CN113201663A - High-conductivity copper alloy plate and preparation method thereof - Google Patents
High-conductivity copper alloy plate and preparation method thereof Download PDFInfo
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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Abstract
The invention discloses a high-conductivity copper alloy plate which is characterized by comprising 0.01-0.05 wt% of Ag, 0.8-1.5 wt% of Ni, 0.01-0.03 wt% of W, 0.10-0.20 wt% of P, 0.01-0.03 wt% of Ta, 0.05-0.13 wt% of Sb, 0.03-0.06 wt% of Hf, 0.01-0.03 wt% of Ho, 0.001-0.003 wt% of graphene-coated nano aluminum powder, 0.1-0.3 wt% of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance of nano copper powder. The invention also provides a preparation method of the high-conductivity copper alloy plate. The high-conductivity copper alloy plate disclosed by the application has excellent conductivity, heat resistance, heat dissipation and high mechanical strength.
Description
Technical Field
The invention relates to the technical field of nonferrous metal processing, in particular to a high-conductivity copper alloy plate and a preparation method thereof.
Background
In various electric/electronic industry fields, a conductive plate material is required as a conductive member having high conductivity. Such a conductive plate material is required to have good electrical conductivity and heat conductivity (heat dissipation) in order to suppress heat generated during energization, and to have sufficient contact pressure between components in order to ensure current flow. It is in this situation that highly conductive copper alloy sheets have come into existence, and its appearance brings about an eosin for the development of electricity/electronics.
With the high-speed transmission (large current) and miniaturization of electric and electronic parts, the conductivity of the copper alloy sheet material used is required to be higher and higher (for example, the popularization of rapid charging, the application of electric automobiles, and the like); thinner and thinner thicknesses require higher strength materials. Meanwhile, the temperature rise caused by the large current is easy to cause the softening of the copper alloy material, and the material is required to have heat resistance with good heat conductivity (heat dissipation); further, as electric and electronic parts have more flexible functions, their shapes become more complicated, and the demand for the bending workability of materials is also increasing. The existing copper alloy sheet cannot meet the requirements due to the selection problem of the component formula.
In order to solve the above problems, patent CN 107090553a discloses a Cu-Ni-Co-V-Cr-Mo-Zn-Mn-Ti alloy, which comprises the following components by weight percent: 4.8 to 7.6 percent of Ni, 2.3 to 5.7 percent of V, 1.7 to 2.2 percent of Cr, 3.5 to 5.7 percent of Mo, 1.5 to 2.3 percent of Zn, 1.2 to 2.3 percent of Mn and 0.7 to 2.5 percent of Ti, wherein the content of Co is only 0.05 to 0.10 percent, the balance is Cu, the strength of the copper alloy reaches 1300MPa, but the conductivity is only 10 percent of IACS.
There is still a need in the art for a copper alloy sheet with high conductivity, excellent heat resistance, heat dissipation and mechanical strength.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-conductivity copper alloy plate with excellent conductivity, high heat resistance, high heat dissipation and high mechanical strength; meanwhile, the invention also provides a preparation method of the high-conductivity copper alloy plate.
In order to achieve the purpose, the invention adopts the technical scheme that: a high-conductivity copper alloy sheet is characterized by comprising 0.01-0.05 wt% of Ag, 0.8-1.5 wt% of Ni, 0.01-0.03 wt% of W, 0.10-0.20 wt% of P, 0.01-0.03 wt% of Ta, 0.05-0.13 wt% of Sb, 0.03-0.06 wt% of Hf, 0.01-0.03 wt% of Ho, 0.001-0.003 wt% of graphene-coated nano aluminum powder, 0.1-0.3 wt% of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance of nano copper powder.
Another object of the present invention is to provide a method for preparing the copper alloy sheet with high conductivity, which comprises the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 15-30min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
step S2, injecting the refined melt qualified in the step S1 into a die for die-casting;
step S3: and (4) carrying out heat treatment on the alloy blank subjected to die-casting molding in the step S2 to obtain the high-conductivity copper alloy plate.
Detailed Description
The following detailed description of preferred embodiments of the invention will be made.
A high-conductivity copper alloy sheet is characterized by comprising 0.01-0.05 wt% of Ag, 0.8-1.5 wt% of Ni, 0.01-0.03 wt% of W, 0.10-0.20 wt% of P, 0.01-0.03 wt% of Ta, 0.05-0.13 wt% of Sb, 0.03-0.06 wt% of Hf, 0.01-0.03 wt% of Ho, 0.001-0.003 wt% of graphene-coated nano aluminum powder, 0.1-0.3 wt% of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance of nano copper powder.
Preferably, the graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of the chinese patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 10-20% of the mass percentage.
Another object of the present invention is to provide a method for preparing the copper alloy sheet with high conductivity, which comprises the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 15-30min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
preferably, the smelting temperature is 1200-1220 ℃; the inert gas is any one of nitrogen, helium, neon and argon.
Preferably, the refining agent comprises the following components in parts by weight: 4-8 parts of potassium hexafluorosilicate, 3-6 parts of sodium bismuthate, 1-4 parts of terbium oxide and 30-40 parts of sodium chloride.
Preferably, the refining agent is added in an amount of (1-3) wt% of the melt mass.
Preferably, the filtration is ceramic filtration.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting;
preferably, the specific process of the die-casting molding is as follows: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 330-360 ℃, the injection speed is 0.5-1.0 m/s, the injection specific pressure is 90-100MPa, the pressurizing pressure is 98-120MPa and the pressure maintaining time is 8-10 seconds.
Step S3: and (4) carrying out heat treatment on the alloy blank subjected to die-casting molding in the step S2 to obtain the high-conductivity copper alloy plate.
Preferably, the heat treatment process specifically comprises: under the condition that the vacuum degree is less than 102MP-103MPa, the temperature is increased to 280-330 ℃ at the temperature rising speed of 3-5 ℃/min, the temperature is preserved for 0.5-1h, then the pressure is increased to 50MPa-55MPa, the temperature is continuously raised to 500-570 ℃, and the temperature and the pressure are preserved for 1-2 h; then heating to 630-680 ℃ at a heating rate of 6-8 ℃/min, removing the pressure, and keeping the temperature for 2-3 h; then heating to 720-800 ℃ at a heating rate of 8-13 ℃/min, pressurizing to 8-10 MPa, and keeping the temperature and pressure for 1-2 h; then cooling to room temperature along with the furnace.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: according to the high-conductivity copper alloy plate, through reasonable formula design and synergistic effect of the components, the prepared plate is excellent in conductivity, heat resistance, heat dissipation and mechanical strength; the mechanical property of the product is effectively improved through the dispersion strengthening effect of the graphene coated nano aluminum powder, and the electric conduction and heat dissipation effects can be improved; through reasonable selection of the components of the refining agent, the refining effect is better, and the comprehensive performance of the product is better. Through the reasonable setting of the pressurizing heat treatment process, the product has high dimensional precision, good performance stability and long service life.
The invention will be further described with reference to specific examples, but the scope of protection of the invention is not limited thereto:
example 1
The high-conductivity copper alloy sheet is characterized by comprising 0.01 wt% of Ag, 0.8 wt% of Ni, 0.01 wt% of W, 0.10 wt% of P, 0.01 wt% of Ta, 0.05 wt% of Sb, 0.03 wt% of Hf, 0.01 wt% of Ho, 0.001% of graphene-coated nano aluminum powder, 0.1% of an additive component formed by mixing Sn, B and Mn in a mass ratio of 1:1:3, and the balance of nano copper powder.
The graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of Chinese invention patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 10% by mass.
The preparation method of the high-conductivity copper alloy plate is characterized by comprising the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 15min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
the smelting temperature is 1200 ℃; the inert gas is nitrogen; the refining agent comprises the following components in parts by weight: 4 parts of potassium hexafluorosilicate, 3 parts of sodium bismuthate, 1 part of terbium oxide and 30 parts of sodium chloride; the addition amount of the refining agent is 1 wt% of the melt mass; the filtration adopts a ceramic filtration mode.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting; the specific process of the die-casting molding is as follows: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 330 ℃, the injection speed is 0.5 m/s, the injection specific pressure is 90MPa, the pressurization pressure is 98MPa and the pressure maintaining time is 8 seconds.
Step S3: carrying out heat treatment on the alloy blank die-cast and formed in the step S2 to obtain a high-conductivity copper alloy plate; the heat treatment process specifically comprises the following steps: under the condition that the vacuum degree is less than 102MP, heating to 280 ℃ at the heating rate of 3 ℃/min, preserving heat for 0.5h, then pressurizing to 50MPa, and continuously heating to 500 ℃, preserving heat and pressure for 1 h; then heating to 630 ℃ at the heating rate of 6 ℃/min, removing the pressure, and keeping the temperature for 2 h; then heating to 720 ℃ at the heating rate of 8 ℃/min, pressurizing to 8MPa, and keeping the temperature and the pressure for 1 h; then cooling to room temperature along with the furnace.
Example 2
The high-conductivity copper alloy plate is characterized by comprising 0.02 wt% of Ag, 1 wt% of Ni, 0.015 wt% of W, 0.13 wt% of P, 0.015 wt% of Ta, 0.08 wt% of Sb, 0.04 wt% of Hf, 0.015 wt% of Ho, 0.0015% of graphene-coated nano aluminum powder, 0.15% of an additive component formed by mixing Sn, B, Mn, Cs, Ca and Sc according to the mass ratio of 1:3:2:1:2:1, and the balance of nano copper powder.
The graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of Chinese invention patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 13% by mass.
The preparation method of the high-conductivity copper alloy plate is characterized by comprising the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 20min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
the smelting temperature is 1205 ℃; the inert gas is helium; the refining agent comprises the following components in parts by weight: 5 parts of potassium hexafluorosilicate, 4 parts of sodium bismuthate, 2 parts of terbium oxide and 33 parts of sodium chloride; the addition amount of the refining agent is 1.5 wt% of the melt mass; the filtration adopts a ceramic filtration mode.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting; the specific process of the die-casting molding is as follows: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 340 ℃, the injection speed is 0.7 m/s, the injection specific pressure is 93MPa, the pressurization pressure is 105MPa and the pressure maintaining time is 8.5 seconds.
Step S3: carrying out heat treatment on the alloy blank die-cast and formed in the step S2 to obtain a high-conductivity copper alloy plate; the heat treatment process specifically comprises the following steps: under the condition that the vacuum degree is less than 102.3MPa, heating to 290 ℃ at the heating rate of 3.5 ℃/min, preserving heat for 0.7h, then pressurizing to 51MPa, and continuously heating to 520 ℃, preserving heat and maintaining pressure for 1.2 h; then heating to 650 ℃ at the heating rate of 6.5 ℃/min, removing the pressure, and keeping the temperature for 2.3 h; then heating to 740 ℃ at the heating rate of 10 ℃/min, pressurizing to 8.5MPa, and keeping the temperature and the pressure for 1.2 h; then cooling to room temperature along with the furnace.
Example 3
A high-conductivity copper alloy sheet is characterized by comprising 0.01-0.05 wt% of Ag, 0.8-1.5 wt% of Ni, 0.01-0.03 wt% of W, 0.10-0.20 wt% of P, 0.01-0.03 wt% of Ta, 0.05-0.13 wt% of Sb, 0.03-0.06 wt% of Hf, 0.01-0.03 wt% of Ho, 0.001-0.003 wt% of graphene-coated nano aluminum powder, 0.1-0.3 wt% of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance of nano copper powder.
The graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of Chinese invention patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 15% by mass.
The preparation method of the high-conductivity copper alloy plate is characterized by comprising the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 23min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
the smelting temperature is 1210 ℃; the inert gas is neon; the refining agent comprises the following components in parts by weight: 6 parts of potassium hexafluorosilicate, 4.5 parts of sodium bismuthate, 2.5 parts of terbium oxide and 35 parts of sodium chloride; the addition amount of the refining agent is 2 wt% of the melt mass; the filtration adopts a ceramic filtration mode.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting; the specific process of the die-casting molding is as follows: and die-casting under the conditions that the temperature of a die cavity of the die is 345 ℃, the injection speed is 0.7 m/s, the injection specific pressure is 95MPa, the pressurizing pressure is 110MPa and the pressure maintaining time is 9 seconds.
Step S3: carrying out heat treatment on the alloy blank die-cast and formed in the step S2 to obtain a high-conductivity copper alloy plate; the heat treatment process specifically comprises the following steps: under the condition that the vacuum degree is less than 102.5MPa, the temperature is increased to 315 ℃ at the temperature rising speed of 4 ℃/min, the temperature is maintained for 0.8h, then the pressure is increased to 53MPa, and the temperature is continuously increased to 550 ℃, the temperature is maintained and the pressure is maintained for 1.5 h; then heating to 660 ℃ at the heating rate of 7 ℃/min, removing the pressure, and keeping the temperature for 2.5 h; then heating to 780 ℃ at the heating rate of 11 ℃/min, pressurizing to 9MPa, and keeping the temperature and the pressure for 1.5 h; then cooling to room temperature along with the furnace.
Example 4
The high-conductivity copper alloy plate is characterized by comprising 0.04 wt% of Ag, 1.4 wt% of Ni, 0.025 wt% of W, 0.18 wt% of P, 0.025 wt% of Ta, 0.12 wt% of Sb, 0.055 wt% of Hf, 0.025 wt% of Ho, 0.0025% of graphene-coated nano aluminum powder, 0.25% of an additive component selected from Sn and the balance of nano copper powder.
The graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of Chinese invention patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 18% by mass.
The preparation method of the high-conductivity copper alloy plate is characterized by comprising the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature and refining for 28min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
the smelting temperature is 1218 ℃; the inert gas is argon; the refining agent comprises the following components in parts by weight: 7.5 parts of potassium hexafluorosilicate, 5.5 parts of sodium bismuthate, 3.5 parts of terbium oxide and 38 parts of sodium chloride; the addition amount of the refining agent is 2.5 wt% of the melt mass; the filtration adopts a ceramic filtration mode.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting; the specific process of the die-casting molding is as follows: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 355 ℃, the injection speed is 0.9 m/s, the injection specific pressure is 98MPa, the pressurization pressure is 115MPa and the pressure maintaining time is 9.5 seconds.
Step S3: carrying out heat treatment on the alloy blank die-cast and formed in the step S2 to obtain a high-conductivity copper alloy plate; the heat treatment process specifically comprises the following steps: under the condition that the vacuum degree is less than 103MPa, heating to 320 ℃ at the heating rate of 4.5 ℃/min, preserving heat for 0.9h, then pressurizing to 54MPa, and continuously heating to 560 ℃, preserving heat and maintaining pressure for 1.9 h; then heating to 670 ℃ at the heating rate of 7.5 ℃/min, removing the pressure, and keeping the temperature for 2.8 h; then raising the temperature to 780 ℃ at the heating rate of 12 ℃/min, pressurizing to 9.5MPa, and keeping the temperature and the pressure for 1.8 h; then cooling to room temperature along with the furnace.
Example 5
A high-conductivity copper alloy sheet is characterized by comprising 0.05 wt% of Ag, 1.5 wt% of Ni, 0.03 wt% of W, 0.20 wt% of P, 0.03 wt% of Ta, 0.13 wt% of Sb, 0.06 wt% of Hf, 0.03 wt% of Ho, 0.003 wt% of graphene-coated nano aluminum powder, 0.3 wt% of an additive component formed by mixing Ca and Sc in a mass ratio of 3:5, and the balance of nano copper powder.
The graphene-coated nano aluminum powder is prepared by the method described in embodiment 1 of Chinese invention patent CN 104923796B. The Cs is added in a Cu-Cs intermediate alloy mode, wherein the Cs accounts for 20% by mass.
The preparation method of the high-conductivity copper alloy plate is characterized by comprising the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 30min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
the smelting temperature is 1220 ℃; the inert gas is nitrogen; the refining agent comprises the following components in parts by weight: 8 parts of potassium hexafluorosilicate, 6 parts of sodium bismuthate, 4 parts of terbium oxide and 40 parts of sodium chloride; the addition amount of the refining agent is 3 wt% of the melt mass; the filtration adopts a ceramic filtration mode.
Step S2, injecting the refined melt qualified in the step S1 into a die for die-casting; the specific process of the die-casting molding is as follows: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 360 ℃, the injection speed is 1.0 m/s, the injection specific pressure is 100MPa, the pressurizing pressure is 120MPa and the pressure maintaining time is 10 seconds.
Step S3: carrying out heat treatment on the alloy blank die-cast and formed in the step S2 to obtain a high-conductivity copper alloy plate; the heat treatment process specifically comprises the following steps: under the condition that the vacuum degree is less than 103MPa, heating to 330 ℃ at the heating rate of 5 ℃/min, preserving heat for 1h, then pressurizing to 55MPa, and continuously heating to 570 ℃, preserving heat and pressure for 2 h; then heating to 680 ℃ at the heating rate of 8 ℃/min, removing the pressure, and keeping the temperature for 3 h; then heating to 800 ℃ at the heating rate of 13 ℃/min, pressurizing to 10MPa, and keeping the temperature and the pressure for 2 h; then cooling to room temperature along with the furnace.
Comparative example 1
A highly conductive copper alloy sheet was prepared in substantially the same manner as in example 1, except that W and Ta were not added.
Comparative example 2
A high-conductivity copper alloy sheet was prepared in substantially the same manner as in example 1, except that Sb and Hf were not added.
Comparative example 3
A highly conductive copper alloy sheet material having substantially the same formulation and preparation method as in example 1, except that Ho and the additive component were not added.
Comparative example 4
The formula and the preparation method of the high-conductivity copper alloy plate are basically the same as those of the high-conductivity copper alloy plate in the embodiment 1, except that the graphene-coated nano aluminum powder is not added.
To further illustrate the technical effects of the embodiments of the present invention, the high conductivity copper alloy sheets prepared in the embodiments 1 to 5 and the comparative examples 1 to 4 of the present invention were tested, the test results are shown in table 1, and the test methods are shown in CN 111575531B, specifically as follows:
[ conductivity ]: measured according to the method defined in JISH 0505;
[ hardness ]: the Vickers hardness is measured under the load of 500 g;
[ temperature resistance ]: the plate-like test pieces were heated and held at 100-600 ℃ for 30 minutes (interval 50 ℃), and then the hardness was measured. As the holding temperature is increased by heating, the hardness is decreased. The temperature corresponding to the hardness of the sample after heating and holding which is 80% of the hardness before heating is the heat-resistant temperature;
[ bending workability ]: plate-like specimens (each having a width of 10mm) cut in the longitudinal direction of LD and TD were subjected to bending by the 90-degree W-type bending method defined in JIS H3110. The surface and cross section of the bent sample were observed at 100 times using an optical microscope. A minimum bending radius R without cracking is obtained. The value of the ratio R/t of the minimum bending radius R to the sheet thickness t was used as an evaluation of the bending workability. The smaller the R/t value, the better the bending workability.
TABLE 1
As can be seen from the data in table 1, the high-conductivity copper alloy sheet prepared in the embodiment of the present application has better conductivity, and more excellent bending workability and heat resistance, which are the result of the synergistic effect of the components and the process steps.
The above-mentioned embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
Claims (9)
1. A high-conductivity copper alloy sheet is characterized by comprising 0.01-0.05 wt% of Ag, 0.8-1.5 wt% of Ni, 0.01-0.03 wt% of W, 0.10-0.20 wt% of P, 0.01-0.03 wt% of Ta, 0.05-0.13 wt% of Sb, 0.03-0.06 wt% of Hf, 0.01-0.03 wt% of Ho, 0.001-0.003 wt% of graphene-coated nano aluminum powder, 0.1-0.3 wt% of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance of nano copper powder.
2. The copper alloy sheet with high conductivity as claimed in claim 1, wherein Cs is added in a form of Cu-Cs master alloy, wherein Cs accounts for 10-20% by mass.
3. The high-conductivity copper alloy sheet according to claim 1, wherein the method for preparing the high-conductivity copper alloy sheet comprises the following steps:
step S1, smelting and refining: uniformly mixing the components in percentage by weight, adding the mixture into a smelting furnace for smelting, then adding a refining agent into the mixture, spraying inert gas into the mixture for refining, and keeping the temperature for refining for 15-30min each time; then, slagging off and filtering are sequentially carried out to obtain refined molten liquid; sampling and testing the chemical components of the alloy, comparing the difference between the designed components and the actually measured components, and finely adjusting to ensure that the alloy components meet the requirements of the designed components;
step S2, injecting the refined melt qualified in the step S1 into a die for die-casting;
step S3: and (4) carrying out heat treatment on the alloy blank subjected to die-casting molding in the step S2 to obtain the high-conductivity copper alloy plate.
4. The copper alloy plate with high electric conductivity as claimed in claim 3, wherein the melting temperature is 1200 ℃ and 1220 ℃; the inert gas is any one of nitrogen, helium, neon and argon.
5. The high-conductivity copper alloy sheet according to claim 3, wherein the refining agent comprises the following components in parts by weight: 4-8 parts of potassium hexafluorosilicate, 3-6 parts of sodium bismuthate, 1-4 parts of terbium oxide and 30-40 parts of sodium chloride.
6. A highly conductive copper alloy sheet as claimed in claim 3, wherein said refining agent is added in an amount of (1-3) wt% based on the mass of the melt.
7. The copper alloy sheet with high conductivity as claimed in claim 3, wherein the filtering is ceramic filtering.
8. The high-conductivity copper alloy sheet according to claim 3, wherein the die-casting molding process comprises the following specific steps: the die-casting molding is carried out under the conditions that the temperature of a die cavity of the die is 330-360 ℃, the injection speed is 0.5-1.0 m/s, the injection specific pressure is 90-100MPa, the pressurizing pressure is 98-120MPa and the pressure maintaining time is 8-10 seconds.
9. The high-conductivity copper alloy sheet according to claim 3, wherein the heat treatment process specifically comprises: under the condition that the vacuum degree is less than 102MP-103MPa, the temperature is increased to 280-330 ℃ at the temperature rising speed of 3-5 ℃/min, the temperature is preserved for 0.5-1h, then the pressure is increased to 50MPa-55MPa, the temperature is continuously raised to 500-570 ℃, and the temperature and the pressure are preserved for 1-2 h; then heating to 630-680 ℃ at a heating rate of 6-8 ℃/min, removing the pressure, and keeping the temperature for 2-3 h; then heating to 720-800 ℃ at a heating rate of 8-13 ℃/min, pressurizing to 8-10 MPa, and keeping the temperature and pressure for 1-2 h; then cooling to room temperature along with the furnace.
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