CN116024455A - Copper alloy material with balanced comprehensive performance and preparation method thereof - Google Patents
Copper alloy material with balanced comprehensive performance and preparation method thereof Download PDFInfo
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- CN116024455A CN116024455A CN202310135512.8A CN202310135512A CN116024455A CN 116024455 A CN116024455 A CN 116024455A CN 202310135512 A CN202310135512 A CN 202310135512A CN 116024455 A CN116024455 A CN 116024455A
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Abstract
The invention provides a copper alloy material with balanced comprehensive performance and a preparation method thereof, and relates to the technical field of nonferrous metal pressure processing. The copper alloy material with balanced comprehensive performance comprises the following raw materials in percentage by mass: ni:0.6-2.2wt%, si:0.1-1.5wt%, mg:0.05-0.1wt%, P:0.05-0.1wt% of rare earth La or Ce: less than or equal to 0.1 weight percent, and the balance of Cu and unavoidable impurities; the preparation method comprises the following steps: step one, smelting: the components of Ni, si, mg, P and the like are proportioned in a metal or master alloy mode according to mass percent. The prepared copper alloy material with balanced comprehensive performance has the performances of medium and high tensile strength, good bending performance of medium and high conductivity, good stress relaxation rate and the like through matching of raw material proportion and process, so that the ideal lead frame material suitable for multi-scene application is simultaneously met, and the copper alloy material is also suitable for other purposes such as electronic parts and connectors, automobile buses and relays.
Description
Technical Field
The invention relates to the technical field of nonferrous metal press working, in particular to a copper alloy material with balanced comprehensive performance and a preparation method thereof.
Background
The development of integrated circuits and the electronic information industry has put higher performance demands on copper and copper alloy materials. Miniaturization and ultra-thinning require that the copper alloy material has enough strength under the premise of smaller thickness; the current-carrying capacity of a unit sectional area is improved along with the high-speed signal transmission belt, and the material is required to have good electric conduction and heat conduction properties; bending deformation is often accompanied in the subsequent processing process of materials such as lead frames and the like, and the materials are required to have good bending performance in all directions; the trend of packaging materials for large current, miniaturization and high temperature in use environment requires copper alloys with good stress relaxation resistance.
In practical applications, the application scene of overstressing a single performance of a material is less (such as high strength or high conductivity), and more emphasis is placed on the synergy of multiple performances. Moreover, with the development of electronic products towards intelligence, multifunctionality and high reliability, the development trend of the copper alloy material from single performance requirement towards multifunctional characteristic requirement is more and more obvious, and the practical scene application of the copper alloy material for simultaneously meeting the performance requirements of strength, conductivity, bending, stress relaxation resistance and the like is more and more. For example, in the service process of elastic electronic components, stress relaxation phenomena with different degrees can occur at high temperature or room temperature, and even the elastic electronic components can fail, so that the service life and the reliability of the material are affected. Particularly, in many copper alloy application scenes with temperature rise, such as lead frames, copper alloys for automobiles and other high-current applications, the stress relaxation resistance of the material is more important than indexes such as strength. Therefore, stress relaxation resistance is an important performance index for evaluating copper alloy materials.
However, most of the current copper alloy materials in China focus on the improvement of single performances such as strength or conductivity, especially the improvement of strength performance is excessively pursued, consideration and consideration of other important performances such as stress relaxation resistance are neglected, and the use requirements of novel electronic products and electronic components cannot be met.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a copper alloy material with balanced comprehensive performance and a preparation method thereof, which solve the problems that the current copper alloy is excessively focused on strength and conductivity, and other important performances such as stress relaxation resistance are ignored, so that the comprehensive performance is poor and the practical application requirements cannot be met.
In order to achieve the above purpose, the invention is realized by the following technical scheme: a copper alloy material with balanced comprehensive performance and a preparation method thereof comprise the following raw materials in percentage by mass: n i:0.6 to 2.2wt%, S i:0.1-1.5wt%, mg:0.05-0.1wt%, P:0.05-0.1wt% of rare earth La or Ce: less than or equal to 0.1 weight percent, and the balance of Cu and unavoidable impurities.
A method for preparing a copper alloy material with balanced comprehensive properties, which is used for preparing the copper alloy material with balanced comprehensive properties in claim 1, and comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements in a metal or intermediate alloy mode according to mass percentage, putting the mixture into an intermediate frequency induction furnace for heating and smelting, and adding rare earth La or Ce for deoxidization and impurity removal treatment after all raw materials are melted;
step two, casting: pouring the melt into a square mold at 1050-1100 ℃, cooling and obtaining an ingot;
step three, hot rolling: heating the cast ingot to 900-950 ℃, preserving heat for 1h, rolling, and controlling the hot rolling processing rate to be more than 85%;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper and lower surfaces of the alloy material subjected to solution treatment;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling reduction ratio is 60-80%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 550-600 ℃, preserving heat for 2-4h, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 30-80%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 350-450 ℃, preserving heat for 6-10h, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
Preferably, the smelting temperature is in the range of 1100-1200 ℃.
Preferably, the temperature is kept for 10-15min after smelting is completed.
Preferably, the finishing temperature in the hot rolling step is controlled to 750 ℃ or higher.
Preferably, the depth of the milling surface is 0.1-0.4mm.
The invention provides a copper alloy material with balanced comprehensive performance and a preparation method thereof. The device comprises the following
The beneficial effects are that:
the invention realizes the preparation of the comprehensive performance balanced copper alloy material by the alloy elements with lower content and cost and by using a simple and easy processing technology, so that the prepared comprehensive performance balanced copper alloy material simultaneously has the performances of medium and high tensile strength (500-700 MPa), medium and high conductivity (50-68% IACS), good bending performance (R/t in the good way direction is less than or equal to 1.0, R/t in the bad way direction is less than or equal to 2.0), good stress relaxation rate (less than or equal to 20%), and the like, thereby realizing the ideal lead frame material which is simultaneously suitable for multi-scene application, and is also suitable for other purposes such as electronic parts and connectors, automobile buses, relays, and the like.
Drawings
FIG. 1 is a schematic process flow diagram of a preparation method of a copper alloy material with balanced comprehensive performance.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
as shown in fig. 1, the embodiment of the invention provides a copper alloy material with balanced comprehensive performance, which comprises the following raw materials in percentage by mass: n i:0.6wt%, S i:0.2wt%, mg:0.06wt%, P:0.08wt% of rare earth La:0.05 wt.%, the balance Cu and unavoidable impurities.
The preparation method of the copper alloy material with balanced comprehensive performance comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements in a metal or intermediate alloy mode according to mass percentage, putting the mixture into an intermediate frequency induction furnace for heating and smelting, adding rare earth La for deoxidization and impurity removal treatment after all raw materials are melted, and keeping the alloy smelting temperature at 1150 ℃ and the heat preservation temperature at 15 min;
step two, casting: pouring the melt into a square mold at the temperature of 1060 ℃, and cooling to obtain an ingot;
step three, hot rolling: heating the cast ingot to 900 ℃, preserving heat for 1h, rolling, controlling the hot rolling rate to be 90%, and controlling the final rolling temperature to be 780 ℃;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper and lower surfaces of the alloy material subjected to solution treatment by 0.1mm respectively;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling reduction ratio is 66.3%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 580 ℃, preserving heat for 3 hours, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 60%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 400 ℃, preserving heat for 8 hours, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
Embodiment two:
as shown in fig. 1, the embodiment of the invention provides a copper alloy material with balanced comprehensive performance, which comprises the following raw materials in percentage by mass: n i:1.0wt%, S i:0.35wt%, mg:0.08wt%, P:0.07wt%, rare earth Ce:0.08 wt.%, the balance Cu and unavoidable impurities.
The preparation method of the copper alloy material with balanced comprehensive performance comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements according to mass percent in a metal or intermediate alloy mode, putting the mixture into an intermediate frequency induction furnace for heating and smelting, adding rare earth Ce for deoxidization and impurity removal treatment after all raw materials are melted, and keeping the alloy smelting temperature at 1180 ℃ and the temperature for 10 min;
step two, casting: pouring the melt into a square mold at 1075 ℃, and cooling to obtain an ingot;
step three, hot rolling: heating the cast ingot to 920 ℃, preserving heat for 1h, rolling, controlling the hot rolling working rate to be 85%, and controlling the final rolling temperature to be 820 ℃;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper and lower surfaces of the alloy material subjected to solution treatment by 0.2mm respectively;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling reduction ratio is 77.4%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 580 ℃, preserving heat for 3 hours, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 69.2%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 360 ℃, preserving heat for 6 hours, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
Embodiment III:
as shown in fig. 1, the embodiment of the invention provides a copper alloy material with balanced comprehensive performance, which comprises the following raw materials in percentage by mass: n i:1.5wt%, S i:0.6wt%, mg:0.1wt%, P:0.1wt% of rare earth La:0.1 wt.%, the balance Cu and unavoidable impurities.
The preparation method of the copper alloy material with balanced comprehensive performance comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements in a metal or intermediate alloy mode according to mass percentage, putting the mixture into an intermediate frequency induction furnace for heating and smelting, adding rare earth La for deoxidization and impurity removal treatment after all raw materials are melted, and keeping the alloy smelting temperature at 1180 ℃ and the temperature at 15 min;
step two, casting: pouring the melt into a square mold at 1080 ℃ and cooling to obtain an ingot;
step three, hot rolling: heating the cast ingot to 930 ℃, preserving heat for 1h, rolling, controlling the hot rolling rate to 88.9%, and controlling the final rolling temperature to 810 ℃;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper surface of the alloy material subjected to solution treatment by 0.1mm, and milling the lower surface by 0.2mm;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling reduction ratio is 80%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 550 ℃, preserving heat for 4 hours, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 76.5%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 350 ℃, preserving heat for 8 hours, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
Embodiment four:
as shown in fig. 1, the embodiment of the invention provides a copper alloy material with balanced comprehensive performance, which comprises the following raw materials in percentage by mass: n i:1.8wt%, S i:1.0wt%, mg:0.05wt%, P:0.04wt% of rare earth Ce:0.05 wt.%, the balance Cu and unavoidable impurities.
The preparation method of the copper alloy material with balanced comprehensive performance comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements according to mass percent in a metal or intermediate alloy mode, putting the mixture into an intermediate frequency induction furnace for heating and smelting, adding rare earth Ce for deoxidization and impurity removal treatment after all raw materials are melted, and keeping the alloy smelting temperature at 1200 ℃ and the heat preservation temperature at 10 min;
step two, casting: pouring the melt into a square mold at 1100 ℃, cooling and obtaining an ingot;
step three, hot rolling: heating the cast ingot to 930 ℃, preserving heat for 1h, rolling, controlling the hot rolling rate to 86.1%, and controlling the final rolling temperature to 815 ℃;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper and lower surfaces of the alloy material subjected to solution treatment by 0.2mm respectively;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling processing rate is 60%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 600 ℃, preserving heat for 4 hours, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 76.2%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 420 ℃, preserving heat for 10 hours, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
Fifth embodiment:
as shown in fig. 1, the embodiment of the invention provides a copper alloy material with balanced comprehensive performance, which comprises the following raw materials in percentage by mass: n i:2.2wt%, S i:1.2wt%, mg:0.06wt%, P:0.08wt% of rare earth La:0.1 to wwt%, the balance being Cu and unavoidable impurities.
The preparation method of the copper alloy material with balanced comprehensive performance comprises the following steps:
step one, smelting: mixing N i, S i, mg, P and other elements in a metal or intermediate alloy mode according to mass percentage, putting the mixture into an intermediate frequency induction furnace for heating and smelting, adding rare earth La for deoxidization and impurity removal treatment after all raw materials are melted, and keeping the alloy smelting temperature at 1200 ℃ and the heat preservation temperature at 10 min;
step two, casting: pouring the melt into a square mold at 1100 ℃, cooling and obtaining an ingot;
step three, hot rolling: heating the cast ingot to 950 ℃, preserving heat for 1h, rolling, controlling the hot rolling rate to be 90%, and controlling the final rolling temperature to be 785 ℃;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper surface of the alloy material subjected to solution treatment by 0.4mm, and milling the lower surface by 0.3mm;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling processing rate is 65%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 560 ℃, preserving heat for 3 hours, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing to obtain a cold rolling reduction ratio of 48%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 450 ℃, preserving heat for 6 hours, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
According to the copper alloy samples prepared by the raw materials with different proportions and different preparation process methods in the embodiment, parameters are obtained after detection as shown in the following table:
in conclusion, the prepared copper alloy with balanced comprehensive performance has the performances of medium and high tensile strength (500-700 MPa), medium and high conductivity (50-68% IACS), good bending performance (R/t in the good direction is less than or equal to 1.0, R/t in the Badway direction is less than or equal to 2.0), good stress relaxation rate (less than or equal to 20%), and the like, and is an ideal lead frame material suitable for multi-scene application, and is also suitable for other uses such as electronic parts and connectors, automobile buses, relays, and the like.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A copper alloy material with balanced comprehensive performance and a preparation method thereof are characterized in that: comprises the following raw materials in percentage by mass: ni:0.6-2.2wt%, si:0.1-1.5wt%, mg:0.05-0.1wt%, P:0.05-0.1wt% of rare earth La or Ce: less than or equal to 0.1 weight percent, and the balance of Cu and unavoidable impurities.
2. A preparation method of a copper alloy material with balanced comprehensive performance is characterized by comprising the following steps: the preparation method is used for preparing the copper alloy material with balanced comprehensive performance in claim 1, and comprises the following steps:
step one, smelting: mixing Ni, si, mg, P and other elements in a metal or intermediate alloy mode according to mass percentage, putting the mixture into an intermediate frequency induction furnace for heating and smelting, and adding rare earth La or Ce for deoxidization and impurity removal treatment after all raw materials are melted;
step two, casting: pouring the melt into a square mold at 1050-1100 ℃, cooling and obtaining an ingot;
step three, hot rolling: heating the cast ingot to 900-950 ℃, preserving heat for 1h, rolling, and controlling the hot rolling processing rate to be more than 85%;
step four, solution treatment: directly carrying out water quenching treatment on the alloy material after hot rolling;
step five, milling the surface: milling the upper and lower surfaces of the alloy material subjected to solution treatment;
step six, primary cold rolling: cold rolling the alloy material with the milled surface, wherein the cold rolling reduction ratio is 60-80%;
step seven, intermediate annealing: heating the alloy material subjected to primary cold rolling to 550-600 ℃, preserving heat for 2-4h, and cooling to room temperature along with a furnace;
step eight, secondary cold rolling: cold rolling the alloy material after intermediate annealing, wherein the cold rolling reduction ratio is 30-80%;
step nine, aging treatment: and heating the alloy strip subjected to secondary cold rolling to 350-450 ℃, preserving heat for 6-10h, and cooling to room temperature along with a furnace to obtain the copper alloy strip with balanced comprehensive properties.
3. The copper alloy material with balanced comprehensive performance and the preparation method thereof according to claim 2 are characterized in that: the smelting temperature range is 1100-1200 ℃.
4. The copper alloy material with balanced comprehensive performance and the preparation method thereof according to claim 2 are characterized in that: and preserving heat for 10-15min after smelting is completed.
5. The copper alloy material with balanced comprehensive performance and the preparation method thereof according to claim 2 are characterized in that: and the final rolling temperature in the hot rolling step is controlled to be more than 750 ℃.
6. The copper alloy material with balanced comprehensive performance and the preparation method thereof according to claim 2 are characterized in that: the depth of the milling surface is 0.1-0.4mm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116732384A (en) * | 2023-08-08 | 2023-09-12 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
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- 2023-02-20 CN CN202310135512.8A patent/CN116024455A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116732384A (en) * | 2023-08-08 | 2023-09-12 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
| CN116732384B (en) * | 2023-08-08 | 2023-11-21 | 宁波兴业盛泰集团有限公司 | Copper nickel silicon alloy cast ingot and preparation method thereof |
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