CN113183653A - Processing technology of thermosensitive CTP plate - Google Patents
Processing technology of thermosensitive CTP plate Download PDFInfo
- Publication number
- CN113183653A CN113183653A CN202110375499.4A CN202110375499A CN113183653A CN 113183653 A CN113183653 A CN 113183653A CN 202110375499 A CN202110375499 A CN 202110375499A CN 113183653 A CN113183653 A CN 113183653A
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- base plate
- downwards
- photosensitive
- plate
- solution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/036—Chemical or electrical pretreatment characterised by the presence of a polymeric hydrophilic coating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Abstract
A heat-sensitive CTP plate processing technology relates to the technical field of CTP plate processing, wherein a scraped base material is clamped by a clamping device, then the surface impregnated with a hydrophilic compound resin solution faces downwards and is kept in a horizontal state, the base material is descended into a container filled with a photosensitive solution, after standing for 30-60min, the photosensitive solution is moved out of the base plate, and after the base plate is reversely rotated for 180 degrees, the base plate is rapidly and downwards moved repeatedly at a certain acceleration and speed, then the surface impregnated with the photosensitive solution is reversely rotated for 180 degrees and faces downwards, the base plate is descended into the container filled with the photosensitive solution again, and standing is carried out for 20-30 min; repeating the above steps for 2-3 times. The manufacturing of the photosensitive layer is realized by adopting a dipping mode, the smoothness of the photosensitive layer is effectively ensured, and the number of cracks appearing on the photosensitive layer is effectively reduced in the later processing process.
Description
Technical Field
The invention relates to the technical field of CTP plate processing, in particular to a processing technology of a thermosensitive CTP plate.
Background
Wherein the photosensitive system CTP plate comprises a silver salt diffusion type plate, a high-sensitivity resin plate and a silver salt/PS plate composite type plate; the heat-sensitive system CTP plate comprises a heat-crosslinking plate, a heat-ablation plate, a heat-transfer plate and the like.
The photosensitive thermosensitive CTP plate needs to be coated twice in the processing process, and a thicker coating edge is easily formed in the coating process to influence plate making. Some processes adopt a spraying mode to manufacture the photosensitive layer, but because the pore sizes on the surface of the plate are different in depth, the problem of unevenness of the photosensitive layer easily exists by adopting the spraying mode.
Disclosure of Invention
The invention aims to provide a processing technology of a thermosensitive CTP plate, which adopts a dipping mode to realize the manufacture of a photosensitive layer, effectively ensures the smoothness of the photosensitive layer and effectively reduces the number of cracks appearing in the photosensitive layer in the later processing process.
In order to achieve the purpose, the invention adopts the following technical scheme: the processing steps are as follows:
firstly, cleaning the surface of a base plate; electrolyzing the cleaned base plate to form a yarn mesh structure on the surface, and cleaning again;
secondly, carrying out anodic oxidation treatment on the surface of the base plate, then coating a connecting layer on the oxidized base plate, and cleaning again;
step three, performing ink affinity treatment on the cleaned base plate, and cleaning again after hole sealing;
step four, clamping the base plate cleaned in the step three by using a clamping device, then enabling the surface needing to be coated with the light sensitive layer to face downwards, keeping the surface in a horizontal state, descending into a container containing the hydrophilic compound resin solution, standing for 20-30min, moving the base plate out of the hydrophilic compound resin solution, reversing for 180 degrees, repeatedly and rapidly moving downwards at a certain acceleration for multiple times, then reversing the surface of the base plate, which is soaked with the hydrophilic compound resin solution, for 180 degrees downwards, descending into the container containing the hydrophilic compound resin solution again, and standing for 20-30 min; repeating the above steps for 2-3 times;
fifthly, leveling the surface of the base plate by using a scraper after the base plate impregnated with the hydrophilic compound resin solution is aligned;
step six, clamping the scraped base material by using a clamping device, then enabling the surface of the base material impregnated with the hydrophilic compound resin solution to face downwards, keeping the surface in a horizontal state, descending into a container filled with a photosensitive solution, standing for 30-60min, moving the photosensitive solution out of the base plate, reversing for 180 degrees, repeatedly and rapidly moving downwards at a certain acceleration and speed for multiple times, then reversing the surface of the base plate impregnated with the photosensitive solution for 180 degrees downwards, descending into the container filled with the photosensitive solution again, and standing for 20-30 min; repeating the above steps for 2-3 times;
scraping the base plate soaked with the photosensitive solution by using a scraper, and then sending the base plate into a drying oven for drying;
step eight, naturally cooling the dried base plate, then clamping the base plate by using a clamping device again, then enabling one surface of the base plate which preliminarily forms the photosensitive layer to face downwards, keeping the surface of the base plate in a horizontal state, descending the base plate into a container containing photosensitive solution, standing the base plate for 30-60min, moving the photosensitive solution out of the base plate, reversing the base plate for 180 degrees, repeatedly and rapidly moving the base plate downwards at a certain acceleration and speed for multiple times, scraping the base plate by using a scraper, and finally sending the base plate into an oven for drying to finally form the photosensitive layer;
and step nine, spraying air guide particles on the surface of the finally formed photosensitive layer, drying, and shearing and packaging.
Preferably, the acceleration is 45-50m/s2。
Preferably, in the fourth step, the sixth step and the eighth step, the periphery of the substrate is wrapped and sealed by a film before the impregnation.
Preferably, the dipping depth in the fourth step, the sixth step and the eighth step is 1/3-1/2 of the thickness of the base plate.
Preferably, after the oven is preheated to 180 ℃, the drying operation is performed, and the drying temperature is 180 ℃ and 200 ℃.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a processing technology of a thermosensitive CTP plate, which adopts a dipping mode to realize the manufacture of a photosensitive layer, effectively ensures the smoothness of the photosensitive layer and effectively reduces the number of cracks appearing on the photosensitive layer in the later processing process.
Description of the drawings:
FIG. 1 is a table of CTP plate performance test in examples one and two and in the prior art.
The specific implementation mode is as follows:
the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings, and the preferred embodiments in the description are only examples, and all other embodiments obtained by those skilled in the art without any inventive work belong to the protection scope of the present invention.
The specific implementation mode (embodiment one) adopts the following technical scheme: the processing steps are as follows:
firstly, cleaning the surface of a base plate; electrolyzing the cleaned base plate to form a yarn mesh structure on the surface, and cleaning again;
secondly, carrying out anodic oxidation treatment on the surface of the base plate, then coating a connecting layer on the oxidized base plate, and cleaning again;
step three, performing ink affinity treatment on the cleaned base plate, and cleaning again after hole sealing;
step four, wrapping and sealing the periphery of the base plate by using a film, clamping the base plate cleaned in the step three by using a clamping device, then facing the surface to be coated with the light sensitive layer downwards, keeping the surface in a horizontal state, descending the base plate into a container containing a hydrophilic compound resin solution, standing for 20min, moving the base plate out of the hydrophilic compound resin solution, reversing the base plate for 180 degrees, and repeating the steps for multiple times at 45m/s2After the substrate is rapidly moved downwards by the acceleration, the surface of the substrate, which is soaked with the hydrophilic compound resin solution, is inverted by 180 degrees and faces downwards, and then the substrate is lowered into a container containing the hydrophilic compound resin solution again and is kept stand for 20 min; repeating the above steps for 2-3 times; 1/3, the above dipping depth is the thickness of the base plate;
fifthly, tearing off the film on the periphery of the base plate impregnated with the hydrophilic compound resin solution, rightly placing the base plate, and scraping the surface of the base plate by using a scraper;
step six, wrapping and sealing the periphery of the scraped base material by using a film, clamping by using a clamping device, then enabling the surface impregnated with the hydrophilic compound resin solution to face downwards, keeping the surface in a horizontal state, descending into a container filled with the photosensitive solution, standing for 30min, moving the photosensitive solution out of the base plate, reversing the photosensitive solution for 180 degrees, and repeating the steps for multiple times at 45m/s2Acceleration and speed ofAfter moving downwards, reversing the surface of the substrate, which is soaked in the photosensitive solution, by 180 degrees downwards, descending into the container containing the photosensitive solution again, and standing for 20 min; repeating the above steps for 2-3 times; 1/3, the above dipping depth is the thickness of the base plate;
removing the film on the periphery of the base plate soaked with the photosensitive solution, scraping the film by using a scraper, and then sending the film into an oven for drying, wherein the oven is preheated to 180 ℃ and then is subjected to drying operation, and the drying temperature is 200 ℃;
step eight, naturally cooling the dried base plate, wrapping and sealing the periphery of the base plate by using a film, clamping by using a clamping device again, then enabling one surface which preliminarily forms the photosensitive layer to face downwards, keeping the horizontal state, descending into a container which contains photosensitive solution, standing for 30min, moving the photosensitive solution out of the base plate, reversing for 180 degrees, and repeating for multiple times at 45m/s2After the acceleration and the speed of the photosensitive layer move downwards rapidly, the photosensitive layer is scraped by a scraper and finally sent into a drying oven for drying to form a photosensitive layer; 1/3, the above dipping depth is the thickness of the base plate;
and step nine, spraying air guide particles on one surface finally forming the photosensitive layer, tearing off the film, drying, preheating the film in an oven at 180 ℃, then performing drying operation, and shearing and packaging at the drying temperature of 180-200 ℃.
Compared with the prior art, the beneficial effects of the embodiment are as follows: the specific embodiment provides a processing technology of a thermosensitive CTP plate, which adopts a dipping mode to realize the manufacture of a photosensitive layer, effectively ensures the smoothness of the photosensitive layer and effectively reduces the number of cracks appearing on the photosensitive layer in the later processing process.
Example two:
the embodiment adopts the following technical scheme: the processing steps are as follows:
firstly, cleaning the surface of a base plate; electrolyzing the cleaned base plate to form a yarn mesh structure on the surface, and cleaning again;
secondly, carrying out anodic oxidation treatment on the surface of the base plate, then coating a connecting layer on the oxidized base plate, and cleaning again;
step three, performing ink affinity treatment on the cleaned base plate, and cleaning again after hole sealing;
step four, wrapping and sealing the periphery of the base plate by using a film, clamping the base plate cleaned in the step three by using a clamping device, then enabling the surface needing to be coated with the light sensitive layer to face downwards, keeping the surface in a horizontal state, descending into a container containing a hydrophilic compound resin solution, standing for 30min, moving the base plate out of the hydrophilic compound resin solution, reversing for 180 degrees, and repeating for multiple times at 45m/s2After the substrate is rapidly moved downwards by the acceleration, the surface of the substrate, which is soaked with the hydrophilic compound resin solution, is inverted by 180 degrees and faces downwards, and then the substrate is lowered into a container containing the hydrophilic compound resin solution again and is kept still for 30 min; repeating the above steps for 2-3 times; 1/2, the above dipping depth is the thickness of the base plate;
fifthly, tearing off the film on the periphery of the base plate impregnated with the hydrophilic compound resin solution, rightly placing the base plate, and scraping the surface of the base plate by using a scraper;
step six, wrapping and sealing the periphery of the scraped base material by using a film, clamping by using a clamping device, then enabling the surface impregnated with the hydrophilic compound resin solution to face downwards, keeping the surface in a horizontal state, descending into a container filled with the photosensitive solution, standing for 50min, moving the photosensitive solution out of the base plate, reversing for 180 degrees, and repeating for multiple times at 50m/s2After the acceleration and the speed of the base plate move downwards rapidly, the surface of the base plate, which is soaked in the photosensitive solution, is turned 180 degrees downwards, and then the base plate descends into a container containing the photosensitive solution again and stands for 25 min; repeating the above steps for 2-3 times; 1/3, the above dipping depth is the thickness of the base plate;
removing the film on the periphery of the base plate soaked with the photosensitive solution, scraping the film by using a scraper, and then sending the film into an oven for drying, wherein the oven is preheated to 180 ℃ and then is subjected to drying operation, and the drying temperature is 200 ℃;
step eight, after the dried base plate is naturally cooled, the periphery of the base plate is wrapped and sealed by a film, the base plate is clamped by the clamping device again, then the surface which preliminarily forms the photosensitive layer faces downwards, the horizontal state is kept, and the base plate is descended to the containing feelingStanding in container for 50min, transferring the photosensitive solution from the substrate, reversing for 180 deg., repeating for multiple times at 50m/s2After the acceleration and the speed of the photosensitive layer move downwards rapidly, the photosensitive layer is scraped by a scraper and finally sent into a drying oven for drying to form a photosensitive layer; 1/2, the above dipping depth is the thickness of the base plate;
and step nine, spraying air guide particles on one surface finally forming the photosensitive layer, tearing off the film, drying, preheating the film in an oven at 180 ℃, then performing drying operation, and cutting and packaging the film at 190 ℃.
And (3) performance detection:
the surface flatness and the integrity of the CTP plate material of which the photosensitive layer is manufactured by adopting a spraying mode in the first embodiment and the second embodiment and the prior art are detected, the flatness is detected by adopting a plate flatness detection machine, the integrity is detected by adopting a human eye observation method, and after the CTP plate material is bent by a certain radian, whether cracks are generated on the surface of the CTP plate material or not, the number and the size of the cracks are observed; detailed inspection data are shown in fig. 1 in detail, and it can be seen from fig. 1 that the photosensitive layer of the CTP plate manufactured by the processes of the first and second examples is relatively flat, and the integrity of the photosensitive layer is relatively high during the bending process.
It will be appreciated by those skilled in the art that modifications and equivalents may be made to the embodiments described above, and that various modifications, equivalents, improvements and the like may be made without departing from the spirit and scope of the invention.
Claims (5)
1. A processing technology of a thermosensitive CTP plate is characterized by comprising the following steps: the processing steps are as follows:
cleaning the surface of a base plate; electrolyzing the cleaned base plate to form a yarn mesh structure on the surface, and cleaning again;
performing anodic oxidation treatment on the surface of the base plate, then coating a connecting layer on the oxidized base plate, and cleaning again;
step three, performing ink affinity treatment on the cleaned base plate, sealing holes, and cleaning again;
clamping the base plate cleaned in the step (three) by adopting a clamping device, then downwards moving the surface to be coated with the light sensitive layer, keeping the surface in a horizontal state, descending the base plate into a container containing the hydrophilic compound resin solution, standing for 20-30min, then moving the base plate out of the hydrophilic compound resin solution, reversing the base plate for 180 degrees, repeatedly and rapidly moving the base plate downwards at a certain acceleration for multiple times, then reversing the surface of the base plate soaked with the hydrophilic compound resin solution for 180 degrees downwards, descending the base plate into the container containing the hydrophilic compound resin solution again, and standing for 20-30 min; repeating the above steps for 2-3 times;
straightening the base plate impregnated with the hydrophilic compound resin solution, and scraping the surface of the base plate by using a scraper;
clamping the scraped base material by using a clamping device, then enabling the surface of the base plate impregnated with the hydrophilic compound resin solution to face downwards, keeping the surface in a horizontal state, descending into a container filled with a photosensitive solution, standing for 30-60min, moving the photosensitive solution out of the base plate, reversing for 180 degrees, repeatedly and rapidly moving downwards at a certain acceleration and speed for multiple times, then reversing the surface of the base plate impregnated with the photosensitive solution for 180 degrees downwards, descending into the container filled with the photosensitive solution again, and standing for 20-30 min; repeating the above steps for 2-3 times;
scraping the base plate soaked with the photosensitive solution by using a scraper, and then sending the base plate into an oven for drying;
naturally cooling the dried base plate, then clamping the base plate by using a clamping device again, then downwards facing one surface of the preliminarily formed photosensitive layer, keeping the surface in a horizontal state, descending the base plate into a container containing photosensitive solution, standing the base plate for 30-60min, then moving the photosensitive solution out of the base plate, reversing the base plate for 180 degrees, repeatedly and rapidly downwards moving the base plate at a certain acceleration and speed for multiple times, scraping the base plate by using a scraper, and finally sending the base plate into an oven for drying to finally form the photosensitive layer;
and step nine, spraying air guide particles on one surface of the finally formed photosensitive layer, drying, and shearing and packaging.
2. The processing technology of the heat-sensitive CTP plate as claimed in claim 1, wherein: the acceleration is 45-50m/s2。
3. The processing technology of the heat-sensitive CTP plate as claimed in claim 1, wherein: in the step (iv), and the step (iv), the periphery of the substrate is wrapped and sealed with a film before the dipping.
4. The processing technology of the heat-sensitive CTP plate as claimed in claim 1, wherein: the dipping depth in the step (four), the step (six) and the step (eight) is 1/3-1/2 of the thickness of the base plate.
5. The processing technology of the heat-sensitive CTP plate as claimed in claim 1, wherein: and after the oven is preheated to 180 ℃, drying at the temperature of 180 ℃ and 200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110375499.4A CN113183653B (en) | 2021-04-08 | 2021-04-08 | Processing technology of thermosensitive CTP plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110375499.4A CN113183653B (en) | 2021-04-08 | 2021-04-08 | Processing technology of thermosensitive CTP plate |
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| Publication Number | Publication Date |
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| CN113183653A true CN113183653A (en) | 2021-07-30 |
| CN113183653B CN113183653B (en) | 2022-11-01 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800976A (en) * | 2005-12-26 | 2006-07-12 | 高丽生 | Method for manufacturing thermal sensitive CTP plate |
| CN101067722A (en) * | 2007-05-28 | 2007-11-07 | 泰州市瑞丰印刷电子器材有限公司 | Method for producing spraying photo sensitive thermosensitive CTP plate material |
| CN201278079Y (en) * | 2008-10-21 | 2009-07-22 | 泰州市瑞丰印刷电子器材有限公司 | Spraying light sensing heat sensitive CTP plate material |
| CN102991176A (en) * | 2012-12-01 | 2013-03-27 | 刘华礼 | Method for fabricating coated light-sensitive thermosensitive CTP plate |
| CN103832048A (en) * | 2013-12-13 | 2014-06-04 | 华北铝业有限公司 | Ctp plate material and manufacturing method thereof |
-
2021
- 2021-04-08 CN CN202110375499.4A patent/CN113183653B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800976A (en) * | 2005-12-26 | 2006-07-12 | 高丽生 | Method for manufacturing thermal sensitive CTP plate |
| CN101067722A (en) * | 2007-05-28 | 2007-11-07 | 泰州市瑞丰印刷电子器材有限公司 | Method for producing spraying photo sensitive thermosensitive CTP plate material |
| CN201278079Y (en) * | 2008-10-21 | 2009-07-22 | 泰州市瑞丰印刷电子器材有限公司 | Spraying light sensing heat sensitive CTP plate material |
| CN102991176A (en) * | 2012-12-01 | 2013-03-27 | 刘华礼 | Method for fabricating coated light-sensitive thermosensitive CTP plate |
| CN103832048A (en) * | 2013-12-13 | 2014-06-04 | 华北铝业有限公司 | Ctp plate material and manufacturing method thereof |
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| CN113183653B (en) | 2022-11-01 |
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