CN105575459B - A kind of copper-plated graphite alkene strengthens the preparation method of copper-based electrical contact material - Google Patents
A kind of copper-plated graphite alkene strengthens the preparation method of copper-based electrical contact material Download PDFInfo
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- CN105575459B CN105575459B CN201610106148.2A CN201610106148A CN105575459B CN 105575459 B CN105575459 B CN 105575459B CN 201610106148 A CN201610106148 A CN 201610106148A CN 105575459 B CN105575459 B CN 105575459B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Abstract
The present invention relates to the preparation method that a kind of copper-plated graphite alkene strengthens copper-based electrical contact material, step is：Rare earth and metal, copper-plated graphite alkene alloy melt, cast molding, stress relief annealing, machine-shaping are added in graphene copper facing, copper weld pool, copper melts.The present invention adds rare earth in copper alloy, improve the inoxidizability and resistance to electrical arc erosion ability of copper alloy electric contact material, copper-plated graphite alkene improves graphene and intermetallic interface wet ability, be conducive to obtaining good interface combination, conductivity of composite material, heat conductivility, anti electric arc corrosion is further improved, preferably meet the performance requirement of electrical contact.
Description
Technical field
Touched the present invention relates to a kind of preparation method of electrical contact material, more particularly to a kind of copper-based electricity of copper-plated graphite alkene enhancing
The preparation method of head material.
Background technology
Electrical contact material is the critical component of instrument and meter, and the life-span and functional reliability to instrument and meter play important
Effect.Copper-base contact material is close due to cheap, conductive, heat conductivility and silver, partly replaces silver-based contact in recent years,
Reduce the loss of noble silver.But, because copper contact material is easily aoxidized, cupric oxide and oxidation of the generation with low-resistivity
It is cuprous, increase the contact resistance of contact elements, make its in use easily heating, cause contact material reliability and
Service life is reduced.
Existing patent document（Publication number CN102385938A）, disclose a kind of metal matrix graphene composite electrical contact material
And preparation method thereof, contact material, the graphene comprising 0.02-10wt%, remaining is metal matrix material.Due to graphene
Strengthen the addition of phase, the composited contact material is had than other more preferable conductive, heat conduction of enhancing phase composited contact material
The hardness and wearability of performance and Geng Gao.But because the use of poisonous and hazardous hydrazine hydrate being reducing agent, it is difficult to meet environmental requirement.
Rare earth accounts for the 80% of global rare earth reserves, the coloured conjunction of high-quality of exploitation rare earth element addition in China's rich reserves
Gold is the exclusive advantage of China.Rare earth element is more active, is added in metallic copper, and can deaerate slagging-off, crystal grain thinning, improves
The decay resistance and abrasion resistance properties of copper alloy.
Publication No. CN105063413A, discloses a kind of copper-base contact material and preparation technology, copper-base contact material bag
Containing following weight composition, 0.2-0.6% magnesium, 0.05-0.3% antimony, 0.05-0.4% bismuth, 0.05- 0.3% tin,
The copper of 0.05-0.3% chromium, 0.005-0.05% boron, 0.02-0.1% lanthanums, 0.2-0.5% graphite and surplus, it is suitable by adding
The boron of amount, tin, antimony powder end, improve the intensity and wearability of electrical contact manufactured goods.
Publication No. CN101145450A Chinese patent, discloses a kind of special powder copper alloy electric contact material, its
It is characterised by：The composition of the material, component by weight percentage is：Rare earth：0.1%~1%, boron：0.01%~
0.1%, aluminium：0.1%~1%, silver：0.1%~1%, conductivity ceramics：0.2%~2%, bortz powder：0.2%~2%, it is remaining
Measure as copper and inevitable impurity.
Above-mentioned two patents all improve the corrosion resistance, anti-oxidant of copper alloy by the addition of rare earth or rare earth oxide
Property, but simultaneously because the material addition of the low electric conductivity such as ceramic particle, chromium, reduces leading for copper contact material to a certain extent
Electricity, heat conductivility, therefore, it is difficult to obtain the copper-base contact material of excellent combination property.
The content of the invention
Conducted electricity very well it is an object of the invention to provide one kind, contact resistance it is low and stably, resistance fusion welding can good, hardness
Copper-plated graphite alkene that is high and easily preparing strengthens the preparation method of copper-based electrical contact material.
The present invention is realized by following technical scheme.
A kind of copper-plated graphite alkene strengthens the preparation method of copper-based electrical contact material, it is characterised in that comprise the following steps：
（1）Using direct current magnetron sputtering process in graphenic surface deposited metal copper into copper-plated graphite alkene；
（2）Purity is 99.9% copper melting in intermediate frequency furnace, add in copper melts weight of copper 0.05-2.0% rare earths with
0.5-5.0% metal X, are sufficiently stirred for, and copper-rare earth-X-alloy melt, the one kind of the X in zinc, aluminium, nickel, bismuth and antimony is made
Or it is several；
（3）Copper-plated graphite alkene is added in copper-rare earth-X-alloy melt, copper-plated graphite alkene and copper-rare earth-X-alloy melt
Weight ratio is 1.0-5.0:95-99.0, is sufficiently stirred for rear cast molding and composite is made；
（4）Composite stress relief annealing, extruding or rolling machine-shaping, are made copper-plated graphite alkene enhancing copper-based electrical contact
Material.
Preferably, the step（1）The number of plies of middle graphene is N layers, and N is 1-10.
The step（1）Using direct current magnetron sputtering process in graphene（Number of plies 1-10）Surface deposited metal copper is prepared into plating
Copper graphene.Purity is first ground removal surface film oxide before being installed for 99.99% copper target material with fine sandpaper, then uses acetone
Cleaning, drying carries out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, removes the metal oxide of target material surface and other miscellaneous
Matter, it is ensured that follow-up graphenic surface deposits the purity of copper film.The technological parameter of magnetically controlled DC sputtering is：Target is that purity is
99.99% copper target, 0.1*10 is reached in vacuum-3-1.0*10-3During Pa, the argon gas of purity 99.99% is passed through, operating air pressure is
0.8-1.5Pa, sputtering power 80-160W, sedimentation time is 5-30min.
Preferably, the step（2）One or more of the middle rare earth in lanthanum, cerium, yttrium, praseodymium and neodymium, rare earth uses copper
Paper tinsel parcel is added, and is pressed directly into using graphite cover below melt liquid level, is sufficiently stirred for after being kept for 3-5 minutes.
It is highly preferred that step（2）Middle rare earth is selected from one or both of lanthanum, cerium.
Preferably, step（4）Middle annealing temperature is 200-300 DEG C, annealing time 2 hours.
Preferably, step（4）Machine-shaping is rolled after middle composite annealing, rolling temperature is 600-850 DEG C, and rolling becomes
Shape amount 80%-90%.
Preferably, step（4）Extrusion process is molded after middle composite annealing, 600-850 DEG C of extrusion temperature, extrusion ratio
50：1-150：1.
The present invention useful achievement be：
（1）The present invention adds graphene reinforcement as skeleton in copper alloy, material is had high rigidity, high abrasion
Property, mechanical shock resistance, arc resistant ablation property.
（2）Copper is deposited in graphenic surface by direct current magnetron sputtering process, graphene can be avoided and existed as nano particle
Reunite during mixed powder.Meanwhile, copper-plated graphite alkene improves graphene and intermetallic interface wet ability, is conducive to obtaining good
Interface cohesion, makes conductivity of composite material, heat conductivility, anti electric arc corrosion further improve, preferably meets electrical contact
Performance requirement.
（3）The addition of rare earth metal, improves the inoxidizability and resistance to electrical arc erosion ability of copper alloy electric contact material.
（4）Conventional cast technique, technique is simple, is conducive to industrialized production.
Embodiment
Embodiment 1
（1）Using direct current magnetron sputtering process in graphene（Number of plies 1-10）Surface deposited metal copper is prepared into copper-plated graphite
Alkene.Purity is first ground removal surface film oxide before being installed for 99.99% copper target material with fine sandpaper, then is cleaned with acetone, dries
It is dry, 5 minutes pre-sputterings are carried out before Deposited By Dc Magnetron Sputtering, the metal oxide and other impurity of target material surface is removed, it is ensured that
Follow-up graphenic surface deposits the purity of copper film.The technological parameter of magnetically controlled DC sputtering is：0.1*10 is reached in vacuum-3 Pa
When, it is passed through the argon gas of purity 99.99%, operating air pressure 0.8Pa, sputtering power 80W, sedimentation time is 30min.
（2）Purity is 99.9% copper melting in intermediate frequency furnace, add in copper melts the cerium of weight of copper content 0.05% with
0.5% metallic zinc, cerium is wrapped up using copper foil and added, and is pressed directly into using graphite cover below melt liquid level, is kept for 3-5 minutes
After be sufficiently stirred for, copper-cerium-kirsite melt is made.
（3）Copper-plated graphite alkene is added in copper-cerium-kirsite melt, the weight of copper-plated graphite alkene and copper-cerium-kirsite melt
Amount is than being 1.0:99.0, it is sufficiently stirred for rear cast molding and composite is made.
（4）Composite stress relief annealing, annealing temperature is 200 DEG C, annealing time 2 hours.Material is squeezed into after annealing
Type, 600 DEG C of extrusion temperature, extrusion ratio 50：1, copper-plated graphite alkene enhancing copper-based electrical contact material is made.
Embodiment 2
（1）Using direct current magnetron sputtering process in graphene（Number of plies 1-10）Surface deposited metal copper is into copper-plated graphite alkene.
Purity is first ground removal surface film oxide before being installed for 99.99% copper target material with fine sandpaper, then is cleaned with acetone, dries,
5 minutes pre-sputterings are carried out before Deposited By Dc Magnetron Sputtering, the metal oxide and other impurity of target material surface is removed, it is ensured that be follow-up
Graphenic surface deposits the purity of copper film.The technological parameter of magnetically controlled DC sputtering is：1*10 is reached in vacuum-3During Pa, it is passed through
The argon gas of purity 99.99%, operating air pressure is in 1.5Pa, and sputtering power is in 160W, and sedimentation time is 5min.
（2）Purity is 99.9% copper melting in intermediate frequency furnace, add in copper melts the Rare Earth Lanthanum of weight of copper content 2.0% with
5.0% metallic zinc, Rare Earth Lanthanum is wrapped up using copper foil and added, and is pressed directly into using graphite cover below melt liquid level, is kept for 3-5 minutes
After be sufficiently stirred for, copper-lanthanum-kirsite melt is made.
（3）Copper-plated graphite alkene is added in copper-lanthanum-kirsite melt, the weight of copper-plated graphite alkene and copper-lanthanum-kirsite melt
Amount is than being 5.0:95.0, it is sufficiently stirred for rear cast molding and composite is made.
（4）Composite stress relief annealing, annealing temperature is 300 DEG C, annealing time 2 hours.Material is squeezed into after annealing
Type, 850 DEG C of extrusion temperature, extrusion ratio 150：1, copper-plated graphite alkene enhancing copper-based electrical contact material is made.
Embodiment 3
（1）Using direct current magnetron sputtering process in graphene（Number of plies 1-10）Surface deposited metal copper is into copper-plated graphite alkene.
Purity is first ground removal surface film oxide before being installed for 99.99% copper target material with fine sandpaper, then is cleaned with acetone, dries,
5 minutes pre-sputterings are carried out before Deposited By Dc Magnetron Sputtering, the metal oxide and other impurity of target material surface is removed, it is ensured that be follow-up
Graphenic surface deposits the purity of copper film.The technological parameter of magnetically controlled DC sputtering is：0.3*10 is reached in vacuum-3During Pa, lead to
Enter the argon gas of purity 99.99%, operating air pressure is in 1.0Pa, and sputtering power is in 100W, and sedimentation time is 15min.
（2）Purity is 99.9% copper melting in intermediate frequency furnace, add in copper melts the Rare Earth Lanthanum of weight of copper content 0.5% with
1.0% metallic zinc, Rare Earth Lanthanum is wrapped up using copper foil and added, and is pressed directly into using graphite cover below melt liquid level, is kept for 3-5 minutes
After be sufficiently stirred for, copper-lanthanum-kirsite melt is made.
（3）Copper-plated graphite alkene is added in copper-lanthanum-kirsite melt, the weight of copper-plated graphite alkene and copper-lanthanum-kirsite melt
Amount is than being 2.0:98.0, it is sufficiently stirred for rear cast molding and composite is made.
（4）Composite stress relief annealing, annealing temperature is 300 DEG C, annealing time 2 hours.Composite rolls after annealing
Type is made, 600-850 DEG C of rolling temperature, deflection is 80-90%, copper-plated graphite alkene enhancing copper-based electrical contact material is made.
Embodiment 4
Copper-plated graphite alkene is added in the kirsite melt of the lanthanum of copper -1.0% -2.0%, copper-plated graphite alkene and copper-lanthanum-kirsite melt
Weight ratio be 3.0:97.0, copper-plated graphite alkene enhancing copper-based electrical contact material is made in other specification be the same as Example 3.
Embodiment 5
Copper-plated graphite alkene is added in the kirsite melt of the cerium of copper -1.0% -1.0%, copper-plated graphite alkene and copper-cerium-kirsite melt
Weight ratio be 2.0:98.0, copper-plated graphite alkene enhancing copper-based electrical contact material is made in other specification be the same as Example 3.
Comparative example 1
Not copper-plated graphene is added in copper melts, and graphene is 2.0 with weight of copper ratio:98.0, other specification is with implementation
Example 3, is made graphene enhancing copper-based electrical contact material.
Comparative example 2
Not plus graphene, copper-based electrical contact material is made according to the technique of embodiment 3 in the kirsite melt of the cerium of copper -1.0% -1.0%.
The composite parameters such as following table being made：
In embodiment, add in copper-plated graphite alkene enhancing copper-based electrical contact material, with comparative example 1 that copper-plated graphite alkene is made
Only add graphene, the electrical contact material that rare earth metal is made is not added and is compared, hardness, electrical conductivity all improve；
With only adding rare earth metal in comparative example 2, the electrical contact material that graphene is made is not added and is compared, hardness is significantly improved, conductance
Rate also improves.
The present invention improves hardness, electrical conductivity and the arc ablation resistance of electrical contact by adding copper-plated graphite alkene, by adding
Plus rare earth metal improves the inoxidizability of electrical contact material, the good electrical contact material of combination property is obtained.
Claims (8)
1. a kind of copper-plated graphite alkene strengthens the preparation method of copper-based electrical contact material, it is characterised in that comprise the following steps：
（1）Using direct current magnetron sputtering process in graphenic surface deposited metal copper into copper-plated graphite alkene；
（2）Purity is addition weight of copper 0.05-2.0% rare earths and 0.5- in 99.9% copper melting in intermediate frequency furnace, copper melts
5.0% metal X, is sufficiently stirred for, and copper-rare earth-X-alloy melt, the one kind or several of the X in zinc, aluminium, nickel, bismuth and antimony is made
Kind；
（3）Copper-plated graphite alkene is added in copper-rare earth-X-alloy melt, the weight of copper-plated graphite alkene and copper-rare earth-X-alloy melt
Than for 1.0-5.0:95-99.0, is sufficiently stirred for rear cast molding and composite is made；
（4）Composite stress relief annealing, extruding or rolling machine-shaping, are made copper-plated graphite alkene enhancing copper-based electrical contact material
Material.
2. preparation method according to claim 1, it is characterised in that the step（1）The number of plies of middle graphene is N layers, N
For 1-10.
3. preparation method according to claim 1, it is characterised in that the step（1）The technique of middle magnetically controlled DC sputtering
Parameter is：Target is the copper target that purity is 99.99%, and 0.1*10 is reached in vacuum-3-1.0*10-3During Pa, purity is passed through
99.99% argon gas, operating air pressure is 0.8-1.5Pa, and sputtering power 80-160W, sedimentation time is 5-30min.
4. preparation method according to claim 1, it is characterised in that step（2）Middle rare earth is selected from lanthanum, cerium, yttrium, praseodymium and neodymium
In one or more, rare earth wrapped up using copper foil and added, is pressed directly into using graphite cover below melt liquid level, keeps 3-5 point
It is sufficiently stirred for after clock.
5. preparation method according to claim 1, it is characterised in that step（2）One kind in lanthanum, cerium of middle rare earth or
Two kinds.
6. preparation method according to claim 1, it is characterised in that step（4）Middle annealing temperature is 200-300 DEG C, is moved back
Fiery time 2 h.
7. preparation method according to claim 1, it is characterised in that step（4）Roll and be processed into after composite annealing
Type, rolling temperature is 600-850 DEG C, rolling reduction 80%-90%.
8. preparation method according to claim 1, it is characterised in that step（4）Composite annealing after extrusion process into
Type, 600-850 DEG C of extrusion temperature, extrusion ratio 50：1-150：1.
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| CN112701513B (en) * | 2020-12-22 | 2022-08-12 | 慈溪市寅升电器有限公司 | Graphene copper alloy chemical nickel-plating power supply pin and preparation method thereof |
| CN114438365B (en) * | 2021-12-22 | 2022-09-23 | 厦门凯纳石墨烯技术股份有限公司 | High-thermal-conductivity carbon-based metal composite heat dissipation material and preparation method thereof |
| CN115786753B (en) * | 2023-02-02 | 2023-05-30 | 泰州泰锦合金材料有限公司 | Tellurium copper alloy material containing rare earth metal and preparation method thereof |
| CN115948674A (en) * | 2023-03-14 | 2023-04-11 | 淄博国创中心先进车用材料技术创新中心 | Preparation method of graphene modified magnesium alloy hub |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106024A (en) * | 2007-08-07 | 2008-01-16 | 济南大学 | Weak electricity copper base electric contact composite material and method for making same |
| CN102557013A (en) * | 2010-12-28 | 2012-07-11 | 国家纳米科学中心 | Preparation method for reduced graphene oxide |
| CN102779988A (en) * | 2012-08-06 | 2012-11-14 | 常州大学 | Composite negative electrode material coating modification method of lithium ion battery |
| WO2013062264A1 (en) * | 2011-10-24 | 2013-05-02 | Src Corporation | Method of manufacturing graphene using metal catalyst |
| CN104451227A (en) * | 2014-12-10 | 2015-03-25 | 济南大学 | Preparation method of copper-plated graphene reinforced metal-based composite |
-
2016
- 2016-02-26 CN CN201610106148.2A patent/CN105575459B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106024A (en) * | 2007-08-07 | 2008-01-16 | 济南大学 | Weak electricity copper base electric contact composite material and method for making same |
| CN102557013A (en) * | 2010-12-28 | 2012-07-11 | 国家纳米科学中心 | Preparation method for reduced graphene oxide |
| WO2013062264A1 (en) * | 2011-10-24 | 2013-05-02 | Src Corporation | Method of manufacturing graphene using metal catalyst |
| CN102779988A (en) * | 2012-08-06 | 2012-11-14 | 常州大学 | Composite negative electrode material coating modification method of lithium ion battery |
| CN104451227A (en) * | 2014-12-10 | 2015-03-25 | 济南大学 | Preparation method of copper-plated graphene reinforced metal-based composite |
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