CN113141727A - Circuit board with embedded electronic element and manufacturing method thereof - Google Patents
Circuit board with embedded electronic element and manufacturing method thereof Download PDFInfo
- Publication number
- CN113141727A CN113141727A CN202010055005.XA CN202010055005A CN113141727A CN 113141727 A CN113141727 A CN 113141727A CN 202010055005 A CN202010055005 A CN 202010055005A CN 113141727 A CN113141727 A CN 113141727A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- substrate
- circuit board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
A method of manufacturing a circuit board having a buried electronic component, comprising: a first circuit substrate including a first substrate layer and a first circuit layer is provided. An electronic component is mounted on the first circuit layer. A second circuit substrate is provided, which comprises a second substrate layer, a second circuit layer and a first conductive column formed on the second circuit layer. And forming a first conductive column electrically connected with the second circuit layer on the second circuit layer, wherein the height of the first conductive column is greater than that of the electronic element. Providing an insulating layer, and respectively laminating the second circuit substrate and the first circuit substrate on two opposite sides of the insulating layer, so that the first conductive columns and the electronic element face the insulating layer and the first conductive columns and the electronic element are staggered, thereby obtaining an intermediate body. And pressing the intermediate body to enable the first conductive column to penetrate through the insulating layer and be electrically connected to the first circuit layer, and to enable the electronic element to be embedded in the insulating layer. In addition, the invention also provides a circuit board with the embedded electronic element.
Description
Technical Field
The invention relates to a circuit board with embedded electronic elements and a manufacturing method thereof.
Background
The embedded circuit board embeds electronic elements (such as resistors, capacitors and the like) in the circuit substrate so as to reduce the overall size of the circuit board, thereby meeting the pursuit of users on light, thin and small electronic products.
In the prior art, the manufacturing process of the embedded circuit board generally includes processes of forming and pressing. The fishing type size and precision have important influence on the circuit board, the fishing type size is too large, the open area is enlarged, the reliability of subsequent products can be influenced, the fishing type size is too small, and pressing deviation can occur, so that the electronic element is damaged. Secondly, the electronic element is connected with a circuit by forming a conductive blind hole after being embedded, and poor precision is easily caused between the conductive blind hole and the electronic element, so that poor connection is caused.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a circuit board having embedded electronic components.
In addition, the invention also provides a circuit board prepared by the manufacturing method.
A method of manufacturing a circuit board, comprising the steps of:
providing a first circuit substrate, wherein the first circuit substrate comprises a first base material layer and a first circuit layer formed on the surface of the first base material layer.
And mounting an electronic component on the first circuit layer.
And providing a second circuit substrate, wherein the second circuit substrate comprises a second base material layer, a second circuit layer formed on the surface of the second base material layer and a first conductive column formed on the second circuit layer.
And forming a first conductive pillar electrically connected with the second circuit layer on the second circuit layer, wherein the height of the first conductive pillar is greater than that of the electronic element.
Providing an insulating layer, and laminating the second circuit substrate with the first conductive pillar and the first circuit substrate with the electronic element on two opposite sides of the insulating layer respectively, so that the first conductive pillar and the electronic element face the insulating layer and are staggered with respect to each other, thereby obtaining an intermediate body. And pressing the intermediate body, so that the first conductive column penetrates through the insulating layer and is electrically connected to the first circuit layer, and the electronic element is embedded in the insulating layer, thereby obtaining the circuit board.
Further, the manufacturing step of the first circuit substrate includes:
providing a copper-clad substrate, wherein the copper-clad substrate comprises a first substrate layer and copper foil layers formed on two opposite sides of the unit substrate layer;
forming a through hole in the copper-clad substrate, and etching each copper foil layer to form the first circuit layer; and
and carrying out copper plating in the opening hole to obtain a second conductive column electrically connecting the two first circuit layers.
Further, forming the first conductive pillar specifically includes:
a dry film layer is arranged on the second circuit layer, and a slot is formed in the area of the dry film layer corresponding to the second conductive column;
electroplating in the open groove to form the first conductive pillar; and
and removing the dry film layer.
Further, the insulating layer is selected from one of prepreg, ink, polyimide, pure glue, copper foil with back glue and ABF material.
Further, the electronic component is mounted and electrically connected to the first circuit layer through a conductive adhesive layer.
Further, the conductive adhesive layer comprises colloid and metal powder filled in the colloid, wherein the metal powder is selected from one or more of copper, silver and gold.
Further, the second circuit substrate has the same structure as the first circuit substrate.
Further, the electronic element includes one or more of a resistor, a capacitor, and an electronic chip.
Further, the first conductive pillar is electrically connected to the first circuit layer.
A circuit board, comprising:
the first circuit substrate comprises a first base material layer and a first circuit layer formed on the surface of the first base material layer.
And the electronic element is arranged on the first circuit layer.
And the second circuit substrate comprises a second base material layer and a second circuit layer formed on the surface of the second base material layer, wherein a first conductive column electrically connected with the second circuit layer is formed on the second circuit layer, and the height of the first conductive column is greater than that of the electronic element. And
and the insulating layer is connected between the first circuit substrate and the second circuit substrate.
The first conductive column penetrates through the insulating layer and is electrically connected to the first circuit layer, the first conductive column and the electronic element are staggered, and the electronic element is embedded in the insulating layer.
The manufacturing method of the circuit board provided by the invention has the following advantages:
1. the cost can be greatly reduced, and the electronic element can be accurately fixed in the circuit board. And the electronic element is adhered to the first circuit substrate through the conductive adhesive layer before lamination, so that rework operation can be carried out when the mounting position of the electronic element deviates.
2. The circuit board does not need to be fished before lamination, and the alignment precision is favorably improved.
3. One-time pressing can be completed, and compared with the two-time pressing in the prior art, the method can simplify the manufacturing process and reduce the cost.
It should be understood that the above examples are only for illustrating the present invention and are not to be construed as limiting the present invention. It will be apparent to those skilled in the art that various other changes and modifications can be made in the technical spirit of the present invention within the scope of the appended claims.
Drawings
Fig. 1 is a cross-sectional view of a copper-clad substrate according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of a first circuit substrate according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of the first circuit substrate of fig. 2 after being brushed with a conductive paste layer.
Fig. 4 is a cross-sectional view of the first circuit board shown in fig. 3 after an electronic component is attached thereto.
Fig. 5 is a cross-sectional view of the first circuit substrate shown in fig. 2 after being provided with a dry film layer.
Fig. 6 is a cross-sectional view of the first circuit substrate shown in fig. 5 after copper plating in the grooves.
Fig. 7 is a cross-sectional view of a second circuit substrate according to an embodiment of the present invention.
Fig. 8 is a cross-sectional view of the first circuit substrate shown in fig. 4, the second circuit substrate shown in fig. 7 and the multilayer body before being bonded.
Fig. 9 is a cross-sectional view of a circuit board provided by the present invention.
Description of the main elements
Copper-clad substrate 10
Conductive adhesive layer 13
First conductive post 15
Insulating layer 17
Copper foil layer 112
Second conductive post 21
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The circuit board 100 and the method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1 to 9, an embodiment of the invention provides a method for manufacturing a circuit board 100 with embedded electronic components, including the following steps:
s1 referring to fig. 2, a first circuit board 101 is provided, in which the first circuit board 101 includes a substrate layer 11 and at least a first circuit layer 12 formed on the surface of the substrate layer 11.
In this embodiment, the specific steps of manufacturing the first circuit substrate 101 in step S1 include:
s10 referring to fig. 1, a copper clad substrate 10 is provided, wherein the copper clad substrate 10 includes a substrate layer 11 and copper foil layers 111 formed on two opposite sides of the substrate layer 11.
In the present embodiment, the substrate layer 11 is a resin layer, such as Polyimide (PI), Polyethylene Terephthalate (PET), or Polyethylene Naphthalate (PEN).
S11, referring to fig. 2, first, at least one through opening 20 is opened in the copper-clad substrate 10, copper plating is performed in the opening 20 to obtain a plurality of second conductive pillars 21 electrically connecting the two copper foil layers 111, each copper foil layer 111 is etched to form the first circuit layer 12, and the first circuit substrate 101 is obtained.
In this embodiment, the first circuit layer 12 is formed protruding from the substrate layer 11, and in other embodiments of the present invention, the substrate layer 11 may be flush with the first circuit layer 12 through an embedded circuit process.
S2 referring to fig. 3, a conductive adhesive layer 13 is formed on the first circuit layer 12.
In this embodiment, the conductive adhesive layer 13 includes a colloid and metal powder filled in the colloid, and the metal powder is selected from one or more of copper, silver, and gold.
S3 referring to fig. 4, an electronic component 14 is provided, and the electronic component 14 is disposed on the conductive adhesive layer 13 such that the electronic component 14 is electrically connected to the first circuit layer 12.
Because the conductive adhesive layer 13 can be hardened at a low temperature, and the conductive adhesive layer 13 has viscosity, the electronic element 14 and the first circuit layer 12 are electrically connected through the conductive adhesive layer 13 without tombstoning or reflowing problems.
In this embodiment, in step S3, the electronic component 14 is disposed on the first circuit layer 12 corresponding to the second conductive pillar 21 through the conductive adhesive layer 13.
In the present embodiment, in step S3, the electronic element 14 includes a resistor, a capacitor, an electronic chip, and the like.
S4 referring to fig. 7, a second circuit board 102 is provided, in which the second circuit board 102 includes a substrate layer 11, and a second circuit layer 121 formed on two opposite surfaces of the substrate layer 11, and then a first conductive pillar 15 is formed on one of the second circuit layers 121.
The second circuit substrate 102 may have substantially the same structure as the first circuit substrate 101.
In this embodiment, the forming of the first conductive pillar 15 in step S4 specifically includes:
s41 referring to fig. 5, a dry film layer 16 is disposed on the first circuit layer 12.
The dry film layer 16 is provided with a slot 161 in a region corresponding to one of the second conductive pillars 21, and the slot 161 penetrates through the dry film layer 16.
S42 referring to fig. 6, electroplating is performed in the groove 161 to form the first pillar 15.
In the present embodiment, the height H1 (see fig. 7) of the first conductive pillar 15 is the same as the depth D of the slot 161, and the height H1 of the first conductive pillar 15 is greater than the height H2 of the electronic element 14.
S42, please refer to fig. 7, the dry film layer 16 is removed.
S5 referring to fig. 8, an insulating layer 17 is provided, and the second circuit board 102 having the first conductive pillar 15 and the first circuit board 101 having the electronic element 14 are respectively stacked on two opposite sides of the insulating layer 17, such that the first conductive pillar 15 and the electronic element 14 both face the insulating layer 17 and the first conductive pillar 15 is offset from the electronic element 14, thereby obtaining an intermediate body (not shown).
In this embodiment, in step S5, the first conductive pillar 15 faces another second conductive pillar 21 of the first circuit substrate 101.
In this embodiment, the insulating layer 17 in step S5 is selected from prepreg, ink, polyimide, pure glue, copper foil with back glue, ABF material (Ajinomoto Build-up Film) or other dielectric material that can be used for printed circuit boards.
And S6, as shown in FIG. 9, pressing the intermediate body to obtain the circuit board 100. Since the height H1 of the first conductive pillar 15 is greater than the height H2 of the electronic element 14, the electronic element 14 is prevented from being crushed during the pressing process.
In this embodiment, after the pressing, the first conductive pillar 15 is electrically connected to the first circuit layer 12.
In this embodiment, in step S6, the insulating layer 17 is in a semi-cured state, and after the pressing, the first conductive pillars 15 penetrate through the insulating layer 17 and are electrically connected to the first circuit layer 12, so that the first circuit board 101 and the second circuit board 102 are electrically connected.
After the lamination, the electronic component 14 and the second circuit layer 121 of the second circuit substrate 102 facing the insulating layer 17 are both embedded in the insulating layer 17.
Referring to fig. 9, the present invention further provides a circuit board 100, which includes a first circuit substrate 101, a second circuit substrate 102, an electronic component 14 disposed between the first circuit substrate 101 and the second circuit substrate 102, an insulating layer 17 filled in a gap between the first circuit substrate 101 and the second circuit substrate 102 except for the electronic component 14, the first circuit substrate 101 includes at least one first circuit layer 12, the second circuit substrate 102 includes at least one second circuit layer 121 and a first conductive pillar 15 formed protruding from the second circuit layer 121, the electronic component 14 is electrically connected to the first circuit layer 12 of the first circuit substrate 101 through a conductive adhesive layer 13, the height of the first conductive pillar 15 is greater than the height of the electronic element 14, and the first conductive pillar 15 is staggered from the electronic element 14.
The manufacturing method of the circuit board provided by the invention has the following advantages:
1. the cost can be greatly reduced, and the electronic element can be accurately fixed in the circuit board. And the electronic element is adhered to the first circuit substrate through the conductive adhesive layer before lamination, so that rework operation can be carried out when the mounting position of the electronic element deviates.
2. The circuit board does not need to be fished before lamination, and the alignment precision is favorably improved.
3. One-time pressing can be completed, and compared with the two-time pressing in the prior art, the method can simplify the manufacturing process and reduce the cost.
It should be understood that the above examples are only for illustrating the present invention and are not to be construed as limiting the present invention. It will be apparent to those skilled in the art that various other changes and modifications can be made in the technical spirit of the present invention within the scope of the appended claims.
Claims (10)
1. A method of manufacturing a circuit board having a buried electronic component, comprising the steps of:
providing a first circuit substrate, wherein the first circuit substrate comprises a first base material layer and a first circuit layer formed on the surface of the first base material layer;
mounting an electronic component on the first circuit layer;
providing a second circuit substrate, wherein the second circuit substrate comprises a second base material layer, a second circuit layer formed on the surface of the second base material layer and a first conductive column formed on the second circuit layer;
forming a first conductive pillar electrically connected with the second circuit layer on the second circuit layer, wherein the height of the first conductive pillar is greater than that of the electronic element;
providing an insulating layer, and laminating the second circuit substrate with the first conductive pillar and the first circuit substrate with the electronic element on two opposite sides of the insulating layer respectively, so that the first conductive pillar and the electronic element face the insulating layer and are staggered with respect to each other, thereby obtaining an intermediate body; and
and pressing the intermediate body, so that the first conductive column penetrates through the insulating layer and is electrically connected to the first circuit layer, and the electronic element is embedded in the insulating layer, thereby obtaining the circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein the manufacturing step of the first circuit substrate includes:
providing a copper-clad substrate, wherein the copper-clad substrate comprises a first substrate layer and copper foil layers formed on two opposite sides of the first substrate layer;
forming a through opening in the copper-clad substrate, and carrying out copper plating in the opening to obtain a second conductive column electrically connecting the two copper foil layers; and
etching each copper foil layer to form the first circuit layer.
3. The method for manufacturing a circuit board according to claim 2, wherein forming the first conductive pillar specifically includes:
a dry film layer is arranged on the second circuit layer, and a slot is formed in the area of the dry film layer corresponding to the second conductive column;
electroplating in the open groove to form the first conductive pillar; and
and removing the dry film layer.
4. The method of manufacturing a circuit board according to claim 1, wherein the insulating layer is selected from one of a prepreg, ink, polyimide, pure glue, copper foil with back glue, and ABF material.
5. The method for manufacturing a circuit board according to claim 1, wherein the electronic component is mounted on and electrically connected to the first wiring layer through a conductive adhesive layer.
6. The method for manufacturing a circuit board according to claim 5, wherein the conductive adhesive layer comprises a colloid and metal powder filled in the colloid, and the metal powder is selected from one or more of copper, silver and gold.
7. The method of manufacturing a circuit board according to claim 1, wherein the second circuit substrate has the same structure as the first circuit substrate.
8. The method of manufacturing a circuit board according to claim 1, wherein the electronic component includes one or more of a resistor, a capacitor, and an electronic chip.
9. The method for manufacturing a circuit board according to claim 1, wherein the first conductive pillar is electrically connected to the first circuit layer.
10. A circuit board having a buried electronic component, comprising:
the first circuit substrate comprises a first base material layer and a first circuit layer formed on the surface of the first base material layer;
an electronic component mounted on the first circuit layer;
the second circuit substrate comprises a second base material layer and a second circuit layer formed on the surface of the second base material layer, wherein a first conductive column electrically connected with the second circuit layer is formed on the second circuit layer, and the height of the first conductive column is greater than that of the electronic element; and
an insulating layer connected between the first circuit substrate and the second circuit substrate;
the first conductive column penetrates through the insulating layer and is electrically connected to the first circuit layer, the first conductive column and the electronic element are staggered, and the electronic element is embedded in the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055005.XA CN113141727A (en) | 2020-01-17 | 2020-01-17 | Circuit board with embedded electronic element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055005.XA CN113141727A (en) | 2020-01-17 | 2020-01-17 | Circuit board with embedded electronic element and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113141727A true CN113141727A (en) | 2021-07-20 |
Family
ID=76809521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010055005.XA Pending CN113141727A (en) | 2020-01-17 | 2020-01-17 | Circuit board with embedded electronic element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113141727A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420715A (en) * | 2001-09-27 | 2003-05-28 | 松下电器产业株式会社 | Insulation sheet, multilayer wiring base board and mfg. method thereof |
| US20080230264A1 (en) * | 2007-03-19 | 2008-09-25 | Mutual-Tek Industries Co., Ltd. | Interconnection structure and method thereof |
| US20090097214A1 (en) * | 2007-10-15 | 2009-04-16 | Samsung Techwin Co., Ltd | Electronic chip embedded circuit board and method of manufacturing the same |
| CN103906372A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN108738241A (en) * | 2017-04-20 | 2018-11-02 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and its circuit board obtained |
| CN110049632A (en) * | 2018-01-16 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Built-in type flexible circuit board and preparation method thereof |
-
2020
- 2020-01-17 CN CN202010055005.XA patent/CN113141727A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420715A (en) * | 2001-09-27 | 2003-05-28 | 松下电器产业株式会社 | Insulation sheet, multilayer wiring base board and mfg. method thereof |
| US20080230264A1 (en) * | 2007-03-19 | 2008-09-25 | Mutual-Tek Industries Co., Ltd. | Interconnection structure and method thereof |
| US20090097214A1 (en) * | 2007-10-15 | 2009-04-16 | Samsung Techwin Co., Ltd | Electronic chip embedded circuit board and method of manufacturing the same |
| CN103906372A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN108738241A (en) * | 2017-04-20 | 2018-11-02 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and its circuit board obtained |
| CN110049632A (en) * | 2018-01-16 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Built-in type flexible circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2954760B1 (en) | Fusion bonded liquid crystal polymer circuit structure | |
| US9439282B2 (en) | Method for manufacturing printed circuit board | |
| US7491896B2 (en) | Information handling system utilizing circuitized substrate with split conductive layer | |
| US9345142B2 (en) | Chip embedded board and method of manufacturing the same | |
| US9351410B2 (en) | Electronic component built-in multi-layer wiring board and method of manufacturing the same | |
| JP2007184568A (en) | Circuit board manufacturing method | |
| JP2016134624A (en) | Electronic element built-in printed circuit board and manufacturing method therefor | |
| CN108934122B (en) | Printed circuit board with built-in electronic component | |
| WO2020073344A1 (en) | Embedded circuit board and manufacturing method therefor | |
| US7814649B2 (en) | Method of making circuitized substrate with filled isolation border | |
| KR100716809B1 (en) | A PCB using the ACF and manufacturing method thereof | |
| CN113141727A (en) | Circuit board with embedded electronic element and manufacturing method thereof | |
| CN112423472A (en) | Rigid-flexible circuit board and manufacturing method thereof | |
| CN112839451B (en) | Manufacturing method of rigid-flex board and rigid-flex board | |
| KR100725481B1 (en) | Pcb electro component embedded electro component and method of the same | |
| KR100734244B1 (en) | Multilayer printed circuit board and fabricating method thereof | |
| JPH10261854A (en) | Printed wiring board and manufacturing method thereof | |
| CN113498633B (en) | Circuit board with embedded electronic element and manufacturing method thereof | |
| CN112153883B (en) | Circuit board manufacturing method and circuit board | |
| KR20150059086A (en) | Chip Embedded Board And Method Of Manufacturing The Same | |
| JP2001313448A (en) | Both-side flexible wiring board, ic card, and manufacturing method of the both-side flexible wiring board | |
| CN116321730A (en) | Circuit board preparation method and circuit board | |
| JP2017188636A (en) | Component built-in electronic circuit board | |
| CN116529878A (en) | Built-in circuit board and manufacturing method thereof | |
| KR20100053761A (en) | Embedded pcb using unclad and embedded pcb manufactured thereby |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |