CN105525132A - Electric contact material and preparation method thereof - Google Patents
Electric contact material and preparation method thereof Download PDFInfo
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- CN105525132A CN105525132A CN201510983356.6A CN201510983356A CN105525132A CN 105525132 A CN105525132 A CN 105525132A CN 201510983356 A CN201510983356 A CN 201510983356A CN 105525132 A CN105525132 A CN 105525132A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1005—Pretreatment of the non-metallic additives
- C22C1/101—Pretreatment of the non-metallic additives by coating
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1047—Alloys containing non-metals starting from a melt by mixing and casting liquid metal matrix composites
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1084—Alloys containing non-metals by mechanical alloying (blending, milling)
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
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Abstract
The invention relates to an electric contact material, in particular to a graphene reinforced copper-matrix electric contact composite material and a preparation method of the material. The electric contact material consists of the following components in percentage by weight: 0.1-1.0% of nickelized graphene and 99.0-99.9% of copper alloy. The preparation method comprises the steps of graphene nickelizing, copper alloy pulverizing, ball-milling and powder mixing, densification processing and vacuum electric arc smelting. According to the electric contact material disclosed by the invention, the nickelized graphene is added in the copper alloy and serves as the framework, so that the material has high hardness, mechanical impact-resistance and electric arc ablation resistance; and the lowering of the electric conductivity and the heat conductivity is avoided. Vacuum electric arc smelting is adopted, so that the smelting time is short; segregation of graphene particles is avoided; and the oxidation of the copper matrix is effectively prevented.
Description
Technical field
The present invention relates to a kind of electrical contact material and preparation method thereof, particularly relate to a kind of Graphene and strengthen copper-based electrical contact composite material and preparation method thereof.
Background technology
Vacuum contact material is the important factor affecting Vacuum Circuit Breaker performance, requires that contact material has high conductivity, high thermal conductivity coefficient, high physical strength and low contact resistance.Vacuum switch does not need maintenance, and contact needs minimum tolerance 8-12 time, and the folding rated short circuit current of 30-50 time is to the scaling loss of contact at most, and therefore contact material should have good are-tight property, resistance fusion welding.Guillaume metal conventional at present has good resistance fusion welding, lower current-carrying value, certain connecting-disconnecting function, but intensity is lower, and arc erosion is large, reduces the life-span of contact material.
Existing (publication number 105063413A), disclose " a kind of copper-based electrical contact material and preparation technology thereof ", copper-base contact material comprises following weight percent composition: the chromium of the bismuth of the magnesium of 0.2-0.6%, the antimony of 0.05-0.3%, 0.05-0.4%, the tin of 0.05-0.3%, 0.05-0.3%, the boron of 0.005-0.05%, the lanthanum of 0.02-0.1% and the graphite of 0.2-0.5% and the copper of surplus.By adding appropriate boron, tin, antimony powder end, improving intensity and the wear resistance of electrical contact finished product, but reducing material conductivity to a certain extent.
Existing patent documentation (publication number 102385938A), disclose a kind of metal matrix graphene composite electrical contact material and preparation method thereof, contact material comprises the Graphene of 0.02-10wt.%, and all the other are metal matrix material.Due to adding of Graphene wild phase, this composited contact material is had better conduct electricity than other wild phase composited contact materials, the hardness of heat conductivility and Geng Gao and wear resistance.The wettability of Graphene and metallic matrix is bad, and electrical contact material performance has the space promoted further.
Summary of the invention
The invention provides a kind of electrical contact material, by adding Ni-coated graphite alkene reinforcement in Cu alloy material, while not reducing its electroconductibility, thermal conductivity, improving the hardness of copper alloy, wear resistance and resistance to arc erosion.
In addition present invention also offers the preparation method of above-mentioned electrical contact material.
The present invention is the technical scheme proposed that solves the problem:
A kind of electrical contact material, it is characterized in that, comprising weight ratio is 0.1-1.0% Ni-coated graphite alkene and 99.0-99.9% copper alloy, and the weight item of copper alloy is the bismuth of 0.15-0.5%, the metal X of 0.1-3.0%, surplus are copper, and X is selected from one or more in zinc, tin, aluminium, nickel and silver.Preferably, X is selected from one or both in zinc and aluminium.
Above-mentioned electrical contact material, preferred Graphene is N layer, and N is 1-10.
The preparation method of above-mentioned electrical contact material, is characterized in that comprising the following steps:
(1) adopt direct current magnetron sputtering process that metallic nickel is deposited on graphenic surface, make Ni-coated graphite alkene.The processing parameter of Deposited By Dc Magnetron Sputtering equipment is: vacuum tightness reaches 0.1*10
-3-1.0*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5-1.2Pa, sputtering power 100-150W, depositing time is 5-30min, preferred 10-30min.
(2) atomization is adopted by copper alloy to make 200-300 object copper alloy powder.
(3) Ni-coated graphite alkene and copper alloy powder are loaded ball mill ball milling, make Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.Ball mill working order is: rotating speed 100-250r/min, ball milling 15-20 minute, stops 5 minutes, and clockwise, counterclockwise alternate run, the mixed powder time is 2-6 hour.
(4) step (3) mixed powder is put into mould and carry out densification, make blank.
(5) compact vacuum arc melting, makes the electric contact composite material that Graphene strengthens copper base.Preferably, smelting furnace vacuum tightness 1.0*10
-3-3.0*10
-3pa, working gas is argon gas, and operating air pressure is 0.02-0.1Pa, smelting time 1-2 minute.
Useful achievement of the present invention is:
(1) this electrical contact material, adds Graphene reinforcement as skeleton in copper alloy, while making material have high rigidity, high-wearing feature, mechanical shock resistance and anti-electric-arc ablation property, avoids the reduction of copper alloy electroconductibility, thermal conductivity.In addition, Ni-coated graphite alkene improves Graphene and intermetallic interface binding power, acquisition good interface combines, solve the problem of boundary moisture between Graphene and matrix, matrix material density, mechanical property, electroconductibility, heat conductivility, anti electric arc corrosion are improved further, meets the demand of electrical contact material better.
(2) preparation method of electrical contact, adopts direct current magnetron sputtering process in graphenic surface nickel deposited, the structure of formation, reduces Graphene as the reunion of nano particle in mixed powder process.Nickel can be used as the alloy element of Copper substrate, improves corrosion resistance and the resistance fusion welding of copper alloy.Use vacuum arc melting, smelting time is short, avoids the segregation of Graphene particle, effectively avoids Copper substrate to be oxidized.
Embodiment
Embodiment 1
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene powder at Graphene (number of plies is 1-10) surface deposition metallic nickel.Purity is first carry out polishing with fine sandpaper before the nickel target installation of 99.99% to remove surface film oxide, then with acetone cleaning, dries.Carry out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: vacuum tightness reaches 0.1*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5Pa, sputtering power 100W, depositing time is 30min.
(2) gas atomization is adopted to make 200 order copper alloy powders the alloy powder containing 0.15% bismuth, 0.1% zinc, 99.75% bronze medal.
(3) part by weight that Ni-coated graphite alkene and copper-0.15% bismuth-0.1% Zinc alloy powder press 0.1:99.9 loads in ball mill; ball grinder first vacuumizes and passes into argon shield again; rotating speed 100r/min, ball milling mixes in powder process, clockwise ball milling 15 minutes; stop 5 minutes; counterclockwise ball milling 15 minutes, stops 5 minutes, alternation according to this; Ball-milling Time 6 hours, obtains Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out densification, pressure is 250MPa.
(5) compact made puts into vacuum arc melting, vacuum tightness 1.0 × 10
-3pa, working gas is high-purity argon gas, and operating air pressure is 0.02Pa, smelting time 2 minutes, prepares Graphene and strengthens copper-based electrical contact composite material.
Embodiment 2
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene powder at Graphene (number of plies is 1-5) surface deposition metallic nickel, purity is first carry out grinding with fine sandpaper before the nickel target installation of 99.99% to remove surface film oxide, clean with acetone again, dry, 5 minutes pre-sputterings are carried out before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: when vacuum tightness reaches 1.0 × 10-3Pa, passes into high-purity argon gas, gas pressure in vacuum 1.2Pa, sputtering power 150W, and depositing time is 10min.
(2) gas atomization is adopted to make 300 order copper alloy powders the alloy powder containing 0.5% bismuth, 3.0% zinc, 96.5% bronze medal.
(3) weight ratio that Ni-coated graphite alkene and copper-0.5% bismuth-3.0% Zinc alloy powder press 0.2:99.9 loads in mechanical ball grinding machine; ball grinder first vacuumizes and passes into argon shield again; rotating speed 250r/min, ball milling mixes in powder process, clockwise ball milling 20 minutes; stop 5 minutes; counterclockwise ball milling 20 minutes, stops 5 minutes, alternation according to this; Ball-milling Time 2 hours, obtains Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out densification, pressure 300MPa.
(5) compact made puts into vacuum arc melting, vacuum tightness 3.0*10
-3pa, working gas is high-purity argon gas, and operating air pressure is 0.1Pa, smelting time 1 minute, makes Graphene and strengthens copper-based electrical contact composite material.
Embodiment 3
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene at Graphene (number of plies is 1-10) surface deposition metallic nickel.Purity is first carry out grinding with fine sandpaper before the target installation of 99.99% to remove surface film oxide, then with acetone cleaning, dries.Carry out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: vacuum tightness reaches 0.5*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 1.0Pa, sputtering power 140W, depositing time is 15min.
(2) gas atomization is adopted to make 200 order copper alloy powders the alloy powder containing 0.2% bismuth, 3.0% aluminium, 96.8% bronze medal.
(3) by Ni-coated graphite alkene: the weight ratio that copper-0.2% bismuth-3.0% Al alloy powder presses 0.2:99.8 loads in ball mill; ball grinder first vacuumizes and passes into argon shield again; rotating speed 250r/min, ball milling mixes in powder process, clockwise ball milling 20 minutes; stop 5 minutes; counterclockwise ball milling 20 minutes, stops 5 minutes, cycle operation according to this; amount to mixed powder time 3h, obtain Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out densification, pressure 300MPa.
(5) compact made puts into vacuum arc melting, vacuum tightness 2.0*10
-3pa, working gas is high-purity argon gas, and operating air pressure is 0.06Pa, smelting time 1.5 minutes, prepares Graphene and strengthens copper-based electrical contact composite material.
Embodiment 4
Ni-coated graphite alkene powder: copper-0.3% bismuth-1.0% Al alloy powder loads ball mill by weight 0.5:99.5, other conditions, with embodiment 3, are prepared Graphene and are strengthened copper-based electrical contact composite material.
Embodiment 5
Ni-coated graphite alkene: copper-0.3% bismuth-3.0% Al alloy powder loads in ball mill by weight 1.0:99.0, other parameters, with embodiment 3, are prepared Graphene and are strengthened copper-based electrical contact composite material.
Comparative example 1
Copper-0.3% bismuth-3.0% aluminium is loaded ball mill and mixes powder, other parameter, with embodiment 5, makes copper-based electrical contact material.
Comparative example 2
The Graphene of non-nickel plating: copper-0.5% bismuth-3.0% zinc loads ball mill by weight 0.2:99.8 and mixes powder, and other parameter, with embodiment 2, makes copper-based electrical contact material.
The matrix material parameters made is as following table:
Add Ni-coated graphite alkene and make Graphene enhancing copper-based electrical contact material, compared with the electrical contact material made with the copper alloy not adding Graphene in comparative example 1, specific conductivity, hardness all significantly improve, and hardness can improve more than 60%, and specific conductivity also significantly improves.Compared with the electrical contact material made with the copper alloy adding Graphene in comparative example 2, specific conductivity, hardness also all significantly improve.
Claims (7)
1. an electrical contact material, it is characterized in that, comprising weight ratio is 0.1-1.0% Ni-coated graphite alkene and 99.0-99.9% copper alloy, and the weight item of copper alloy is the bismuth of 0.15-0.5%, the metal X of 0.1-3.0%, surplus are copper, and X is selected from one or more in zinc, tin, aluminium, nickel and silver.
2. a kind of electrical contact material according to claim 1, is characterized in that, Graphene is N layer, and N is 1-10.
3. a kind of electrical contact material according to claim 1, is characterized in that, X to be selected from zinc, aluminium one or both.
4. a preparation method for electrical contact material described in claim 1, is characterized in that comprising the following steps:
(1) adopt direct current magnetron sputtering process that metallic nickel is deposited on graphenic surface, make Ni-coated graphite alkene;
(2) atomization is adopted by copper alloy to make 200-300 object copper alloy powder;
(3) Ni-coated graphite alkene and copper alloy powder are loaded ball mill ball milling, make Ni-coated graphite alkene and the mixed uniformly powder of copper alloy;
(4) step (3) mixed powder is put into mould and carry out densification, make blank;
(5) compact vacuum arc melting, makes the electric contact composite material that Graphene strengthens copper base.
5. the preparation method of a kind of electrical contact material according to claim 4, is characterized in that, in described step (1), the processing parameter of Deposited By Dc Magnetron Sputtering equipment is: vacuum tightness reaches 0.1*10
-3-1.0*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5-1.2Pa, sputtering power 100-150W, depositing time is 5-30min, preferred 10-30min.
6. the preparation method of a kind of electrical contact material according to claim 4, is characterized in that, in described step (3), ball mill working order is: rotating speed 100-250r/min, ball milling 15-20 minute, stop 5 minutes, clockwise, counterclockwise alternate run, the mixed powder time is 2-6 hour.
7. want the preparation method of a kind of electrical contact material described in 4 according to right, it is characterized in that, in described step (5), briquet carries out vacuum arc melting, smelting furnace vacuum tightness 1.0*10
-3-3.0*10
-3pa, working gas is argon gas, and operating air pressure is 0.02-0.1Pa, smelting time 1-2 minute.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110614381A (en) * | 2019-08-06 | 2019-12-27 | 温州聚星电接触科技有限公司 | Preparation method of silver-based graphene electrical contact material and electrical contact material thereof |
| CN113201663A (en) * | 2021-04-16 | 2021-08-03 | 安徽绿能技术研究院有限公司 | High-conductivity copper alloy plate and preparation method thereof |
| CN115094358A (en) * | 2022-06-30 | 2022-09-23 | 国网河南省电力公司电力科学研究院 | Electrical contact material surface nanocrystallization method and device |
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| JP2004076097A (en) * | 2002-08-19 | 2004-03-11 | Railway Technical Res Inst | Carbonaceous sintered contact strip material with crack resistance |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110614381A (en) * | 2019-08-06 | 2019-12-27 | 温州聚星电接触科技有限公司 | Preparation method of silver-based graphene electrical contact material and electrical contact material thereof |
| CN113201663A (en) * | 2021-04-16 | 2021-08-03 | 安徽绿能技术研究院有限公司 | High-conductivity copper alloy plate and preparation method thereof |
| CN115094358A (en) * | 2022-06-30 | 2022-09-23 | 国网河南省电力公司电力科学研究院 | Electrical contact material surface nanocrystallization method and device |
| CN115094358B (en) * | 2022-06-30 | 2023-06-09 | 国网河南省电力公司电力科学研究院 | Surface nanocrystallization method and device for electrical contact material |
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