CN113178456B - Display module, display panel and manufacturing method of display module - Google Patents
Display module, display panel and manufacturing method of display module Download PDFInfo
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- CN113178456B CN113178456B CN202110460344.0A CN202110460344A CN113178456B CN 113178456 B CN113178456 B CN 113178456B CN 202110460344 A CN202110460344 A CN 202110460344A CN 113178456 B CN113178456 B CN 113178456B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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Abstract
The embodiment of the application provides a display module, a display screen and a display module manufacturing method, and relates to the technical field of display. Through set up the coating different with the insulating layer refracting index on at least partial surface of at least partial metal wiring structure, can make the light of one side incident of a layer metal wiring structure change the propagation path at the position that insulating layer and coating are bordered, make the light that originally should shelter from transmit out from display module to improve display module's light transmissivity.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module, a display panel and a manufacturing method of the display module.
Background
The display module may adopt a pixel driving array including a Thin Film Transistor (TFT) to drive the pixels to emit light, and the structure of the pixel driving array is composed of complicated mesh metal wires.
Along with the promotion of functional requirements such as fingerprint identification under the screen and make a video recording under the screen, also higher and higher to the requirement of display module's light transmissivity, because the metal is walked the line lighttightly, the metal is walked the line and is become the biggest obstacle that improves display module's light transmissivity. How to improve the light transmittance of the display module is a technical problem that those skilled in the art are in urgent need to solve.
Disclosure of Invention
In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a display module, a display panel and a method for manufacturing the display module.
In a first aspect of the present application, a display module is provided, where the display module includes stacked multiple metal routing structures and an insulating layer located between two adjacent metal routing structures;
the display module further comprises a coating layer positioned on at least part of the surface of at least part of the metal wiring structure in the multilayer metal wiring structure, wherein the refractive index of the coating layer is different from that of an insulating layer in contact with the coating layer.
In the structure, the coating layer with the different refractive index from the insulating layer is arranged on at least part of the surface of at least part of the metal wiring structure, so that the transmission path of light rays can be changed when the light rays incident from one side of one layer of the metal wiring structure pass through the coating layer and the insulating layer contacted with the coating layer, and the light rays which should be shielded originally are transmitted out of the display module, so that the light transmittance of the display module is improved.
In one possible embodiment of the present application, the display module further includes a substrate layer, and the plurality of layers of metal routing structures are sequentially stacked on the substrate layer;
the coating layer is at least positioned on the surface of one side, close to the substrate layer, of a target layer metal wiring structure in the multilayer metal wiring structure, wherein the refractive index of the coating layer is greater than that of an insulating layer in contact with the coating layer; or the like, or, alternatively,
the coating layer is at least positioned on the inclined side surfaces of two sides of a target layer metal wiring structure in the multilayer metal wiring structure in the extending direction, wherein the refractive index of the coating layer is smaller than that of the insulating layer in contact with the coating layer;
preferably, when the target layer metal wiring structure is an anode film layer, the coating layer is located on the surface of the anode film layer close to one side of the substrate layer.
In one possible embodiment of the present application, the display module further includes a substrate layer, and the plurality of layers of metal routing structures are sequentially stacked on the substrate layer;
when any two layers of metal wiring structures comprise target metal wirings which are overlapped with orthographic projection parts on the substrate layer, the coating layer is positioned on at least part of the surface of the target metal wirings.
In one possible embodiment of the present application, the cladding layer is located on all sides of the target metal trace.
In one possible embodiment of the present application, the target metal traces include a first target metal trace close to the substrate layer and a second target metal trace far from the substrate layer;
the cladding layer comprises a first cladding layer positioned on one side surface of the first target metal wire close to the substrate layer and a second cladding layer positioned on the other side surface of the second target metal wire except the one side surface close to the substrate layer; or the like, or, alternatively,
the cladding layer comprises a first cladding layer positioned on one side surface of the second target metal wire close to the substrate layer and a second cladding layer positioned on the other side surface of the first target metal wire except the one side surface close to the substrate layer.
In one possible embodiment of the present application, an orthogonal projection of a starting position of a slope angle of the cladding layer located at a side of the target metal trace facing the substrate layer on the substrate layer is a first projection, an orthogonal projection of the target metal trace on the substrate layer is a second projection, and the first projection and the second projection do not overlap.
In the embodiment of the application, the difference between the refractive index of the cladding layer and the refractive index of the insulating layer in contact with the cladding layer is more than 0.1;
preferably, when the refractive index of the clad is greater than that of the insulating layer in contact with the clad, the clad includes a silicon nitride layer; when the refractive index of the clad is smaller than that of the insulating layer in contact with the clad, the clad includes a poly-heptafluorobutyl methacrylate layer.
In a second aspect of the present application, a display panel is further provided, where the display panel includes a touch module and the display module of the first aspect;
the touch module is stacked on the display module.
In the embodiment of the present application, the touch module includes a touch routing structure;
the touch module further comprises a coating layer located on at least part of the surface of at least part of the touch routing structures, wherein the refractive index of the coating layer is different from that of a film layer in contact with the coating layer.
In a third aspect of the present application, a manufacturing method of a display module is further provided, for manufacturing the display module of the first aspect, the manufacturing method includes at least one of the following manufacturing steps:
manufacturing a channel on the insulating layer;
manufacturing a cladding material layer with a refractive index different from that of the insulating layer on the insulating layer, and removing the cladding material layer outside the region where the channel is located;
and manufacturing a metal wiring structure on one side of the cladding material layer at the position of the channel, which is far away from the insulating layer.
Compared with the prior art, the display module, the display panel and the display module manufacturing method provided by the embodiment of the application can enable the light incident from one side of one layer of metal wiring structure to be changed in the position where the insulating layer is intersected with the coating layer by arranging the coating layer with the refractive index different from that of the insulating layer on at least part of the surface of at least part of the metal wiring structure, so that the light which should be shielded originally is transmitted out of the display module, and the light transmittance of the display module is improved.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic view of a film structure of a display module according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram illustrating a specific film structure of the array substrate and the light emitting device layer in fig. 1;
fig. 3 is a schematic film layer diagram of a two-layer metal routing structure according to an embodiment of the present disclosure;
FIG. 4 is a diagram of a light path of a light propagating in a layer of metal routing structure in the prior art;
FIG. 5 is a diagram illustrating an optical path of light propagating on a metal trace structure according to an embodiment of the present invention;
FIG. 6 is a second optical path diagram of light propagating on a metal routing structure according to an embodiment of the present invention;
FIG. 7 is a diagram of light paths of light propagating in a partially overlapped two-layer metal trace structure according to the prior art;
FIG. 8 is a diagram of light paths of light propagating in a partially overlapped two-layer metal trace structure according to an embodiment of the present application;
fig. 9 is a schematic view illustrating a film structure and light propagation of two layers of target metal traces according to a first embodiment of the present application;
fig. 10 is a schematic view illustrating a film structure and light propagation of two target metal traces according to a second embodiment of the present application;
fig. 11 is a schematic view illustrating a film structure and light propagation of a two-layer target metal trace according to a third embodiment of the present application;
fig. 12 is a schematic view illustrating a film structure of two layers of target metal traces and light propagation according to a fourth embodiment of the present application;
fig. 13 is a schematic view of a film structure of a two-layer target metal trace according to another embodiment of the present application;
fig. 14 is a diagram illustrating a specific positional relationship between a target metal trace and a cladding layer according to an embodiment of the present application;
fig. 15 is a schematic diagram of a film structure of a display screen according to an embodiment of the present disclosure;
fig. 16 is a partial flowchart of a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 17 is a process diagram corresponding to the step shown in fig. 16.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the product of the application is usually placed in when used, and are used only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, should not be construed as limiting the present application.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
In order to solve the technical problems mentioned in the background art, solutions such as metal traces or transparent traces with narrower widths are generally adopted in the industry, but the solutions have higher process requirements and can also affect the performance of the device. In addition, with the increase of pixel density (pixel Per inc, PPI), the metal wires are bound to be more dense, which further reduces the light transmittance of the display module.
In order to solve the above technical problem, in the embodiment of the present application, the coating layer having a refractive index different from that of the insulating layer is disposed on at least part of the surface of at least part of the metal wiring structure, so that the light incident from one side of the metal wiring structure changes the propagation path at the boundary position between the insulating layer and the coating layer, and the light which is originally shielded can be transmitted out from the display module, thereby improving the light transmittance of the display module.
Specific implementations of the present application will be described in detail below with reference to the accompanying drawings.
In order to better describe the technical solution provided in the embodiments of the present application, a film structure of the display module 10 is introduced first. The structure of the display module 10 will now be described with reference to fig. 1 and 2.
The display module 10 may include an array substrate 101 and a light emitting device layer 102, wherein the array substrate 101 may include a substrate layer 1011, a buffer layer 1012 and a pixel driving layer.
The substrate layer 1011 may be a glass substrate, the buffer layer 1012 on one side of the substrate layer 1011, and the pixel driving layer on a side of the buffer layer 1012 away from the substrate layer 1011. In the present embodiment, the buffer layer 1012 may be made of an inorganic material, such as silicon oxide, silicon nitride, silicon oxynitride, or the like. In this embodiment, the buffer layer 1012 may have a double-layer structure of a silicon nitride (SiNx) layer and a silicon oxide (SiOx) layer sequentially formed on the substrate layer 1011.
The pixel driving layer may include an active layer 10131, a gate insulating layer 10132, a gate 10133, a source 10134, a drain 10135, a first insulating layer 10136, a second insulating layer 10137, and a first electrode 10138 and a second electrode 10139 for forming a capacitor.
The active layer 10131 is formed on the buffer layer 1012, the active layer 10131 may be formed of an inorganic semiconductor (e.g., amorphous silicon or polycrystalline silicon), an organic semiconductor, or an oxide semiconductor, and the active layer 10131 may include a source region (S), a drain region (D), and a channel region (p-si).
A gate insulating layer 10132 is formed on the active layer 10131 and the buffer layer 1012 not covered by the active layer 10131 so as to insulate and isolate the active layer 10131 from the gate 10133. The gate insulating layer 10132 may be made of, but not limited to, silicon oxide or silicon nitride.
The gate 10133 is formed on a side of the gate insulating layer 10132 opposite to the substrate layer 1011 corresponding to the active layer 10131, and the gate 10133 may be formed using one or more of Al, Mo, Cu, Ti, or other low resistivity metal materials. Meanwhile, a first electrode 10138 for capacitance is formed over the gate insulating layer 10132. The first electrode 10138 is formed on the gate insulating layer 10132, the first electrode 10138 and the gate 10133 may be made of the same material, and the first metal layer M1 may be formed on the gate insulating layer 10132, so as to form the gate 10133 and the first electrode 10138 on the gate insulating layer 10132 at the same time.
The first insulating layer 10136 is formed on the gate insulating layer 10132 and covers the gate 10133 and the first electrode 10138, and the second electrode 10139 is located on a side of the first insulating layer 10136 corresponding to the first electrode 10138 away from the substrate layer 1011. The first insulating layer 10136 is used to insulate and isolate the first electrode 10138 from the first electrode 10138, so that the first electrode 10138 and the second electrode 10139 form a capacitor. The first insulating layer 10136 may also be made of inorganic materials such as: silicon nitride and silicon oxide. The second electrode 10139 is located in the second metal layer M2 formed over the first insulating layer 10136.
A second insulating layer 10137 is formed on the first insulating layer 10136 and covers the second electrode 10139 to isolate the source 10134, the drain 10135 and the second electrode 10139 from each other, so that the source 10134, the drain 10135 and the second electrode 10139 are insulated from each other. The second insulating layer 10137 may also be formed of inorganic materials such as silicon nitride and silicon oxide. The second insulating layer 10137 may have a double-layer structure or a triple-layer structure of silicon nitride and silicon oxide.
A source electrode 10134 and a drain electrode 10135 are formed on the second insulating layer 10137, the source electrode 10134 being electrically connected to the source region (S) in the active layer 10131 through a via hole, and the drain electrode 10135 being electrically connected to the drain region (D) in the active layer 10131 through a via hole. The electrode material of the gate 10133, the source 10134, the drain 10135, the first electrode 10138 and the second electrode 10139 may be one or more of Al, Mo, Cu, Ti or other low resistivity metal materials. The source 10134 and the drain 10135 are in the third metal layer M3 formed on the second insulating layer 10137.
A planarization layer 1014 and a light-emitting device layer 102 may be further provided on the side of the pixel driving layer away from the substrate layer 1011. The driver element includes a TFT (Thin Film Transistor) formed of the gate 10133, the source 10134, the drain 10135, the active layer 10131, and the like.
The light emitting device layer 102 may include an anode film layer 1021, a pixel defining layer 1022, a light emitting layer 1023, and a cathode film layer 1024. The anode film layer 1021 is located on the array substrate 101, the pixel defining layer 1022 forms a pixel opening 1025 on the anode film layer 1021, the light-emitting layer 1023 is located on a side of the pixel opening 1025 away from the array substrate 101, and the cathode film layer (not shown) is located on a side of the light-emitting layer 1023 away from the array substrate 101.
Specifically, the anode film layer 1021 is located on the side of the planarization layer 1014 away from the substrate layer 1011, and the anode film layer 1021 is electrically connected to the drain 10135 of the driving element through the planarization layer via. The pixel defining layer 1022 is located on the planarization layer 1014 and the anode film layer 1021 on the side away from the substrate layer 1011.
In this embodiment, the planarization layer 1014 may include a first planarization layer 10141 and a second planarization layer 10142, a fourth metal layer M4 may be further disposed between the first planarization layer 10141 and the second planarization layer, and the fourth metal layer M4 may connect the drain 10135 and the anode film 1021 of the driving element through a film via of the planarization layer 1014. For example, in fig. 2, the anode film 1021 may be connected to the fourth metal layer M4 through the film via of the second planarization layer 10142, and the fourth metal layer M4 is connected to the drain 10135 of the driving device at the third metal layer M3 through the film via of the first planarization layer 10141.
Referring to fig. 3, in the embodiment of the present invention, the display module 10 may include a plurality of metal routing structures 11 and an insulating layer 12 located between two adjacent metal routing structures 11. Referring to fig. 2, the multi-layer metal trace structure 11 may include a metal trace structure located in the first metal layer M1, a metal trace structure located in the second metal layer M2, a metal trace structure located in the third metal layer M3, and a metal trace structure located in the fourth metal layer M4 or an anode film layer 1021. The insulating layer 12 may include a first insulating layer 10136, a second insulating layer 10137, a first planarization layer 10141, and a second planarization layer 10142.
The display module 10 may further include a cladding layer 13 disposed on at least a portion of a surface of at least a portion of the metal trace structures of the multi-layer metal trace structure 11, wherein a refractive index of the cladding layer 13 is different from a refractive index of the insulating layer 12 in contact with the cladding layer.
The metal trace structure 11 includes end surfaces (not shown) at two ends of the metal trace structure in an extending direction, a bottom surface 1101, a top surface 1102, and two inclined side surfaces 1103 and 1104, wherein the inclined side surfaces 1103 and 1104 are formed by controlling different etching times when the metal trace structure 11 is fabricated.
The display module 10 provided above can change the propagation path of the light incident from one side of the metal routing structure 11 at the boundary 13 between the insulating layer 12 and the covering layer, so that the light that should be blocked originally is transmitted from the display module 10, thereby improving the light transmittance of the display module 10.
In the embodiment of the present application, the covering layer 13 may be disposed on one layer of the multi-layer metal routing structure 11 or on multiple layers (e.g., two layers) of the multi-layer metal routing structure 11. The following description will take an example in which the covering layer 13 is disposed in one layer of the metal routing structure 11.
Referring to fig. 4, fig. 4 is a diagram illustrating a light path of light propagating in a metal routing structure in the prior art. When light enters the display module 10 from one side of the display module 10 (the side of the substrate layer 1011 or the side of the light emitting device layer 102), the light is blocked by the side surface of the metal routing structure 11 close to the substrate layer 1011 or the side of the light emitting device layer 102, so that the light transmittance of the display module 10 is reduced.
In order to solve the above technical problem, referring to fig. 5 and fig. 6, an embodiment of the present invention provides a display module 10 having a cladding layer 13 disposed on a metal routing structure, so that light originally shielded by the metal routing structure 11 can bypass the metal routing structure 11 and exit from one side of the metal routing structure.
In one possible embodiment, as shown in fig. 5, the cladding layer 13 may be located at least on a surface (bottom surface 1101 in the figure) of a target layer metal trace structure in the multi-layer metal trace structure 11 close to the substrate layer 1011, and in this embodiment, the refractive index of the cladding layer 13 is greater than that of the insulating layer 12 in contact with the cladding layer 13. When light enters the display module 10 from the substrate layer 1011 side, after entering the coating layer 13, the light can be emitted from the side of the target layer metal wiring structure toward the side of the light emitting device layer 102 after being refracted, or emitted from the side of the target layer metal wiring structure toward the side of the light emitting device layer 102 after being totally reflected at the interface of the coating layer 13 and the insulating layer 12, so that the light originally shielded by the target layer metal wiring structure can be emitted from the side of the target layer metal wiring structure after the light path is changed by the coating layer 13 and the insulating layer 12.
In another possible embodiment, as shown in fig. 6, the cladding layer 13 may be located at least on the oblique sides ( oblique sides 1103 and 1104 in the figure) of a target layer metal trace structure in the multi-layer metal trace structure at both sides of the extending direction, and in one embodiment, the refractive index of the cladding layer 13 is smaller than that of the insulating layer 12 in contact with the cladding layer 13. When light enters the cladding layer 13 from the light-emitting device layer 102 side, since the refractive index of the insulating layer 12 is larger than that of the cladding layer 13, the incident light is totally reflected when entering the interface between the insulating layer 12 and the cladding layer 13, and the light is emitted from the substrate layer 1011 of the display module 10.
In the embodiment of the present application, when the target layer metal trace structure is the anode film layer 1021, the cladding layer 13 is located on a surface (i.e. the bottom surface 1101) of the anode film layer 1021 near the substrate layer 1011.
After completing the exemplary description of the placement of coverlay 13 in one layer of metal trace structure 11, the following description will describe the placement of coverlay 13 in two layers of metal trace structure 11.
Referring to fig. 7 and 8, fig. 7 is a light path diagram illustrating light propagating in a partially overlapped two-layer metal trace structure in the prior art, and fig. 8 is a light path diagram illustrating light propagating in a partially overlapped two-layer metal trace structure in an embodiment of the present application. As can be seen from fig. 7, when light enters the display module 10 from one side (the substrate layer 1011 side or the light emitting device layer 102 side) of the display module 10, the light entering from an oblique side close to one layer of metal wiring structure 11 is blocked by the other layer of metal wiring structure 11, which results in an extremely low light transmittance of the display module 10. As can be seen from fig. 8, although there is some overlap between the different layers of metal routing structures 11, when light enters from one side (the substrate layer 1011 side or the light emitting device layer 102 side) of the display module 10, taking the case that light enters from the light emitting device layer 102 side as an example, the light is refracted when entering the cladding layer 13 from the insulating layer 12, the refracted light is reflected on the metal routing structure 11, and the reflected light may exit directly from the substrate layer 1011 side of the display module 10 without passing through another layer of metal routing structure 11, or exit from the substrate layer 1011 side of the display module 10 after multiple reflections of two layers of metal routing structures 11. When light enters from the substrate layer 1011 side, the same principle as above can be applied to transmit light, which is originally blocked by the other layers of metal wiring structures 11, out of the display module 10, so as to improve the light transmittance of the display module 10.
In the embodiment of the present application, when there is a target metal trace in any two layers of metal trace structures 11, which overlaps with the orthographic projection of the substrate layer 1011, the covering layer 13 may be located on at least a part of the surface of the target metal trace.
The following description will take an example that the target metal trace includes a first target metal trace and a second target metal trace respectively located in the third metal layer M3 and the fourth metal layer M4, and the oblique side 1103 of the first target metal trace extends out relative to the second target metal trace, and the oblique side 1104 of the second target metal trace extends out relative to the first target metal trace.
Referring to fig. 9, in the first implementation manner of the embodiment of the present application, the cladding layer 13 may be located on all side surfaces of the target metal trace except for the end surfaces, that is, the cladding layer 13 is located on the bottom surface 1101, the top surface 1102 and the inclined side surfaces 1103 and 1104 shown in fig. 3, and the refractive index of the cladding layer 13 is greater than the refractive indices of the first planarization layer 10141 and the second screen bulk layer 10142.
Taking a vertical incidence as an example, when the incident light is incident from the light emitting device layer 102 side, the light that is originally incident to the oblique side 1104 near the second target metal trace 111b will be blocked by the first target metal trace 111a, but because the oblique side 1104 of the second target metal trace 111b is coated with the coating layer 13, the incident light is refracted when entering the coating layer 13 from the second planarization layer 10142, because the refractive index of the coating layer 13 is greater than that of the second planarization layer 10142, the refraction angle of the incident light refracted at the interface between the second planarization layer 10142 and the coating layer 13 will be greater than the incident angle, and the refracted light can exit from the substrate layer 1011 side without passing through the first target metal trace 111 a. Similarly, for example, when the incident light is incident from the substrate layer 1011 side, the light that is originally incident on the inclined side surface 1103 of the first target metal trace is shielded by the second target metal trace 111b, but since the inclined side surface 1103 of the first target metal trace 111a is coated with the coating layer 13, the incident light is refracted when entering the first planarization layer 10141 from the coating layer 13, and since the refractive index of the coating layer 13 is greater than that of the first planarization layer 10141, the refraction angle at which the incident light is refracted at the interface between the coating layer 13 and the first planarization layer 10141 is smaller than the incident angle, and the refracted light can directly exit from the light emitting device layer 102 side without passing through the second target metal trace 111 b.
As can be seen from the above analysis, in the first embodiment of the present application, the light transmittance of the display module 10 to the incident light on two sides can be enhanced by the cladding layer 13 on the oblique side 1103 of the first target metal trace and the cladding layer 13 on the oblique side 1104 of the second target metal trace.
Referring to fig. 10, in the second implementation manner of the embodiment of the present application, the cladding layer 13 may be located on all sides of the target metal trace 111, that is, the cladding layer 13 may be located on the bottom surface 1101, the top surface 1102 and the inclined side surfaces 1103 and 1104 shown in fig. 3, and a refractive index of the cladding layer 13 is smaller than refractive indices of the first planarization layer 10141 and the second planarization layer 10142.
Taking a vertical incidence as an example, when the incident light is incident from the light emitting device layer 102 side, the light that is originally incident to the oblique side 1104 near the second target metal trace 111b will be shielded by the first target metal trace 111a, but since the oblique side 1104 of the second target metal trace 111b is coated with the coating layer 13, the incident light is refracted when entering the coating layer 13 from the second planarizing layer 10142, since the refractive index of the coating layer 13 is smaller than that of the second planarizing layer 10142, the refraction angle of the incident light at the interface between the second planarizing layer 10142 and the coating layer 13 will be smaller than the incident angle, and the refracted light is incident to the oblique side 1104 of the second target metal trace 111b, and then exits from the substrate layer 1011 side after being reflected by the oblique side 1104. Similarly, for example, when incident light is incident from the substrate layer 1011 side, light that is originally incident to the oblique side 1103 close to the first target metal trace 111a is shielded by the second metal trace structure 111b, but since the oblique side 1103 of the first target metal trace 111a is covered by the covering layer 13, the incident light is refracted when entering the first planarization layer 10141 from the covering layer 13, since the refractive index of the covering layer 13 is smaller than that of the first planarization layer 10141, the refraction angle at which the incident light is refracted at the interface between the covering layer 13 and the first planarization layer 10141 is larger than the incident angle, and the refracted light can be emitted from the light emitting device layer 102 side after being reflected multiple times on the bottom 1101 of the second target metal trace 111b and the top 1102 of the first target metal trace 111 a.
From the above analysis, it can be seen that the light transmittance of the display module 10 to the incident light on both sides can be enhanced by the coating layer 13 on the inclined side surface 1103 and the top surface 1102 of the first target metal trace 111a, and the coating layer 13 on the inclined side surface 1104 and the bottom surface 1101 of the second target metal trace 111 b.
Referring to fig. 11, in a third implementation manner of the embodiment of the present application, the cladding layer 13 may include a first cladding layer 131 located on a surface of the first target metal trace 111a close to the substrate layer, and a second cladding layer 132 located on a surface of the second target metal trace 111b except a surface close to the substrate layer 1011. That is, in this embodiment, the first cladding layer 131 is located on the bottom surface 1101 of the first target metal trace 111a, the second cladding layer 132 is located on the top surface 1102 and the two side surfaces 1103 and 1104 of the second target metal trace 111b, and the refractive indexes of the first cladding layer 131 and the second cladding layer 132 are different from the refractive indexes of the first planarization layer 10141 and the second planarization layer 10142.
Taking the vertical incidence as an example, when the incident light is incident from the light emitting device layer 102 side, the light that is originally incident to the oblique side 1104 near the second target metal trace 111b will be blocked by the first target metal trace 111a, but because the oblique side 1104 of the second target metal trace 111b is coated with the second cladding layer 132, the incident light is refracted when entering the second cladding layer 132 from the second planarization layer 10142, and because the refractive index of the second cladding layer 132 is different from that of the second planarization layer 10142, the incident light is refracted at the interface between the second planarization layer 10142 and the second cladding layer 132, and the light path is changed. When the refractive index of the second planarizing layer 10142 is smaller than the refractive index of the second cladding layer 132, refracted light can directly exit from the substrate layer 1011 side; when the refractive index of the second planarizing layer 10142 is greater than the refractive index of the second cladding layer 132, the refracted light enters the oblique side 1104 of the second target metal trace 111b, and is reflected by the oblique side 1104 and exits from the substrate layer 1011. When the incident light is vertically incident from the substrate layer 1011 side, the light incident on the inclined side 1103 close to the first target metal wire 111a is blocked by the second target metal wire 111b, and the light cannot exit from the light emitting device layer 102 side.
As can be seen from the above analysis, the first cladding layer 131 on the bottom 1101 of the first target metal trace 111a and the second cladding layer 132 on the top 1102 and two sides 1103 and 1104 of the second target metal trace 111b can be disposed to enhance the light transmittance of the display module 10 to the incident light on the side of the light emitting device layer 102.
Referring to fig. 12, in a fourth implementation manner of the present embodiment, the cladding layer 13 can include a first cladding layer 131 on the surface of the first target metal wire 111a except the surface near one side of the substrate layer 1011, and a second cladding layer 132 on the surface of the second target metal wire 111b near one side of the substrate layer 1011. That is, in this embodiment, the first cladding layer 131 is located on the top surface 1102 and the two side surfaces 1103 and 1104 of the first target metal trace 111a, the second cladding layer 132 is located on the bottom surface 1101 of the second target metal trace 111b, and the refractive indexes of the first cladding layer 131 and the second cladding layer 132 are different from the refractive indexes of the first planarization layer 10141 and the second planarization layer 10142.
Taking normal incidence as an example, when incident light enters from the light-emitting device layer 102 side, light entering the oblique side 1104 near the second target metal trace 111b will be blocked by the first target metal trace 111a, and the light cannot exit from the substrate layer 1011 side. When incident light vertically enters from the substrate layer 1011 side, light that originally enters the oblique side 1103 close to the first target metal wire 111a will be shielded by the second metal wire structure 111b, but since the oblique side 1103 of the first target metal wire 111a is coated with the first coating layer 131, the incident light refracts when entering the first planarization layer 10141 from the first coating layer 131, and since the refractive index of the first coating layer 131 is different from that of the first planarization layer 10141, the incident light refracts at the interface between the first coating layer 131 and the first planarization layer 10141, and the light path changes. Specifically, when the refractive index of the first cladding layer 131 is smaller than the refractive index of the first planarization layer 10141, the refracted light may exit from the light emitting device layer 102 side after being reflected multiple times on the bottom surface 1101 of the second target metal trace and the top surface 1102 of the first target metal trace. When the refractive index of the first cladding layer 131 is greater than that of the first planarization layer 10141, the refracted light may directly exit from one side of the substrate layer 1011.
As can be seen from the above analysis, the first cladding layer 131 on the top surface 1102 and the two side surfaces 1103 and 1104 of the first target metal trace 111a and the second cladding layer 132 on the bottom surface 1101 of the second target metal trace 111b can be disposed to enhance the light transmittance of the display module 10 to the incident light on the substrate layer 1011 side.
It should be understood that the above embodiments are only examples for illustrating the technical solutions provided in the embodiments of the present application, and other embodiments provided in the embodiments of the present application may further include other types of cladding structures, for example, as shown in fig. 13, the cladding 13 may also be only located on the oblique sides 1103 and 1104 on both sides of the target metal trace 111. The refractive index of the cladding layer 13 may also be different, and specifically, the refractive index of the cladding layer 13 may be adjusted according to the relative position relationship between the first target metal trace 111a and the second target metal trace 111 b. For example, when the inclined side 1103 of the first target metal trace 111a protrudes relative to the second target metal trace 111b and the inclined side 1104 of the second target metal trace 111b protrudes relative to the first target metal trace 111a, the refractive index of the cladding layer 13 on the second target metal trace 111b may be greater than the refractive index of the second planarization layer 10142, and the refractive index of the cladding layer 13 on the first target metal trace 111a may be less than the refractive index of the first planarization layer 10141.
Referring to fig. 14, fig. 14 shows a specific positional relationship diagram of a target metal wire 111 and a cladding layer 13, an orthogonal projection of an initial position of a slope angle (Taper angle in the drawing) of the cladding layer 13 on a side of the target metal wire 111 facing a substrate layer 1011 on the substrate layer 1011 is a first projection, an orthogonal projection of the target metal wire 111 on the substrate layer 1011 is a second projection, and the first projection and the second projection do not overlap. So set up, can make cladding layer 13 have the thickness of broad, compare in the narrower cladding layer 13 of thickness, the thickness of cladding layer 13 sets up the path change (the path skew is bigger) that can more do benefit to incident ray more, is convenient for reach the purpose that increases display module assembly 10 light transmissivity.
The larger the difference between the refractive index of the clad 13 and the refractive index of the insulating layer 12 is, the larger the change to the incident optical path is, and in the embodiment of the present application, the difference between the refractive index of the clad 13 and the refractive index of the insulating layer 12 in contact with the clad 13 is larger than 0.1. When the insulating layer 12 is the planarization layer 1014 (refractive index of about 1.6), the cladding layer 13 may be a poly-heptafluorobutyl methacrylate layer (refractive index of about 1.38) having a smaller refractive index than the planarization layer 1014, or the cladding layer 13 may be a silicon nitride layer (refractive index of about 1.8) having a larger refractive index than the planarization layer 1014.
Referring to fig. 15, an embodiment of the present invention further provides a display screen 1, where the display screen 1 may include the display module 10 and the touch module 20 stacked on the display module 10.
In this embodiment, the touch module 20 includes a touch trace structure and a coating layer located on at least a portion of a surface of at least a portion of the touch trace structure, wherein a refractive index of the coating layer is different from a refractive index of a film layer in contact with the coating layer.
Based on the same reason with display module assembly 10 increases the light transmissivity, including touch module assembly 20 and display module assembly 10's display screen 1 can increase the light transmissivity, be convenient for promote the effect of functions such as fingerprint discernment under the screen, make a video recording under the screen.
An embodiment of the present application further provides a manufacturing method for manufacturing the display module, where the manufacturing method includes at least one of the following manufacturing steps, please refer to fig. 16 and 17, fig. 16 shows a partial flowchart of the manufacturing method of the display module, and fig. 17 is a process diagram corresponding to the step of fig. 16. The process of fabricating the metal trace structure will now be described in detail with reference to fig. 16 and 17.
In step S101, a trench 14 is formed on the first insulating layer 1201.
Specifically, a trench 14 having the same routing path as the metal routing structure can be formed on the first insulating layer 1201 by a mask exposure etching method.
In step S102, a first cladding material layer 1301 having a refractive index different from that of the first insulating layer 1201 is formed on the first insulating layer 1201, and the first cladding material layer 1301 except for a region where the channel is located is removed.
Specifically, when the first cladding material layer 1301 is an inorganic layer, the first cladding material layer 1301 can be manufactured by chemical vapor deposition; when the first cladding material layer 1301 is an organic layer, the first cladding material layer 1301 can be manufactured by ink-jet printing, glue coating, evaporation and other processes. The first cladding material layer 1301 is processed to remove the first cladding material layer 1301 except the region where the channel is located.
In step S103, a metal trace structure 11 is formed on a side of the first cladding material layer 1301 located at the channel position, away from the first insulating layer 1201.
Specifically, a metal layer may be fabricated first, and then the metal layer is etched through a mask to obtain the metal routing structure 11.
The display module obtained by repeating the manufacturing method can change the transmission path of light in the display module through the coating material layer with the different refractive index from the insulating layer, so that part of light which is originally shielded by the metal wiring structure is transmitted out of the display module, and the light transmittance of the display module is improved.
Referring to fig. 16 and 17 again, in the embodiment of the present application, after the step S103, the method for manufacturing a display module provided by the present application may further include steps S104 and S105.
In step S104, a second cladding material layer 1302 is formed on a side of the metal trace structure 11 away from the first insulating layer 1201, and the second cladding material layer 1302 is removed outside the region where the channel is located.
In step S105, a second insulating layer 1202 having a refractive index different from that of the second cladding material layer 1302 is formed on the first insulating layer 1201 and the second cladding material layer 1302.
In the embodiment of the present application, the first cladding material layer 1301 and the second cladding material layer 1302 may be the same material or different materials.
According to the display module, the display panel and the display module manufacturing method, the coating layers with different refractive indexes are arranged on at least part of the surfaces of at least part of the metal wiring structures, so that the transmission path of light incident from one side of one layer of the metal wiring structures at the junction of the insulating layer and the coating layers can be changed, the light which should be shielded originally is transmitted out of the display module, and the light transmittance of the display module is improved.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (12)
1. A display module is characterized by comprising a plurality of stacked metal wiring structures and an insulating layer positioned between two adjacent layers of metal wiring structures;
the display module further comprises a coating layer positioned on at least part of the surface of at least part of the metal wiring structure in the multilayer metal wiring structure, wherein the refractive index of the coating layer is different from that of an insulating layer in contact with the coating layer.
2. The display module of claim 1, wherein the display module further comprises a substrate layer, and the plurality of layers of metal wiring structures are sequentially stacked on the substrate layer;
the coating layer is at least positioned on the surface of one side, close to the substrate layer, of a target layer metal wiring structure in the multilayer metal wiring structure, wherein the refractive index of the coating layer is greater than that of an insulating layer in contact with the coating layer; or the like, or, alternatively,
the coating layer is at least positioned on the inclined side surfaces of two sides of a target layer metal wiring structure in the multilayer metal wiring structure in the extending direction, wherein the refractive index of the coating layer is smaller than that of the insulating layer in contact with the coating layer.
3. The display module as claimed in claim 2, wherein when the target layer metal trace structure is an anode film layer, the covering layer is disposed on a surface of the anode film layer close to one side of the substrate layer.
4. The display module of claim 1, wherein the display module further comprises a substrate layer, and the plurality of layers of metal wiring structures are sequentially stacked on the substrate layer;
when any two layers of metal wiring structures comprise target metal wirings which are overlapped with orthographic projection parts on the substrate layer, the coating layer is positioned on at least part of the surface of the target metal wirings.
5. The display module of claim 4, wherein the cladding layer is located on all sides of the target metal traces.
6. The display module of claim 4, wherein the target metal traces include a first target metal trace that is close to the substrate layer and a second target metal trace that is far from the substrate layer;
the cladding layers comprise a first cladding layer positioned on one side surface of the substrate layer, which is close to the first target metal wire, and a second cladding layer positioned on the other side surface of the second target metal wire except for one side surface of the substrate layer; or the like, or, alternatively,
the cladding layer comprises a first cladding layer positioned on one side surface of the substrate layer, which is close to the second target metal wire, and a second cladding layer positioned on the other side surface of the first target metal wire except one side surface of the substrate layer.
7. The display module of claim 4,
the orthographic projection of the initial position of the gradient angle of the coating layer, which is positioned at one side of the target metal wire facing the substrate layer, on the substrate layer is a first projection, the orthographic projection of the target metal wire on the substrate layer is a second projection, and the first projection and the second projection are not overlapped.
8. The display module of any of claims 1-7, wherein the difference between the index of refraction of the cladding layer and the index of refraction of the insulating layer in contact with the cladding layer is greater than 0.1.
9. The display module of claim 8, wherein the cladding layer comprises a silicon nitride layer when the index of refraction of the cladding layer is greater than the index of refraction of an insulating layer in contact with the cladding layer; when the refractive index of the clad is smaller than that of the insulating layer in contact with the clad, the clad includes a poly-heptafluorobutyl methacrylate layer.
10. A display panel, comprising a touch module and the display module of any one of claims 1-9;
the touch module is stacked on the display module.
11. The display panel of claim 10, wherein the touch module comprises a touch trace structure;
the touch module comprises a coating layer positioned on at least part of the surface of at least part of the touch routing structures, wherein the refractive index of the coating layer is different from that of a film layer in contact with the coating layer.
12. The manufacturing method of the display module is characterized by comprising at least one manufacturing step, wherein the manufacturing step comprises the following steps:
manufacturing a channel on the insulating layer;
manufacturing a cladding material layer with a refractive index different from that of the insulating layer on the insulating layer, and removing the cladding material layer outside the region where the channel is located;
and manufacturing a metal routing structure on one side, far away from the insulating layer, of the cladding material layer at the position of the channel.
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| CN112416178A (en) * | 2020-12-02 | 2021-02-26 | 云谷（固安）科技有限公司 | Touch module and touch display screen |
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| CN110047880A (en) * | 2019-03-28 | 2019-07-23 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN112416178A (en) * | 2020-12-02 | 2021-02-26 | 云谷（固安）科技有限公司 | Touch module and touch display screen |
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