CN113201717A - Manufacturing process of heat dissipation assembly under screen - Google Patents
Manufacturing process of heat dissipation assembly under screen Download PDFInfo
- Publication number
- CN113201717A CN113201717A CN202110294588.6A CN202110294588A CN113201717A CN 113201717 A CN113201717 A CN 113201717A CN 202110294588 A CN202110294588 A CN 202110294588A CN 113201717 A CN113201717 A CN 113201717A
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- CN
- China
- Prior art keywords
- heat dissipation
- graphene layer
- under
- dissipation assembly
- screen
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing process of a heat dissipation assembly under a screen, which comprises the following steps of plating a graphene layer on one side of foam by a magnetron sputtering method; and plating a metal layer on the graphene layer by adopting a magnetron sputtering method. The method has the advantages that the graphene coating is formed on the foam by the magnetron sputtering method, and the metal coating is formed on the graphene coating by the magnetron sputtering method, so that the under-screen heat dissipation assembly can be manufactured, glue is not needed, the heat dissipation performance of the under-screen heat dissipation assembly can be effectively improved, the production process can be simplified, the production efficiency is improved, and the manufacturing cost of the under-screen heat dissipation assembly is reduced.
Description
Technical Field
The invention relates to a manufacturing process of a heat dissipation assembly under a screen.
Background
When mobile terminal equipment such as a smart phone works, a screen body can generate a large amount of heat, and the heat accumulation can influence the normal work of the mobile terminal equipment in turn, so that the mobile terminal equipment is blocked and the like. Therefore, an under-screen heat dissipation assembly for dissipating heat from the screen body is generally disposed in the existing mobile terminal device. In the prior art, the under-screen heat dissipation assembly generally comprises foam, a first heat dissipation sheet and a second heat dissipation sheet which are sequentially stacked, wherein the foam is attached to the inner side surface of the screen body.
Although the heat dissipation performance of the screen body can be improved to a certain extent by the existing under-screen heat dissipation assembly, the first heat dissipation sheet and the foam (and/or the second heat dissipation sheet) are in adhesive connection, and glue can block heat transfer, so that the whole heat dissipation capacity of the under-screen heat dissipation assembly is affected.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the manufacturing process of the under-screen heat dissipation assembly is low in cost, and the under-screen heat dissipation assembly manufactured by the manufacturing process is excellent in heat dissipation performance.
In order to solve the technical problems, the invention adopts the technical scheme that: a manufacturing process of a heat dissipation component under a screen comprises the following steps,
plating a graphene layer on one side of the foam by adopting a magnetron sputtering method;
and plating a metal layer on the graphene layer by adopting a magnetron sputtering method.
The invention has the beneficial effects that: the method has the advantages that the graphene coating is formed on the foam by the magnetron sputtering method, the metal coating is formed on the graphene coating by the magnetron sputtering method, and the under-screen radiating assembly can be manufactured without glue, so that the radiating performance of the under-screen radiating assembly can be effectively improved, the production process can be simplified, the production efficiency is improved, the manufacturing cost of the under-screen radiating assembly is reduced, the overall thickness of the under-screen radiating assembly can be reduced, and the development trend of lightness and thinness of the mobile terminal equipment is better met.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description will be given with reference to the embodiments.
A manufacturing process of a heat dissipation component under a screen comprises the following steps,
plating a graphene layer on one side of the foam by adopting a magnetron sputtering method;
and plating a metal layer on the graphene layer by adopting a magnetron sputtering method.
From the above description, the beneficial effects of the present invention are: the method has the advantages that the graphene coating is formed on the foam by the magnetron sputtering method, and the metal coating is formed on the graphene coating by the magnetron sputtering method, so that the under-screen heat dissipation assembly can be manufactured, glue is not needed, the heat dissipation performance of the under-screen heat dissipation assembly can be effectively improved, the production process can be simplified, the production efficiency is improved, and the manufacturing cost of the under-screen heat dissipation assembly is reduced.
Further, the method for plating the metal layer on the graphene layer by adopting the magnetron sputtering method also comprises the step of cooling the graphene layer.
As can be seen from the above description, the graphene layer is cooled to facilitate subsequent sputtering of a metal layer on the graphene layer.
Further, "cool off the processing to graphite alkene layer", cool off the processing to graphite alkene layer from graphite alkene layer one side of keeping away from the bubble cotton.
From the above description, it can be known that cooling treatment is carried out on the graphene layer from the side of the graphene layer away from the foam, so that the cooling speed of the graphene layer can be increased, and the production efficiency is improved.
Further, the method for plating the metal layer on the graphene layer by adopting the magnetron sputtering method also comprises the step of carrying out flattening treatment on the graphene layer.
According to the description, the roughness of the surface of the foam is higher, and after the graphene layer is plated on the foam, the surface of the graphene layer is concave-convex, so that the surface of the metal plating layer is not smooth enough, and the product quality of the heat dissipation assembly under the screen is affected.
Further, when the graphene layer is subjected to flattening treatment, polishing equipment is adopted to carry out flattening treatment on the surface of the graphene layer.
Further, when the graphene layer is subjected to leveling treatment, laser cutting equipment is adopted to level the surface of the graphene layer.
As can be seen from the above description, the method for planarizing the graphene layer is various and can be selected according to actual situations.
Further, the method for plating the graphene layer on one side of the foam by using the magnetron sputtering method comprises the step of cleaning the foam.
According to the description, the foam is cleaned, so that the bonding force between the foam and the graphene layer can be improved, and the structural stability of the heat dissipation assembly under the screen is guaranteed.
Further, the foam is high-temperature foam.
According to the description, the high-temperature foam cannot generate unexpected thermal deformation when being plated with graphene, and the product quality of the heat dissipation assembly under the screen is guaranteed.
Further, the metal layer is a copper layer.
Example one
The first embodiment of the invention is as follows: a manufacturing process of a heat dissipation component under a screen comprises the following steps,
s1, plating a graphene layer on one side of the foam by adopting a magnetron sputtering method;
and S2, plating a metal layer on the graphene layer by adopting a magnetron sputtering method, wherein the metal layer is a copper layer.
The method has the advantages that the graphene coating is formed on the foam by the magnetron sputtering method, and the metal coating is formed on the graphene coating by the magnetron sputtering method, so that the under-screen heat dissipation assembly can be manufactured, glue is not needed, the heat dissipation performance of the under-screen heat dissipation assembly can be effectively improved, the production process can be simplified, the production efficiency is improved, and the manufacturing cost of the under-screen heat dissipation assembly is reduced.
Further, step S11 is further included before step S2, and the graphene layer is subjected to a cooling process. In order to increase the cooling rate, in step S11, it is preferable to perform a cooling process on the graphene layer from the side of the graphene layer away from the foam. When cooling down graphite alkene layer, can adopt the mode of liquid cooling, it is concrete, add a cooling plate in the sputtering cavity of vacuum sputtering equipment, the bubble cotton of having sputtered good graphite alkene layer passes between the chill roll of chill roll and vacuum sputtering equipment, wherein, is equipped with the cooling water course in the cooling plate, and the cooling water course communicates with external cooling device, has mobile coolant liquid in the cooling water course, and cooling device makes the coolant liquid circulation.
In order to improve the flatness of the surface of the produced under-screen heat dissipation assembly, step S12 is further included before step S2, and the graphene layer is subjected to a flattening treatment. To better flatten the graphene layer, step S12 is located after step S11. When step S12 is implemented, a polishing device may be selected to perform a planarization process on the surface of the graphene layer, or a laser cutting device may be selected to perform a planarization process on the surface of the graphene layer. The laser beam has the advantage of high concentration, and can effectively eliminate the raised area on the surface of the graphene layer by utilizing the laser beam so as to flatten the surface of the graphene layer. Moreover, when leveling graphene layer, usable laser cutting equipment carries out the attenuate processing to graphene layer to reduce graphene layer's thickness, and then improve graphene layer's radiating effect. In detail, when utilizing laser cutting equipment to carry out leveling to graphite alkene layer surface, can arrange the laser beam in graphite alkene layer on the route that advances, that is to say, in the in-process that advances of the semi-manufactured goods on bubble cotton and graphite alkene layer, graphite alkene layer just can be cut by the laser beam, need not to bubble cotton and graphite alkene layer semi-manufactured goods and stops waiting for the cutting of laser cutting equipment, so can increase substantially production efficiency. Preferably, the laser cutting equipment selects the bubble cotton region corresponding to the region to be cut on the graphene layer to be still attached to the cooling roller of the vacuum sputtering equipment (namely, the bubble cotton region corresponding to the region to be cut on the graphene layer is not separated from the cooling roller) when the laser cutting equipment cuts the graphene layer, so that the cutting precision can be ensured, and the leveling effect of leveling treatment is improved.
In order to make the graphene layer better bond with the foam, step S1 is preceded by step S0, in which the foam is cleaned.
In a preferred embodiment, the foam is a high temperature foam, and in this example, the foam is a foam produced by 3M company and capable of withstanding a high temperature of 145 ℃.
In conclusion, the manufacturing process of the under-screen heat dissipation assembly provided by the invention has the advantages of low implementation cost and high production efficiency, and the manufactured under-screen heat dissipation assembly has the advantages of stable structure, excellent heat dissipation performance and good flatness.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention in the specification or directly or indirectly applied to the related technical field are included in the scope of the present invention.
Claims (9)
1. A manufacturing process of a heat dissipation assembly under a screen is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
plating a graphene layer on one side of the foam by adopting a magnetron sputtering method;
and plating a metal layer on the graphene layer by adopting a magnetron sputtering method.
2. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: the method comprises the step of cooling the graphene layer before plating a metal layer on the graphene layer by adopting a magnetron sputtering method.
3. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: when the graphene layer is cooled, the graphene layer is cooled from the side of the graphene layer away from the foam.
4. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: the method comprises the step of carrying out flattening treatment on the graphene layer before plating a metal layer on the graphene layer by adopting a magnetron sputtering method.
5. The process for manufacturing an under-screen heat dissipation assembly according to claim 4, wherein: when the graphene layer is subjected to flattening treatment, the surface of the graphene layer is flattened by adopting polishing equipment.
6. The process for manufacturing an under-screen heat dissipation assembly according to claim 4, wherein: when the graphene layer is subjected to flattening treatment, laser cutting equipment is adopted to flatten the surface of the graphene layer.
7. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: the method comprises the following steps of plating a graphene layer on one side of foam by adopting a magnetron sputtering method, and cleaning the foam.
8. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: the foam is high-temperature foam.
9. The process for manufacturing an under-screen heat dissipation assembly according to claim 1, wherein: the metal layer is a copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294588.6A CN113201717A (en) | 2021-03-19 | 2021-03-19 | Manufacturing process of heat dissipation assembly under screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110294588.6A CN113201717A (en) | 2021-03-19 | 2021-03-19 | Manufacturing process of heat dissipation assembly under screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113201717A true CN113201717A (en) | 2021-08-03 |
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ID=77025492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110294588.6A Pending CN113201717A (en) | 2021-03-19 | 2021-03-19 | Manufacturing process of heat dissipation assembly under screen |
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| Country | Link |
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| CN (1) | CN113201717A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205902314U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Compound graphite radiating sheet |
| WO2017008455A1 (en) * | 2015-07-13 | 2017-01-19 | 中兴通讯股份有限公司 | Heat sink device |
| CN108059929A (en) * | 2017-12-28 | 2018-05-22 | 张家港康得新光电材料有限公司 | Heat-conducting glue band, its production method and electronic equipment |
-
2021
- 2021-03-19 CN CN202110294588.6A patent/CN113201717A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017008455A1 (en) * | 2015-07-13 | 2017-01-19 | 中兴通讯股份有限公司 | Heat sink device |
| CN205902314U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Compound graphite radiating sheet |
| CN108059929A (en) * | 2017-12-28 | 2018-05-22 | 张家港康得新光电材料有限公司 | Heat-conducting glue band, its production method and electronic equipment |
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Application publication date: 20210803 |