the single boards and the design requirement parameters according to preset design rules to determine multiple jointed board parameters of jointed boards formed by the single boards, wherein the preset design rules are obtained by processing the jointed board parameters of multiple PCB jointed boards meeting the industrial standard;

and the output module is used for outputting the parameters of the jointed boards corresponding to the jointed boards with the maximum utilization rate.

9. An electronic device, comprising:

a memory and a processor, the processor coupled to the memory;

the memory is used for storing programs;

the processor to invoke a program stored in the memory to perform the method of any of claims 1-7.

10. A storage medium having stored thereon a computer program which, when executed by a processor, performs the method according to any one of claims 1-7.