CN112634227A

CN112634227A - Detection and identification method and device for PCB jointed board, electronic equipment and storage medium

Info

Publication number: CN112634227A
Application number: CN202011517253.8A
Authority: CN
Inventors: 王思远
Original assignee: Guangzhou Maker Ray Intelligent Technology Co ltd
Current assignee: Guangzhou Luchen Intelligent Equipment Technology Co ltd
Priority date: 2020-12-21
Filing date: 2020-12-21
Publication date: 2021-04-09
Anticipated expiration: 2040-12-21
Also published as: CN112634227B

Abstract

The embodiment of the application provides a detection and identification method and device for a PCB jointed board, electronic equipment and a storage medium, wherein the method comprises the following steps: acquiring a PCB daughter board template image, PCB daughter board detection information and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required by the detection of the electronic component; performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image; and according to the position of the electronic component to be detected on the PCB daughter board template image and the position of each PCB daughter board image, marking the electronic component on each PCB daughter board image and detecting parameters required by the electronic component. The embodiment of the application can simplify the operation, shorten the time and improve the efficiency.

Description

Detection and identification method and device for PCB jointed board, electronic equipment and storage medium

Technical Field

The embodiment of the application relates to the field of PCBs, in particular to a detection and identification method and device for a PCB jointed board, electronic equipment and a storage medium.

Background

Because the area of the PCB integrated circuit board of design is little, single integrated circuit board welding is inconvenient among the conventional art, the mill usually can splice many the same PCB daughter boards together earlier in manufacturing and form the PCB makeup, then detect each PCB daughter board on the PCB makeup one by one, treat each PCB daughter board all detect the back, again with each PCB daughter board from the PCB makeup split, and then obtain a plurality of the same PCB daughter boards.

When detecting each PCB daughter board of PCB makeup among the conventional art, edit the position that needs the electronic components that detect and need the electronic components that detect in the PCB daughter board in the PCB makeup earlier usually and form electronic components and detect the template, then cover electronic components and detect the template on other PCB daughter boards in the PCB makeup through the manual work, through the position between them of artifical adjustment, make electronic components and detect the position of the electronic components that correspond on the template and the PCB daughter board and align each other, detect the electronic components on each PCB daughter board at last again, in order to judge whether qualified each PCB daughter board. In the process of implementing the invention, the inventor finds that the position of the traditional PCB daughter board detection mode needs to be adjusted manually and continuously by experience, and the detection method is complex in operation and long in time consumption.

Disclosure of Invention

In order to overcome the problems in the related art, the application provides a detection and identification method, a device, a system, electronic equipment and a storage medium for a PCB jointed board, and the method, the device, the system, the electronic equipment and the storage medium have the advantages of simplifying operation, shortening time and improving efficiency.

According to a first aspect of the embodiments of the present application, a method for detecting and identifying a jointed PCB board is provided, which includes the following steps:

acquiring a PCB daughter board template image, PCB daughter board detection information and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component;

performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image;

according to the position of the electronic component to be detected on the PCB daughter board template image and the position of each PCB daughter board image, marking the electronic component on each PCB daughter board image and detecting parameters required by the electronic component.

According to a second aspect of the embodiments of the present application, there is provided a detection and identification device for a jointed PCB board, including:

the image acquisition module is used for acquiring a PCB daughter board template image, PCB daughter board detection information and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component;

the image matching module is used for performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image;

and the element identification module is used for identifying the electronic elements and detecting parameters required by the electronic elements on the PCB daughter board images according to the positions of the electronic elements to be detected on the PCB daughter board template images and the positions of the PCB daughter board images.

According to a third aspect of embodiments of the present application, there is provided an electronic apparatus, including: a display screen, a processor and a memory; wherein the memory stores a computer program adapted to be loaded by the processor and to execute a method for implementing the detection and identification of the PCB panels as described in any one of the above.

According to a fourth aspect of the embodiments of the present application, there is provided a computer-readable storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the method for detecting and identifying a PCB panel as described in any one of the above.

In the embodiment of the application, by acquiring the template image of the PCB daughter board, the detection information of the PCB daughter board and the image of the jointed PCB board to be detected, the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component, the PCB daughter board template image is matched with the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image, and then according to the position of the electronic component to be detected on the PCB daughter board template image and the position of each PCB daughter board image, identifying the electronic components on each PCB daughter board image and detecting parameters required by the electronic components, therefore, the position is not required to be adjusted manually, and inexperienced operators can operate the device, so that the operation is simplified, the time is shortened, and the efficiency is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a flow chart of a method for detecting identification of PCB tiles according to one embodiment of the present application;

FIG. 2 is an image of a PCB panel shown in one embodiment of the present application;

FIG. 3 is an illustration of a PCB daughter board template image according to one embodiment of the present application;

FIG. 4 is an effect diagram of a PCB panel detection and identification method according to an embodiment of the present application;

FIG. 5 is a flow diagram illustrating a method of image matching according to one embodiment of the present application;

FIG. 6 is a graph of the match of the PCB tiles shown in one embodiment of the present application;

FIG. 7 is an image of a PCB panel after binarization and morphological processing of the match degree image according to an embodiment of the present application;

FIG. 8 is a block diagram illustrating the structure of a PCB panel detection and identification device in accordance with one embodiment of the present application;

FIG. 9 is a block diagram illustrating a schematic structure of an image matching module according to an embodiment of the present application;

fig. 10 is a block diagram illustrating a schematic structure of an electronic device according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

In the description of the present application, it is to be understood that the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not necessarily used to describe a particular order or sequence, nor are they to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The word "if/if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination". Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The application environment of the detection and identification method for the PCB jointed board comprises electronic equipment; the electronic device may be, but is not limited to, various personal computers, notebook computers, interactive intelligent tablets, AOI (Automated Optical Inspection) devices. The electronic device may include one or more processing cores, and the detection and identification method for the PCB jointed board of the present application may be implemented in a pure software manner, or the aging test method for the USB device of the present application may be implemented in a manner of combining software and hardware, for example, in a form of at least one hardware of digital signal processing, field programmable gate array, and programmable logic array; one or more of a central processing unit, an image processor, a modem and the like can be integrated. The electronic device may run an application program for implementing the method for detecting and identifying the PCB panels of the present application, and the application program may be presented in a form suitable for the electronic device, for example, may be an APP application program, and in some examples, may also be presented in a form of, for example, a system plug-in, a web plug-in, and the like. In the exemplary embodiment of the present application, the electronic device is an AOI device, and the AOI device runs an application program that implements the detection and identification method for the PCB jointed board of the present application.

Example 1

The embodiment of the application discloses a detection and identification method for a PCB jointed board, which is applied to electronic equipment.

The following describes in detail a method for detecting and marking a jointed PCB board according to an embodiment of the present application with reference to fig. 1.

Referring to fig. 1, a method for detecting and identifying a jointed PCB board provided in an embodiment of the present application includes the following steps:

step S101: acquiring a PCB daughter board template image, a PCB daughter board detection template image and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component.

A PCB (Printed Circuit Board) provides mechanical support for fixing and assembling various electronic components, and realizes wiring, electrical connection and electrical insulation between various electronic components. However, the PCB daughter board of the present invention is a component in which electronic components are fixed to the PCB board and wired and electrically connected; in order to ensure the function of the PCB sub-board, it is necessary to check the performance or the wiring or electrical connection of some electronic components themselves in the PCB sub-board.

The PCB jointed board is a PCB board formed by splicing a plurality of same PCB sub-boards manufactured in the production and manufacturing process. The PCB jointed board to be detected refers to the detection of the performance or wiring or electrical connection of some electronic components in each PCB daughter board of the PCB jointed board, and before the detection, the position of the electronic component to be detected in each PCB daughter board needs to be determined; the PCB makeup image that awaits measuring is for shoot through shooting equipment awaits measuring the image that the PCB makeup obtained, it is specific, through AOI (Automated Optical Inspection, automatic Optical Inspection) equipment from the camera automatic scanning PCB makeup that awaits measuring obtains the PCB makeup image that awaits measuring in this application one embodiment. As shown in fig. 2, the image of the PCB panel is obtained by scanning the PCB panel to be tested, wherein the image of the PCB panel includes 16 identical images of PCB daughter boards.

The PCB daughter board template is characterized in that one PCB daughter board is selected from a PCB jointed board to be detected, an electronic component to be detected, the position of the electronic component and parameters required for detecting the electronic component are determined in the PCB daughter board, and then the PCB daughter board is determined to be the PCB daughter board template; the PCB daughter board template image is an image obtained by shooting the PCB daughter board template through shooting equipment, or the PCB daughter board template image is obtained by selecting and dividing the PCB daughter board template image from the PCB jointed board image. As shown in fig. 3, the PCB daughter board image selected from the fourth frame when facing the to-be-detected PCB jointed board image is the PCB daughter board template image.

The PCB daughter board detection information may be presented in the form of an image or text data, for example, the PCB daughter board detection information may be an image, specifically, a PCB daughter board detection image, where the PCB daughter board detection image is an image formed by selecting a position of an electronic component to be detected in the PCB daughter board template image and parameters required for detecting the electronic component after the electronic component to be detected is selected in the PCB daughter board template image, that is, the position of the electronic component to be detected in the PCB daughter board template image and the parameters required for detecting the electronic component are stored in the PCB daughter board detection image. Specifically, in an embodiment of the application, a square frame is adopted to frame an electronic component to be detected in a PCB daughter board template image displayed by display equipment of AOI equipment, the AOI equipment automatically identifies the position of the square frame, the position of the square frame is further used as the electronic component to be detected, and parameters required by the electronic component can be marked and detected after the electronic component is framed by the square frame for subsequent detection. As shown in fig. 3, an image formed by a white square frame in the PCB daughter board image selected by the fourth frame when facing the to-be-detected PCB spliced board image is the PCB daughter board detection information, and the white square frame is the to-be-detected electronic component.

Step S102: and performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image.

Specifically, pixel points of the PCB daughter board template images are matched with pixel points of the PCB jointed board images, and then each PCB daughter board image identical to the PCB daughter board template image and the position of each PCB daughter board image are determined in the PCB jointed board.

Step S103: according to the position of the electronic component to be detected on the PCB daughter board template image and the position of each PCB daughter board image, marking the electronic component on each PCB daughter board image and detecting parameters required by the electronic component.

Because each PCB daughter board image is the same as the PCB daughter board template image, the positions of each electronic component in each PCB daughter board image correspond to the positions of each electronic component in the PCB daughter board template image one by one, so that the positions of the electronic components to be detected in each PCB daughter board image can be determined according to the positions of the electronic components to be detected in the PCB daughter board template image, and the electronic components can be identified in each PCB daughter board image. Specifically, as shown in fig. 4, in an embodiment of the present application, an electronic component to be detected is framed in a PCB daughter board template image by a square frame, and a position of the electronic component to be detected stored in the PCB daughter board template image is a position of the square frame, so that when the electronic component is identified in each PCB daughter board image, the electronic component is also identified in a square frame manner, and specifically, an area framed by a white square frame shown in fig. 4 is used for identifying the electronic component.

Referring to fig. 5, in an exemplary embodiment of the present application, the image matching the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and a position of each PCB daughter board image includes:

step S1021: and carrying out template matching on the PCB daughter board template image and the PCB jointed board image to obtain a first image of each PCB daughter board and a first position of the first image of each PCB daughter board.

Specifically, will PCB daughter board template image with PCB makeup image carries out image matching, obtains the first image of each PCB daughter board and each the first position of the first image of PCB daughter board includes:

step S10211: and taking the PCB daughter board template image as a first sliding window, and sliding in the PCB jointed board image by a first preset step length.

In the embodiment of the application, one pixel is used as a first preset step length, and the PCB jointed board image slides rightwards and downwards from the upper left corner when facing the PCB jointed board image.

Step S10211: and when the PCB jointed board image slides, matching operation is carried out on the overlapped area of the first sliding window and the PCB jointed board image, and a matching degree image of the PCB jointed board is obtained.

The matching operation may be any matching method that can implement the present scheme, such as a squared error matching method, a normalized squared error matching method, a correlation matching method, a normalized correlation matching method, and the like, which is not limited herein. Specifically, the matching operation of the present application adopts a normalized squared difference matching method. In order to visually obtain the matching operation result, the matching operation result is converted into pixels and then displayed in the form of an image, and the specific conversion mode is a conventional conversion mode and is not repeated here.

Step S10213: determining a first position of a first image of each PCB sub-board according to the matching degree image of the PCB jointed board; the matching degree image of the PCB jointed board is marked with the central point position of the first image of each PCB daughter board.

In the matching degree image of the PCB jointed board, the position where the matching degree of the first sliding window and the PCB jointed board image is the highest is the central point position of the first image of each PCB daughter board, specifically, as shown in fig. 6, the central point position of the first image of each PCB daughter board is the black point position. In an exemplary embodiment, after obtaining the matching degree image of the PCB panel, the method further includes: and carrying out binarization processing on the matching degree image of the PCB jointed board so as to eliminate noise interference. As shown in fig. 7, in an exemplary embodiment, after performing binarization processing on the matching degree image of the PCB panel, the method further includes: and performing morphological processing on the image of the matching degree of the PCB jointed board after the binarization processing, further eliminating image interference, and improving the accuracy of the position of the central point of the first image of each PCB subboard, thereby improving the position of the first image of each PCB subboard.

Step S10214: and determining the first image of each PCB sub-board in the PCB jointed board image according to the first position of the first image of each PCB sub-board.

Step S1022: and determining a characteristic electronic component image in the PCB daughter board template image and a first characteristic position of the characteristic electronic component image in the PCB daughter board template image.

The characteristic electronic component can be round or provided with holes and other electronic components with a relatively rule, and can be an electronic component to be detected or not. The mode for determining the characteristic electronic component image in the PCB daughter board template image can be as follows: and framing the characteristic electronic component by adopting a square frame in a PCB daughter board template image displayed by display equipment of AOI equipment, automatically identifying the position of the square frame by the AOI equipment, taking the position of the square frame as the characteristic electronic component, and simultaneously taking the image framed by the square frame as the characteristic electronic component image of the PCB daughter board template image.

Step S1023: determining a second characteristic position corresponding to the first characteristic position on the first image of each PCB daughter board; the second characteristic position is a position in the first image of the PCB daughter board, which is overlapped with the first characteristic position of the PCB daughter board template image.

The first images of the PCB daughter boards are obtained through template matching and are matched with the PCB daughter board template images, so that the first characteristic positions of the PCB daughter board template images have corresponding second characteristic positions on the first images of the PCB daughter boards.

Step S1024: and determining a feature matching search area in the first image of each PCB daughter board by taking the second feature position as a center.

When matching is completely consistent, the second feature position is the position of the feature electronic component of each PCB daughter board, but in the matching process, due to deviation of a shooting angle, calculation error and the like, the actual second feature position may not be the position of the feature electronic component of each PCB daughter board, but may be the position of the feature electronic component of each PCB daughter board at other positions around the second feature position. The feature matching search area may be a square or rectangular area centered on the second feature position, and the specific size may be adjusted as needed, which is not limited in the present application.

Step S1025: and carrying out template matching on the characteristic electronic component image in each characteristic matching search area to obtain a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board.

Specifically, the template matching the characteristic electronic component image in each characteristic matching search area to obtain a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board includes:

step S10251: and taking the characteristic electronic component image as a second sliding window, and sliding in the characteristic matching search area by a second preset step length.

In the embodiment of the present application, one pixel is used as a second preset step size, and the feature matching search area slides down to the right from the top left corner of the feature matching search area when facing the feature matching search area.

Step S10252: and when the sliding window slides on the feature matching search area, matching operation is carried out on the area where the second sliding window is overlapped with the feature matching search area, and a matching degree image of the feature matching search area is obtained.

The matching operation may be any matching method that can implement the present scheme, such as a squared error matching method, a normalized squared error matching method, a correlation matching method, a normalized correlation matching method, and the like, which is not limited herein. Specifically, the matching operation of the present application adopts a normalized squared difference matching method.

Step S10253: determining a third feature position of the feature electronic component in the first image of each PCB daughter board according to the matching degree image of the feature matching search area; and the matching degree image of the feature matching search area identifies the central point position of the feature electronic component.

In the matching degree image of the feature matching search area, the position with the highest matching degree of the second sliding window and the feature matching search area is the central point position of the first image of each PCB daughter board.

Step S1026: and adjusting the position of the PCB daughter board template image matched with the PCB jointed board image to enable the first characteristic position of the PCB daughter board template image to coincide with the third characteristic position in the first image of each PCB daughter board.

According to the embodiment of the application, the first characteristic position of the PCB daughter board template image is coincided with each of the third characteristic positions in the first image of the PCB daughter board, so that the PCB daughter board template image is aligned with each of the positions of the PCB daughter board image accurately, and then each of the PCB daughter board image and each of the positions of the PCB daughter board image are obtained accurately.

Step S1027: determining the position of each superposed image of the jointed PCB image and the PCB daughter board template image as the position of each PCB daughter board image, and determining the image of each superposed image of the jointed PCB image and the PCB daughter board template image as each PCB daughter board image.

According to the embodiment of the application, the PCB daughter board template image and the PCB jointed board image are subjected to template matching to obtain a first image of each PCB daughter board and a first position of the first image of each PCB daughter board, and a characteristic electronic component image of the PCB daughter board template image and a first characteristic position of the characteristic electronic component image in the PCB daughter board template image are obtained; determining a second characteristic position corresponding to the first characteristic position on the first image of each PCB daughter board; the second characteristic position is a position in the first image of the PCB daughter board, which is overlapped with the first characteristic position of the PCB daughter board template image; determining a feature matching search area in the first image of each PCB daughter board according to the second feature position; carrying out template matching on the characteristic electronic component image in each characteristic matching search area to obtain a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board; adjusting the position of the PCB daughter board template image matched with the PCB jointed board image to enable the first characteristic position of the PCB daughter board template image to coincide with the third characteristic position in the first image of each PCB daughter board; the position of each image of the jointed PCB board, which is coincided with the image of the PCB daughter board template, is determined as the position of each image of the PCB daughter board, and each image of the jointed PCB board, which is coincided with the image of the PCB daughter board template, is determined as each image of the PCB daughter board, so that each image of the PCB daughter board and each position of the image of the PCB daughter board can be quickly and accurately determined in the image of the jointed PCB board.

Example 2

The following are embodiments of the apparatus of the present application that may be used to perform embodiments of the method of the present application. For details which are not disclosed in the embodiments of the apparatus of the present application, reference is made to the embodiments of the method of the present application.

Please refer to fig. 8, which illustrates a schematic structural diagram of a detection and identification device for a PCB panel according to an embodiment of the present application. The detection identification device 200 of the PCB panel may be an AOI device, and the detection identification device of the PCB panel may implement a part or all of the contents of the AOI device through software, hardware, or a combination of the two. Specifically, the detection identification device 200 for the jointed PCB boards includes:

the image acquisition module 201 is used for acquiring a PCB daughter board template image, PCB daughter board detection information and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component;

the image matching module 202 is used for performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image;

and the component identification module 203 is used for identifying the electronic components and detecting parameters required by the electronic components on the PCB daughter board images according to the positions of the electronic components to be detected on the PCB daughter board template images and the positions of the PCB daughter board images.

Referring to fig. 9, in one embodiment, the image matching module 202 includes:

the first template matching module 2021 is configured to perform template matching on the PCB daughter board template image and the PCB jointed board image to obtain a first image of each PCB daughter board and a first position of the first image of each PCB daughter board;

the first feature position determining module 2022 is configured to determine a feature electronic component image in the PCB daughter board template image and a first feature position of the feature electronic component image in the PCB daughter board template image;

a second feature position determining module 2023, configured to determine, on the first image of each PCB daughter board, a second feature position corresponding to the first feature position; the second characteristic position is a position in the first image of the PCB daughter board, which is overlapped with the first characteristic position of the PCB daughter board template image;

a search area determining module 2024, configured to determine a feature matching search area in the first image of each PCB sub-board with the second feature position as a center;

a third feature position determining module 2025, configured to perform template matching on the feature electronic component image in each feature matching search area to obtain a third feature position of the feature electronic component in the first image of each PCB sub-board;

the position adjusting module 2026 is configured to adjust a position at which the PCB daughter board template image is matched with the PCB jointed board image, so that a first feature position of the PCB daughter board template image coincides with a third feature position in the first image of each PCB daughter board;

a daughter board image position determining module 2027, configured to determine, as the position of each PCB daughter board image, a position in the PCB jointed board image that coincides with the PCB daughter board template image, and determine, as each PCB daughter board image, an image in the PCB jointed board image that coincides with the PCB daughter board template image.

In an exemplary embodiment, the first template matching module 2021 includes:

the first sliding window sliding module is used for sliding in the PCB jointed board image by a first preset step length by taking the PCB daughter board template image as a first sliding window;

the jointed board matching degree image acquisition module is used for performing matching operation on a region where the first sliding window and the PCB jointed board image are overlapped when the first sliding window slides on the PCB jointed board image to obtain a matching degree image of the PCB jointed board;

the first position determining module is used for determining the first position of the first image of each PCB sub-board according to the matching degree image of the PCB jointed board; the matching degree image of the PCB jointed board identifies the central point position of the first image of each PCB daughter board;

and the first image determining module is used for determining the first image of each PCB sub-board in the PCB jointed board image according to the first position of the first image of each PCB sub-board.

Further, the first template matching module 2021 further includes a binarization processing module, configured to perform binarization processing on the matching degree image of the PCB jointed board to filter noise.

Further, the first template matching module 2021 further includes a morphology processing module, configured to perform morphology processing on the matching degree image of the PCB jointed board after the binarization processing, so as to eliminate image interference.

In an exemplary embodiment, the third feature position determination module 2025 includes:

the second sliding window sliding module is used for sliding in the feature matching search area by a second preset step length by taking the feature electronic component image as a second sliding window;

the characteristic matching degree image acquisition module is used for performing matching operation on the region where the second sliding window is overlapped with the characteristic matching search region when the second sliding window slides on the characteristic matching search region to acquire a matching degree image of the characteristic matching search region;

the position determining module is used for determining a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board according to the matching degree image of the characteristic matching search area; and the matching degree image of the feature matching search area identifies the central point position of the feature electronic component.

Example 3

The following are embodiments of the apparatus of the present application that may be used to perform embodiments of the methods of the present application. For details which are not disclosed in the embodiments of the apparatus of the present application, reference is made to the embodiments of the method of the present application.

Referring to fig. 10, the present application also provides an electronic device 300, which may be, but is not limited to, various personal computers, notebook computers, interactive intelligent tablets, and AOI (Automated Optical Inspection) devices. The electronic device 300 may include: at least one processor 301, at least one memory 302, at least one network interface 303, a user interface 304, and at least one communication bus 305. In the exemplary embodiment of the present application, the electronic device 300 is an AOI device.

The user interface 304 is mainly used for providing an input interface for a user, acquiring data input by the user, and may include a display terminal and a camera terminal; the display end comprises a display screen and a touch screen, and the display screen is used for displaying the data processed by the processor; the touch screen may include: a capacitive screen, an electromagnetic screen, an infrared screen, or the like, and in general, the touch screen may receive a touch operation or a writing operation input by a user through a finger or an input device. Optionally, the user interface 304 may also include a standard wired interface, a wireless interface.

The network interface 303 may optionally include a standard wired interface or a wireless interface (e.g., WI-FI interface).

Wherein the communication bus 305 is used to enable connection communication between these components.

The processor 301 may include one or more processing cores. The processor 301, using various interfaces and lines to connect various parts throughout the electronic device 300, performs various functions of the electronic device 300 and processes data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 302, and calling data stored in the memory 302. Optionally, the processor 301 may be implemented in at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 301 may integrate one or more of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a modem, and the like. Wherein, the CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing the content required to be displayed by the display screen; the modem is used to handle wireless communications. It is understood that the modem may not be integrated into the processor 301, but may be implemented by a single chip.

The Memory 302 may include a Random Access Memory (RAM) or a Read-Only Memory (Read-Only Memory). Optionally, the memory 302 includes a non-transitory computer-readable medium. The memory 302 may be used to store instructions, programs, code, sets of codes, or sets of instructions. The memory 302 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the above-described method embodiments, and the like; the storage data area may store data and the like referred to in the above respective method embodiments. The memory 302 may alternatively be at least one storage device located remotely from the processor 301. As shown in fig. 10, the memory 302, which is a kind of computer storage medium, may include an operating system, a network communication module, and a user therein.

The processor 301 may be configured to invoke an application program of the detection identification method for the PCB panel stored in the memory 302, and specifically perform the following operations: acquiring a PCB daughter board template image, PCB daughter board detection information and a PCB jointed board image to be detected; the PCB jointed board image to be detected comprises a plurality of PCB daughter board images which are the same as the PCB daughter board template images; the PCB daughter board detection information stores the position of an electronic component to be detected on the PCB daughter board template image and parameters required for detecting the electronic component; performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image; according to the position of the electronic component to be detected on the PCB daughter board template image and the position of each PCB daughter board image, marking the electronic component on each PCB daughter board image and detecting parameters required by the electronic component

In an embodiment, the processor 301 may be configured to invoke the memory 302 to perform image matching on the PCB daughter board template image and the PCB jointed board image, and when obtaining each PCB daughter board image and a position of each PCB daughter board image, specifically perform the following operations: performing template matching on the PCB daughter board template image and the PCB jointed board image to obtain a first image of each PCB daughter board and a first position of the first image of each PCB daughter board; determining a characteristic electronic component image in the PCB daughter board template image and a first characteristic position of the characteristic electronic component image in the PCB daughter board template image; determining a second characteristic position corresponding to the first characteristic position on the first image of each PCB daughter board; the second characteristic position is a position in the first image of the PCB daughter board, which is overlapped with the first characteristic position of the PCB daughter board template image; determining a feature matching search area in the first image of each PCB daughter board by taking the second feature position as a center; carrying out template matching on the characteristic electronic component image in each characteristic matching search area to obtain a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board; adjusting the position of the PCB daughter board template image matched with the PCB jointed board image to enable the first characteristic position of the PCB daughter board template image to coincide with the third characteristic position in the first image of each PCB daughter board; determining the position of each superposed image of the jointed PCB image and the PCB daughter board template image as the position of each PCB daughter board image, and determining the image of each superposed image of the jointed PCB image and the PCB daughter board template image as each PCB daughter board image.

In an exemplary embodiment, the processor 301 may be configured to invoke the memory 302 to perform image matching on the PCB daughter board template image and the PCB jigsaw image, and when the first image of each PCB daughter board and the first position of the first image of each PCB daughter board are obtained, specifically perform the following operations: taking the PCB daughter board template image as a first sliding window, and sliding in the PCB jointed board image by a first preset step length; when the PCB jointed board image slides, matching operation is carried out on the overlapped area of the first sliding window and the PCB jointed board image, and a matching degree image of the PCB jointed board is obtained; determining a first position of a first image of each PCB sub-board according to the matching degree image of the PCB jointed board; the matching degree image of the PCB jointed board identifies the central point position of the first image of each PCB daughter board; and determining the first image of each PCB sub-board in the PCB jointed board image according to the first position of the first image of each PCB sub-board.

In an exemplary embodiment, the processor 301 may be configured to invoke the memory 302 to perform template matching on the feature electronic component image in each feature matching search area, and when a third feature position of the feature electronic component in the first image of each PCB daughter board is obtained, specifically perform the following operations: taking the characteristic electronic component image as a second sliding window, and sliding in the characteristic matching search area by a second preset step length; when sliding on the feature matching search area, performing matching operation on an area where the second sliding window is overlapped with the feature matching search area to obtain a matching degree image of the feature matching search area; determining a third feature position of the feature electronic component in the first image of each PCB daughter board according to the matching degree image of the feature matching search area; and the matching degree image of the feature matching search area identifies the central point position of the feature electronic component.

Example 4

The present application further provides a computer-readable storage medium, on which a computer program is stored, where the instructions are suitable for being loaded by a processor and executing the method steps of the foregoing illustrated embodiments, and specific execution processes may refer to specific descriptions shown in embodiment 1, which are not described herein again. The device where the storage medium is located can be an electronic device such as a personal computer, a notebook computer, a smart phone and a tablet computer.

For the apparatus embodiment, since it basically corresponds to the method embodiment, reference may be made to the partial description of the method embodiment for relevant points. The above-described device embodiments are merely illustrative, wherein the components described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of the application. One of ordinary skill in the art can understand and implement it without inventive effort.

As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart block or blocks and/or flowchart block or blocks. These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.

The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). The memory is an example of a computer-readable medium.

Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium, such as a modulated data signal and a carrier wave

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A detection and identification method for a PCB jointed board is characterized by comprising the following steps:

2. The method for detecting and identifying the PCB jointed boards according to claim 1, wherein the step of performing image matching on the PCB daughter board template image and the PCB jointed board image to obtain each PCB daughter board image and the position of each PCB daughter board image comprises the steps of:

performing template matching on the PCB daughter board template image and the PCB jointed board image to obtain a first image of each PCB daughter board and a first position of the first image of each PCB daughter board;

determining a characteristic electronic component image in the PCB daughter board template image and a first characteristic position of the characteristic electronic component image in the PCB daughter board template image;

determining a second characteristic position corresponding to the first characteristic position on the first image of each PCB daughter board; the second characteristic position is a position in the first image of the PCB daughter board, which is overlapped with the first characteristic position of the PCB daughter board template image;

determining a feature matching search area in the first image of each PCB daughter board by taking the second feature position as a center;

carrying out template matching on the characteristic electronic component image in each characteristic matching search area to obtain a third characteristic position of the characteristic electronic component in the first image of each PCB daughter board;

adjusting the position of the PCB daughter board template image matched with the PCB jointed board image to enable the first characteristic position of the PCB daughter board template image to coincide with the third characteristic position in the first image of each PCB daughter board;

determining the position of each superposed image of the jointed PCB image and the PCB daughter board template image as the position of each PCB daughter board image, and determining the image of each superposed image of the jointed PCB image and the PCB daughter board template image as each PCB daughter board image.

3. The method for detecting and identifying the PCB jointed board as claimed in claim 2, wherein the image matching of the PCB daughter board template image and the PCB jointed board image to obtain the first image of each PCB daughter board and the first position of the first image of each PCB daughter board comprises:

taking the PCB daughter board template image as a first sliding window, and sliding in the PCB jointed board image by a first preset step length;

when the PCB jointed board image slides, matching operation is carried out on the overlapped area of the first sliding window and the PCB jointed board image, and a matching degree image of the PCB jointed board is obtained;

determining a first position of a first image of each PCB sub-board according to the matching degree image of the PCB jointed board; the matching degree image of the PCB jointed board identifies the central point position of the first image of each PCB daughter board;

and determining the first image of each PCB sub-board in the PCB jointed board image according to the first position of the first image of each PCB sub-board.

4. The method for detecting and identifying the PCB jointed board as claimed in claim 3, wherein in the image of the matching degree of the PCB jointed board, the position where the matching degree of the first sliding window and the image of the PCB jointed board is the highest is the position of the central point of the first image of each PCB daughter board.

5. The method for detecting and identifying the PCB jointed board as claimed in claim 3, wherein after obtaining the image of the matching degree of the PCB jointed board, the method further comprises: and carrying out binarization processing on the matching degree image of the PCB jointed board.

6. The method for detecting and identifying the jointed PCB board as claimed in claim 5, wherein after the binarization processing is performed on the matching degree image of the jointed PCB board, the method further comprises: and performing morphological processing on the matching degree image of the PCB jointed board after the binarization processing.

7. The method for detecting and identifying the jointed PCB board as claimed in claim 2, wherein the step of performing template matching on the images of the characteristic electronic components in each of the characteristic matching search regions to obtain a third characteristic position of the characteristic electronic component in the first image of each of the PCB daughter boards comprises:

taking the characteristic electronic component image as a second sliding window, and sliding in the characteristic matching search area by a second preset step length;

when sliding on the feature matching search area, performing matching operation on an area where the second sliding window is overlapped with the feature matching search area to obtain a matching degree image of the feature matching search area;

determining a third feature position of the feature electronic component in the first image of each PCB daughter board according to the matching degree image of the feature matching search area; and the matching degree image of the feature matching search area identifies the central point position of the feature electronic component.

8. The utility model provides a detection identification means of PCB makeup which characterized in that includes:

9. An electronic device, comprising: a display screen, a processor and a memory; wherein the memory stores a computer program adapted to be loaded by the processor and to execute the method of detecting and identifying a PCB panel as claimed in any one of claims 1 to 7.

10. A computer-readable storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements a method for detecting identification of a PCB panel as claimed in any one of claims 1 to 7.