CN105483422A - Electrical contact material and preparation method thereof - Google Patents
Electrical contact material and preparation method thereof Download PDFInfo
- Publication number
- CN105483422A CN105483422A CN201510983357.0A CN201510983357A CN105483422A CN 105483422 A CN105483422 A CN 105483422A CN 201510983357 A CN201510983357 A CN 201510983357A CN 105483422 A CN105483422 A CN 105483422A
- Authority
- CN
- China
- Prior art keywords
- electrical contact
- preparation
- copper alloy
- contact material
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000843 powder Substances 0.000 claims abstract description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 30
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 28
- 238000005245 sintering Methods 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 238000000498 ball milling Methods 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 238000000889 atomisation Methods 0.000 claims abstract description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 24
- 239000010439 graphite Substances 0.000 claims description 24
- -1 graphite alkene Chemical class 0.000 claims description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000002679 ablation Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract 3
- 238000000465 moulding Methods 0.000 abstract 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000009689 gas atomisation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/027—Composite material containing carbon particles or fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention relates to an electrical contact material, in particular to a graphene reinforced copper base electrical contact composite material and a preparation method of the material. The electrical contact material consists of 0.1-2.0 weight% of graphene plating nickel and 98.0-99.9 weight% of copper alloy. The preparation method comprises the steps of graphene nickel plating, copper alloy atomization, ball milling and powder mixing, primary molding, sintering, secondary molding and sintering. The electrical contact material adds the nickel plating graphene in the copper alloy as a skeleton, so that the material prevents the reduction of electricity conductivity and heat conductivity when having high hardness, mechanical shock resistance and arc ablation resistance.
Description
Technical field
The present invention relates to a kind of electrical contact material and preparation method thereof, particularly relate to a kind of Graphene and strengthen copper-based electrical contact composite material and preparation method thereof.
Background technology
Vacuum contact material is the important factor affecting Vacuum Circuit Breaker performance, requires that contact material has high conductivity, high thermal conductivity coefficient, high physical strength and low contact resistance.Vacuum switch does not need maintenance, and contact needs minimum tolerance 8-12 time, and the folding rated short circuit current of 30-50 time is to the scaling loss of contact at most, and therefore contact material should have good are-tight property, resistance fusion welding.Guillaume metal conventional at present has good resistance fusion welding, lower current-carrying value, certain connecting-disconnecting function, but intensity is lower, and arc erosion is large, reduces the life-span of contact material.
Existing (publication number 105063413A), disclose " a kind of copper-based electrical contact material and preparation technology thereof ", copper-base contact material comprises following weight percent composition: the chromium of the bismuth of the magnesium of 0.2-0.6%, the antimony of 0.05-0.3%, 0.05-0.4%, the tin of 0.05-0.3%, 0.05-0.3%, the boron of 0.005-0.05%, the lanthanum of 0.02-0.1% and the graphite of 0.2-0.5% and the copper of surplus.By adding appropriate boron, tin, antimony powder end, improving intensity and the wear resistance of electrical contact finished product, but reducing material conductivity to a certain extent.
Existing patent documentation (publication number 102385938A), disclose a kind of metal matrix graphene composite electrical contact material and preparation method thereof, contact material comprises the Graphene of 0.02-10wt.%, and all the other are metal matrix material.Due to adding of Graphene wild phase, this composited contact material is had better conduct electricity than other wild phase composited contact materials, the hardness of heat conductivility and Geng Gao and wear resistance.The wettability of Graphene and metallic matrix is bad, and electrical contact material performance has the space promoted further.
Summary of the invention
The invention provides a kind of electrical contact material, by adding Ni-coated graphite alkene reinforcement in Cu alloy material, while not reducing its electroconductibility, thermal conductivity, improving the hardness of copper alloy, wear resistance and resistance to arc erosion.
In addition present invention also offers the preparation method of above-mentioned electrical contact material.
The present invention is the technical scheme proposed that solves the problem:
A kind of electrical contact material, it is characterized in that, be that 0.1-2.0% Ni-coated graphite alkene and 98.0-99.9% copper alloy form by weight ratio, the weight item of copper alloy is the bismuth of 0.15-0.5%, the metal X of 0.1-3.0%, surplus are copper, and X is selected from one or more in zinc, tin, aluminium, nickel and silver.
Preferably, X is selected from one or more in zinc, al and ni.
Preferably, Graphene is N layer, and N is 1-10.
The preparation method of above-mentioned electrical contact material, is characterized in that comprising the following steps:
(1) adopt direct current magnetron sputtering process that metallic nickel is deposited on graphenic surface, make Ni-coated graphite alkene.The processing parameter of Deposited By Dc Magnetron Sputtering equipment is: vacuum tightness reaches 0.1*10
-3-1.0*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5-1.2Pa, sputtering power 100-150W, depositing time is 5-30min, preferred 10-30min.
(2) atomization is adopted by copper alloy to make 200-300 object copper alloy powder.
(3) Ni-coated graphite alkene and copper alloy are loaded ball mill ball milling, make Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.Ball mill working order is: rotating speed 100-250r/min, ball milling 15-20 minute, stops 5 minutes, and clockwise, counterclockwise alternate run, the mixed powder time is 2-6 hour.
(4) powder after step (3) mixing is put into mould to cold pressing once shaped, pressure 400-600MPa, dwell time 3-5 minute.Sinter after colding pressing, sintering vacuum tightness is 1.0*10
-3-5.0*10
-1pa, sintering temperature 700-900 DEG C, soaking time 2-4 hour.
(5) by blank post forming, pressure is 200-500MPa, dwell time 3-5 minute.Sintering, vacuum tightness is 1.0*10
-3-5.0*10
-1pa, sintering temperature 700-900 DEG C, soaking time 2-4 hour, make the electric contact composite material that Graphene strengthens copper base.
Useful achievement of the present invention is:
(1) this electrical contact material, add in copper alloy and there is superstrength, hardness and the Graphene reinforcement with chemical stability as skeleton, while making material have high rigidity, high-wearing feature, mechanical shock resistance and anti-electric-arc ablation property, avoid the reduction of copper alloy electroconductibility, thermal conductivity.In addition, Ni-coated graphite alkene improves Graphene and intermetallic interface binding power, acquisition good interface combines, solve the problem of boundary moisture between Graphene and matrix, matrix material density, mechanical property, electroconductibility, heat conductivility, anti electric arc corrosion are improved further, meets the demand of electrical contact material better.
(2) preparation method of electrical contact, adopts direct current magnetron sputtering process in graphenic surface nickel deposited, the structure of formation, reduces Graphene as the reunion of nano particle in mixed powder process.Nickel can be used as the alloy element of Copper substrate, improves corrosion resistance and the resistance fusion welding of copper alloy.The coldmoulding sintering preparation technology used reduces production cost, is applicable to large-scale industrial production.
Embodiment
Embodiment 1
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene at Graphene (number of plies is 1-5) surface deposition metallic nickel.Purity is first carry out polishing with fine sandpaper before the nickel target installation of 99.99% to remove surface film oxide, then with acetone cleaning, dries.Carry out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: vacuum tightness reaches 0.1*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5Pa, sputtering power 100W, depositing time is 30min.
(2) gas atomization is adopted to make 200 order copper alloy powders the alloy powder containing 0.15% bismuth, 0.1% zinc, 99.75% bronze medal.
(3) part by weight that Ni-coated graphite alkene and copper-0.15% bismuth-0.1% Zinc alloy powder press 0.1:99.9 loads in mechanical ball grinding machine; ball grinder first vacuumizes and passes into argon shield again; rotating speed 100r/min, ball milling mixes in powder process, clockwise ball milling 15 minutes; stop 5 minutes; counterclockwise ball milling 15 minutes, stops 5 minutes, alternation according to this; Ball-milling Time 6 hours, obtains Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out coldmoulding, pressure 600MPa, 3 minutes dwell times.After colding pressing, compact puts into vacuum sintering furnace (vacuum tightness: 5.0*10
-1pa) sinter in, sintering temperature 700 DEG C, soaking time 4 hours.
(5) by blank post forming, pressing pressure is 200MPa, 3 minutes dwell times.In vacuum (vacuum tightness: 5.0*10
-1pa) sinter under, sintering temperature 700 DEG C, soaking time 4 hours, prepare the electric contact composite material that Graphene strengthens copper base.
Embodiment 2
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene at Graphene (number of plies is 1-10) surface deposition metallic nickel.Purity is first carry out polishing with fine sandpaper before the nickel target installation of 99.99% to remove surface film oxide, then with acetone cleaning, dries.Carry out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: vacuum tightness reaches 1.0*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 1.2Pa, sputtering power 150W, depositing time is 10min.
(2) gas atomization is adopted to make 300 order copper alloy powders the alloy powder containing 0.5% bismuth, 3.0% zinc, 96.5% bronze medal.
(3) part by weight that Ni-coated graphite alkene and copper-0.5% bismuth-3.0% Al alloy powder press 0.2:99.8 loads in ball mill; ball grinder first vacuumizes and passes into argon shield again; rotating speed 250r/min, ball milling mixes in powder process, clockwise ball milling 20 minutes; stop 5 minutes; counterclockwise ball milling 20 minutes, stops 5 minutes, alternation according to this; Ball-milling Time 2 hours, obtains Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out coldmoulding, pressure 500MPa, 5 minutes dwell times.After colding pressing, compact puts into vacuum sintering furnace (vacuum tightness: 1.0*10
-3pa) sinter in, sintering temperature 900 DEG C, soaking time 2 hours.
(5) by blank post forming, pressing pressure is 500MPa, 5 minutes dwell times.In vacuum (vacuum tightness: 1.0*10
-3pa) sinter under, sintering temperature 900 DEG C, soaking time 2 hours, prepare the electric contact composite material that Graphene strengthens copper base.
Embodiment 3
(1) direct current magnetron sputtering process is adopted to be prepared into Ni-coated graphite alkene at Graphene (number of plies is 1-10) surface deposition metallic nickel.Purity is first carry out polishing with fine sandpaper before the target installation of 99.99% to remove surface film oxide, then with acetone cleaning, dries.Carry out 5 minutes pre-sputterings before Deposited By Dc Magnetron Sputtering, remove metal oxide and other impurity of target material surface, ensure the purity of follow-up graphenic surface nickel deposited film.Sputtering parameter is as follows: vacuum tightness reaches 0.5*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 1.0Pa, sputtering power 140W, depositing time is 15min.
(2) gas atomization is adopted to make 200 order copper alloy powders the alloy powder containing 0.4% bismuth, 1.5% zinc, 98.1% bronze medal.
(3) by Ni-coated graphite alkene: copper-0.4% bismuth-1.5% Zinc alloy powder loads in ball mill by weight 0.3:99.7; ball grinder first vacuumizes and passes into argon shield again; rotating speed 150r/min, ball milling mixes in powder process, clockwise ball milling 20 minutes; stop 5 minutes; counterclockwise ball milling 20 minutes, stops 5 minutes, cycle operation according to this; amount to mixed powder time 3h, obtain Ni-coated graphite alkene and the mixed uniformly powder of copper alloy.
(4) powder after mixing is put into mould and carry out coldmoulding, pressure 400MPa, 3 minutes dwell times.After colding pressing, compact puts into vacuum sintering furnace (vacuum tightness: 1.0*10
-1pa) sinter, sintering temperature 750 DEG C, soaking time 2 hours.
(5) by blank post forming, pressing pressure is 400MPa, 5 minutes dwell times.In vacuum (vacuum tightness: 1.0*10
-1pa) sinter under, sintering temperature 750 DEG C, soaking time 2 hours, make the electric contact composite material that Graphene strengthens copper base.
Embodiment 4
Ni-coated graphite alkene: copper-0.2% bismuth-3.0% Al alloy powder loads ball mill by weight 0.5:99.5, other conditions, with embodiment 3, make the electric contact composite material that Graphene strengthens copper base.
Embodiment 5
Ni-coated graphite alkene: copper-0.2% bismuth-3.0% Al alloy powder loads in ball mill by weight 1.0:99.0, other parameters, with embodiment 3, make the electric contact composite material that Graphene strengthens copper base.
Embodiment 6
Ni-coated graphite alkene: copper-0.3% bismuth-1.0% nickel alloy powder loads in ball mill by by weight 2.0:98.0, other parameters, with embodiment 3, are made Graphene and are strengthened copper-based electrical contact composite material.
Comparative example 1
Copper-0.4% bismuth-1.5% zinc is loaded ball mill and mixes powder, other parameter, with embodiment 3, makes copper-based electrical contact material.
Comparative example 2
Copper-0.3% bismuth-1.0% nickel is loaded ball mill and mixes powder, other parameter, with embodiment 3, makes copper-based electrical contact material.
Comparative example 3
Graphene and copper are loaded ball mill by weight 2.0:98.0 and mixes powder, other parameter, with embodiment 3, makes copper-based electrical contact material.
The matrix material parameters made is as following table:
Add Ni-coated graphite alkene and make Graphene enhancing copper-based electrical contact composite material, compared with the electrical contact material made with the copper alloy not adding Graphene in comparative example 1,2, specific conductivity, hardness all significantly improve, and hardness can improve more than 60%, and specific conductivity also significantly improves.Compared with the electrical contact material made with the copper alloy adding Graphene in comparative example 3, specific conductivity, hardness also all significantly improve.
Claims (10)
1. an electrical contact material, it is characterized in that, be that 0.1-2.0% Ni-coated graphite alkene and 98.0-99.9% copper alloy form by weight ratio, the weight item of copper alloy is the bismuth of 0.15-0.5%, the metal X of 0.1-3.0%, surplus are copper, and X is selected from one or more in zinc, tin, aluminium, nickel and silver.
2. a kind of electrical contact material according to claim 1, is characterized in that, Graphene is N layer, and N is 1-10.
3. a kind of electrical contact material according to claim 1, is characterized in that, X is selected from one or more in zinc, al and ni.
4. a preparation method for electrical contact material described in claim 1, is characterized in that comprising the following steps:
(1) adopt direct current magnetron sputtering process that metallic nickel is deposited on graphenic surface, make Ni-coated graphite alkene;
(2) atomization is adopted by copper alloy to make 200-300 object copper alloy powder;
(3) Ni-coated graphite alkene and copper alloy are loaded ball mill ball milling, make Ni-coated graphite alkene and the mixed uniformly powder of copper alloy;
(4) powder after step (3) mixing is put into mould to cold pressing once shaped, sintering;
(5) by blank post forming, sintering, makes the electric contact composite material that Graphene strengthens copper base.
5. the preparation method of a kind of electrical contact material according to claim 4, is characterized in that, in described step (1), the processing parameter of Deposited By Dc Magnetron Sputtering equipment is: vacuum tightness reaches 0.1*10
-3-1.0*10
-3during Pa, pass into high-purity argon gas, gas pressure in vacuum 0.5-1.2Pa, sputtering power 100-150W, depositing time is 5-30min, preferred 10-30min.
6. preparation method according to claim 4, is characterized in that, in described step (3), ball mill working order is: rotating speed 100-250r/min, ball milling 15-20 minute, stop 5 minutes, and clockwise, counterclockwise alternate run, the mixed powder time is 2-6 hour.
7. preparation method according to claim 4, is characterized in that, once shaped of colding pressing in described step (4), pressure 400-600MPa, dwell time 3-5 minute.
8. preparation method according to claim 4, is characterized in that, the vacuum tightness in described step (4) sintering process is 1.0*10
-3-5.0*10
-1pa, sintering temperature 700-900 DEG C, soaking time 2-4 hour.
9. preparation method according to claim 4, is characterized in that, post forming in described step (5), pressure is 200-500MPa, dwell time 3-5 minute.
10. preparation method according to claim 4, is characterized in that, the vacuum tightness in described step (5) sintering process is 1.0*10
-3-5.0*10
-1pa, sintering temperature 700-900 DEG C, soaking time 2-4 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510983357.0A CN105483422B (en) | 2015-12-24 | 2015-12-24 | A kind of electrical contact material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510983357.0A CN105483422B (en) | 2015-12-24 | 2015-12-24 | A kind of electrical contact material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105483422A true CN105483422A (en) | 2016-04-13 |
| CN105483422B CN105483422B (en) | 2017-09-29 |
Family
ID=55670692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510983357.0A Active CN105483422B (en) | 2015-12-24 | 2015-12-24 | A kind of electrical contact material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105483422B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098490A (en) * | 2016-08-08 | 2016-11-09 | 李聪 | A kind of low-voltage circuit breaker |
| CN110614381A (en) * | 2019-08-06 | 2019-12-27 | 温州聚星电接触科技有限公司 | Preparation method of silver-based graphene electrical contact material and electrical contact material thereof |
| EP4089697A1 (en) * | 2021-05-10 | 2022-11-16 | ABB Schweiz AG | Metal-graphene coated electrical contact |
| CN115491081A (en) * | 2022-09-16 | 2022-12-20 | 江苏智先生电器有限公司 | Preparation method and application of sintered graphene ink |
| CN117337475A (en) * | 2021-05-10 | 2024-01-02 | Abb瑞士股份有限公司 | Graphene-copper coated electrical contacts |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004076097A (en) * | 2002-08-19 | 2004-03-11 | Railway Technical Res Inst | Carbonaceous sintered contact strip material with crack resistance |
| CN105063403A (en) * | 2015-06-25 | 2015-11-18 | 中国航空工业集团公司北京航空材料研究院 | Preparation method of copper matrix graphene alloy |
-
2015
- 2015-12-24 CN CN201510983357.0A patent/CN105483422B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004076097A (en) * | 2002-08-19 | 2004-03-11 | Railway Technical Res Inst | Carbonaceous sintered contact strip material with crack resistance |
| CN105063403A (en) * | 2015-06-25 | 2015-11-18 | 中国航空工业集团公司北京航空材料研究院 | Preparation method of copper matrix graphene alloy |
Non-Patent Citations (2)
| Title |
|---|
| 杨帅: "少层石墨烯增强铜基复合材料制备和性能研究", 《中国优秀硕士学位论文全文数据库(电子期刊)工程科技Ⅰ辑》 * |
| 龚文照 等: "热膨胀石墨烯表面化学镀纳米镍", 《新型炭材料》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098490A (en) * | 2016-08-08 | 2016-11-09 | 李聪 | A kind of low-voltage circuit breaker |
| CN110614381A (en) * | 2019-08-06 | 2019-12-27 | 温州聚星电接触科技有限公司 | Preparation method of silver-based graphene electrical contact material and electrical contact material thereof |
| EP4089697A1 (en) * | 2021-05-10 | 2022-11-16 | ABB Schweiz AG | Metal-graphene coated electrical contact |
| CN117337475A (en) * | 2021-05-10 | 2024-01-02 | Abb瑞士股份有限公司 | Graphene-copper coated electrical contacts |
| CN115491081A (en) * | 2022-09-16 | 2022-12-20 | 江苏智先生电器有限公司 | Preparation method and application of sintered graphene ink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105483422B (en) | 2017-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105385883A (en) | Electrical contact material and preparation method thereof | |
| CN105483422A (en) | Electrical contact material and preparation method thereof | |
| CN105385884A (en) | Electrical contact material and preparation method thereof | |
| CN104711443B (en) | A kind of graphene/copper composite material and preparation method thereof | |
| CN105428097B (en) | A kind of Ag-based electrical contact composite and preparation method thereof | |
| CN105525131A (en) | Electrical contact material and preparation method thereof | |
| CN110157932B (en) | Preparation method of graphene modified copper-based electrical contact material based on in-situ synthesis | |
| CN105525130B (en) | A kind of copper chromium electrical contact material and preparation method thereof | |
| CN105551839B (en) | A kind of copper-plated graphite alkene/copper-based electrical contact material and preparation method thereof | |
| CN108220703B (en) | Cast aluminum-silicon alloy cooperatively reinforced by graphene and rare earth and preparation method thereof | |
| CN102242302A (en) | Preparation method of layered ternary ceramic reinforced copper composite material | |
| CN103352136B (en) | Copper-base contact material and manufacture craft | |
| CN112553500B (en) | Method for simultaneously improving strength and conductivity of Cu-Cr-Nb alloy | |
| CN105603247A (en) | Graphene reinforced copper-rare earth based electrical contact material and preparing method thereof | |
| CN105463238B (en) | A kind of copper chromium electrical contact material and preparation method thereof | |
| CN105609159B (en) | A kind of copper-plated graphite alkene enhancing copper-based electrical contact material and preparation method thereof | |
| CN105385877A (en) | Novel silver-based electrical contact composite material and preparing method thereof | |
| CN105506329A (en) | Preparation method for Cu-Al2O3 nano dispersion strengthened alloy with high Al2O3 concentration | |
| CN105695776A (en) | Preparation method for graphene reinforced copper-matrix electrical contact material | |
| CN105575459B (en) | A kind of copper-plated graphite alkene strengthens the preparation method of copper-based electrical contact material | |
| CN105525132B (en) | A kind of electrical contact material and preparation method thereof | |
| CN102628114B (en) | Vacuum copper-based electrical contact composite material containing ceramic phase and preparation method of vacuum copper-based electrical contact composite material | |
| CN105679560B (en) | A kind of preparation method of Ni-coated graphite alkene enhancing Ag-based electrical contact material | |
| CN105695792B (en) | A kind of preparation method of graphene/silver nickel electric contact material | |
| CN105551860A (en) | Preparation method of nickel-plated graphene/silver-nickel electrical contact material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240806 Address after: 810, 8th Floor, Building 10, Courtyard 1, Tianxing Street, Fangshan District, Beijing, 102400 Patentee after: Beijing Zhichanhui Technology Co.,Ltd. Country or region after: China Address before: 250022 No. 336, South Xin Zhuang West Road, Shizhong District, Ji'nan, Shandong Patentee before: University of Jinan Country or region before: China |
|
| TR01 | Transfer of patent right |