CN113193096A - Low-cost LED light-emitting device and preparation method thereof - Google Patents
Low-cost LED light-emitting device and preparation method thereof Download PDFInfo
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- CN113193096A CN113193096A CN202110475501.5A CN202110475501A CN113193096A CN 113193096 A CN113193096 A CN 113193096A CN 202110475501 A CN202110475501 A CN 202110475501A CN 113193096 A CN113193096 A CN 113193096A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
The application provides a low-cost LED light-emitting device and a preparation method thereof, wherein the preparation method comprises the following steps: mounting the LED particles or the LED chips on a substrate to obtain the substrate with the LED particles or the LED chips mounted thereon, wherein a runner for filling glue into a concave part of the mold for forming the lens is arranged in the substrate; inversely pressing the substrate pasted with the LED particles or the LED chips on a mould, wherein the LED particles or the LED chips are positioned in the concave part of the mould, and a gap is reserved between the LED particles or the LED chips and the concave part of the mould; and filling curing glue into the flow channel of the substrate, filling curing glue into the recessed part of the mold through the flow channel, and after the curing glue is cured, directly pressing and molding the curing glue to form the lens and the LED particles or the LED chip and the substrate, wherein the lens and the LED particles or the LED chip are fixed together.
Description
Technical Field
The invention relates to the technical field of display devices, in particular to a preparation method of a low-cost LED light-emitting device and the LED light-emitting device.
Background
The straight following formula backlight unit of display device, generally from the bottom up includes: backplate, LED backlight, diffuser plate, other optics diaphragms, LED backlight includes a plurality of LED luminescent device, adopts LED luminescent device to make intensive dot matrix, and LED luminescent device includes: the direct type backlight module adopts the light emitted by the LED backlight source to directly irradiate a screen, namely the light is directly scattered, so that the required light mixing height is higher, the thickness of the direct type backlight module is larger than that of the side type backlight module, and the thinning is always difficult. The LED light-emitting device generally comprises a substrate, LED particles or LED chips, in order to pursue the slimness of the direct type backlight module, the LED light-emitting device can be pasted with a lens above the LED particles, the traditional process for pasting the lens adopts an SMT pasting mode to paste the lens above the LED particles, the process requirement is high, and the production efficiency is low.
The prior art proposes an LED light emitting device with high production efficiency, as described in patent CN112259660A, S1, in which LED particles or LED chips are mounted on a substrate of the LED light emitting device; s2, filling the concave part of the lens insert on the lens mould plate with curing glue; s3, the substrate obtained in the step S1 is inverted and pressed on the lens mold plate obtained in the step S2, and the positions of the LED particles or the LED chips correspond to the positions of the middle parts of the concave parts of the lens mold inserts; and S4, curing the substrate and the lens mold plate which are pressed together after the step S3, after curing the curing glue, fixing the curing glue, the LED particles or the LED chips and the substrate together, and opening the mold to obtain the LED light-emitting device. However, if the lenses of the entire LED light emitting device are all molded at one time, the mold cost is high, and the size is large, and the existing machine cannot be used for processing, which increases the cost for purchasing a new machine. Therefore, in the processing mode of the prior art, the lenses on one LED lamp panel are selected to be formed not at one time but in batches, the size of the die is small, the die can be processed by using the existing machine, and although the time cost is slightly increased, the die cost and the cost for purchasing a new machine are reduced. And in order to increase the glue filling efficiency, a plurality of concave parts for glue filling in the mould are connected through a hot runner, glue is filled from the central point of the hot runner, and the curing glue flows into the concave parts through each flow channel connected with the central point. However, after the mold and the substrate are pressed together, the curing glue on the flow channel flows onto the substrate to form a raised glue channel fixed to the upper surface of the substrate, and the glue channel can affect the application of the reflector plate on the LED lamp panel, so that the action of cutting the glue channel can be performed in the manufacturing process of the LED lamp panel, and the glue channel is not easy to remove, thereby greatly increasing the time cost and the process cost.
In view of the above, the invention provides a low-cost LED light emitting device and a manufacturing method thereof, in which a curing adhesive in a flow channel does not form a protruding adhesive channel on the surface of a substrate, and a process for cutting off the adhesive channel on the substrate is not required, thereby reducing time cost and process cost.
Disclosure of Invention
The invention aims to provide a low-cost LED light-emitting device and a preparation method thereof, wherein a curing adhesive in a flow channel does not form a raised adhesive channel on the surface of a substrate, the process work of cutting the adhesive channel on the substrate is not needed, and the time cost and the process cost are reduced.
One aspect of the present application provides a method for manufacturing a low-cost LED light emitting device, including the steps of:
s1, mounting the LED particles or the LED chips on a substrate to obtain the substrate with the LED particles or the LED chips mounted thereon, wherein a flow channel for filling glue into a concave part of the mold for forming the lens is arranged in the substrate;
s2, placing and pressing the substrate pasted with the LED particles or the LED chips on a mold, wherein the LED particles or the LED chips are positioned in the concave parts of the mold, and gaps are reserved between the LED particles or the LED chips and the concave parts of the mold;
s3, pouring curing glue into the flow channel of the substrate, pouring curing glue into the recessed part of the mold through the flow channel, and after the curing glue is cured, fixing the lens and the LED particles or the LED chip and the substrate which are directly formed by compression molding of the curing glue.
In some embodiments, a runner of the substrate can be used to fill one or more recessed portions of the mold.
Further preferably, the runner of one substrate can be used for filling glue into the concave parts of a plurality of molds.
In some embodiments, the substrate has one or more flow channels, the flow channels have the same or different shapes, the flow channels include glue filling points and branch channels, one flow channel has one or more glue filling points, and one flow channel has one or more branch channels.
Furthermore, the glue filling points are arranged on the lower panel of the substrate, the branch channels are grooves formed in the substrate, one end of each branch channel is connected with the glue filling points, and the other end of each branch channel is arranged in a gap between the LED particles or the LED chips and the concave parts of the mold.
Further, the shape of a runner is related to the number of recessed portions of the mold to which the runner is connected, and the shape of the runner is different when the number of recessed portions of the mold to which the runner is connected is different.
Furthermore, 2 lenses are formed by pouring glue into one flow channel, the flow channel is in a 'I' shape or an 'I' shape, and one glue pouring point is arranged at the center point of the flow channel.
Furthermore, 3 lenses are formed by pouring glue into one flow channel, the flow channel is Y-shaped, and one glue pouring point is arranged at the center point of the Y-shaped flow channel.
Furthermore, 4 lenses are formed by pouring glue into one flow channel, the flow channel is in an X shape, and one glue pouring point is arranged at the center point of the X flow channel.
Furthermore, the number of the lenses formed by glue pouring of one flow channel is more than 4, the flow channel consists of more than 2 parallel branch channels and a branch channel vertical to the parallel branch channels, and one or more glue pouring points are arranged.
Furthermore, the depth of the branch channel is 0.8-1.2mm, and the width of the branch channel is 1.8-2.2 mm.
Further, when the mold is opened, the glue filling point of the flow channel automatically cuts off glue.
In some embodiments, the number of the concave portions of one mold is the same as or different from the number of the LED particles or LED chips of the LED light emitting device.
It is further preferred that the number of the concave portions of one mold is different from the number of the LED particles or the LED chips of the LED light emitting device, and the number of the concave portions of one mold is 1/60 to 1/2 of the number of the LED particles or the LED chips of the LED light emitting device.
Furthermore, the substrate above the die can be periodically moved during production, and one LED light-emitting device is formed by multiple glue filling.
In some embodiments, the lens directly compression molded by the cured glue has a shape of: m-shaped (double peak overlapping shape), arch shape, semi-circle shape, four peak overlapping shape, donut shape, circular arc shape, microprism, microlens or microwave guide structure.
In some embodiments, the substrate is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, a polyester resin substrate.
In some embodiments, the LED particles or LED chips are uniformly distributed in rows and columns, the LED particles include LED chips and a support, and the LED chips include: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.
In another aspect of the present application, there is provided an LED light emitting device including: the LED die comprises a substrate, LED particles or LED chips and a lens, wherein the LED particles or the LED chips are attached to the substrate, the lens is arranged above the LED particles or the LED chips and is directly molded by curing glue.
In some embodiments, the substrate has one or more flow channels, and the flow channels have the same or different shapes.
Furthermore, the runner of the base plate can be used for filling glue into the concave parts of one or more dies. Preferably, the runner of one substrate can be used for filling glue into the concave parts of a plurality of molds.
In some embodiments, the flow channels include glue sites and branches, one flow channel having one or more glue sites and one flow channel having one or more branches.
Furthermore, the glue filling point is arranged on the lower panel of the substrate, the branch channel is arranged inside the substrate, one end of the branch channel is connected with the glue filling point, and the other end of the branch channel is connected with the lens.
Further, the shape of one flow channel is related to the number of lenses connected to the flow channel.
Furthermore, a flow channel is connected with 2 lenses, the flow channel is of a 'I' shape or an 'I' shape, and a glue filling point is arranged at the center point of the flow channel.
Furthermore, a runner is connected with 3 lenses, the runner is Y-shaped, and a glue filling point is arranged at the center point of the Y-shaped runner.
Furthermore, a runner is connected with 4 lenses, the runner is of an X shape, and a glue filling point is arranged at the center point of the X runner.
Furthermore, a runner is connected with more than 4 lenses, the runner is composed of more than 2 parallel branch channels and a branch channel vertical to the parallel branch channels, and one or more glue filling points are arranged.
Furthermore, the depth of the branch channel is 0.8-1.2mm, and the width of the branch channel is 1.8-2.2 mm.
In some embodiments, the lens directly compression molded by the cured glue has a shape of: m-shaped (double peak overlapping shape), arch shape, semi-circle shape, four peak overlapping shape, donut shape, circular arc shape, microprism, microlens or microwave guide structure.
In some embodiments, the substrate is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, a polyester resin substrate.
In some embodiments, the LED particles or LED chips are uniformly distributed in rows and columns, the LED particles include LED chips and a support, and the LED chips include: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.
Drawings
Fig. 1 is a schematic structural diagram of the low-cost LED light emitting device manufacturing method according to the present application when step S2 is to be laminated.
Fig. 2 is a schematic structural view of a "one" type flow channel of the present application.
Fig. 3 is a schematic structural view of the "Y" shaped flow channel of the present application.
Fig. 4 is a schematic structural diagram of an "X" type flow channel of the present application.
Fig. 5 is a schematic structural view of another flow channel of the present application.
Fig. 6 is a schematic structural diagram of a substrate according to the present application.
Detailed Description
The following examples are described to aid in the understanding of the present application and are not, and should not be construed to, limit the scope of the present application in any way.
In the following description, those skilled in the art will recognize that components may be described throughout this discussion as separate functional units (which may include sub-units), but those skilled in the art will recognize that various components or portions thereof may be divided into separate components or may be integrated together (including being integrated within a single system or component).
Also, connections between components or systems are not intended to be limited to direct connections. Rather, data between these components may be modified, reformatted, or otherwise changed by the intermediate components. Additionally, additional or fewer connections may be used. It should also be noted that the terms "coupled," "connected," or "input" and "fixed" are understood to encompass direct connections, indirect connections, or fixed through one or more intermediaries.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "side", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships commonly recognized in the product of the application, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Example 1:
a method for manufacturing a low-cost LED light emitting device, as shown in fig. 1, 4 and 6, comprising the steps of:
s1, mounting the LED particles or the LED chips on a substrate to obtain the substrate with the LED particles or the LED chips mounted thereon, wherein a flow channel for filling glue into a concave part of the mold for forming the lens is arranged in the substrate; s2, placing and pressing the substrate pasted with the LED particles or the LED chips on a mold, wherein the LED particles or the LED chips are positioned in the concave parts of the mold, and gaps are reserved between the LED particles or the LED chips and the concave parts of the mold; s3, pouring curing glue into the flow channel of the substrate, pouring curing glue into the recessed part of the mold through the flow channel, and after the curing glue is cured, fixing the lens and the LED particles or the LED chip and the substrate which are directly formed by compression molding of the curing glue.
The runner of the base plate can be used for filling glue into the concave parts of the molds. The substrate is provided with a plurality of flow channels, the flow channels are identical in shape and comprise glue filling points and branch channels, one flow channel is provided with one glue filling point, and the other flow channel is provided with a plurality of branch channels. The glue filling point is arranged on the lower panel of the substrate, the branch channel is a groove arranged in the substrate, one end of the branch channel is connected with the glue filling point, and the other end of the branch channel is arranged in a gap between the LED particles or the LED chips and the concave part of the mold. One runner is filled with glue to form 4 lenses, the runner is of an X shape, and one glue filling point is arranged at the central point of the X runner. The depth of the branch channel is 0.8mm, and the width of the branch channel is 1.8 mm. And when the mold is opened, the glue pouring point of the flow passage automatically cuts off glue. The number of the concave portions of one mold is different from the number of the LED particles or the LED chips of the LED light emitting device, and the number of the concave portions of one mold is 1/20 of the number of the LED particles or the LED chips of the LED light emitting device. During production, the substrate above the die can be moved periodically, and one LED light-emitting device is formed by pouring glue for multiple times. The lens directly molded by the curing adhesive in a compression molding mode is M-shaped, the substrate is a PCB substrate, a plurality of LED particles or LED chips are uniformly distributed in a row and column mode, the LED particles comprise LED chips and supports, and the LED chips comprise blue light LED chips, red light LED chips and green light LED chips.
Example 2:
an LED light emitting device, as shown in fig. 5, comprising: the LED die comprises a substrate, LED particles or LED chips and a lens, wherein the LED particles or the LED chips are attached to the substrate, the lens is arranged above the LED particles or the LED chips and is directly molded by curing glue.
The substrate is provided with a plurality of flow channels, and the flow channels are identical in shape. The runner of one base plate can be used for pouring glue into the concave parts of 8 molds. The runner includes encapsulating point and branch way, and a runner has one, and a runner has a plurality of branch ways. The glue filling point is arranged on the lower panel of the substrate, the branch channel is arranged inside the substrate, one end of the branch channel is connected with the glue filling point, and the other end of the branch channel is connected with the lens. A runner is connected with 8 lenses, the runner is composed of 4 parallel branch channels and a branch channel vertical to the parallel branch channels, and one glue filling point is arranged. The depth of the branch channel is 1.0mm, and the width of the branch channel is 2 mm. The lens directly molded by the curing adhesive in a die pressing mode is in a four-peak overlapping shape, the substrate is an FPC (flexible printed circuit) substrate, a plurality of LED particles or LED chips are uniformly distributed in a row and column mode, the LED particles comprise LED chips and supports, and the LED chips are blue light LED chips.
While various aspects and embodiments have been disclosed herein, it will be apparent to those skilled in the art that other aspects and embodiments can be made without departing from the spirit of the disclosure, and that several modifications and improvements can be made without departing from the spirit of the disclosure. The various aspects and embodiments disclosed herein are presented by way of example only and are not intended to limit the present disclosure, which is to be controlled in the spirit and scope of the appended claims.
Claims (10)
1. A preparation method of a low-cost LED light-emitting device is characterized by comprising the following steps:
s1, mounting the LED particles or the LED chips on a substrate to obtain the substrate with the LED particles or the LED chips mounted thereon, wherein a flow channel for filling glue into a concave part of the mold for forming the lens is arranged in the substrate;
s2, placing and pressing the substrate pasted with the LED particles or the LED chips on a mold, wherein the LED particles or the LED chips are positioned in the concave parts of the mold, and gaps are reserved between the LED particles or the LED chips and the concave parts of the mold;
s3, pouring curing glue into the flow channel of the substrate, pouring curing glue into the recessed part of the mold through the flow channel, and after the curing glue is cured, fixing the lens and the LED particles or the LED chip and the substrate which are directly formed by compression molding of the curing glue.
2. The method of claim 1, wherein the runner of the substrate is capable of encapsulating one or more recessed portions of the mold.
3. The method of claim 1, wherein the substrate has one or more flow channels, the flow channels have the same or different shapes, the flow channels include glue filling points and branch channels, one flow channel has one or more glue filling points, and one flow channel has one or more branch channels.
4. The method according to claim 3, wherein the glue filling points are disposed on a lower panel of the substrate, the branch channels are grooves disposed inside the substrate, one end of each branch channel is connected to the glue filling points, and the other end of each branch channel is disposed at a gap between the LED particles or the LED chips and the concave portion of the mold.
5. The method of claim 4, wherein the shape of a runner is related to the number of the concave parts of the mold connected to the runner, one runner is filled with glue to form 2 lenses, the runner is in a 'one' or 'I' shape, and a glue filling point is arranged at the center of the runner; one runner is filled with glue to form 3 lenses, the runner is Y-shaped, and one glue filling point is arranged at the center point of the Y-shaped runner; 4 lenses are formed by pouring glue into one flow channel, the flow channel is in an X shape, and one glue pouring point is arranged at the center point of the X flow channel; the number of the lenses formed by pouring glue into one flow channel is more than 4, the flow channel consists of more than 2 parallel branch channels and a branch channel vertical to the parallel branch channels, and one or more glue pouring points are arranged.
6. The method for manufacturing a low-cost LED light emitting device according to claim 1, wherein the number of the concave portions of one mold is the same as or different from the number of LED particles or LED chips of the LED light emitting device.
7. The method of manufacturing a low-cost LED light emitting device according to claim 1, wherein the number of the concave portions of one mold is different from the number of the LED particles or the LED chips of the LED light emitting device, and the number of the concave portions of one mold is 1/60 to 1/2 of the number of the LED particles or the LED chips of the LED light emitting device.
8. An LED light emitting device comprising: the LED die comprises a substrate, LED particles or LED chips and a lens, wherein the LED particles or the LED chips are attached to the substrate, the lens is arranged above the LED particles or the LED chips and is directly molded by curing glue.
9. The LED light emitting device of claim 8, wherein the substrate has one or more flow channels thereon, the flow channels being identical or different in shape; the flow channel comprises glue pouring points and branch channels, one flow channel is provided with one or more glue pouring points, and the other flow channel is provided with one or more branch channels.
10. The LED light emitting device of claim 9, wherein the glue sites are disposed on a lower panel of the substrate, the branches are disposed inside the substrate, one end of each branch is connected to the glue sites, the other end of each branch is connected to a lens, and the shape of one flow channel is related to the number of lenses connected to the flow channel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110475501.5A CN113193096B (en) | 2021-04-29 | 2021-04-29 | Low-cost LED light-emitting device and preparation method thereof |
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| CN202110475501.5A CN113193096B (en) | 2021-04-29 | 2021-04-29 | Low-cost LED light-emitting device and preparation method thereof |
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| CN113193096A true CN113193096A (en) | 2021-07-30 |
| CN113193096B CN113193096B (en) | 2022-09-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113941474A (en) * | 2021-10-12 | 2022-01-18 | 尹梦梦 | Production process of LED outdoor lighting lamp |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS611067A (en) * | 1984-06-13 | 1986-01-07 | Stanley Electric Co Ltd | Molding method of led chip mounted on printed board |
| JPH0722653A (en) * | 1993-06-30 | 1995-01-24 | Mitsubishi Cable Ind Ltd | Molding method of electronic component mounted on substrate |
| CN101162750A (en) * | 2007-11-26 | 2008-04-16 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| CN202487658U (en) * | 2011-12-08 | 2012-10-10 | 峻泓光电（苏州）有限公司 | Mixed light light-emitting diode |
| CN203553217U (en) * | 2013-11-11 | 2014-04-16 | 成都川联盛科技有限公司 | Simple LED silica gel chip packaging structure |
| CN103943756A (en) * | 2014-04-15 | 2014-07-23 | 深圳市晶台股份有限公司 | LED module COB packaging technology and structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113941474A (en) * | 2021-10-12 | 2022-01-18 | 尹梦梦 | Production process of LED outdoor lighting lamp |
| CN113941474B (en) * | 2021-10-12 | 2023-01-10 | 湖南湘能智城科技有限公司 | Production process of LED outdoor lighting lamp |
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| Publication number | Publication date |
|---|---|
| CN113193096B (en) | 2022-09-16 |
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