CN111598832A - Slot defect marking method and device and storage medium - Google Patents

Slot defect marking method and device and storage medium Download PDF

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Publication number
CN111598832A
CN111598832A CN202010250698.8A CN202010250698A CN111598832A CN 111598832 A CN111598832 A CN 111598832A CN 202010250698 A CN202010250698 A CN 202010250698A CN 111598832 A CN111598832 A CN 111598832A
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Prior art keywords
image
detected
slot
pcb
quality inspection
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CN202010250698.8A
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Chinese (zh)
Inventor
曾建华
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Jiangmen Glory Faith Pcb Co ltd
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Jiangmen Glory Faith Pcb Co ltd
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Priority to CN202010250698.8A priority Critical patent/CN111598832A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0008Industrial image inspection checking presence/absence
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10004Still image; Photographic image
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30164Workpiece; Machine component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Geometry (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The application discloses a slot defect marking method and device and a storage medium. The method comprises the steps of obtaining an image to be detected and model information of the PCB through a client, reading a reference image and a preset quality inspection area according to signal information, comparing slot hole parameters of the image to be detected and the reference image according to the quality inspection area, if the slot hole parameters are different, marking the corresponding quality inspection area in the image to be detected, selecting a specific area in the PCB through the quality inspection area to perform image comparison, and not needing to compare the whole PCB area, so that the defect area is marked quickly, the image processing time is greatly reduced, and the production efficiency is improved.

Description

Slot defect marking method and device and storage medium
Technical Field
The present application relates to the field of data processing technologies, and in particular, to a method and an apparatus for marking a slot defect, and a storage medium.
Background
The manufacturing process of the PCB board involves a plurality of processes, the slotted hole on the board can be blocked or damaged in each process, the traditional efficiency of visual inspection by workers is very low, and the requirement of modern production can not be met. With the development of image recognition technology, the technology of recognizing and imaging the slot on the PCB by using equipment such as a hole counting machine is mature, for example, a light source assembly can be used to irradiate the PCB, an image of the slot in the PCB can be obtained according to a light transmission effect, and the size, shape and the like of the slot can be recognized. However, the existing scheme can only compare images, and the defects still need to be manually checked after the images are failed to be compared, so that the working efficiency is low.
Disclosure of Invention
In order to overcome the defects of the prior art, the application aims to provide a slot defect marking method, a slot defect marking device and a storage medium, which can mark the defects quickly and improve the production efficiency.
The technical scheme adopted by the application for solving the problems is as follows: in a first aspect, the application provides a slot defect labeling method for a hole counting machine, which comprises the following steps:
the method comprises the steps that a client side obtains an image to be detected of a PCB and model information of the PCB;
the client reads a reference image and a preset quality inspection area according to the model information; the client compares the slot parameters of the image to be detected and the reference image according to the quality inspection area;
if the slotted hole parameters of the image to be detected and the reference image are different, marking the corresponding quality inspection area in the image to be detected.
Further, the image to be detected is obtained through image recognition.
Further, the slot parameters include at least one of:
a quantity parameter;
a location parameter;
a shape parameter;
a dimensional parameter;
and (4) area parameters.
Further, if the slot parameter of the comparison is a size parameter, the method further comprises: and acquiring a preset error value, and if the difference value of the size parameters of the reference image and the image to be detected is smaller than the error value, outputting a signal that the size parameters of the reference image and the image to be detected are the same.
Further, still include: and the client acquires the type of a slotted hole contained in the PCB according to the model information, and if the PCB is detected to comprise a special-shaped hole, the client compares the reference image with the image to be detected according to the area parameter and the shape parameter.
Further, after the corresponding quality inspection region is marked in the image to be detected, the method further includes: and marking corresponding slotted holes in the image to be detected according to the reference image.
In a second aspect, the present application provides an apparatus for performing a slot defect labeling method, comprising a CPU unit for performing the following steps:
the method comprises the steps that a client side obtains an image to be detected of a PCB and model information of the PCB;
the client reads a reference image and a preset quality inspection area according to the model information; the client compares the slot parameters of the image to be detected and the reference image according to the quality inspection area;
if the slotted hole parameters of the image to be detected and the reference image are different, marking the corresponding quality inspection area in the image to be detected.
In a third aspect, the present application provides an apparatus for performing a slot defect labeling method, comprising at least one control processor and a memory communicatively coupled to the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the slot defect labeling method as described above.
In a fourth aspect, the present application provides a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the slot defect labeling method as described above.
In a fifth aspect, the present application further provides a computer program product comprising a computer program stored on a computer-readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the slot defect labeling method as described above.
One or more technical schemes provided in the embodiment of the application have at least the following beneficial effects: this application acquires waiting of PCB board and examines image and model information through the customer end, reads reference image and preset's quality inspection region according to signal information, according to the quality inspection is regional right wait to examine the image with reference image carries out the comparison of slotted hole parameter, if slotted hole parameter is different wait to examine in the image mark correspond the quality inspection region has selected the specific area in the PCB board through the quality inspection region and has carried out the image contrast, need not to compare whole PCB board region, has realized marking defective area fast, has reduced image processing's time by a wide margin, has improved production efficiency.
Drawings
The present application is further described below with reference to the following figures and examples.
Fig. 1 is a flowchart of a method for marking a slot defect according to an embodiment of the present application;
FIG. 2 is a flow chart of a method for marking a slot defect according to another embodiment of the present disclosure;
FIG. 3 is a flowchart of a method for marking a slot defect according to another embodiment of the present disclosure;
FIG. 4 is a flowchart of a method for marking a slot defect according to another embodiment of the present disclosure;
fig. 5 is a schematic diagram of an apparatus for performing a slot defect labeling method according to a second embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that, if not conflicted, the various features of the embodiments of the present application may be combined with each other within the scope of protection of the present application. Additionally, while functional block divisions are performed in apparatus schematics, with logical sequences shown in flowcharts, in some cases, steps shown or described may be performed in sequences other than block divisions in apparatus or flowcharts.
Referring to fig. 1, a first embodiment of the present application provides a method for marking a slot defect for a hole counting machine, including the following steps:
s100, a client acquires an image to be detected of the PCB and the model information of the PCB;
step S200, the client reads the reference image and a preset quality inspection area according to the model information; the client compares the slot hole parameters of the image to be detected and the reference image according to the quality inspection area;
and step S300, if the slotted hole parameters of the image to be detected and the reference image are different, marking a corresponding quality inspection area in the image to be detected.
In an embodiment, the image to be detected of the PCB acquired in step S100 may be an entire image of the PCB or a partial area to be detected, and is selected according to actual requirements.
In an embodiment, the model information of the PCB is used for acquiring a corresponding reference image and a preset quality inspection area from the server, and the model information is adopted to facilitate correspondence when the reference image and various parameters are preset. It is understood that the number of the quality inspection areas can be any number, including at least one, and can be increased or decreased according to actual needs. It should be noted that if there are multiple quality inspection regions, in this embodiment, preferably, labeling is performed once after each quality inspection region is completed until the comparison of all the regions is completed, and the entire PCB can be detected by one operation, which saves the process.
In an embodiment, the comparison in step S200 may be performed by a common image comparison method in the prior art, for example, whether each pixel in the reference image and the image to be detected is the same or not may be compared, and whether the two images are the same or not may be determined, which is not described in this embodiment again.
In another embodiment of the present application, the image to be detected is acquired by image recognition.
In an embodiment, the image to be detected may be obtained by any image recognition method in the prior art, for example, a stable LED lamp is used as a light source in an existing hole counting machine, when light penetrates through a hole on a PCB and is projected onto a CCD optical sensor through a lens, the CCD sensor may sense the intensity change of the light source and generate a voltage signal for output, and then the analog signal is converted into a digital image signal by an electronic circuit and transmitted to a computer, or other image recognition techniques may be used to obtain the image to be detected, which is not described herein again.
In another embodiment of the present application, the slot parameters include at least one of:
a quantity parameter;
a location parameter;
a shape parameter;
a dimensional parameter;
and (4) area parameters.
In an embodiment, the number parameter may be the number of the slots, and since the types and shapes of the slots of the PCB are known, the number of the slots may be obtained by identifying the number of the patterns having the specific shapes, and the conventional image identification technology is adopted, which is not described herein again, and is beneficial to determining whether there is a production defect or not from the number of the slots.
In an embodiment, the position parameter may be a position of the slot in the PCB, for example, the position parameter is embodied in a form of a coordinate system, and a coordinate value of a position where the slot is absent or is excessive in the image to be detected is obtained by comparing the reference image with the image to be detected, and a position corresponding to the coordinate value is labeled, so that the setting position of the slot can be detected.
In an embodiment, since the shapes of the slots are of a plurality of types, the defects of the slots can be determined according to the shape parameters, for example, the slots in the reference image are circular, and if the slots in the corresponding region in the image to be detected are square, the slots in the image to be detected are defective slots, so that the shape defects of the slots can be detected.
In an embodiment, in the manufacturing process of the PCB, the existing slot holes are likely to be unnecessarily filled in a certain process, which results in the slot holes being reduced, or the slot holes are too large in the opening process, so that the slot holes are detected according to the size parameters, which can avoid the above-mentioned defects.
In an embodiment, the area parameter may be used to detect the special-shaped hole, and since the shape of the special-shaped hole is not fixed, it is difficult to determine whether the special-shaped hole has a defect through the size parameter.
Referring to fig. 2, in another embodiment of the present application, if the slot parameters of the performed comparison are size parameters, the method further includes:
step S210, obtaining a preset error value, and if the difference between the size parameters of the reference image and the image to be detected is smaller than the error value, outputting a signal that the size parameters of the reference image and the image to be detected are the same.
In an embodiment, since the production process of the PCB cannot realize absolute accuracy, a certain error is acceptable, in this case, an error value can be introduced in the embodiment when comparing the size parameters, and if the absolute value of the difference between the size parameters of the reference image and the image to be detected is smaller than the error value, the size parameter of the slot hole meets the production standard and does not belong to the slot hole with the defect.
Referring to fig. 3, in another embodiment of the present application, further includes:
and S220, the client acquires the type of a slotted hole contained in the PCB according to the model information, and if the PCB is detected to contain a special-shaped hole, the client compares the reference image with the image to be detected according to the area parameter and the shape parameter.
In an embodiment, the PCB board including the special-shaped holes can be marked through the model information, if the special-shaped holes do not exist, the area parameters are not adopted to compare the reference image with the image to be detected, and the comparison time is saved. It can be understood that, for the special-shaped hole, the area parameter and the shape parameter are preferably used together for comparison, and if only the area parameter is adopted, the situation that the shapes are different and the areas are the same is likely to occur, and the special-shaped hole cannot be accurately judged.
Referring to fig. 4, in another embodiment of the present application, after marking a corresponding quality inspection area in an image to be detected, the method further includes:
step S310, marking corresponding slotted holes in the image to be detected according to the reference image.
In an embodiment, the labeling in step S310 may be to generate text information for description, or to display at a corresponding position of the image to be detected, for example, highlighting at a position lacking a slot, or indexing a plurality of slots through lines, and the specific manner is selected according to actual requirements.
Referring to fig. 5, another embodiment of the present application further provides an apparatus for performing a slot defect labeling method, where the apparatus is a smart device, such as a smart phone, a computer, a tablet computer, and the like, and the embodiment is described by taking the computer as an example.
In the computer 5000 for executing the slot defect labeling method, a CPU unit 5100 is included, and the CPU unit 5100 is configured to perform the following steps:
the method comprises the steps that a client side obtains an image to be detected of a PCB and model information of the PCB;
the client reads the reference image and a preset quality inspection area according to the model information; the client compares the slot hole parameters of the image to be detected and the reference image according to the quality inspection area;
if the slot hole parameters of the image to be detected and the reference image are different, marking a corresponding quality inspection area in the image to be detected.
In this embodiment, the intelligent device is installed with a client for executing the above-mentioned slot defect labeling method, which is not completed by user operation in this embodiment, but automatically completed by initialization of the CPU unit when the computer 5000 is started.
Further, in another embodiment of the present application, the CPU unit 5100 is further configured to perform the following steps:
and acquiring a preset error value, and if the difference value of the size parameters of the reference image and the image to be detected is smaller than the error value, outputting a signal that the size parameters of the reference image and the image to be detected are the same.
Further, in another embodiment of the present application, the CPU unit 5100 is further configured to perform the following steps:
and the client acquires the type of a slotted hole contained in the PCB according to the model information, and if the PCB is detected to comprise a special-shaped hole, the client compares the reference image with the image to be detected according to the area parameter and the shape parameter.
Further, in another embodiment of the present application, the CPU unit 5100 is further configured to perform the following steps:
and marking the corresponding slot holes in the image to be detected according to the reference image.
The computer 5000 and the CPU unit 5100 may be connected via a bus or other means, and the computer 5000 further includes a memory as a non-transitory computer readable storage medium, which may be used to store non-transitory software programs, non-transitory computer executable programs, and modules, such as program instructions/modules corresponding to the apparatus for performing the slot defect labeling method in the embodiment of the present application. The computer 5000 controls the CPU 5100 to execute various functional applications for executing the slot defect labeling method and data processing by operating non-transitory software programs, instructions, and modules stored in the memory, so as to implement the slot defect labeling method of the above-described method embodiment.
The memory may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created from use of the CPU unit 5100, and the like. Further, the memory may include high speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory located remotely from the CPU unit 5100, which may be connected to the computer 5000 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The one or more modules are stored in the memory and, when executed by the CPU unit 5100, perform the slot defect labeling method in the above-described method embodiments.
The embodiment of the present application further provides a computer-readable storage medium, where computer-executable instructions are stored, and the computer-executable instructions are executed by the CPU 5100, so as to implement the slot defect labeling method described above.
The above-described embodiments of the apparatus are merely illustrative, and the apparatuses described as separate components may or may not be physically separate, may be located in one place, or may be distributed over a plurality of network apparatuses. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
It should be noted that, since the apparatus for performing the slot defect labeling method in the present embodiment is based on the same inventive concept as the slot defect labeling method described above, the corresponding contents in the method embodiments are also applicable to the apparatus embodiments, and are not described in detail herein.
Through the above description of the embodiments, those skilled in the art can clearly understand that the embodiments can be implemented by software plus a general hardware platform. Those skilled in the art will appreciate that all or part of the processes in the methods of the above embodiments may be implemented by hardware related to instructions of a computer program, which may be stored in a computer-readable storage medium, and when executed, may include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read Only Memory (ROM), a Random Access Memory (RAM), or the like.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope of the present invention defined by the claims.

Claims (8)

1. A method for marking slot defects is used for a hole counting machine and is characterized by comprising the following steps: the method comprises the steps that a client side obtains an image to be detected of a PCB and model information of the PCB;
the client reads a reference image and a preset quality inspection area according to the model information;
the client compares the slot parameters of the image to be detected and the reference image according to the quality inspection area;
if the slotted hole parameters of the image to be detected and the reference image are different, marking the corresponding quality inspection area in the image to be detected.
2. The method for marking the slot defects according to claim 1, wherein the method comprises the following steps: and the image to be detected is acquired through image identification.
3. The method as claimed in claim 1, wherein the slot parameters include at least one of:
a quantity parameter;
a location parameter;
a shape parameter;
a dimensional parameter;
and (4) area parameters.
4. The method as claimed in claim 3, wherein if the slot parameter is a dimension parameter, the method further comprises: and acquiring a preset error value, and if the difference value of the size parameters of the reference image and the image to be detected is smaller than the error value, outputting a signal that the size parameters of the reference image and the image to be detected are the same.
5. The method for marking the slot defect as claimed in claim 3, further comprising: and the client acquires the type of a slotted hole contained in the PCB according to the model information, and if the PCB is detected to comprise a special-shaped hole, the client compares the reference image with the image to be detected according to the area parameter and the shape parameter.
6. The method for labeling the defect of the slot hole according to claim 3, wherein after the corresponding quality inspection region is labeled in the image to be detected, the method further comprises the following steps: and marking corresponding slotted holes in the image to be detected according to the reference image.
7. An apparatus for performing a slot defect labeling method, comprising a CPU unit configured to perform the steps of:
the method comprises the steps that a client side obtains an image to be detected of a PCB and model information of the PCB;
the client reads a reference image and a preset quality inspection area according to the model information;
the client compares the slot parameters of the image to be detected and the reference image according to the quality inspection area;
if the slotted hole parameters of the image to be detected and the reference image are different, marking the corresponding quality inspection area in the image to be detected.
8. A computer-readable storage medium characterized by: the computer-readable storage medium stores computer-executable instructions for causing a computer to perform a method of slot defect labeling as claimed in any one of claims 1 to 6.
CN202010250698.8A 2020-04-01 2020-04-01 Slot defect marking method and device and storage medium Pending CN111598832A (en)

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CN116907341A (en) * 2023-07-06 2023-10-20 深圳市塔联科技有限公司 Intelligent detection method and system for PCB

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Application publication date: 20200828